DE60310907D1 - Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat - Google Patents

Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat

Info

Publication number
DE60310907D1
DE60310907D1 DE60310907T DE60310907T DE60310907D1 DE 60310907 D1 DE60310907 D1 DE 60310907D1 DE 60310907 T DE60310907 T DE 60310907T DE 60310907 T DE60310907 T DE 60310907T DE 60310907 D1 DE60310907 D1 DE 60310907D1
Authority
DE
Germany
Prior art keywords
substrate
applying multilayer
multilayer surfaces
applying
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310907T
Other languages
English (en)
Other versions
DE60310907T2 (de
Inventor
Chris Pagano
Jeffrey Nelson
E Burrows
Edward Gross
R Zumhoff
Maclyn Martin
C Bonham
Lee Graff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Vitex Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitex Systems Inc filed Critical Vitex Systems Inc
Publication of DE60310907D1 publication Critical patent/DE60310907D1/de
Application granted granted Critical
Publication of DE60310907T2 publication Critical patent/DE60310907T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
DE60310907T 2002-04-15 2003-04-14 Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat Expired - Lifetime DE60310907T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37255902P 2002-04-15 2002-04-15
US372559P 2002-04-15
US10/412,133 US8808457B2 (en) 2002-04-15 2003-04-11 Apparatus for depositing a multilayer coating on discrete sheets
US412133 2003-04-11
PCT/US2003/011480 WO2003090260A2 (en) 2002-04-15 2003-04-14 Apparatus for depositing a multilayer coating on discrete sheets

Publications (2)

Publication Number Publication Date
DE60310907D1 true DE60310907D1 (de) 2007-02-15
DE60310907T2 DE60310907T2 (de) 2007-10-25

Family

ID=29254493

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60310907T Expired - Lifetime DE60310907T2 (de) 2002-04-15 2003-04-14 Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat

Country Status (9)

Country Link
US (2) US8808457B2 (de)
EP (2) EP1758181A3 (de)
JP (1) JP4677644B2 (de)
KR (1) KR100934544B1 (de)
CN (2) CN100358091C (de)
AU (1) AU2003228522A1 (de)
DE (1) DE60310907T2 (de)
TW (1) TWI319626B (de)
WO (1) WO2003090260A2 (de)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US20070196682A1 (en) * 1999-10-25 2007-08-23 Visser Robert J Three dimensional multilayer barrier and method of making
US20090191342A1 (en) * 1999-10-25 2009-07-30 Vitex Systems, Inc. Method for edge sealing barrier films
DE10142043C2 (de) * 2001-08-28 2003-08-21 Avery Dennison Zweckform Offic Kartenbogen
US20090208754A1 (en) * 2001-09-28 2009-08-20 Vitex Systems, Inc. Method for edge sealing barrier films
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) * 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8003184B2 (en) * 2002-08-28 2011-08-23 Avery Dennison Corporation Clean edged cards on plastic carrier
US7510913B2 (en) * 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7011529B2 (en) * 2004-03-01 2006-03-14 Anritsu Company Hermetic glass bead assembly having high frequency compensation
US20050255253A1 (en) * 2004-05-13 2005-11-17 White John M Apparatus and methods for curing ink on a substrate using an electron beam
US20050253917A1 (en) * 2004-05-13 2005-11-17 Quanyuan Shang Method for forming color filters in flat panel displays by inkjetting
DE102004024461A1 (de) * 2004-05-14 2005-12-01 Konarka Technologies, Inc., Lowell Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauelements mit zumindest einer aktiven organischen Schicht
US20060088656A1 (en) * 2004-10-25 2006-04-27 Eastman Kodak Company Manufacturing donor substrates for making OLED displays
US7413272B2 (en) * 2004-11-04 2008-08-19 Applied Materials, Inc. Methods and apparatus for precision control of print head assemblies
US20070042113A1 (en) * 2004-11-04 2007-02-22 Applied Materials, Inc. Methods and apparatus for inkjet printing color filters for displays using pattern data
US20060093751A1 (en) * 2004-11-04 2006-05-04 Applied Materials, Inc. System and methods for inkjet printing for flat panel displays
US7556334B2 (en) * 2004-11-04 2009-07-07 Applied Materials, Inc. Methods and apparatus for aligning print heads
US20060092218A1 (en) * 2004-11-04 2006-05-04 Applied Materials, Inc. Methods and apparatus for inkjet printing
US20060109296A1 (en) * 2004-11-04 2006-05-25 Bassam Shamoun Methods and apparatus for inkjet printing color filters for displays
US20060159843A1 (en) * 2005-01-18 2006-07-20 Applied Materials, Inc. Method of substrate treatment for manufacturing of color filters by inkjet printing systems
US20060185587A1 (en) * 2005-02-18 2006-08-24 Applied Materials, Inc. Methods and apparatus for reducing ink conglomerates during inkjet printing for flat panel display manufacturing
EP1717339A2 (de) * 2005-04-20 2006-11-02 Applied Films GmbH & Co. KG Kontinuierliche Beschichtungsanlage
ATE392490T1 (de) * 2005-04-20 2008-05-15 Applied Materials Gmbh & Co Kg Magnetische maskenhalterung
EP1715076B1 (de) * 2005-04-20 2009-07-22 Applied Materials GmbH & Co. KG Verfahren und Vorrichtung zur Maskenpositionierung
US20070015847A1 (en) * 2005-07-15 2007-01-18 Applied Materials, Inc. Red printing ink for color filter applications
US7544723B2 (en) * 2005-07-15 2009-06-09 Applied Materials, Inc. Blue printing ink for color filter applications
KR20070014986A (ko) * 2005-07-28 2007-02-01 어플라이드 머티어리얼스, 인코포레이티드 동시적인 잉크젯 프린팅 및 결함 검사를 위한 방법 및 장치
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US20070070132A1 (en) * 2005-09-27 2007-03-29 Fan-Cheung Sze Inkjet delivery module
US7611217B2 (en) * 2005-09-29 2009-11-03 Applied Materials, Inc. Methods and systems for inkjet drop positioning
US20080018677A1 (en) * 2005-09-29 2008-01-24 White John M Methods and apparatus for inkjet print head cleaning using an inflatable bladder
US20070068560A1 (en) * 2005-09-29 2007-03-29 Quanyuan Shang Methods and apparatus for inkjet print head cleaning
US20070076040A1 (en) * 2005-09-29 2007-04-05 Applied Materials, Inc. Methods and apparatus for inkjet nozzle calibration
US20070070109A1 (en) * 2005-09-29 2007-03-29 White John M Methods and systems for calibration of inkjet drop positioning
US7508130B2 (en) 2005-11-18 2009-03-24 Eastman Kodak Company OLED device having improved light output
TWI328520B (en) * 2006-02-07 2010-08-11 Applied Materials Inc Methods and apparatus for reducing irregularities in color filters
CN101045395A (zh) * 2006-03-24 2007-10-03 应用材料股份有限公司 用于采用多组打印头的喷墨打印的方法和装置
JP2007294398A (ja) * 2006-03-30 2007-11-08 Canon Inc 有機デバイスの製造方法
US20070252863A1 (en) * 2006-04-29 2007-11-01 Lizhong Sun Methods and apparatus for maintaining inkjet print heads using parking structures with spray mechanisms
US20070263026A1 (en) * 2006-04-29 2007-11-15 Quanyuan Shang Methods and apparatus for maintaining inkjet print heads using parking structures
US20070256709A1 (en) * 2006-04-29 2007-11-08 Quanyuan Shang Methods and apparatus for operating an inkjet printing system
CN100487157C (zh) * 2006-05-19 2009-05-13 中国科学院半导体研究所 用于制备有机/无机薄膜的有机分子束沉积设备
JP4796677B2 (ja) * 2006-06-14 2011-10-19 トッキ株式会社 封止膜形成装置及び封止膜形成方法
WO2008013902A2 (en) * 2006-07-28 2008-01-31 Applied Materials, Inc. Methods and apparatus for improved manufacturing of color filters
US20080204501A1 (en) * 2006-12-01 2008-08-28 Shinichi Kurita Inkjet print head pressure regulator
US7646144B2 (en) 2006-12-27 2010-01-12 Eastman Kodak Company OLED with protective bi-layer electrode
US7750558B2 (en) 2006-12-27 2010-07-06 Global Oled Technology Llc OLED with protective electrode
JP2008171001A (ja) * 2007-01-11 2008-07-24 Applied Materials Inc 共通軸周囲を回転可能な複数のプリントヘッドを用いて、処理量を増加するための方法、装置及びシステム
US8174187B2 (en) 2007-01-15 2012-05-08 Global Oled Technology Llc Light-emitting device having improved light output
US7857413B2 (en) 2007-03-01 2010-12-28 Applied Materials, Inc. Systems and methods for controlling and testing jetting stability in inkjet print heads
US20080259101A1 (en) * 2007-03-23 2008-10-23 Applied Materials, Inc. Methods and apparatus for minimizing the number of print passes in flat panel display manufacturing
US7560747B2 (en) 2007-05-01 2009-07-14 Eastman Kodak Company Light-emitting device having improved light output
US7722422B2 (en) 2007-05-21 2010-05-25 Global Oled Technology Llc Device and method for improved power distribution for a transparent electrode
CA2690303C (en) 2007-06-11 2016-10-18 Smith & Nephew, Inc. Ceramic layered medical implant
US7681986B2 (en) * 2007-06-12 2010-03-23 Applied Materials, Inc. Methods and apparatus for depositing ink onto substrates
US7637587B2 (en) * 2007-08-29 2009-12-29 Applied Materials, Inc. System and method for reliability testing and troubleshooting inkjet printers
US20090109250A1 (en) * 2007-10-26 2009-04-30 Johnston Benjamin M Method and apparatus for supporting a substrate
WO2009086494A2 (en) * 2007-12-27 2009-07-09 Exatec, Llc Multi-pass vacuum coating systems
EP2235131A4 (de) * 2007-12-28 2013-10-02 3M Innovative Properties Co Flexible einhüllfolien
WO2010002755A2 (en) * 2008-06-30 2010-01-07 3M Innovative Properties Company Method of making inorganic or inorganic/organic hybrid barrier films
US9337446B2 (en) * 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
US20100167002A1 (en) * 2008-12-30 2010-07-01 Vitex Systems, Inc. Method for encapsulating environmentally sensitive devices
US20100252606A1 (en) * 2009-04-03 2010-10-07 United Solar Ovonic Llc Roll-to-roll deposition apparatus with improved web transport system
US8590338B2 (en) * 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
KR101239575B1 (ko) * 2010-08-16 2013-03-05 고려대학교 산학협력단 기체 차단막 형성 장치 및 그 방법
EP2646594A1 (de) * 2010-12-01 2013-10-09 Applied Materials, Inc. Verdunstungsanlage und vakuumbeschichtungsvorrichtung
EP2689050A2 (de) * 2011-03-25 2014-01-29 LG Electronics Inc. Plasmaverstärkte chemiedampfabscheidungsvorrichtung und steuerverfahren dafür
CN103597625B (zh) * 2011-06-17 2017-07-11 应用材料公司 用于有机发光二极管处理的化学气相沉积掩模对准
KR101903054B1 (ko) * 2012-07-11 2018-10-02 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
KR102072799B1 (ko) 2012-09-12 2020-02-04 삼성디스플레이 주식회사 유기 발광 장치 및 이의 제조 방법
US20140166989A1 (en) * 2012-12-17 2014-06-19 Universal Display Corporation Manufacturing flexible organic electronic devices
CN106486601A (zh) * 2013-04-30 2017-03-08 成均馆大学校产学协力团 多层封装薄膜
KR102120896B1 (ko) 2013-07-25 2020-06-10 삼성디스플레이 주식회사 대향 타겟 스퍼터링 장치를 이용한 유기발광표시장치 및 그 제조방법
CN105018894A (zh) * 2014-04-18 2015-11-04 友威科技股份有限公司 真空设备多载具同时多工处理工艺
TWI565820B (zh) * 2015-08-06 2017-01-11 行政院原子能委員會核能研究所 卷對卷模組化電漿複合製程設備
US10550469B2 (en) * 2015-09-04 2020-02-04 Lam Research Corporation Plasma excitation for spatial atomic layer deposition (ALD) reactors
US10634397B2 (en) * 2015-09-17 2020-04-28 Purdue Research Foundation Devices, systems, and methods for the rapid transient cooling of pulsed heat sources
CN107251650B (zh) 2015-09-24 2021-06-01 积水化学工业株式会社 电子器件用密封剂及电子器件的制造方法
KR101857482B1 (ko) * 2016-04-25 2018-06-20 강흥석 박막증착장치 및 박막증착방법
CN113773681A (zh) 2016-10-19 2021-12-10 积水化学工业株式会社 有机el显示元件用密封剂
JP6404496B2 (ja) 2016-10-19 2018-10-10 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
CN113214604A (zh) 2016-10-19 2021-08-06 积水化学工业株式会社 有机el显示元件用密封剂以及有机el显示元件用密封剂的制造方法
KR20220061263A (ko) 2016-10-19 2022-05-12 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
KR102392860B1 (ko) 2016-10-19 2022-04-29 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
JP7303628B2 (ja) 2017-01-12 2023-07-05 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
US10886468B2 (en) * 2017-04-14 2021-01-05 Sakai Display Products Corporation Manufacturing method and manufacturing apparatus for organic EL display device
EP3396458A1 (de) * 2017-04-28 2018-10-31 ASML Netherlands B.V. Verfahren und vorrichtung zur optimierung eines lithographieverfahrens
KR20200016195A (ko) 2017-06-02 2020-02-14 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
WO2018225723A1 (ja) 2017-06-07 2018-12-13 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
WO2018230388A1 (ja) 2017-06-15 2018-12-20 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
KR102337035B1 (ko) 2017-06-30 2021-12-08 교리쯔 가가꾸 산교 가부시키가이샤 유기 el 소자의 밀봉용의 양이온 중합 경화형 잉크젯용 수지 조성물
CN110914469A (zh) * 2017-07-27 2020-03-24 瑞士艾发科技 渗透屏障
CN107482042B (zh) * 2017-08-18 2020-04-03 京东方科技集团股份有限公司 Oled显示基板及其制作方法、oled显示装置
CN111567143B (zh) 2017-12-15 2023-11-07 积水化学工业株式会社 电子设备用密封剂及有机el显示元件用密封剂
KR20240052999A (ko) 2017-12-15 2024-04-23 세키스이가가쿠 고교가부시키가이샤 전자 디바이스용 봉지제 및 유기 el 표시 소자용 봉지제
CN111837456A (zh) 2018-03-30 2020-10-27 积水化学工业株式会社 有机el显示元件用密封剂
JP7474052B2 (ja) 2018-03-30 2024-04-24 積水化学工業株式会社 有機ｅｌ表示素子用封止剤
KR20200141978A (ko) 2018-04-09 2020-12-21 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
CN111837457A (zh) 2018-04-20 2020-10-27 积水化学工业株式会社 有机el显示元件用密封剂
KR20200040537A (ko) * 2018-10-10 2020-04-20 엘지디스플레이 주식회사 측향식 진공증착용 소스, 소스 어셈블리 및 이를 이용한 측향식 진공증착 장치
KR102155569B1 (ko) * 2019-06-25 2020-09-15 한국표준과학연구원 Oled용 재료의 장시간 열안정성 평가를 위한 열처리 장치 및 oled용 재료의 정제 장치
WO2022169065A1 (ko) * 2021-02-08 2022-08-11 주식회사 넥서스비 롤투롤 원자층 증착 장치
CN114853362B (zh) * 2022-06-08 2023-12-26 宜昌南玻显示器件有限公司 应用于玻璃面板的镀膜方法及玻璃面板

Family Cites Families (384)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2382432A (en) * 1940-08-02 1945-08-14 Crown Cork & Seal Co Method and apparatus for depositing vaporized metal coatings
US2384500A (en) * 1942-07-08 1945-09-11 Crown Cork & Seal Co Apparatus and method of coating
US3475307A (en) 1965-02-04 1969-10-28 Continental Can Co Condensation of monomer vapors to increase polymerization rates in a glow discharge
US3496427A (en) 1966-01-13 1970-02-17 Gen Electric Semiconductor device with composite encapsulation
US3607365A (en) 1969-05-12 1971-09-21 Minnesota Mining & Mfg Vapor phase method of coating substrates with polymeric coating
US3661117A (en) 1969-12-03 1972-05-09 Stanford Research Inst Apparatus for depositing thin lines
US3941630A (en) 1974-04-29 1976-03-02 Rca Corporation Method of fabricating a charged couple radiation sensing device
US4055530A (en) 1975-02-27 1977-10-25 Standard Oil Company (Indiana) Aqueous dispersion of addition polymer of an alpha-beta-ethylenically unsaturated monomer and suspended polypropylene particles
US4098965A (en) 1977-01-24 1978-07-04 Polaroid Corporation Flat batteries and method of making the same
US4266223A (en) 1978-12-08 1981-05-05 W. H. Brady Co. Thin panel display
JPS55129345A (en) 1979-03-29 1980-10-07 Ulvac Corp Electron beam plate making method by vapor phase film formation and vapor phase development
US4313254A (en) * 1979-10-30 1982-02-02 The Johns Hopkins University Thin-film silicon solar cell with metal boride bottom electrode
US4581337A (en) 1983-07-07 1986-04-08 E. I. Du Pont De Nemours And Company Polyether polyamines as linking agents for particle reagents useful in immunoassays
US4426275A (en) 1981-11-27 1984-01-17 Deposition Technology, Inc. Sputtering device adaptable for coating heat-sensitive substrates
JPS58156848A (ja) 1982-03-15 1983-09-17 Fuji Photo Film Co Ltd イオン選択電極及びその製造法
JPS59138440A (ja) 1983-01-27 1984-08-08 豊田合成株式会社 セラミツクス被膜層を有する樹脂成形体
US4521458A (en) 1983-04-01 1985-06-04 Nelson Richard C Process for coating material with water resistant composition
DE3324106A1 (de) 1983-07-05 1985-01-17 Draiswerke Gmbh, 6800 Mannheim Verfahren zum beleimen von holz-spaenen und dergl. mit fluessigleim und vorrichtung zur durchfuehrung des verfahrens
US4710426A (en) 1983-11-28 1987-12-01 Polaroid Corporation, Patent Dept. Solar radiation-control articles with protective overlayer
US4557978A (en) 1983-12-12 1985-12-10 Primary Energy Research Corporation Electroactive polymeric thin films
DE3484793D1 (de) 1983-12-19 1991-08-14 Spectrum Control Inc Miniaturisierter monolithischer mehrschichtkondensator sowie geraet und verfahren zur herstellung.
US5032461A (en) 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
US4842893A (en) 1983-12-19 1989-06-27 Spectrum Control, Inc. High speed process for coating substrates
EP0155823B1 (de) 1984-03-21 1989-07-26 Nihon Shinku Gijutsu Kabushiki Kaisha Beschichtung von Gegenständen mit Kunststoffilmen
DE3427057A1 (de) * 1984-07-23 1986-01-23 Standard Elektrik Lorenz Ag, 7000 Stuttgart Anlage zum herstellen von halbleiter-schichtstrukturen durch epitaktisches wachstum
JPS6179644A (ja) 1984-09-28 1986-04-23 住友ベークライト株式会社 透明積層導電フイルム
US4722515A (en) 1984-11-06 1988-02-02 Spectrum Control, Inc. Atomizing device for vaporization
JPH0141067Y2 (de) 1985-03-12 1989-12-06
EP0196031A3 (de) * 1985-03-22 1987-12-23 Fuji Photo Film Co., Ltd. Lichtempfindliche Zusammensetzungen und Materialien
US4695618A (en) 1986-05-23 1987-09-22 Ameron, Inc. Solventless polyurethane spray compositions and method for applying them
US4954371A (en) 1986-06-23 1990-09-04 Spectrum Control, Inc. Flash evaporation of monomer fluids
JP2530350B2 (ja) 1986-06-23 1996-09-04 スペクトラム コントロール，インコーポレイテッド モノマ―流体のフラッシュ蒸発
JPS6396895A (ja) 1986-10-13 1988-04-27 株式会社小松製作所 薄膜ｅｌ素子
US4690728A (en) 1986-10-23 1987-09-01 Intel Corporation Pattern delineation of vertical load resistor
JPH07105034B2 (ja) 1986-11-28 1995-11-13 株式会社日立製作所 磁気記録体
DE3707214A1 (de) 1987-03-06 1988-09-15 Hoechst Ag Beschichtete kunststoffolie und daraus hergestelltes kunststofflaminat
US4768666A (en) 1987-05-26 1988-09-06 Milton Kessler Tamper proof container closure
US4843036A (en) 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
US4847469A (en) 1987-07-15 1989-07-11 The Boc Group, Inc. Controlled flow vaporizer
JPS6441067A (en) 1987-08-06 1989-02-13 Fuji Xerox Co Ltd Back-up device for production of english sentence
JPS6441192A (en) 1987-08-07 1989-02-13 Alps Electric Co Ltd Thin film electroluminescent display element
JPH0193129A (ja) * 1987-10-02 1989-04-12 Mitsubishi Electric Corp 化学気相成長装置
GB2210826B (en) 1987-10-19 1992-08-12 Bowater Packaging Ltd Barrier packaging materials
US4931158A (en) 1988-03-22 1990-06-05 The Regents Of The Univ. Of Calif. Deposition of films onto large area substrates using modified reactive magnetron sputtering
US4977013A (en) 1988-06-03 1990-12-11 Andus Corporation Tranparent conductive coatings
JP2742057B2 (ja) 1988-07-14 1998-04-22 シャープ株式会社 薄膜ｅｌパネル
JPH0244738A (ja) * 1988-08-05 1990-02-14 Semiconductor Energy Lab Co Ltd 電子装置作製方法
US4889609A (en) * 1988-09-06 1989-12-26 Ovonic Imaging Systems, Inc. Continuous dry etching system
JPH02117973A (ja) 1988-10-26 1990-05-02 Chugoku Marine Paints Ltd コーティング材
JPH02183230A (ja) 1989-01-09 1990-07-17 Sharp Corp 有機非線形光学材料及びその製造方法
US5189405A (en) 1989-01-26 1993-02-23 Sharp Kabushiki Kaisha Thin film electroluminescent panel
JP2678055B2 (ja) 1989-03-30 1997-11-17 シャープ株式会社 有機化合物薄膜の製法
US5792550A (en) 1989-10-24 1998-08-11 Flex Products, Inc. Barrier film having high colorless transparency and method
US5047131A (en) 1989-11-08 1991-09-10 The Boc Group, Inc. Method for coating substrates with silicon based compounds
US5036249A (en) 1989-12-11 1991-07-30 Molex Incorporated Electroluminescent lamp panel and method of fabricating same
JPH03183759A (ja) 1989-12-12 1991-08-09 Toyobo Co Ltd 積層プラスチックフイルムおよびその製造方法
CA2038117A1 (en) 1990-03-29 1991-09-30 Mahfuza B. Ali Controllable radiation curable photoiniferter prepared adhesives for attachment of microelectronic devices and a method of attaching microelectronic devices therewith
JPH03290375A (ja) 1990-04-09 1991-12-20 Sumitomo Electric Ind Ltd 被覆炭素繊維強化複合材料
JPH0414440A (ja) 1990-05-07 1992-01-20 Toray Ind Inc 積層フィルム
JPH0448515A (ja) 1990-06-14 1992-02-18 Hitachi Aic Inc 透明導電性フィルムの製造方法
US5204314A (en) 1990-07-06 1993-04-20 Advanced Technology Materials, Inc. Method for delivering an involatile reagent in vapor form to a CVD reactor
US5711816A (en) 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
US5362328A (en) 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
US5047687A (en) 1990-07-26 1991-09-10 Eastman Kodak Company Organic electroluminescent device with stabilized cathode
US5059861A (en) 1990-07-26 1991-10-22 Eastman Kodak Company Organic electroluminescent device with stabilizing cathode capping layer
FR2666190B1 (fr) 1990-08-24 1996-07-12 Thomson Csf Procede et dispositif d'encapsulation hermetique de composants electroniques.
JP2793048B2 (ja) 1991-02-22 1998-09-03 三井化学株式会社 有機発光素子の封止方法
JPH07106366B2 (ja) 1991-03-27 1995-11-15 新日本製鐵株式会社 耐加工フロー腐食性に優れたオーステナイト系ステンレス鋼板の製造方法
JP2755844B2 (ja) 1991-09-30 1998-05-25 シャープ株式会社 プラスチック基板液晶表示素子
JP3359649B2 (ja) 1991-11-27 2002-12-24 東洋アルミニウム株式会社 高防湿静電破壊防止袋
US5336324A (en) * 1991-12-04 1994-08-09 Emcore Corporation Apparatus for depositing a coating on a substrate
US5372851A (en) 1991-12-16 1994-12-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chemically adsorbed film
US5203898A (en) 1991-12-16 1993-04-20 Corning Incorporated Method of making fluorine/boron doped silica tubes
JPH0613258A (ja) 1991-12-20 1994-01-21 Matsushita Electric Ind Co Ltd 薄膜積層コンデンサのパターン形成方法
JPH05182759A (ja) 1991-12-26 1993-07-23 Pioneer Video Corp 有機ｅｌ素子
US5759329A (en) 1992-01-06 1998-06-02 Pilot Industries, Inc. Fluoropolymer composite tube and method of preparation
US5393607A (en) 1992-01-13 1995-02-28 Mitsui Toatsu Chemiclas, Inc. Laminated transparent plastic material and polymerizable monomer
US5402314A (en) 1992-02-10 1995-03-28 Sony Corporation Printed circuit board having through-hole stopped with photo-curable solder resist
JP3203623B2 (ja) 1992-03-06 2001-08-27 ソニー株式会社 有機電解液電池
EP0562517B1 (de) 1992-03-23 1997-08-27 Canon Kabushiki Kaisha Solarzelle mit einer aus Polymer bestehenden Schutzschicht
JPH05290972A (ja) 1992-04-08 1993-11-05 Nichia Chem Ind Ltd Ｅｌ素子及びその製造方法
JP2958186B2 (ja) 1992-04-20 1999-10-06 シャープ株式会社 プラスチック基板液晶表示素子
US5427638A (en) 1992-06-04 1995-06-27 Alliedsignal Inc. Low temperature reaction bonding
US5652192A (en) 1992-07-10 1997-07-29 Battelle Memorial Institute Catalyst material and method of making
GB9215928D0 (en) 1992-07-27 1992-09-09 Cambridge Display Tech Ltd Manufacture of electroluminescent devices
US5260095A (en) 1992-08-21 1993-11-09 Battelle Memorial Institute Vacuum deposition and curing of liquid monomers
DE4232390A1 (de) 1992-09-26 1994-03-31 Roehm Gmbh Verfahren zum Erzeugen von siliciumoxidischen kratzfesten Schichten auf Kunststoffen durch Plasmabeschichtung
JPH06111936A (ja) 1992-09-29 1994-04-22 Nec Kansai Ltd 電界発光灯の製造方法
JPH06136159A (ja) 1992-10-27 1994-05-17 Kanegafuchi Chem Ind Co Ltd 透明導電性フィルムおよびその製造法
JPH06158305A (ja) * 1992-11-27 1994-06-07 Shimadzu Corp インラインスパッタリング装置
JPH06182935A (ja) 1992-12-18 1994-07-05 Bridgestone Corp ガスバリア性ゴム積層物及びその製造方法
GB9311092D0 (en) 1993-01-28 1993-07-14 Du Pont Int Extrusion process
JPH06223966A (ja) 1993-01-28 1994-08-12 Toshiba Corp 有機分散型ｅｌパネル
ES2090893T3 (es) * 1993-01-28 1996-10-16 Applied Materials Inc Aparato de tratamiento en vacio que tiene una capacidad de produccion mejorada.
JPH06234186A (ja) 1993-02-10 1994-08-23 Mitsui Toatsu Chem Inc 高ガスバリヤー性透明電極フィルム
EP0662604B1 (de) 1993-05-17 2000-11-02 Kyoei Automatic Control Technology Co., Ltd. Messung eines dynamischen Gewichts mit einer zwangsbewegten Grundplatte
JP3170105B2 (ja) 1993-07-01 2001-05-28 キヤノン株式会社 太陽電池モジュール
US5357063A (en) 1993-07-12 1994-10-18 Battelle Memorial Institute Method and apparatus for acoustic energy identification of objects buried in soil
US5510173A (en) 1993-08-20 1996-04-23 Southwall Technologies Inc. Multiple layer thin films with improved corrosion resistance
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
US20040241454A1 (en) 1993-10-04 2004-12-02 Shaw David G. Barrier sheet and method of making same
WO1995010117A1 (en) 1993-10-04 1995-04-13 Catalina Coatings, Inc. Cross-linked acrylate coating material useful for forming capacitor dielectrics and oxygen barriers
JPH07147189A (ja) 1993-11-25 1995-06-06 Idemitsu Kosan Co Ltd 有機エレクトロルミネッセンス素子
JPH07192866A (ja) 1993-12-26 1995-07-28 Ricoh Co Ltd 有機薄膜型電界発光素子
JP2846571B2 (ja) 1994-02-25 1999-01-13 出光興産株式会社 有機エレクトロルミネッセンス素子
US5451449A (en) 1994-05-11 1995-09-19 The Mearl Corporation Colored iridescent film
JPH0846013A (ja) * 1994-05-23 1996-02-16 Tokyo Electron Ltd マルチチャンバ処理システム用搬送装置
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
US5795399A (en) * 1994-06-30 1998-08-18 Kabushiki Kaisha Toshiba Semiconductor device manufacturing apparatus, method for removing reaction product, and method of suppressing deposition of reaction product
US5654084A (en) 1994-07-22 1997-08-05 Martin Marietta Energy Systems, Inc. Protective coatings for sensitive materials
US5464667A (en) 1994-08-16 1995-11-07 Minnesota Mining And Manufacturing Company Jet plasma process and apparatus
JP3453223B2 (ja) * 1994-08-19 2003-10-06 東京エレクトロン株式会社 処理装置
TW295677B (de) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
JP3385292B2 (ja) 1994-09-02 2003-03-10 株式会社クラレ 多層構造体およびその用途
WO1996010483A1 (fr) 1994-09-30 1996-04-11 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Feuille en plastique optique stratifiee resistant a la chaleur et son procede de production
JP3274292B2 (ja) 1994-09-30 2002-04-15 富士写真フイルム株式会社 カセット用収納ケース
DE4438359C2 (de) 1994-10-27 2001-10-04 Schott Glas Behälter aus Kunststoff mit einer Sperrbeschichtung
US6083628A (en) 1994-11-04 2000-07-04 Sigma Laboratories Of Arizona, Inc. Hybrid polymer film
JPH08171988A (ja) 1994-12-20 1996-07-02 Showa Shell Sekiyu Kk エレクトロルミネッセンス素子
JP3565929B2 (ja) 1994-12-27 2004-09-15 大日本印刷株式会社 液晶表示素子用プラスチック基板
US5607789A (en) 1995-01-23 1997-03-04 Duracell Inc. Light transparent multilayer moisture barrier for electrochemical cell tester and cell employing same
JPH08203669A (ja) 1995-01-30 1996-08-09 Seikosha Co Ltd Ｅｌ両面発光表示体
JP3364081B2 (ja) 1995-02-16 2003-01-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
US5620524A (en) 1995-02-27 1997-04-15 Fan; Chiko Apparatus for fluid delivery in chemical vapor deposition systems
US5877895A (en) * 1995-03-20 1999-03-02 Catalina Coatings, Inc. Multicolor interference coating
US5811183A (en) 1995-04-06 1998-09-22 Shaw; David G. Acrylate polymer release coated sheet materials and method of production thereof
GB9507862D0 (en) 1995-04-18 1995-05-31 Cambridge Display Tech Ltd Fabrication of organic light-emitting devices
GB9507817D0 (en) 1995-04-18 1995-05-31 Philips Electronics Uk Ltd Touch sensing devices and methods of making such
US5771562A (en) 1995-05-02 1998-06-30 Motorola, Inc. Passivation of organic devices
US5554220A (en) 1995-05-19 1996-09-10 The Trustees Of Princeton University Method and apparatus using organic vapor phase deposition for the growth of organic thin films with large optical non-linearities
JPH08325713A (ja) 1995-05-30 1996-12-10 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
US5629389A (en) 1995-06-06 1997-05-13 Hewlett-Packard Company Polymer-based electroluminescent device with improved stability
US5922161A (en) 1995-06-30 1999-07-13 Commonwealth Scientific And Industrial Research Organisation Surface treatment of polymers
US5681615A (en) 1995-07-27 1997-10-28 Battelle Memorial Institute Vacuum flash evaporated polymer composites
JPH0959763A (ja) 1995-08-25 1997-03-04 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
US5723219A (en) 1995-12-19 1998-03-03 Talison Research Plasma deposited film networks
WO1997016053A1 (de) 1995-10-20 1997-05-01 Robert Bosch Gmbh Elektrolumineszierendes schichtsystem
DE19603746A1 (de) 1995-10-20 1997-04-24 Bosch Gmbh Robert Elektrolumineszierendes Schichtsystem
JP3533790B2 (ja) 1995-11-10 2004-05-31 富士電機ホールディングス株式会社 有機薄膜発光素子
JP3484891B2 (ja) 1995-11-21 2004-01-06 三菱化学株式会社 ガスバリア性オレフィン系樹脂積層体
US5811177A (en) 1995-11-30 1998-09-22 Motorola, Inc. Passivation of electroluminescent organic devices
US5686360A (en) 1995-11-30 1997-11-11 Motorola Passivation of organic devices
US5684084A (en) 1995-12-21 1997-11-04 E. I. Du Pont De Nemours And Company Coating containing acrylosilane polymer to improve mar and acid etch resistance
US6195142B1 (en) 1995-12-28 2001-02-27 Matsushita Electrical Industrial Company, Ltd. Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element
US5660961A (en) 1996-01-11 1997-08-26 Xerox Corporation Electrophotographic imaging member having enhanced layer adhesion and freedom from reflection interference
US5955161A (en) 1996-01-30 1999-09-21 Becton Dickinson And Company Blood collection tube assembly
US5738920A (en) 1996-01-30 1998-04-14 Becton, Dickinson And Company Blood collection tube assembly
US5683771A (en) 1996-01-30 1997-11-04 Becton, Dickinson And Company Blood collection tube assembly
US5763033A (en) 1996-01-30 1998-06-09 Becton, Dickinson And Company Blood collection tube assembly
TW434301B (en) 1996-01-30 2001-05-16 Becton Dickinson Co Non-ideal barrier coating composition comprising organic and inorganic materials
US5716683A (en) 1996-01-30 1998-02-10 Becton, Dickinson And Company Blood collection tube assembly
US6106627A (en) 1996-04-04 2000-08-22 Sigma Laboratories Of Arizona, Inc. Apparatus for producing metal coated polymers
US5731948A (en) 1996-04-04 1998-03-24 Sigma Labs Inc. High energy density capacitor
JPH10725A (ja) 1996-06-18 1998-01-06 Toppan Printing Co Ltd 包装用ガスバリア積層体
JPH1013083A (ja) 1996-06-27 1998-01-16 Tosoh Corp 電磁波吸収体
US5731661A (en) 1996-07-15 1998-03-24 Motorola, Inc. Passivation of electroluminescent organic devices
US5902688A (en) 1996-07-16 1999-05-11 Hewlett-Packard Company Electroluminescent display device
US5693956A (en) 1996-07-29 1997-12-02 Motorola Inverted oleds on hard plastic substrate
US5844363A (en) 1997-01-23 1998-12-01 The Trustees Of Princeton Univ. Vacuum deposited, non-polymeric flexible organic light emitting devices
US5948552A (en) 1996-08-27 1999-09-07 Hewlett-Packard Company Heat-resistant organic electroluminescent device
WO1998010116A1 (en) 1996-09-05 1998-03-12 Talison Research Ultrasonic nozzle feed for plasma deposited film networks
US5861658A (en) 1996-10-03 1999-01-19 International Business Machines Corporation Inorganic seal for encapsulation of an organic layer and method for making the same
US7728049B2 (en) 1996-10-08 2010-06-01 Zamore Alan M Irradiation conversion of thermoplastic to thermoset polymers
KR19980033213A (ko) 1996-10-31 1998-07-25 조셉제이.스위니 스퍼터링 챔버내의 미립자 물질 발생 감소 방법
US5895228A (en) 1996-11-14 1999-04-20 International Business Machines Corporation Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives
US5821692A (en) 1996-11-26 1998-10-13 Motorola, Inc. Organic electroluminescent device hermetic encapsulation package
US5912069A (en) 1996-12-19 1999-06-15 Sigma Laboratories Of Arizona Metal nanolaminate composite
US5952778A (en) 1997-03-18 1999-09-14 International Business Machines Corporation Encapsulated organic light emitting device
US5872355A (en) 1997-04-09 1999-02-16 Hewlett-Packard Company Electroluminescent device and fabrication method for a light detection system
US6117266A (en) 1997-12-19 2000-09-12 Interuniversifair Micro-Elektronica Cenirum (Imec Vzw) Furnace for continuous, high throughput diffusion processes from various diffusion sources
JP3290375B2 (ja) 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
US5920080A (en) 1997-06-23 1999-07-06 Fed Corporation Emissive display using organic light emitting diodes
US6198220B1 (en) 1997-07-11 2001-03-06 Emagin Corporation Sealing structure for organic light emitting devices
JP3743876B2 (ja) 1997-07-16 2006-02-08 カシオ計算機株式会社 電界発光素子及びその製造方法
FR2766200B1 (fr) 1997-07-17 1999-09-24 Toray Plastics Europ Sa Films polyester composites metallises a proprietes barriere
JPH1145779A (ja) 1997-07-25 1999-02-16 Tdk Corp 有機ｅｌ素子の製造方法および装置
EP2098906A1 (de) 1997-08-29 2009-09-09 Sharp Kabushiki Kaisha Flüssigkristall- Anzeigevorrichtung
US6203898B1 (en) 1997-08-29 2001-03-20 3M Innovatave Properties Company Article comprising a substrate having a silicone coating
US5994174A (en) 1997-09-29 1999-11-30 The Regents Of The University Of California Method of fabrication of display pixels driven by silicon thin film transistors
US5902641A (en) 1997-09-29 1999-05-11 Battelle Memorial Institute Flash evaporation of liquid monomer particle mixture
US6224948B1 (en) 1997-09-29 2001-05-01 Battelle Memorial Institute Plasma enhanced chemical deposition with low vapor pressure compounds
US5965907A (en) 1997-09-29 1999-10-12 Motorola, Inc. Full color organic light emitting backlight device for liquid crystal display applications
US6469437B1 (en) 1997-11-03 2002-10-22 The Trustees Of Princeton University Highly transparent organic light emitting device employing a non-metallic cathode
DE69813144T2 (de) 1997-11-07 2003-12-04 Rohm & Haas Kunstoffsubstrate zur Verwendung in elektronischen Anzeigesystemen
US6194487B1 (en) 1997-11-14 2001-02-27 Sharp Kabushiki Kaisha Method of manufacturing modified particles
JP3400324B2 (ja) 1997-11-17 2003-04-28 住友ベークライト株式会社 導電性フィルム
KR100249784B1 (ko) 1997-11-20 2000-04-01 정선종 고분자복합막을이용한유기물혹은고분자전기발광소자의패키징방법
US6045864A (en) 1997-12-01 2000-04-04 3M Innovative Properties Company Vapor coating method
BR9814540A (pt) 1997-12-31 2004-06-29 Kimberly Clark Co Pelìcula respirável de microcamada de polìmeros degradáveis e elastÈmeros termoplásticos, e método para fabricação da mesma
US6569515B2 (en) 1998-01-13 2003-05-27 3M Innovative Properties Company Multilayered polymer films with recyclable or recycled layers
DE19802740A1 (de) 1998-01-26 1999-07-29 Leybold Systems Gmbh Verfahren zur Behandlung von Oberflächen von Substraten aus Kunststoff
US6178082B1 (en) 1998-02-26 2001-01-23 International Business Machines Corporation High temperature, conductive thin film diffusion barrier for ceramic/metal systems
US5996498A (en) 1998-03-12 1999-12-07 Presstek, Inc. Method of lithographic imaging with reduced debris-generated performance degradation and related constructions
US6004660A (en) 1998-03-12 1999-12-21 E.I. Du Pont De Nemours And Company Oxygen barrier composite film structure
US6066826A (en) 1998-03-16 2000-05-23 Yializis; Angelo Apparatus for plasma treatment of moving webs
US5904958A (en) 1998-03-20 1999-05-18 Rexam Industries Corp. Adjustable nozzle for evaporation or organic monomers
GB2335884A (en) 1998-04-02 1999-10-06 Cambridge Display Tech Ltd Flexible substrates for electronic or optoelectronic devices
US6361885B1 (en) 1998-04-10 2002-03-26 Organic Display Technology Organic electroluminescent materials and device made from such materials
US6146462A (en) 1998-05-08 2000-11-14 Astenjohnson, Inc. Structures and components thereof having a desired surface characteristic together with methods and apparatuses for producing the same
US6137221A (en) 1998-07-08 2000-10-24 Agilent Technologies, Inc. Organic electroluminescent device with full color characteristics
US6146225A (en) 1998-07-30 2000-11-14 Agilent Technologies, Inc. Transparent, flexible permeability barrier for organic electroluminescent devices
WO2000008899A1 (en) 1998-08-03 2000-02-17 Uniax Corporation Encapsulation of polymer-based solid state devices with inorganic materials
US6352777B1 (en) 1998-08-19 2002-03-05 The Trustees Of Princeton University Organic photosensitive optoelectronic devices with transparent electrodes
US6040017A (en) 1998-10-02 2000-03-21 Sigma Laboratories, Inc. Formation of multilayered photonic polymer composites
US6084702A (en) 1998-10-15 2000-07-04 Pleotint, L.L.C. Thermochromic devices
US6322860B1 (en) 1998-11-02 2001-11-27 Rohm And Haas Company Plastic substrates for electronic display applications
CA2353506A1 (en) 1998-11-02 2000-05-11 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US6837950B1 (en) 1998-11-05 2005-01-04 Interface, Inc. Separation of floor covering components for recycling
US6268695B1 (en) 1998-12-16 2001-07-31 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6217947B1 (en) 1998-12-16 2001-04-17 Battelle Memorial Institute Plasma enhanced polymer deposition onto fixtures
US6207239B1 (en) 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition of conjugated polymer
US6274204B1 (en) 1998-12-16 2001-08-14 Battelle Memorial Institute Method of making non-linear optical polymer
US6228436B1 (en) 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making light emitting polymer composite material
TW439308B (en) 1998-12-16 2001-06-07 Battelle Memorial Institute Environmental barrier material for organic light emitting device and method of making
US6207238B1 (en) 1998-12-16 2001-03-27 Battelle Memorial Institute Plasma enhanced chemical deposition for high and/or low index of refraction polymers
US6228434B1 (en) 1998-12-16 2001-05-08 Battelle Memorial Institute Method of making a conformal coating of a microtextured surface
US6960877B1 (en) 1998-12-17 2005-11-01 Cambrdige Display Technology Limited Organic light-emitting devices including specific barrier layers
WO2001087825A1 (en) 2000-04-04 2001-11-22 The Regents Of The University Of California Methods, compositions and bi-functional catalysts for synthesis of silica, glass, silicones
AU2713000A (en) 1998-12-18 2000-07-03 Regents Of The University Of California, The Methods, compositions, and biomimetic catalysts for in vitro synthesis of silica, polysilsequioxane, polysiloxane, and polymetallo-oxanes
JP2000208252A (ja) 1999-01-14 2000-07-28 Tdk Corp 有機ｅｌ素子
JP3817081B2 (ja) 1999-01-29 2006-08-30 パイオニア株式会社 有機ｅｌ素子の製造方法
US6118218A (en) 1999-02-01 2000-09-12 Sigma Technologies International, Inc. Steady-state glow-discharge plasma at atmospheric pressure
US6172810B1 (en) 1999-02-26 2001-01-09 3M Innovative Properties Company Retroreflective articles having polymer multilayer reflective coatings
WO2000053423A1 (en) * 1999-03-10 2000-09-14 American Bank Note Holographics, Inc. Techniques of printing micro-structure patterns such as holograms directly onto final documents or other substrates in discrete areas thereof
US6358570B1 (en) 1999-03-31 2002-03-19 Battelle Memorial Institute Vacuum deposition and curing of oligomers and resins
TW463528B (en) 1999-04-05 2001-11-11 Idemitsu Kosan Co Organic electroluminescence element and their preparation
JP2002542498A (ja) 1999-04-22 2002-12-10 シグナス， インコーポレイテッド 干渉種を除去するための方法およびデバイス
AU768085B2 (en) 1999-04-28 2003-12-04 E.I. Du Pont De Nemours And Company Flexible organic electronic device with improved resistance to oxygen and moisture degradation
JP4261680B2 (ja) 1999-05-07 2009-04-30 株式会社クレハ 防湿性多層フィルム
US6387732B1 (en) 1999-06-18 2002-05-14 Micron Technology, Inc. Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby
US6083313A (en) 1999-07-27 2000-07-04 Advanced Refractory Technologies, Inc. Hardcoats for flat panel display substrates
US6165628A (en) 1999-08-30 2000-12-26 General Electric Company Protective coatings for metal-based substrates and related processes
US7198832B2 (en) 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6573652B1 (en) 1999-10-25 2003-06-03 Battelle Memorial Institute Encapsulated display devices
US6548912B1 (en) 1999-10-25 2003-04-15 Battelle Memorial Institute Semicoductor passivation using barrier coatings
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US6298685B1 (en) * 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
US6460369B2 (en) 1999-11-03 2002-10-08 Applied Materials, Inc. Consecutive deposition system
US7394153B2 (en) 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
JP2001249221A (ja) 1999-12-27 2001-09-14 Nitto Denko Corp 透明積層体とその製造方法およびプラズマデイスプレイパネル用フイルタ
TW490714B (en) 1999-12-27 2002-06-11 Semiconductor Energy Lab Film formation apparatus and method for forming a film
US20020036297A1 (en) 2000-02-04 2002-03-28 Karl Pichler Low absorption sputter protection layer for OLED structure
US6416690B1 (en) 2000-02-16 2002-07-09 Zms, Llc Precision composite lens
JP2001338755A (ja) * 2000-03-21 2001-12-07 Seiko Epson Corp 有機ｅｌ素子およびその製造方法
CN1264387C (zh) * 2000-03-22 2006-07-12 出光兴产株式会社 有机el显示装置的制造装置以及使用其制造有机el显示装置的方法
US6492026B1 (en) 2000-04-20 2002-12-10 Battelle Memorial Institute Smoothing and barrier layers on high Tg substrates
JP3936151B2 (ja) * 2000-05-08 2007-06-27 双葉電子工業株式会社 有機ｅｌ素子
JP3783099B2 (ja) 2000-05-16 2006-06-07 株式会社豊田中央研究所 有機電界発光素子
US6465953B1 (en) 2000-06-12 2002-10-15 General Electric Company Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices
US6867539B1 (en) 2000-07-12 2005-03-15 3M Innovative Properties Company Encapsulated organic electronic devices and method for making same
US6416872B1 (en) 2000-08-30 2002-07-09 Cp Films, Inc. Heat reflecting film with low visible reflectance
US7094690B1 (en) * 2000-08-31 2006-08-22 Micron Technology, Inc. Deposition methods and apparatuses providing surface activation
JP4608182B2 (ja) 2000-09-06 2011-01-05 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Ｏｌｅｄデバイスのカプセル化
CN1341644A (zh) 2000-09-07 2002-03-27 上海博德基因开发有限公司 一种新的多肽——人核内非均－核蛋白32.01和编码这种多肽的多核苷酸
CA2357324A1 (en) * 2000-09-15 2002-03-15 James D. Huggins Continuous feed coater
JP2002100469A (ja) 2000-09-25 2002-04-05 Pioneer Electronic Corp 有機エレクトロルミネッセンス表示パネル
US6537688B2 (en) 2000-12-01 2003-03-25 Universal Display Corporation Adhesive sealed organic optoelectronic structures
US6541098B2 (en) 2000-12-22 2003-04-01 Avery Dennison Corporation Three-dimensional flexible adhesive film structures
JP4856308B2 (ja) 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
US20020096114A1 (en) 2001-01-22 2002-07-25 Applied Materials, Inc. Series chamber for substrate processing
JP4101522B2 (ja) * 2001-02-01 2008-06-18 株式会社半導体エネルギー研究所 成膜装置及び成膜方法
CN101397649B (zh) * 2001-02-01 2011-12-28 株式会社半导体能源研究所 能够将有机化合物沉积在衬底上的装置
US6614057B2 (en) 2001-02-07 2003-09-02 Universal Display Corporation Sealed organic optoelectronic structures
US6468595B1 (en) 2001-02-13 2002-10-22 Sigma Technologies International, Inc. Vaccum deposition of cationic polymer systems
WO2002071506A1 (en) 2001-02-15 2002-09-12 Emagin Corporation Thin film encapsulation of organic light emitting diode devices
US6576351B2 (en) 2001-02-16 2003-06-10 Universal Display Corporation Barrier region for optoelectronic devices
US6822391B2 (en) 2001-02-21 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic equipment, and method of manufacturing thereof
US6881447B2 (en) 2002-04-04 2005-04-19 Dielectric Systems, Inc. Chemically and electrically stabilized polymer films
US6624568B2 (en) 2001-03-28 2003-09-23 Universal Display Corporation Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices
US6664137B2 (en) 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
TWI222838B (en) 2001-04-10 2004-10-21 Chi Mei Optoelectronics Corp Packaging method of organic electroluminescence light-emitting display device
JP2002343580A (ja) 2001-05-11 2002-11-29 Pioneer Electronic Corp 発光ディスプレイ装置及びその製造方法
KR100682377B1 (ko) 2001-05-25 2007-02-15 삼성전자주식회사 유기 전계발광 디바이스 및 이의 제조 방법
JP3678361B2 (ja) 2001-06-08 2005-08-03 大日本印刷株式会社 ガスバリアフィルム
US6397776B1 (en) 2001-06-11 2002-06-04 General Electric Company Apparatus for large area chemical vapor deposition using multiple expanding thermal plasma generators
CA2352567A1 (en) 2001-07-06 2003-01-06 Mohamed Latreche Translucent material displaying ultra-low transport of gases and vapors, and method for its production
KR100413450B1 (ko) 2001-07-20 2003-12-31 엘지전자 주식회사 표시소자의 보호막 구조
EP1419286A1 (de) 2001-08-20 2004-05-19 Nova-Plasma Inc. Beschichtungen mit niedriger gas- bzw. dampfdurchlässigkeit
US6888307B2 (en) 2001-08-21 2005-05-03 Universal Display Corporation Patterned oxygen and moisture absorber for organic optoelectronic device structures
US6737753B2 (en) 2001-09-28 2004-05-18 Osram Opto Semiconductor Gmbh Barrier stack
US6803245B2 (en) 2001-09-28 2004-10-12 Osram Opto Semiconductors Gmbh Procedure for encapsulation of electronic devices
TW519853B (en) 2001-10-17 2003-02-01 Chi Mei Electronic Corp Organic electro-luminescent display and its packaging method
JP2003123969A (ja) 2001-10-17 2003-04-25 Matsushita Electric Ind Co Ltd 蒸着用マスクおよび有機エレクトロルミネッセンスディスプレイの製造方法
US6888305B2 (en) 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
US6948448B2 (en) 2001-11-27 2005-09-27 General Electric Company Apparatus and method for depositing large area coatings on planar surfaces
US6681716B2 (en) 2001-11-27 2004-01-27 General Electric Company Apparatus and method for depositing large area coatings on non-planar surfaces
US6597111B2 (en) 2001-11-27 2003-07-22 Universal Display Corporation Protected organic optoelectronic devices
US6765351B2 (en) 2001-12-20 2004-07-20 The Trustees Of Princeton University Organic optoelectronic device structures
KR100419204B1 (ko) * 2001-12-24 2004-02-21 삼성전자주식회사 전자렌지
KR100472502B1 (ko) 2001-12-26 2005-03-08 삼성에스디아이 주식회사 유기 전계 발광 표시 장치
US7012363B2 (en) 2002-01-10 2006-03-14 Universal Display Corporation OLEDs having increased external electroluminescence quantum efficiencies
US6620657B2 (en) 2002-01-15 2003-09-16 International Business Machines Corporation Method of forming a planar polymer transistor using substrate bonding techniques
JP4046512B2 (ja) 2002-01-25 2008-02-13 株式会社半導体エネルギー研究所 発光装置の作製方法
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US7112351B2 (en) 2002-02-26 2006-09-26 Sion Power Corporation Methods and apparatus for vacuum thin film deposition
JP2003258189A (ja) 2002-03-01 2003-09-12 Toshiba Corp 半導体装置及びその製造方法
JP2003253434A (ja) 2002-03-01 2003-09-10 Sanyo Electric Co Ltd 蒸着方法及び表示装置の製造方法
JP2003272827A (ja) 2002-03-13 2003-09-26 Matsushita Electric Ind Co Ltd 有機発光素子及びその製造方法
JP4180831B2 (ja) 2002-03-25 2008-11-12 パイオニア株式会社 有機エレクトロルミネッセンス表示パネル及び製造方法
JP2003292394A (ja) 2002-03-29 2003-10-15 Canon Inc 液相成長方法および液相成長装置
US6891330B2 (en) 2002-03-29 2005-05-10 General Electric Company Mechanically flexible organic electroluminescent device with directional light emission
US20050174045A1 (en) 2002-04-04 2005-08-11 Dielectric Systems, Inc. Organic light-emitting device display having a plurality of passive polymer layers
US6835950B2 (en) 2002-04-12 2004-12-28 Universal Display Corporation Organic electronic devices with pressure sensitive adhesive layer
US6897474B2 (en) 2002-04-12 2005-05-24 Universal Display Corporation Protected organic electronic devices and methods for making the same
US8808457B2 (en) 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US7223672B2 (en) 2002-04-24 2007-05-29 E Ink Corporation Processes for forming backplanes for electro-optic displays
US20030203210A1 (en) 2002-04-30 2003-10-30 Vitex Systems, Inc. Barrier coatings and methods of making same
US6949389B2 (en) 2002-05-02 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic light emitting diodes devices
TWI336905B (en) 2002-05-17 2011-02-01 Semiconductor Energy Lab Evaporation method, evaporation device and method of fabricating light emitting device
NL1020635C2 (nl) 2002-05-21 2003-11-24 Otb Group Bv Werkwijze voor het vervaardigen van een polymere OLED.
NL1020634C2 (nl) 2002-05-21 2003-11-24 Otb Group Bv Werkwijze voor het passiveren van een halfgeleider substraat.
KR100477745B1 (ko) 2002-05-23 2005-03-18 삼성에스디아이 주식회사 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널
US6743524B2 (en) 2002-05-23 2004-06-01 General Electric Company Barrier layer for an article and method of making said barrier layer by expanding thermal plasma
US7221093B2 (en) 2002-06-10 2007-05-22 Institute Of Materials Research And Engineering Patterning of electrodes in OLED devices
DE10230607A1 (de) 2002-07-08 2004-02-05 Abb Patent Gmbh Verfahren zur Überwachung einer Messeinrichtung, insbesondere einer Durchflussmesseinrichtung, sowie eine Messeinrichtung selbst
JP4130555B2 (ja) 2002-07-18 2008-08-06 住友精密工業株式会社 ガス加湿装置
US6734625B2 (en) 2002-07-30 2004-05-11 Xerox Corporation Organic light emitting device (OLED) with multiple capping layers passivation region on an electrode
US6710542B2 (en) 2002-08-03 2004-03-23 Agilent Technologies, Inc. Organic light emitting device with improved moisture seal
US6818291B2 (en) 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
TWI236862B (en) 2002-09-03 2005-07-21 Au Optronics Corp Package for OLED device
US7015640B2 (en) 2002-09-11 2006-03-21 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same
US20040229051A1 (en) 2003-05-15 2004-11-18 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
US6994933B1 (en) 2002-09-16 2006-02-07 Oak Ridge Micro-Energy, Inc. Long life thin film battery and method therefor
TW554639B (en) 2002-10-04 2003-09-21 Au Optronics Corp Method for fabricating an OLED device and the solid passivation
US7056584B2 (en) 2002-10-11 2006-06-06 General Electric Company Bond layer for coatings on plastic substrates
JP3953404B2 (ja) 2002-10-21 2007-08-08 インターナショナル・ビジネス・マシーンズ・コーポレーション 有機エレクトロ・ルミネッセンス素子、該有機エレクトロ・ルミネッセンス素子の製造方法、および有機エレクトロ・ルミネッセンス表示装置
JP2004176111A (ja) 2002-11-26 2004-06-24 Matsushita Electric Ind Co Ltd 樹脂蒸着成膜方法及び装置
US7086918B2 (en) 2002-12-11 2006-08-08 Applied Materials, Inc. Low temperature process for passivation applications
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US7338820B2 (en) 2002-12-19 2008-03-04 3M Innovative Properties Company Laser patterning of encapsulated organic light emitting diodes
NL1022269C2 (nl) 2002-12-24 2004-06-25 Otb Group Bv Werkwijze voor het vervaardigen van een organic electroluminescent display device, substraat ten gebruike bij een dergelijke werkwijze, alsmede een organic electroluminescent display device verkregen met de werkwijze.
AU2003299989A1 (en) 2002-12-27 2004-07-29 Add-Vision, Inc. Method for encapsulation of light emitting polyme devices and apparatus made by same
JP2004224815A (ja) 2003-01-20 2004-08-12 Fuji Photo Film Co Ltd ガスバリア性積層フィルムの製造方法及びガスバリア性積層フィルム
JP4138672B2 (ja) 2003-03-27 2008-08-27 セイコーエプソン株式会社 電気光学装置の製造方法
JP4491196B2 (ja) 2003-03-31 2010-06-30 富士フイルム株式会社 ガスバリア性積層フィルム及びその製造方法、並びに該フィルムを用いた基板及び画像表示素子
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7029765B2 (en) 2003-04-22 2006-04-18 Universal Display Corporation Organic light emitting devices having reduced pixel shrinkage
JP2004353021A (ja) 2003-05-28 2004-12-16 Toppan Printing Co Ltd スパッタ用メタルマスク
JP4784308B2 (ja) 2003-05-29 2011-10-05 コニカミノルタホールディングス株式会社 ディスプレイ基板用透明フィルム、該フィルムを用いたディスプレイ基板およびその製造方法、液晶ディスプレイ、有機エレクトロルミネッセンスディスプレイ、およびタッチパネル
ITMI20031281A1 (it) 2003-06-24 2004-12-25 Whirlpool Co Apparecchio refrigerante domestico con supporti amovibili dei ripiani.
NL1024090C2 (nl) 2003-08-12 2005-02-15 Otb Group Bv Werkwijze voor het aanbrengen van een dunne-film-afsluitlaagsamenstel op een device met microstructuren, alsmede een device voorzien van een dergelijk dunne-film-afsluitlaagsamenstel.
US6998648B2 (en) 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
US7282244B2 (en) 2003-09-05 2007-10-16 General Electric Company Replaceable plate expanded thermal plasma apparatus and method
US7635525B2 (en) 2003-09-30 2009-12-22 Fujifilm Corporation Gas barrier laminate film and method for producing the same
US7297414B2 (en) 2003-09-30 2007-11-20 Fujifilm Corporation Gas barrier film and method for producing the same
US7052355B2 (en) 2003-10-30 2006-05-30 General Electric Company Organic electro-optic device and method for making the same
US8722160B2 (en) 2003-10-31 2014-05-13 Aeris Capital Sustainable Ip Ltd. Inorganic/organic hybrid nanolaminate barrier film
US20050093437A1 (en) 2003-10-31 2005-05-05 Ouyang Michael X. OLED structures with strain relief, antireflection and barrier layers
US7271534B2 (en) 2003-11-04 2007-09-18 3M Innovative Properties Company Segmented organic light emitting device
US7432124B2 (en) 2003-11-04 2008-10-07 3M Innovative Properties Company Method of making an organic light emitting device
EP1548846A3 (de) 2003-11-28 2007-09-19 Sharp Kabushiki Kaisha Kantenabdichtungselement für Solarzellenmodul und Solarzellenmodul mit demselben
US7075103B2 (en) 2003-12-19 2006-07-11 General Electric Company Multilayer device and method of making
US7792489B2 (en) 2003-12-26 2010-09-07 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, electronic appliance, and method for manufacturing light emitting device
JP2005251671A (ja) 2004-03-08 2005-09-15 Fuji Photo Film Co Ltd 表示装置
US20050238846A1 (en) 2004-03-10 2005-10-27 Fuji Photo Film Co., Ltd. Gas barrier laminate film, method for producing the same and image display device utilizing the film
US20050212419A1 (en) 2004-03-23 2005-09-29 Eastman Kodak Company Encapsulating oled devices
US8405193B2 (en) 2004-04-02 2013-03-26 General Electric Company Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
US7220687B2 (en) 2004-06-25 2007-05-22 Applied Materials, Inc. Method to improve water-barrier performance by changing film surface morphology
US7033850B2 (en) 2004-06-30 2006-04-25 Eastman Kodak Company Roll-to-sheet manufacture of OLED materials
US7342356B2 (en) 2004-09-23 2008-03-11 3M Innovative Properties Company Organic electroluminescent device having protective structure with boron oxide layer and inorganic barrier layer
US20060063015A1 (en) 2004-09-23 2006-03-23 3M Innovative Properties Company Protected polymeric film
US7825582B2 (en) 2004-11-08 2010-11-02 Kyodo Printing Co., Ltd. Flexible display and manufacturing method thereof
DE102004063619A1 (de) 2004-12-27 2006-07-06 Cfs Kempten Gmbh Schrumpfbare Mehrschichtfolie mit einer Releaseschicht
US20060198986A1 (en) 2005-03-01 2006-09-07 Keckeisen Michael S Multilayer packaging with peelable coupon
JP2006294780A (ja) 2005-04-08 2006-10-26 Toppan Printing Co Ltd 太陽電池モジュール用バックシートおよび太陽電池モジュール
US20060246811A1 (en) 2005-04-28 2006-11-02 Eastman Kodak Company Encapsulating emissive portions of an OLED device
US20060250084A1 (en) 2005-05-04 2006-11-09 Eastman Kodak Company OLED device with improved light output
EP1719809A3 (de) 2005-05-06 2007-05-30 Eastman Chemical Company Druckempfindliche Klebstofflaminate
WO2007002452A2 (en) 2005-06-23 2007-01-04 E Ink Corporation Edge seals and processes for electro-optic displays
CN101228649B (zh) 2005-07-27 2011-09-28 皇家飞利浦电子股份有限公司 具有密封的集成驱动电路的发光器件
US7251947B2 (en) 2005-08-09 2007-08-07 Carrier Corporation Refrigerant system with suction line restrictor for capacity correction
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
US7621794B2 (en) 2005-11-09 2009-11-24 International Display Systems, Inc. Method of encapsulating an organic light-emitting device
KR100699254B1 (ko) 2006-02-14 2007-03-28 삼성전자주식회사 표시장치의 제조방법과 이에 의한 표시장치
EP1857270B1 (de) 2006-05-17 2013-04-17 Curwood, Inc. Myoglobin-Blühmittel sowie Folien, Verpackungen und Verfahren zum Verpacken
DE102006037478A1 (de) 2006-08-10 2008-02-14 Merck Patent Gmbh 2-(Heterocyclylbenzyl)-pyridazinonderivate
US8084102B2 (en) 2007-02-06 2011-12-27 Sion Power Corporation Methods for co-flash evaporation of polymerizable monomers and non-polymerizable carrier solvent/salt mixtures/solutions
EP2153699B1 (de) 2007-05-18 2016-07-13 Henkel AG & Co. KGaA Durch einen elastomeren laminierungshaftstoff geschützte organische elektronische bauelemente
JP5501587B2 (ja) 2007-09-28 2014-05-21 株式会社船井電機新応用技術研究所 エレクトロクロミック表示デバイス
US8187718B2 (en) 2008-04-14 2012-05-29 Fujifilm Corporation Barrier laminate, barrier film substrate and device
JP6234186B2 (ja) 2013-11-25 2017-11-22 三星エスディアイ株式会社Samsung SDI Co., Ltd. 非水電解質二次電池

Also Published As

Publication number Publication date
EP1497853A2 (de) 2005-01-19
US8808457B2 (en) 2014-08-19
US20040018305A1 (en) 2004-01-29
US20140037845A1 (en) 2014-02-06
EP1758181A2 (de) 2007-02-28
AU2003228522A1 (en) 2003-11-03
TW200402152A (en) 2004-02-01
KR20040101479A (ko) 2004-12-02
AU2003228522A8 (en) 2003-11-03
WO2003090260A2 (en) 2003-10-30
CN101231974B (zh) 2010-06-02
CN100358091C (zh) 2007-12-26
JP4677644B2 (ja) 2011-04-27
EP1758181A3 (de) 2009-04-01
JP2005522891A (ja) 2005-07-28
CN1647247A (zh) 2005-07-27
TWI319626B (en) 2010-01-11
US9839940B2 (en) 2017-12-12
DE60310907T2 (de) 2007-10-25
EP1497853B1 (de) 2007-01-03
WO2003090260A3 (en) 2004-04-01
KR100934544B1 (ko) 2009-12-29
CN101231974A (zh) 2008-07-30

Similar Documents

Publication Publication Date Title
DE60310907D1 (de) Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat
DE602004000051D1 (de) Verfahren zum Beschichten von grossflächigen Substraten
DE10393089D2 (de) Vorrichtung zum Zuführen von Fluiden
DE602004000727T8 (de) Verfahren zum Aufbringen einer magnetostriktiven Beschichtung
ATE398957T1 (de) Vorrichtung zum erhitzen einer flüssigkeit
DE60317732D1 (de) Vorrichtung und Verfahren zum Aufbringen von Beschichtungsmaterial auf ein Substrat mit Ultraschall
DE602004025548D1 (de) Vorrichtung und Verfahren zum Drucken von Biomolekülen auf ein Substrat unter Ausnutzung von elektrohydrodynamischen Effekten
DE60327672D1 (de) Verfahren zum Beschichten von Stents
DE60320734D1 (de) Verfahren zum Beschichten von mikro-elektromechanischen Vorrichtungen
DE60300401D1 (de) Vorrichtung zum Abgeben von Tröpfchen
NL1020820A1 (nl) Inrichting om een laag op een vlak substraat aan te brengen.
DE10352144B8 (de) Vakuumbeschichtungsanlage zum Beschichten von längserstreckten Substraten
FR2865420B1 (fr) Procede de nettoyage d'un substrat
DE69726459D1 (de) Vorrichtung zum auftragen von proben auf ein substrat
DE60312182D1 (de) Vorrichtung und verfahren zum untersuchen von auf ein substrat aufgedrucktem cream-lot
DE50210808D1 (de) Verfahren und Vorrichtung zum Auftragen von Fluiden auf Substraten
DE60327977D1 (de) Vorrichtung zum Auftragen einer Flüssigkeit
DE60116819D1 (de) Verfahren zum Laminieren von plattenförmigen Substraten
DE202004014885U1 (de) Vorrichtung zum Auftragen von Fluiden auf ein Substrat
DE50313432D1 (de) Verfahren zum Beschichten von plattenförmigen Werkstücken mit einer Dekorfolie
DE50209805D1 (de) Verfahren zum beschichten von einem substrat mit löchern
DE602006017291D1 (de) Vorrichtung zum Drucken von Biomolekülen auf ein Substrat unter Ausnutzung vom elektrohydrodynamischen Effekt
DE60136696D1 (de) Handgerät zum Auftragen eines Klebe-, Beschichtungs- oder Farbfilmes von einem Trägermaterial auf ein Substrat
DE60106207D1 (de) Handgerät zum auftragen eines gesamten streifens auf ein substrat
DE60309765D1 (de) Vorrichtung zum Ablegen von Bögen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
R082 Change of representative

Ref document number: 1497853

Country of ref document: EP

Representative=s name: VOLLMANN & HEMMER, 23560 LUEBECK, DE

R082 Change of representative

Ref document number: 1497853

Country of ref document: EP

Representative=s name: VOLLMANN & HEMMER, DE

R081 Change of applicant/patentee

Ref document number: 1497853

Country of ref document: EP

Owner name: SAMSUNG DISPLAY CO., LTD., KR

Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD., YONGIN, KR

Effective date: 20121017

R082 Change of representative

Ref document number: 1497853

Country of ref document: EP

Representative=s name: VOLLMANN & HEMMER, DE

Effective date: 20121017