CN105789918B - 一种分离电路的元器件堆积式连接实现方法及电路 - Google Patents

一种分离电路的元器件堆积式连接实现方法及电路 Download PDF

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CN105789918B
CN105789918B CN201610259246.XA CN201610259246A CN105789918B CN 105789918 B CN105789918 B CN 105789918B CN 201610259246 A CN201610259246 A CN 201610259246A CN 105789918 B CN105789918 B CN 105789918B
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circuit
component
welded
implementation method
resistance
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CN105789918A (zh
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郑溥
郑一溥
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Shenzhen Xilong Toys Co Ltd
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Shenzhen Xilong Toys Co Ltd
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Priority to US15/258,788 priority patent/US9894791B2/en
Priority to JP2018555655A priority patent/JP6704066B2/ja
Priority to PCT/CN2017/081429 priority patent/WO2017186058A1/zh
Priority to US15/860,103 priority patent/US10455717B2/en
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Publication of CN105789918B publication Critical patent/CN105789918B/zh
Priority to US16/521,317 priority patent/US11116100B2/en
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Abstract

本发明一种分离电路的元器件堆积式连接实现方法及电路，其方法设置针对电路中用于串联和/或并联的至少两个电路元器件，其中，依照电路的连接结构，将元器件的对应引脚直接焊接，使元器件依照电路需要的连接方式形成组合模块，省却电路板和连接导线。本发明分离电路的元器件堆积式连接实现方法及电路，由于采用了模块化的元器件，以及在元器件上设置的方便焊接的焊接盘，从而无需PCB电路板的存在，而仅仅依靠元器件之间的焊接拼接即可形成电路单元，从而形成节约电路板空间的电路，并且其设计实现方式可以在三维空间内进行，比现有技术的PCB限制在电路板平面内的电路具有更宽的设计空间，而且可以缩短从设计到制作电路的时间。

Description

一种分离电路的元器件堆积式连接实现方法及电路
技术领域
本发明涉及一种电路硬件实现方法及相关电路，尤其涉及的是一种全新的电路制作方法和由此形成的电路装置。
背景技术
现有技术中的电路设置方式中，除了集成电路采用的是高度集成的电路方式，大部分的传统电路和集成电路芯片周边电路依然需要采用分离电路，也即电路元器件需要采用分离的电路元器件依照电路原理图进行电路连接，从而实现电路功能。
常见的分离电路元件器主要是包括电阻，电容，二极管，三极管等，传统的电路元器件采用的是接插脚焊接的方式，焊接在印刷电路板上；当然简单的电路也可以直接通过导线连接，例如某些实验单元电路。
随着电路加工工艺的进步，特别是为方便自动焊接加工工艺，目前的分离电路元器件已经不再使用接插脚焊接的方式，而是将电阻、二极管、三极管等元器件设计成贴片元器件的方式，尤其是跟集成电路芯片的贴片加工工艺通用，可以通过贴片自动焊接机，将各贴片元器件贴装到印刷电路板上。
然而上述不管是传统的接插脚焊接技术，还是贴片元器件的贴装加工工艺，都通常是将元器件焊接到印刷电路板上，而印刷电路板即PCB板，通常是预先设计好后通过PCB板加工工厂将电路板预先加工好，以便将绝大部分导线预先印刷到一个平板的绝缘材料上，依照预先设计的电路结构在该绝缘材料上进行线路的印刷。
这种传统的电路设计受制于电路板的平面印刷工艺，整个电路受电路板的尺寸限制，而且电路需要在电路板的平面内进行布局和形成；并且由于需要使用电路板，其空间尺寸无法灵活设计，设计实现的电路板体积也无法适应小体积的产品。
因此，现有技术还有待于改进和发展。
发明内容
本发明的目的在于提供一种分离电路的元器件堆积式连接实现方法及电路，可以在三维空间内考虑其电路的实现方式，并且无需印刷电路板和导线，实现一种简单却不受限制的自由电路及其实现方法。
本发明的技术方案如下：
一种分离电路的元器件堆积式连接实现方法，其设置针对电路中用于串联和/或并联的至少两个电路元器件，其中，依照电路的连接结构，将元器件的对应引脚直接焊接，使元器件依照电路需要的连接方式形成组合模块，省却电路板和连接导线。
所述的元器件堆积式连接实现方法，其中，所述元器件包括电阻，所述电阻设置为方体形状，并在至少两端侧面上设置有焊接盘。
所述的元器件堆积式连接实现方法，其中，所述电阻还在至少一个体侧侧面上设置有与对应的端侧面上焊接盘电性连接的焊接盘。
所述的元器件堆积式连接实现方法，其中，所述电阻在所述体侧侧面上设置的焊接盘长度设置超过该侧面的一半长度。
所述的元器件堆积式连接实现方法，其中，所述元器件还包括一二极管，所述二极管设置为方体形状，并且设置有区分不同电流方向的两焊接盘。
所述的元器件堆积式连接实现方法，其中，所述元器件还包括一三极管，所述三极管设置为方体形状，并在方体形状中设置具有包括基极、集电极以及发射极三个不同焊接盘。
所述的元器件堆积式连接实现方法，其中，所述三极管的三个焊接盘设置为依次的三个模块，并且所述基极设置在中间位置。
一种分离电路的模块化电路，其中，所述分离电路中包括用于串联和/或并联的至少两个电路元器件；所述电路元器件依照电路的连接结构，将元器件的对应引脚直接焊接，使元器件依照电路需要的连接方式形成组合模块，省却电路板和连接导线。
所述的模块化电路，其中，所述元器件包括电阻，所述电阻设置为方体形状，并在至少两端侧面上设置有焊接盘。
所述的模块化电路，其中，所述元器件包括二极管，所述二极管设置为方体形状，并且设置有区分不同电流方向的两焊接盘。
所述的模块化电路，其中，所述元器件还包括一三极管，所述三极管设置为方体形状，并在方体形状中设置具有包括基极、集电极以及发射极三个不同焊接盘。
本发明所提供的一种分离电路的元器件堆积式连接实现方法及电路，由于采用了模块化的元器件，以及在元器件上设置的方便焊接的焊接盘，从而可以以搭积木的方式进行焊接连接形成电路单元，从而实现方便设计和加工的电路，这种电路无需PCB电路板的存在，而仅仅依靠元器件之间的焊接拼接即可形成电路单元，从而形成节约电路板空间的电路，突破二维电路板的限制，并且其设计实现方式不限于二维平面内的电路板焊接加工，可以在三维空间内进行元器件之间的直接焊接实现电路，比现有技术的PCB限制在电路板平面内的电路具有更宽的设计空间，而且可以缩短从设计到制作电路的时间。
附图说明
图1为本发明第一较佳实施例的电路原理图。
图2为图1所示电路原理图对应的现有技术电路板示意图。
图3为图1所示电路原理图对应的本发明电路模块示意图。
图4为图3所示的电路原理图对应的本发明电路模块化产品示意图。
图5a为本发明电路中的最基本连接方式示意图，即串联方式的焊接连接图示。
图5b为本发明电路中的最基本连接方式示意图，即并联方式的焊接连接图示。
图6为图5a所示堆叠方式的其他同等实现方案示意图。
图7为本发明第二较佳实施例的电路原理图示意图。
图8为图7所示电路原理图对应的本发明电路模块示意图。
图9为图7所示电路原理图对应的本发明电路模块化产品示意图。
具体实施方式
以下对本发明的较佳实施例加以详细说明。
本发明所提供的一种分离电路的元器件堆积式连接实现方法，其设置针对了电路中用于串联和/或并联的至少两个电路元器件，本发明方法和电路无需利用电路板，而是将电路元器件设置成规则的形状，进行相互插接或焊接的方式实现模块化堆积式电路，从电路的稳定性角度焊接优先于插接。由于采用模块化堆积式的电路结构，可以针对较为简单的电路进行自由的三维空间设计，从而突破现有电路依赖于PCB板电路板需要在平面内设计电路的思维方式。当然，针对较为复杂的电路结构，需要利用数学的拓扑结构原理进行设计，并且较为复杂电路的核心部分可以采用集成电路设计，并将集成电路芯片设计成符合本发明模块化电路的模块方式，以方便焊接形成工作电路。
本发明电路中的各元器件可以依照电路原理图的连接结构要求，将元器件进行合适的堆叠，并将对应引脚直接焊接或插接等使电性导通的连接方式，使元器件依照电路原理图需要的连接方式形成组合模块和堆积化，省却电路板和连接导线，从而可以形成体积较小且体积较为灵活的设计方式，可以根据产品的电路所在空间要求形成立体的电路模块，实现电路功能。
本发明所述元器件堆积式连接实现方法以及电路结构中，所述元器件包括电阻R10、R20，如图1所示，电阻R1、R2、R3，如图7所示，每一电阻除了阻值不同外，其结构设置类似，主要设置所述电阻为方体形状，例如长方体，具体尺寸可以根据实际的需要设置，也可以根据电性特点例如散热要求设置成不同的尺寸标准，在每一电阻上，在至少两端侧面上设置有焊接盘110。这样电阻在串联是就可以端对端的焊接连接延伸设置。
更好的是，将所述电阻还可以设置成从端面到体侧侧面延伸的焊接盘，即L型焊接盘，即在至少一个体侧侧面上设置有与对应的端侧面上焊接盘电性连接的焊接盘，并可以设置所述电阻在所述体侧侧面上设置的焊接盘长度设置超过该侧面的一半长度，如图3和图4所示。
具体的连接原理如图5a和图5b所示，如图5a所示的，串联时的焊接方式是将并排设置的两个元器件将超过侧面长度一半的焊接盘进行焊接，这样就相当于将两个电阻进行串联；如图5b所示的，并联时，可以将所述两个元器件的两侧段焊接盘分别向两侧两个侧面上进行延伸设置，从而在并排设置两个元器件时，进行两端的焊接盘之间焊接即可，从而形成并联连接。图5a和图5b所示为本发明两个基本的连接单元方式，其他各种串并联的电路结构分别通过上述两种基本连接方式的组合实现，而针对不同的连接方式，本发明所述元器件上的焊接盘可以设置采用不同的结构特点，如图5a中的L形焊接盘结构就是适合于串联的结构，而图5b中的方C形焊接盘结构就是适合于并联的结构。在本发明的元器件焊接盘结构设置中，可以设置不同的结构标准以区别电阻的串联方式和并联方式，以及其他元器件的结构方式，尤其是二极管的极性设置等，这些结构的标准都有待于进一步发展。
如图2所示为现有技术的PCB板电路实现方式的电路板示意图，其各个元器件需要贴片焊接或插接焊接在预先印刷好的电路板上预留位置上，所形成的电路产品显然与本发明产品不同，本发明产品形成后将具有模块化的结构，并且可以在相应设计的情况下，形成独特的插接外形，例如除了适应电路所在空间之外，还可以形成不同的空间形状，例如人或物。
在本发明所述的元器件堆积式连接实现方法及其电路模块中，所述元器件还包括具有极性连接方向的元器件，例如二极管，如图3和图4所示，所述二极管可以设置为与电阻相同的形状，也设置为方体形状，更好的是，将二极管的连接方向设置成有区别不同电流方向的两焊接盘，例如在正极增加标识的图案或凸点等，更加有效的设计方式，是可以设置不对称的焊接盘，从而保证对二极管极性使用的保证。
本发明所述元器件堆积式连接实现方法及其电路中，所述元器件还包括更多焊接盘的元器件，例如三极管以及集成电路芯片等，所述三极管也设置为方体形状，并在方体形状中设置具有包括基极、集电极以及发射极三个不同焊接盘，如图8和图9所示的放大叠加电路，可以应用与感应开关中。所述三极管设置为E、B、C三个焊接盘，其中，所述基极模块即B模块设置在中间位置（在不同的焊接结构要求下，三个引脚的焊接盘也可以有其他的结构设置，例如将基极B模块设置在一端侧），并在整个三极管产品上一侧面设置为绝缘面，从而在相应的其他侧面与电阻或二极管等其他元器件连接，具体连接后的模块化产品如图9所示，但具体的产品拓扑结构并不限于上述组合方式，并且其电路元器件的设计焊接盘方式也并不受各实施例具体示例的限制，如图6所示，也可以采用其他的堆叠方式实现图5a的串接，由于没有电路板的平面和框架限制，本发明所述堆叠方式其实现电路的可能性远超过传统的PCB板方式，具有更灵活的设计空间。
本发明的分离电路模块化电路，所述分离电路中包括了用于串联和/或并联的至少两个电路元器件；所述电路元器件依照电路的连接结构，将元器件的对应引脚直接焊接，使元器件依照电路需要的连接方式形成组合模块，省却了电路板和连接导线。其中，所述元器件包括电阻，二极管，三极管等，都设置为方体形状，并设置用于焊接的焊接盘。不管是较为简单的电路和稍微复杂的分离电路中，通过本发明的上述模块化焊接结构，可以实现无需电路板和导线的电路模块，从而方便实现较小空间内的电路产品，并且其设计空间自由，有利于生产出全新的电路模块。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本发明所附权利要求的保护范围。

Claims (11)

1.一种分离电路的元器件堆积式连接实现方法，其设置针对电路中用于串联和/或并联的至少两个电路元器件，其特征在于，依照电路的连接结构，将元器件的对应引脚直接焊接，使元器件依照电路需要的连接方式形成组合模块，省却电路板和连接导线；
所述元器件设置为方体形状，在端侧面或体侧侧面上设置焊接盘；
所述元器件以堆叠方式形成电路，不受电路板的平面和框架限制。
2.根据权利要求1所述的元器件堆积式连接实现方法，其特征在于，所述元器件包括电阻，所述电阻在至少两端侧面上设置有焊接盘。
3.根据权利要求2所述的元器件堆积式连接实现方法，其特征在于，所述电阻还在至少一个体侧侧面上设置有与对应的端侧面上焊接盘电性连接的焊接盘。
4.根据权利要求3所述的元器件堆积式连接实现方法，其特征在于，所述电阻在所述体侧侧面上设置的焊接盘长度设置超过该侧面的一半长度。
5.根据权利要求1所述的元器件堆积式连接实现方法，其特征在于，所述元器件还包括一二极管，所述二极管设置有区分不同电流方向的两焊接盘。
6.根据权利要求1所述的元器件堆积式连接实现方法，其特征在于，所述元器件还包括一三极管，所述三极管在方体形状中设置具有包括基极、集电极以及发射极三个不同焊接盘。
7.根据权利要求6所述的元器件堆积式连接实现方法，其特征在于，所述三极管的三个焊接盘设置为依次的三个模块，并且所述基极设置在中间位置。
8.一种分离电路的模块化电路，其特征在于，所述分离电路中包括用于串联和/或并联的至少两个电路元器件；所述电路元器件依照电路的连接结构，将元器件的对应引脚直接焊接，使元器件依照电路需要的连接方式形成组合模块，省却电路板和连接导线；
所述元器件设置为方体形状，在端侧面或体侧侧面上设置焊接盘；
所述元器件以堆叠方式形成电路，不受电路板的平面和框架限制。
9.根据权利要求8所述的模块化电路，其特征在于，所述元器件包括电阻，所述电阻在至少两端侧面上设置有焊接盘。
10.根据权利要求8所述的模块化电路，其特征在于，所述元器件包括二极管，所述二极管设置有区分不同电流方向的两焊接盘。
11.根据权利要求8所述的模块化电路，其特征在于，所述元器件还包括一三极管，所述三极管在方体形状中设置具有包括基极、集电极以及发射极三个不同焊接盘。
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