JP6704066B2 - 分離回路の部品の集積接続の実現方法及び回路 - Google Patents
分離回路の部品の集積接続の実現方法及び回路 Download PDFInfo
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- JP6704066B2 JP6704066B2 JP2018555655A JP2018555655A JP6704066B2 JP 6704066 B2 JP6704066 B2 JP 6704066B2 JP 2018555655 A JP2018555655 A JP 2018555655A JP 2018555655 A JP2018555655 A JP 2018555655A JP 6704066 B2 JP6704066 B2 JP 6704066B2
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- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
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Description
回路の直列及び/又は並列用の少なくとも3つの回路部品が配置され、当該部品のそれぞれが少なくとも1つの絶縁面及びピンを含み、回路の接続構造に従って、第1部品の第1のピンを第2部品の第1のピンにはんだ付けで直接接続し、前記第1部品の第2のピンを第3部品の第1のピンにはんだ付けで直接接続し、前記第2部品の絶縁面を前記第3部品の絶縁面に直接接続し、これら部品を回路の所望の接続方式に従って組合せモジュールとして形成することによって、回路基板及び接続導線を省略する分離回路の部品の集積接続の実現方法である。
Claims (11)
- 回路の直列及び/又は並列用の少なくとも3つの回路部品が配置される分離回路の部品の集積接続の実現方法であって、当該部品のそれぞれが少なくとも1つの絶縁面及びピンを含み、回路の接続構造に従って、第1部品の第1のピンを第2部品の第1のピンにはんだ付けで直接接続し、前記第1部品の第2のピンを第3部品の第1のピンにはんだ付けで直接接続し、前記第2部品の絶縁面を前記第3部品の絶縁面に直接接続し、これら部品を回路の所望の接続方式に従って組合せモジュールとして形成することを特徴とする分離回路の部品の集積接続の実現方法。
- 前記第2及び第3部品のいずれかは、方体形状の抵抗を含み、前記ピンを構成するはんだ付けパッドが前記抵抗の少なくとも一端面及び前記一端面と対向する他端面上に配置されていることを特徴とする請求項1に記載の部品の集積接続の実現方法。
- 前記抵抗の前記一端面と前記他端面との間の少なくとも一つの側面上には、前記一端面上の前記はんだ付けパッドと電気的に接続されるはんだ付けパッドがさらに配置されていることを特徴とする請求項2に記載の部品の集積接続の実現方法。
- 前記抵抗の前記側面上に配置されるはんだ付けパッドの長さが、当該側面の長さの半分を超えるように設定することを特徴とする請求項3に記載の部品の集積接続の実現方法。
- 前記第2及び第3部品のいずれかは、異なる電流方向を区別する2つの前記ピンを構成するはんだ付けパッドが配置される方体形状のダイオードをさらに含むことを特徴とする請求項1に記載の部品の集積接続の実現方法。
- 前記第1部品は、ベース電極、コレクタ電極及びエミッタ電極の三つの異なる前記ピンを構成するはんだ付けパッドを含む方体形状のトランジスタをさらに含むことを特徴とする請求項1に記載の部品の集積接続の実現方法。
- 前記トランジスタの三つのはんだ付けパッドを、一列に配置し、前記ベース電極のはんだ付けパッドを中央位置に配置することを特徴とする請求項6に記載の部品の集積接続の実現方法。
- 分離回路に直列及び/又は並列用の少なくとも3つの回路部品が含まれ、当該部品のそれぞれが少なくとも1つの絶縁面及びピンを含み、回路の接続構造に従って、第1部品の第1のピンが第2部品の第1のピンにはんだ付けで直接接続され、前記第1部品の第2のピンが第3部品の第1のピンにはんだ付けで直接接続され、前記第2部品の絶縁面が前記第3部品の絶縁面に直接接続され、これら部品が回路の所望の接続方式に従って組合せモジュールとして形成されていることを特徴とする分離回路のモジュール化回路。
- 前記第2及び第3部品のいずれかは、方体形状の抵抗を含み、前記ピンを構成するはんだ付けパッドが前記抵抗の少なくとも一端面及び前記一端面と対向する他端面上に配置されていることを特徴とする請求項8に記載のモジュール化回路。
- 前記第2及び第3部品のいずれかは、異なる電流方向を区別する2つの前記ピンを構成するはんだ付けパッドが配置される方体形状のダイオードをさらに含むことを特徴とする請求項8に記載のモジュール化回路。
- 前記第1部品は、ベース電極、コレクタ電極及びエミッタ電極の三つの異なる前記ピンを構成するはんだ付けパッドを含む方体形状のトランジスタをさらに含むことを特徴とする請求項8に記載のモジュール化回路。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610259246.X | 2016-04-25 | ||
CN201610259246.XA CN105789918B (zh) | 2016-04-25 | 2016-04-25 | 一种分离电路的元器件堆积式连接实现方法及电路 |
PCT/CN2017/081429 WO2017186058A1 (zh) | 2016-04-25 | 2017-04-21 | 一种分离电路的元器件堆积式连接实现方法及电路 |
Publications (3)
Publication Number | Publication Date |
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JP2019514227A JP2019514227A (ja) | 2019-05-30 |
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JPS58200562A (ja) * | 1982-05-18 | 1983-11-22 | Mitsubishi Electric Corp | トランジスタスタツク |
EP0135633B1 (en) * | 1983-09-29 | 1986-12-30 | Lee, Lan-Ying | A combinative electronic circuit element with multidirectionally adjustable joints |
JPH02207562A (ja) * | 1989-02-08 | 1990-08-17 | Hitachi Ltd | モジュールの実装構造 |
CN2290378Y (zh) * | 1997-04-30 | 1998-09-09 | 尤伟长 | 万用电子积木电子元器件 |
US6320255B1 (en) * | 1998-10-09 | 2001-11-20 | Texas Instruments Incorporated | Rerouted semiconductor device and method of fabrication |
CN2475179Y (zh) * | 2000-12-11 | 2002-01-30 | 龙彬发 | 积木式组合电子元件连接器 |
JP4003578B2 (ja) * | 2001-08-09 | 2007-11-07 | 株式会社デンソー | 半導体装置とその製造方法 |
JP2004014687A (ja) * | 2002-06-05 | 2004-01-15 | Taiyo Yuden Co Ltd | コンデンサモジュール及びコンデンサアレイ実装用中継基板 |
DE20210306U1 (de) * | 2002-07-03 | 2002-08-29 | Kopp Heinrich Ag | Leiterplattenvorrichtung |
CN2728100Y (zh) * | 2004-04-14 | 2005-09-21 | 韩克水 | 集成石英晶体表面贴装元器件 |
JP3119039U (ja) * | 2005-10-05 | 2006-02-16 | 興夫 荒井 | 3次元ジグソーパズル式電子回路学習教材用装置 |
TWI303543B (en) * | 2006-10-16 | 2008-11-21 | Delta Electronics Inc | Stacked electronic device and the clipping device thereof |
US20080217754A1 (en) * | 2007-03-08 | 2008-09-11 | Kabushiki Kaisha Toshiba | Semiconductor device and manufacturing method thereof |
JP2008252058A (ja) * | 2007-03-08 | 2008-10-16 | Toshiba Corp | 半導体装置及びその製造方法 |
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