JP5069344B2 - メモリコントローラを備える様々な異なる規格のカードとともに用いられる汎用不揮発性メモリカード - Google Patents
メモリコントローラを備える様々な異なる規格のカードとともに用いられる汎用不揮発性メモリカード Download PDFInfo
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- JP5069344B2 JP5069344B2 JP2010214753A JP2010214753A JP5069344B2 JP 5069344 B2 JP5069344 B2 JP 5069344B2 JP 2010214753 A JP2010214753 A JP 2010214753A JP 2010214753 A JP2010214753 A JP 2010214753A JP 5069344 B2 JP5069344 B2 JP 5069344B2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/06—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means which conduct current when a mark is sensed or absent, e.g. contact brush for a conductive mark
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/382—Information transfer, e.g. on bus using universal interface adapter
- G06F13/387—Information transfer, e.g. on bus using universal interface adapter for adaptation of different data processing systems to different peripheral devices, e.g. protocol converters for incompatible systems, open system
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F12/00—Accessing, addressing or allocating within memory systems or architectures
- G06F12/14—Protection against unauthorised use of memory or access to memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07741—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
- H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Computer Security & Cryptography (AREA)
- Artificial Intelligence (AREA)
- Credit Cards Or The Like (AREA)
- Storage Device Security (AREA)
- Transceivers (AREA)
- Read Only Memory (AREA)
- Techniques For Improving Reliability Of Storages (AREA)
Description
Claims (14)
- メモリカードであって、
前記カード内に入れられ、チップの向かい合う第1および第2の側に沿って1つの表面上に複数の電気回路接点を有する少なくとも1つの不揮発性メモリ集積回路チップと、
前記集積回路チップと外部デバイスとの間の通信を可能にする外部アクセス可能な一組の電気接点と、を備え
前記外部アクセス可能な電気接点は前記チップの第1の側に隣接するパターン成形されたリードフレームの導体の端部から形成され、第1の複数の前記導体はチップの下でその前記第1および第2の側の間を延び、かつチップのための物理的支持体となり、前記チップの第2の側に沿った接触領域は前記第1の複数の前記リードフレーム導体にチップの第2の側に隣接するその端部において電気的に接続され、前記チップの第1の側に沿った接触領域はチップの第1の側に隣接する第2の複数の前記リードフレーム導体と電気的に接続され、第2の複数の前記リードフレーム導体はチップの下でチップの前記第1および第2の側の間を延びていないことにより第1の複数の前記リードフレーム導体よりも短いメモリカード。 - 請求項1記載のメモリカードにおいて、
前記外部アクセス可能な電気接点は、もっぱら1つの表面上にあり、メモリカードの1つのエッジに隣接するメモリカード。 - 請求項1記載のメモリカードにおいて、
前記少なくとも1つの不揮発性メモリ集積回路チップおよび前記パターン成形されたリードフレームは、前記パターン成形されたリードフレームの前記外部アクセス可能な電気接触部分を除いて、プラスチック内に完全に封入されるメモリカード。 - 請求項1記載のメモリカードにおいて、
前記パターン成形されたリードフレームの導体の端部は、複数の接点および第1の複数の導体を異なる平面内で配向させるように成形されるメモリカード。 - 請求項1または3のいずれか記載のメモリカードにおいて、
前記外部デバイスを用いた機械的保持を容易にする形状が、前記プラスチック封入と一体的に形成されるメモリカード。 - 請求項1または3のいずれか記載のメモリカードにおいて、
前記外部デバイスからの取り外しを容易にする形状が、前記プラスチック封入と一体的に形成されるメモリカード。 - 請求項1または3のいずれか記載のメモリカードにおいて、
前記外部接点を介した外部デバイスとの通信を認証または阻止するセキュリティ機能をさらに含むメモリカード。 - 請求項7記載のメモリカードにおいて、
前記セキュリティ機能は、前記少なくとも1つの不揮発性メモリ集積回路チップ内に含まれるメモリカード。 - 請求項7記載のメモリカードにおいて、
前記セキュリティ機能は、前記カード内に入れられた第2の集積回路チップ内に含まれるメモリカード。 - メモリカードであって、
前記カード中に入れられ、各々が複数の電気回路接点をその1つの表面上にチップの向かい合う第1および第2の側に沿って有する第1および第2の不揮発性メモリ集積回路チップと、
第1および第2の集積回路チップと外部デバイスとの間の通信を可能にする外部アクセス可能な一組の電気接点と、を備え、
前記外部アクセス可能な電気接点はパターン成形されたリードフレームの導体の端部から形成され、前記リードフレームは前記第1および第2のチップ間に配置され、かつチップのための物理的支持体となる第1の複数の導体を備え、各々のチップの第2の側に沿った接触領域は第1および第2のチップの両方の第1の複数のリードフレーム導体に前記チップの第2の側に隣接するその端部において電気的に接続され、前記チップの第1の側に沿った接触領域はチップの第1の側に隣接する第2の複数の前記リードフレーム導体と電気的に接続され、第2の複数の前記リードフレーム導体はチップの前記第1および第2の側の間の第1および第2のチップ間を延びていないことにより第1の複数の前記リードフレーム導体よりも短いメモリカード。 - 請求項10記載のメモリカードにおいて、
前記外部アクセス可能な電気接触は、もっぱら1つの表面上にあり、メモリカードの1つのエッジに隣接するメモリカード。 - 請求項10記載のメモリカードにおいて、
前記少なくとも1つの不揮発性メモリ集積回路チップおよび前記パターン成形されたリードフレームは、前記パターン成形されたリードフレームの前記外部アクセス可能な電気接触部分を除いて、プラスチック内に完全に封入されるメモリカード。 - 請求項10記載のメモリカードにおいて、
前記パターン成形されたリードフレームの導体の端部は、複数の接点および第1の複数の導体を異なる平面内で配向させるように成形されるメモリカード。 - 請求項10記載のメモリカードにおいて、
セキュリティ機能は、前記第1および第2のチップの一方にのみ設けられるメモリカード。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/293,985 US7367503B2 (en) | 2002-11-13 | 2002-11-13 | Universal non-volatile memory card used with various different standard cards containing a memory controller |
US10/293,985 | 2002-11-13 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004551786A Division JP4718837B2 (ja) | 2002-11-13 | 2003-11-05 | メモリコントローラを備える様々な異なる規格のカードとともに用いられる汎用不揮発性メモリカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011023034A JP2011023034A (ja) | 2011-02-03 |
JP5069344B2 true JP5069344B2 (ja) | 2012-11-07 |
Family
ID=32229761
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004551786A Expired - Fee Related JP4718837B2 (ja) | 2002-11-13 | 2003-11-05 | メモリコントローラを備える様々な異なる規格のカードとともに用いられる汎用不揮発性メモリカード |
JP2010214753A Expired - Fee Related JP5069344B2 (ja) | 2002-11-13 | 2010-09-27 | メモリコントローラを備える様々な異なる規格のカードとともに用いられる汎用不揮発性メモリカード |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004551786A Expired - Fee Related JP4718837B2 (ja) | 2002-11-13 | 2003-11-05 | メモリコントローラを備える様々な異なる規格のカードとともに用いられる汎用不揮発性メモリカード |
Country Status (10)
Country | Link |
---|---|
US (4) | US7367503B2 (ja) |
EP (2) | EP1785882B1 (ja) |
JP (2) | JP4718837B2 (ja) |
KR (1) | KR101077123B1 (ja) |
CN (1) | CN100589090C (ja) |
AT (2) | ATE438142T1 (ja) |
AU (1) | AU2003291247A1 (ja) |
DE (2) | DE60328637D1 (ja) |
TW (1) | TWI317479B (ja) |
WO (1) | WO2004044755A2 (ja) |
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2002
- 2002-11-13 US US10/293,985 patent/US7367503B2/en not_active Expired - Lifetime
-
2003
- 2003-11-05 AU AU2003291247A patent/AU2003291247A1/en not_active Abandoned
- 2003-11-05 EP EP06023700A patent/EP1785882B1/en not_active Expired - Lifetime
- 2003-11-05 DE DE60328637T patent/DE60328637D1/de not_active Expired - Lifetime
- 2003-11-05 KR KR1020057008682A patent/KR101077123B1/ko not_active IP Right Cessation
- 2003-11-05 JP JP2004551786A patent/JP4718837B2/ja not_active Expired - Fee Related
- 2003-11-05 DE DE60315337T patent/DE60315337T2/de not_active Expired - Lifetime
- 2003-11-05 AT AT06023700T patent/ATE438142T1/de not_active IP Right Cessation
- 2003-11-05 WO PCT/US2003/035325 patent/WO2004044755A2/en active IP Right Grant
- 2003-11-05 EP EP03783177A patent/EP1561170B1/en not_active Expired - Lifetime
- 2003-11-05 AT AT03783177T patent/ATE368892T1/de not_active IP Right Cessation
- 2003-11-05 CN CN200380107342A patent/CN100589090C/zh not_active Expired - Fee Related
- 2003-11-10 TW TW092131414A patent/TWI317479B/zh not_active IP Right Cessation
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2005
- 2005-03-07 US US11/075,438 patent/US7114659B2/en not_active Expired - Lifetime
-
2008
- 2008-05-05 US US12/115,408 patent/US20090321530A1/en not_active Abandoned
-
2010
- 2010-09-27 JP JP2010214753A patent/JP5069344B2/ja not_active Expired - Fee Related
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2012
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Also Published As
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US20040089717A1 (en) | 2004-05-13 |
ATE368892T1 (de) | 2007-08-15 |
AU2003291247A8 (en) | 2004-06-03 |
WO2004044755A2 (en) | 2004-05-27 |
JP2011023034A (ja) | 2011-02-03 |
US7367503B2 (en) | 2008-05-06 |
EP1561170B1 (en) | 2007-08-01 |
EP1785882B1 (en) | 2009-07-29 |
US20090321530A1 (en) | 2009-12-31 |
JP4718837B2 (ja) | 2011-07-06 |
US7114659B2 (en) | 2006-10-03 |
DE60328637D1 (de) | 2009-09-10 |
US8752765B2 (en) | 2014-06-17 |
DE60315337D1 (de) | 2007-09-13 |
TW200413928A (en) | 2004-08-01 |
AU2003291247A1 (en) | 2004-06-03 |
TWI317479B (en) | 2009-11-21 |
CN1732448A (zh) | 2006-02-08 |
KR20050091704A (ko) | 2005-09-15 |
JP2006506709A (ja) | 2006-02-23 |
US20130087623A1 (en) | 2013-04-11 |
US20050198424A1 (en) | 2005-09-08 |
KR101077123B1 (ko) | 2011-10-26 |
EP1785882A2 (en) | 2007-05-16 |
EP1785882A3 (en) | 2007-06-13 |
CN100589090C (zh) | 2010-02-10 |
EP1561170A2 (en) | 2005-08-10 |
ATE438142T1 (de) | 2009-08-15 |
WO2004044755A3 (en) | 2004-11-18 |
DE60315337T2 (de) | 2008-05-08 |
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