JP2011508936A5 - - Google Patents

Download PDF

Info

Publication number
JP2011508936A5
JP2011508936A5 JP2010538288A JP2010538288A JP2011508936A5 JP 2011508936 A5 JP2011508936 A5 JP 2011508936A5 JP 2010538288 A JP2010538288 A JP 2010538288A JP 2010538288 A JP2010538288 A JP 2010538288A JP 2011508936 A5 JP2011508936 A5 JP 2011508936A5
Authority
JP
Japan
Prior art keywords
pat
patent application
flash memory
nand flash
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010538288A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011508936A (ja
JP5469088B2 (ja
Filing date
Publication date
Priority claimed from US12/168,354 external-priority patent/US8399973B2/en
Application filed filed Critical
Publication of JP2011508936A publication Critical patent/JP2011508936A/ja
Publication of JP2011508936A5 publication Critical patent/JP2011508936A5/ja
Application granted granted Critical
Publication of JP5469088B2 publication Critical patent/JP5469088B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010538288A 2007-12-20 2008-12-11 データ記憶装置及び積層可能構成 Expired - Fee Related JP5469088B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US1534507P 2007-12-20 2007-12-20
US61/015,345 2007-12-20
US3220308P 2008-02-28 2008-02-28
US61/032,203 2008-02-28
US12/168,354 2008-07-07
US12/168,354 US8399973B2 (en) 2007-12-20 2008-07-07 Data storage and stackable configurations
PCT/CA2008/002145 WO2009079749A1 (en) 2007-12-20 2008-12-11 Data storage and stackable configurations

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013121853A Division JP5548803B2 (ja) 2007-12-20 2013-06-10 データ記憶装置及び積層可能構成

Publications (3)

Publication Number Publication Date
JP2011508936A JP2011508936A (ja) 2011-03-17
JP2011508936A5 true JP2011508936A5 (https=) 2012-09-06
JP5469088B2 JP5469088B2 (ja) 2014-04-09

Family

ID=40788405

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010538288A Expired - Fee Related JP5469088B2 (ja) 2007-12-20 2008-12-11 データ記憶装置及び積層可能構成
JP2013121853A Expired - Fee Related JP5548803B2 (ja) 2007-12-20 2013-06-10 データ記憶装置及び積層可能構成

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013121853A Expired - Fee Related JP5548803B2 (ja) 2007-12-20 2013-06-10 データ記憶装置及び積層可能構成

Country Status (8)

Country Link
US (2) US8399973B2 (https=)
EP (2) EP2223300B1 (https=)
JP (2) JP5469088B2 (https=)
KR (1) KR20100105536A (https=)
CN (1) CN101919002B (https=)
ES (1) ES2439960T3 (https=)
TW (1) TWI460846B (https=)
WO (1) WO2009079749A1 (https=)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8472795B2 (en) * 2006-09-19 2013-06-25 Capso Vision, Inc System and method for capsule camera with on-board storage
US8026740B2 (en) 2008-03-21 2011-09-27 Micron Technology, Inc. Multi-level signaling for low power, short channel applications
US7978721B2 (en) 2008-07-02 2011-07-12 Micron Technology Inc. Multi-serial interface stacked-die memory architecture
JP2010021449A (ja) * 2008-07-11 2010-01-28 Toshiba Corp 半導体装置
US9893004B2 (en) * 2011-07-27 2018-02-13 Broadpak Corporation Semiconductor interposer integration
US8014166B2 (en) * 2008-09-06 2011-09-06 Broadpak Corporation Stacking integrated circuits containing serializer and deserializer blocks using through silicon via
US8086913B2 (en) 2008-09-11 2011-12-27 Micron Technology, Inc. Methods, apparatus, and systems to repair memory
JP5543094B2 (ja) * 2008-10-10 2014-07-09 ピーエスフォー ルクスコ エスエイアールエル 低ノイズ半導体パッケージ
US8472199B2 (en) * 2008-11-13 2013-06-25 Mosaid Technologies Incorporated System including a plurality of encapsulated semiconductor chips
US8674482B2 (en) * 2008-11-18 2014-03-18 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Semiconductor chip with through-silicon-via and sidewall pad
US8259461B2 (en) * 2008-11-25 2012-09-04 Micron Technology, Inc. Apparatus for bypassing faulty connections
US8900921B2 (en) * 2008-12-11 2014-12-02 Stats Chippac, Ltd. Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
JP2010192680A (ja) * 2009-02-18 2010-09-02 Elpida Memory Inc 半導体装置
US8328218B2 (en) * 2009-07-13 2012-12-11 Columbia Cycle Works, LLC Commuter vehicle
US8264067B2 (en) * 2009-10-09 2012-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. Through silicon via (TSV) wire bond architecture
US9142262B2 (en) 2009-10-23 2015-09-22 Rambus Inc. Stacked semiconductor device
US8421500B2 (en) * 2009-11-30 2013-04-16 International Business Machines Corporation Integrated circuit with stacked computational units and configurable through vias
US9123552B2 (en) * 2010-03-30 2015-09-01 Micron Technology, Inc. Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same
US8843692B2 (en) 2010-04-27 2014-09-23 Conversant Intellectual Property Management Inc. System of interconnected nonvolatile memories having automatic status packet
KR20120024099A (ko) * 2010-09-06 2012-03-14 삼성전자주식회사 멀티-칩 패키지 및 그의 제조 방법
KR20120028484A (ko) * 2010-09-15 2012-03-23 삼성전자주식회사 모바일 기기에 채용하기 적합한 복합형 반도체 장치
KR101157032B1 (ko) * 2010-11-17 2012-06-21 에스케이하이닉스 주식회사 반도체 장치
US8363418B2 (en) * 2011-04-18 2013-01-29 Morgan/Weiss Technologies Inc. Above motherboard interposer with peripheral circuits
JP2013050860A (ja) * 2011-08-31 2013-03-14 Renesas Electronics Corp マイクロコンピュータ及びマルチマイクロコンピュータシステム
US9269646B2 (en) 2011-11-14 2016-02-23 Micron Technology, Inc. Semiconductor die assemblies with enhanced thermal management and semiconductor devices including same
WO2013071399A1 (en) * 2011-11-14 2013-05-23 Mosaid Technologies Incorporated Package having stacked memory dies with serially connected buffer dies
KR20130104430A (ko) * 2012-03-14 2013-09-25 삼성전자주식회사 멀티-칩 패키지 및 그의 제조 방법
US9343449B2 (en) * 2012-07-06 2016-05-17 Nvidia Corporation Alternative 3D stacking scheme for DRAMs atop GPUs
WO2014097916A1 (ja) * 2012-12-18 2014-06-26 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
KR102018885B1 (ko) * 2012-12-20 2019-09-05 삼성전자주식회사 관통전극을 갖는 반도체 소자 및 그 제조방법
KR102012505B1 (ko) * 2012-12-20 2019-08-20 에스케이하이닉스 주식회사 토큰 링 루프를 갖는 스택 패키지
KR101984831B1 (ko) * 2013-01-31 2019-05-31 삼성전자 주식회사 반도체 패키지 및 그 제조 방법
JP5843803B2 (ja) * 2013-03-25 2016-01-13 株式会社東芝 半導体装置とその製造方法
KR20150062760A (ko) 2013-11-29 2015-06-08 에스케이하이닉스 주식회사 플립플롭 회로 및 이를 이용한 반도체 장치
JP6071929B2 (ja) * 2014-03-13 2017-02-01 株式会社東芝 半導体装置
KR102026979B1 (ko) * 2014-04-18 2019-09-30 에스케이하이닉스 주식회사 반도체 칩 적층 패키지
US9627367B2 (en) 2014-11-21 2017-04-18 Micron Technology, Inc. Memory devices with controllers under memory packages and associated systems and methods
KR102215826B1 (ko) 2014-12-22 2021-02-16 삼성전자주식회사 입출력 부하를 감소하는 적층형 메모리 칩, 이를 포함하는 메모리 모듈 및 메모리 시스템
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
WO2017040967A1 (en) * 2015-09-04 2017-03-09 Octavo Systems Llc Improved system using system in package components
KR102367512B1 (ko) 2015-09-08 2022-02-24 삼성전자주식회사 시스템 온 패키지
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
CN105789918B (zh) * 2016-04-25 2018-03-06 深圳市熙龙玩具有限公司 一种分离电路的元器件堆积式连接实现方法及电路
US9595511B1 (en) 2016-05-12 2017-03-14 Invensas Corporation Microelectronic packages and assemblies with improved flyby signaling operation
WO2017208901A1 (ja) * 2016-05-30 2017-12-07 国立研究開発法人産業技術総合研究所 半導体演算装置
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board
JP6721696B2 (ja) 2016-09-23 2020-07-15 キオクシア株式会社 メモリデバイス
WO2018106266A1 (en) * 2016-12-11 2018-06-14 Intel Corporation Microelectronic die stack having at least one rotated microelectronic die
KR102671937B1 (ko) * 2017-01-10 2024-06-05 에스케이하이닉스 주식회사 멀티 플레인을 포함하는 비휘발성 메모리 장치
CN112802835A (zh) 2017-06-02 2021-05-14 超极存储器股份有限公司 半导体模块
KR102395446B1 (ko) * 2017-09-28 2022-05-10 삼성전자주식회사 적층형 반도체 장치, 이를 포함하는 시스템 및 적층형 반도체 장치에서의 신호 전송 방법
US10727203B1 (en) * 2018-05-08 2020-07-28 Rockwell Collins, Inc. Die-in-die-cavity packaging
CN108986853B (zh) * 2018-06-11 2020-12-04 深圳市江波龙电子股份有限公司 一种存储控制芯片、存储设备及自适应接口方法
JP2020043258A (ja) * 2018-09-12 2020-03-19 キオクシア株式会社 半導体メモリおよびその製造方法
CN110164488A (zh) * 2019-04-08 2019-08-23 苏州汇峰微电子有限公司 一种支持多元存储配置的存储器
CN111179987B (zh) * 2019-12-11 2022-03-29 深圳市国微电子有限公司 3d堆叠存储器、时钟偏斜消除方法及时钟偏斜消除电路
CN113051199A (zh) 2019-12-26 2021-06-29 阿里巴巴集团控股有限公司 数据传输方法及装置
KR102817225B1 (ko) * 2020-02-13 2025-06-05 에스케이하이닉스 주식회사 점대칭 구조의 칩 패드를 구비하는 반도체 칩을 포함하는 반도체 패키지
KR102736240B1 (ko) * 2020-02-24 2024-12-02 에스케이하이닉스 주식회사 인터포즈 브리지 및 반도체 다이들을 포함한 스택 모듈들이 스택된 반도체 패키지
US11527508B2 (en) * 2020-03-03 2022-12-13 Micron Technology, Inc. Apparatuses and methods for coupling a plurality of semiconductor devices
US12274058B2 (en) 2022-03-21 2025-04-08 Macronix International Co., Ltd. Memory device
TWI810855B (zh) * 2022-03-21 2023-08-01 旺宏電子股份有限公司 記憶體元件

Family Cites Families (144)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6034054A (ja) * 1983-08-04 1985-02-21 Nec Corp メモリｉｃモジユ−ル
JPS60245195A (ja) * 1984-05-18 1985-12-04 松下電器産業株式会社 多層配線基板
JPS62104149A (ja) * 1985-10-30 1987-05-14 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 集積回路チツプ・モジユ−ル
JPH07120772B2 (ja) 1986-01-10 1995-12-20 富士写真フイルム株式会社 固体撮像素子
JPH0511887Y2 (https=) 1986-11-21 1993-03-25
US5191405A (en) 1988-12-23 1993-03-02 Matsushita Electric Industrial Co., Ltd. Three-dimensional stacked lsi
US5399898A (en) 1992-07-17 1995-03-21 Lsi Logic Corporation Multi-chip semiconductor arrangements using flip chip dies
JPH03291960A (ja) * 1990-04-09 1991-12-24 Hitachi Ltd 半導体装置積層用基板及び積層半導体装置
DE69129933T2 (de) * 1990-12-31 1999-01-14 At & T Corp., New York, N.Y. Verminderung von Verdrahtungskreuzungen in gestapelten Multiprozessorleiterplatten
US5422435A (en) 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
FR2694840B1 (fr) 1992-08-13 1994-09-09 Commissariat Energie Atomique Module multi-puces à trois dimensions.
JP3321925B2 (ja) * 1992-09-08 2002-09-09 セイコーエプソン株式会社 液晶表示装置、半導体チップの実装構造、電子光学装置および電子印字装置
JP3206144B2 (ja) * 1992-10-21 2001-09-04 松下電器産業株式会社 集積回路装置
FR2701153B1 (fr) 1993-02-02 1995-04-07 Matra Marconi Space France Composant et module de mémoire à semi-conducteur.
JP3123338B2 (ja) * 1993-04-05 2001-01-09 松下電器産業株式会社 集積回路装置
US5323060A (en) 1993-06-02 1994-06-21 Micron Semiconductor, Inc. Multichip module having a stacked chip arrangement
US5477082A (en) 1994-01-11 1995-12-19 Exponential Technology, Inc. Bi-planar multi-chip module
US5579207A (en) 1994-10-20 1996-11-26 Hughes Electronics Three-dimensional integrated circuit stacking
US5998864A (en) 1995-05-26 1999-12-07 Formfactor, Inc. Stacking semiconductor devices, particularly memory chips
US5646067A (en) 1995-06-05 1997-07-08 Harris Corporation Method of bonding wafers having vias including conductive material
US5886412A (en) * 1995-08-16 1999-03-23 Micron Technology, Inc. Angularly offset and recessed stacked die multichip device
US5742840A (en) 1995-08-16 1998-04-21 Microunity Systems Engineering, Inc. General purpose, multiple precision parallel operation, programmable media processor
US5721452A (en) * 1995-08-16 1998-02-24 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
US6002177A (en) 1995-12-27 1999-12-14 International Business Machines Corporation High density integrated circuit packaging with chip stacking and via interconnections
US5777345A (en) 1996-01-03 1998-07-07 Intel Corporation Multi-chip integrated circuit package
CA2196024A1 (en) 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
JPH1011404A (ja) * 1996-06-27 1998-01-16 Fuji Xerox Co Ltd マルチプロセッサ装置を構成するための集積回路装置及びその接続方法及びマルチチップモジュール
EP0890989A4 (en) 1997-01-24 2006-11-02 Rohm Co Ltd SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
US6378018B1 (en) 1997-10-10 2002-04-23 Intel Corporation Memory device and system including a low power interface
US6222276B1 (en) 1998-04-07 2001-04-24 International Business Machines Corporation Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
KR100277438B1 (ko) 1998-05-28 2001-02-01 윤종용 멀티칩패키지
US6187652B1 (en) 1998-09-14 2001-02-13 Fujitsu Limited Method of fabrication of multiple-layer high density substrate
EP1145315A1 (de) 1998-12-30 2001-10-17 Infineon Technologies AG Vertikal integrierte halbleiteranordnung
JP3662461B2 (ja) 1999-02-17 2005-06-22 シャープ株式会社 半導体装置、およびその製造方法
JP4547728B2 (ja) 1999-03-29 2010-09-22 ソニー株式会社 半導体装置及びその製造方法
JP3304921B2 (ja) 1999-06-18 2002-07-22 日本電気株式会社 半導体記憶装置
US6355980B1 (en) * 1999-07-15 2002-03-12 Nanoamp Solutions Inc. Dual die memory
JP2001053243A (ja) * 1999-08-06 2001-02-23 Hitachi Ltd 半導体記憶装置とメモリモジュール
JP2001118893A (ja) * 1999-10-18 2001-04-27 Matsushita Electric Ind Co Ltd 半導体装置
JP3765952B2 (ja) 1999-10-19 2006-04-12 富士通株式会社 半導体装置
US6291884B1 (en) 1999-11-09 2001-09-18 Amkor Technology, Inc. Chip-size semiconductor packages
JP3822768B2 (ja) * 1999-12-03 2006-09-20 株式会社ルネサステクノロジ Ｉｃカードの製造方法
US6376904B1 (en) 1999-12-23 2002-04-23 Rambus Inc. Redistributed bond pads in stacked integrated circuit die package
US6678167B1 (en) 2000-02-04 2004-01-13 Agere Systems Inc High performance multi-chip IC package
JP4569913B2 (ja) * 2000-03-10 2010-10-27 エルピーダメモリ株式会社 メモリモジュール
JP4497640B2 (ja) * 2000-03-29 2010-07-07 株式会社日立メディコ 高電圧スイッチ回路及びこれを用いたｘ線装置
JP2002007308A (ja) * 2000-06-20 2002-01-11 Nec Corp メモリバスシステムおよび信号線の接続方法
US6404043B1 (en) 2000-06-21 2002-06-11 Dense-Pac Microsystems, Inc. Panel stacking of BGA devices to form three-dimensional modules
JP4570809B2 (ja) 2000-09-04 2010-10-27 富士通セミコンダクター株式会社 積層型半導体装置及びその製造方法
US6577013B1 (en) 2000-09-05 2003-06-10 Amkor Technology, Inc. Chip size semiconductor packages with stacked dies
JP2002217356A (ja) * 2001-01-19 2002-08-02 Nec Corp 半導体装置及びその製造方法
TW480686B (en) * 2001-04-03 2002-03-21 Siliconware Precision Industries Co Ltd Intersecting stacked type dual die package structure and manufacturing process
JP2002231882A (ja) 2001-02-06 2002-08-16 Mitsubishi Electric Corp 半導体装置
KR100364635B1 (ko) 2001-02-09 2002-12-16 삼성전자 주식회사 칩-레벨에 형성된 칩 선택용 패드를 포함하는 칩-레벨3차원 멀티-칩 패키지 및 그 제조 방법
WO2002082540A1 (en) 2001-03-30 2002-10-17 Fujitsu Limited Semiconductor device, method of manufacture thereof, and semiconductor substrate
JP2002359346A (ja) 2001-05-30 2002-12-13 Sharp Corp 半導体装置および半導体チップの積層方法
US6900528B2 (en) 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package
US6525953B1 (en) * 2001-08-13 2003-02-25 Matrix Semiconductor, Inc. Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication
JP3872320B2 (ja) * 2001-08-22 2007-01-24 松下電器産業株式会社 半導体記憶装置およびその貼り合わせ方法
JP4041663B2 (ja) * 2001-09-12 2008-01-30 株式会社ルネサステクノロジ 半導体装置及びその検査装置
JP3959264B2 (ja) * 2001-09-29 2007-08-15 株式会社東芝 積層型半導体装置
US6555917B1 (en) 2001-10-09 2003-04-29 Amkor Technology, Inc. Semiconductor package having stacked semiconductor chips and method of making the same
KR100435813B1 (ko) 2001-12-06 2004-06-12 삼성전자주식회사 금속 바를 이용하는 멀티 칩 패키지와 그 제조 방법
US7081373B2 (en) 2001-12-14 2006-07-25 Staktek Group, L.P. CSP chip stack with flex circuit
JP2003197854A (ja) * 2001-12-26 2003-07-11 Nec Electronics Corp 両面接続型半導体装置、多段積層型半導体装置、その製造方法および該半導体装置を搭載した電子部品
US6635970B2 (en) 2002-02-06 2003-10-21 International Business Machines Corporation Power distribution design method for stacked flip-chip packages
KR100486832B1 (ko) 2002-02-06 2005-05-03 삼성전자주식회사 반도체 칩과 적층 칩 패키지 및 그 제조 방법
TW523890B (en) * 2002-02-07 2003-03-11 Macronix Int Co Ltd Stacked semiconductor packaging device
KR100422450B1 (ko) * 2002-05-10 2004-03-11 삼성전자주식회사 반도체 메모리장치의 플립칩 인터페이스회로 및 그 방법
SG120073A1 (en) 2002-07-18 2006-03-28 United Test & Assembly Ct Ltd Multiple chip semiconductor packages
KR20050027118A (ko) 2002-07-22 2005-03-17 가부시끼가이샤 르네사스 테크놀로지 반도체 집적회로 장치 데이터 처리 시스템 및 메모리시스템
US6885101B2 (en) 2002-08-29 2005-04-26 Micron Technology, Inc. Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
US7071547B2 (en) * 2002-09-11 2006-07-04 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7045887B2 (en) 2002-10-08 2006-05-16 Chippac, Inc. Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package
AU2003301632A1 (en) 2002-10-22 2004-05-13 Unitive International Limited Stacked electronic structures including offset substrates
JP3908146B2 (ja) 2002-10-28 2007-04-25 シャープ株式会社 半導体装置及び積層型半導体装置
US7847383B2 (en) * 2002-12-02 2010-12-07 Samsung Electronics Co., Ltd. Multi-chip package for reducing parasitic load of pin
TW556961U (en) 2002-12-31 2003-10-01 Advanced Semiconductor Eng Multi-chip stack flip-chip package
JP2004221215A (ja) * 2003-01-14 2004-08-05 Renesas Technology Corp 半導体装置
KR100498488B1 (ko) 2003-02-20 2005-07-01 삼성전자주식회사 적층형 반도체 패키지 및 그 제조방법
JP2004273044A (ja) 2003-03-10 2004-09-30 Innotech Corp 半導体装置の検査方法
US6815836B2 (en) 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
KR100497111B1 (ko) 2003-03-25 2005-06-28 삼성전자주식회사 웨이퍼 레벨 칩 스케일 패키지, 그를 적층한 적층 패키지및 그 제조 방법
US6841883B1 (en) 2003-03-31 2005-01-11 Micron Technology, Inc. Multi-dice chip scale semiconductor components and wafer level methods of fabrication
KR20040087501A (ko) 2003-04-08 2004-10-14 삼성전자주식회사 센터 패드 반도체 칩의 패키지 및 그 제조방법
TWI225292B (en) 2003-04-23 2004-12-11 Advanced Semiconductor Eng Multi-chips stacked package
TWI220781B (en) 2003-04-28 2004-09-01 Advanced Semiconductor Eng Multi-chip package substrate for flip-chip and wire bonding
TWI225299B (en) 2003-05-02 2004-12-11 Advanced Semiconductor Eng Stacked flip chip package
US6853064B2 (en) 2003-05-12 2005-02-08 Micron Technology, Inc. Semiconductor component having stacked, encapsulated dice
US7098541B2 (en) 2003-05-19 2006-08-29 Hewlett-Packard Development Company, L.P. Interconnect method for directly connected stacked integrated circuits
JP4160447B2 (ja) * 2003-05-28 2008-10-01 シャープ株式会社 電子部品およびモジュールならびにモジュールの組み立て方法、識別方法および環境設定方法
CN1295766C (zh) * 2003-05-29 2007-01-17 财团法人工业技术研究院 三维堆叠的电子封装件及其组装方法
US7309923B2 (en) 2003-06-16 2007-12-18 Sandisk Corporation Integrated circuit package having stacked integrated circuits and method therefor
KR100626364B1 (ko) 2003-07-02 2006-09-20 삼성전자주식회사 멀티칩을 내장한 반도체패키지
TWI229434B (en) 2003-08-25 2005-03-11 Advanced Semiconductor Eng Flip chip stacked package
KR100537892B1 (ko) 2003-08-26 2005-12-21 삼성전자주식회사 칩 스택 패키지와 그 제조 방법
US7208758B2 (en) 2003-09-16 2007-04-24 Micron Technology, Inc. Dynamic integrated circuit clusters, modules including same and methods of fabricating
JP4272968B2 (ja) 2003-10-16 2009-06-03 エルピーダメモリ株式会社 半導体装置および半導体チップ制御方法
JP3880572B2 (ja) 2003-10-31 2007-02-14 沖電気工業株式会社 半導体チップ及び半導体装置
JP4205553B2 (ja) 2003-11-06 2009-01-07 エルピーダメモリ株式会社 メモリモジュール及びメモリシステム
KR100621992B1 (ko) 2003-11-19 2006-09-13 삼성전자주식회사 이종 소자들의 웨이퍼 레벨 적층 구조와 방법 및 이를이용한 시스템-인-패키지
US7049170B2 (en) 2003-12-17 2006-05-23 Tru-Si Technologies, Inc. Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
US7173340B2 (en) * 2004-02-25 2007-02-06 Texas Instruments Incorporated Daisy chaining of serial I/O interface on stacking devices
JP2005317830A (ja) * 2004-04-30 2005-11-10 Elpida Memory Inc 半導体装置、マルチチップパッケージ、およびワイヤボンディング方法
US7342310B2 (en) 2004-05-07 2008-03-11 Avago Technologies General Ip Pte Ltd Multi-chip package with high-speed serial communications between semiconductor die
JP4441328B2 (ja) 2004-05-25 2010-03-31 株式会社ルネサステクノロジ 半導体装置及びその製造方法
US7221613B2 (en) 2004-05-26 2007-05-22 Freescale Semiconductor, Inc. Memory with serial input/output terminals for address and data and method therefor
TWI245397B (en) 2004-06-29 2005-12-11 Advanced Semiconductor Eng Leadframe with a chip pad for double side stacking and method for manufacturing the same
JP4063796B2 (ja) * 2004-06-30 2008-03-19 日本電気株式会社 積層型半導体装置
US7282791B2 (en) 2004-07-09 2007-10-16 Elpida Memory, Inc. Stacked semiconductor device and semiconductor memory module
US8324725B2 (en) * 2004-09-27 2012-12-04 Formfactor, Inc. Stacked die module
DE102004049356B4 (de) * 2004-10-08 2006-06-29 Infineon Technologies Ag Halbleitermodul mit einem internen Halbleiterchipstapel und Verfahren zur Herstellung desselben
US7215031B2 (en) 2004-11-10 2007-05-08 Oki Electric Industry Co., Ltd. Multi chip package
JP4622469B2 (ja) * 2004-11-12 2011-02-02 ソニー株式会社 回路基板、回路基板製造方法、及び半導体装置
US7217995B2 (en) 2004-11-12 2007-05-15 Macronix International Co., Ltd. Apparatus for stacking electrical components using insulated and interconnecting via
JP4354398B2 (ja) 2004-12-27 2009-10-28 三菱重工業株式会社 半導体装置及びその製造方法
TWI255536B (en) 2005-02-02 2006-05-21 Siliconware Precision Industries Co Ltd Chip-stacked semiconductor package and fabrication method thereof
US7271026B2 (en) 2005-03-14 2007-09-18 Infineon Technologies Ag Method for producing chip stacks and chip stacks formed by integrated devices
US7132754B1 (en) 2005-03-17 2006-11-07 Alfred E. Mann Foundation For Scientific Research Flip chip stack
US7317256B2 (en) 2005-06-01 2008-01-08 Intel Corporation Electronic packaging including die with through silicon via
US7297574B2 (en) 2005-06-17 2007-11-20 Infineon Technologies Ag Multi-chip device and method for producing a multi-chip device
KR100630761B1 (ko) 2005-08-23 2006-10-02 삼성전자주식회사 메모리 집적도가 다른 2개의 반도체 메모리 칩들을내장하는 반도체 멀티칩 패키지
US7358616B2 (en) * 2005-09-14 2008-04-15 Freescale Semiconductor, Inc. Semiconductor stacked die/wafer configuration and packaging and method thereof
US20070076502A1 (en) 2005-09-30 2007-04-05 Pyeon Hong B Daisy chain cascading devices
US7652922B2 (en) 2005-09-30 2010-01-26 Mosaid Technologies Incorporated Multiple independent serial link memory
US7307348B2 (en) 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
US7826243B2 (en) * 2005-12-29 2010-11-02 Bitmicro Networks, Inc. Multiple chip module and package stacking for storage devices
JP4753725B2 (ja) 2006-01-20 2011-08-24 エルピーダメモリ株式会社 積層型半導体装置
JP4777807B2 (ja) 2006-03-29 2011-09-21 エルピーダメモリ株式会社 積層メモリ
DE102006017947B4 (de) 2006-04-18 2008-02-21 Qimonda Ag Speicherbaustein, entsprechende Baugruppe sowie entsprechendes Herstellungsverfahren
US7629675B2 (en) 2006-05-03 2009-12-08 Marvell International Technology Ltd. System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices
JP5065618B2 (ja) * 2006-05-16 2012-11-07 株式会社日立製作所 メモリモジュール
US7745942B2 (en) 2006-06-21 2010-06-29 Micron Technology, Inc. Die package and probe card structures and fabrication methods
US20080122040A1 (en) 2006-06-29 2008-05-29 Icemos Technology Corporation Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter
JP4791924B2 (ja) * 2006-09-22 2011-10-12 株式会社東芝 半導体記憶装置
JP2008091627A (ja) * 2006-10-02 2008-04-17 Toshiba Corp 半導体集積チップ及び半導体装置
JP2008299997A (ja) * 2007-06-01 2008-12-11 Toshiba Corp 半導体記憶装置
US7791175B2 (en) * 2007-12-20 2010-09-07 Mosaid Technologies Incorporated Method for stacking serially-connected integrated circuits and multi-chip device made from same
JP5099780B2 (ja) * 2008-01-18 2012-12-19 独立行政法人産業技術総合研究所 ３次元集積回路
TWI389291B (zh) 2008-05-13 2013-03-11 財團法人工業技術研究院 三維堆疊晶粒封裝結構
JP2010021306A (ja) * 2008-07-10 2010-01-28 Hitachi Ltd 半導体装置
JP4977101B2 (ja) * 2008-08-26 2012-07-18 株式会社東芝 積層型半導体装置
JP2011166026A (ja) * 2010-02-12 2011-08-25 Elpida Memory Inc 半導体装置
JP5640406B2 (ja) 2010-03-12 2014-12-17 株式会社リコー 半導電性複合樹脂

Similar Documents

Publication Publication Date Title
JP2011508936A5 (https=)
CN104321863B (zh) 带有多个管芯的封装基板
CN105874420B (zh) 对数据进行压缩的系统和方法
TW200721441A (en) Integrated circuit package having stacked integrated circuits and method therefor
CN104871248B (zh) 集成mram高速缓存模块
CN102683331B (zh) 侧装控制器及其制造方法
AU2018260954A1 (en) Thermal management for solid-state drive
EP2884535A3 (en) Packaging DRAM and SOC in an IC package
Karim et al. Power comparison of 2D, 3D and 2.5 D interconnect solutions and power optimization of interposer interconnects
JP2018525825A5 (https=)
JP2016502223A5 (https=)
CN101770439A (zh) 电子系统与其操作方法
TWI907518B (zh) 電子設備
EP2760048A3 (en) Manufacturing method of semiconductor device
CN108054152A (zh) 集成电路封装结构
JP2012508968A (ja) 封止された複数の半導体チップを備えたソリッドステートドライブまたは他の記憶装置
US20060268519A1 (en) Method and stacked memory structure for implementing enhanced cooling of memory devices
US20180374774A1 (en) Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology
US10847439B2 (en) Heat spreaders for use with semiconductor devices
TWI443802B (zh) 三維晶片之突波型態層識別編號檢測器及其方法
US9741686B2 (en) Electronic package and method of connecting a first die to a second die to form an electronic package
US9059053B2 (en) Multi-die stack structure
US8456881B2 (en) Stacked memory and devices including the same
US20240421025A1 (en) Enhanced i/o semiconductor chip package and cooling assembly having side i/os
CN204497215U (zh) 半导体封装体