BR112012024725A2 - embalagem microeletrônica com terminais em massa dielétrica - Google Patents
embalagem microeletrônica com terminais em massa dielétricaInfo
- Publication number
- BR112012024725A2 BR112012024725A2 BR112012024725A BR112012024725A BR112012024725A2 BR 112012024725 A2 BR112012024725 A2 BR 112012024725A2 BR 112012024725 A BR112012024725 A BR 112012024725A BR 112012024725 A BR112012024725 A BR 112012024725A BR 112012024725 A2 BR112012024725 A2 BR 112012024725A2
- Authority
- BR
- Brazil
- Prior art keywords
- terminals
- dielectric
- mass
- bulk terminals
- microelectronic packaging
- Prior art date
Links
- 238000004377 microelectronic Methods 0.000 title abstract 4
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01047—Silver [Ag]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
embalagem microeletrônica com terminais em massa dielétrica. a presente invenção refere-se a uma embalagem de um elemento microeletrônico 48, como um chip semicondutor, que possui uma massa dielétrica 86 que sobrepõe o substrato de embalagem 56 e o elemento microeletrônico 48 e possui terminais superiores 38 expostos na superfície superior 94 da massa dielétrica 86. os traços 36a, 36b que se estendem ao longo das superfícies de borda 96, 108 da massa dielétrica 86 conectam desejavelmente os terminais superiores 38 aos terminais inferiores 64 sobre o substrato de embalagem 56. a massa dielétrica 86 pode ser formada, por exemplo, por moldagem ou pela aplicação de uma a camada conformal 505.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR20100113271A KR101075241B1 (ko) | 2010-11-15 | 2010-11-15 | 유전체 부재에 단자를 구비하는 마이크로전자 패키지 |
PCT/US2011/060551 WO2012067990A1 (en) | 2010-11-15 | 2011-11-14 | Microelectronic package with terminals on dielectric mass |
Publications (1)
Publication Number | Publication Date |
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BR112012024725A2 true BR112012024725A2 (pt) | 2016-06-07 |
Family
ID=45048282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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BR112012024725A BR112012024725A2 (pt) | 2010-11-15 | 2011-11-14 | embalagem microeletrônica com terminais em massa dielétrica |
Country Status (8)
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US (4) | US8623706B2 (pt) |
EP (2) | EP2631945B1 (pt) |
JP (1) | JP5619276B2 (pt) |
KR (1) | KR101075241B1 (pt) |
CN (2) | CN103325779B (pt) |
BR (1) | BR112012024725A2 (pt) |
TW (1) | TWI469274B (pt) |
WO (1) | WO2012067990A1 (pt) |
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-
2010
- 2010-11-15 KR KR20100113271A patent/KR101075241B1/ko active IP Right Grant
-
2011
- 2011-11-14 US US13/637,185 patent/US8623706B2/en active Active
- 2011-11-14 EP EP13162975.0A patent/EP2631945B1/en active Active
- 2011-11-14 CN CN201310264264.3A patent/CN103325779B/zh active Active
- 2011-11-14 JP JP2013509325A patent/JP5619276B2/ja active Active
- 2011-11-14 EP EP11788721.6A patent/EP2537182B1/en active Active
- 2011-11-14 WO PCT/US2011/060551 patent/WO2012067990A1/en active Application Filing
- 2011-11-14 CN CN201180022247.8A patent/CN102884623B/zh active Active
- 2011-11-14 US US13/295,608 patent/US8637991B2/en active Active
- 2011-11-14 BR BR112012024725A patent/BR112012024725A2/pt not_active Application Discontinuation
- 2011-11-15 TW TW100141695A patent/TWI469274B/zh not_active IP Right Cessation
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- 2012-10-10 US US13/648,495 patent/US8659164B2/en active Active
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Also Published As
Publication number | Publication date |
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JP5619276B2 (ja) | 2014-11-05 |
CN103325779B (zh) | 2017-04-12 |
TW201230256A (en) | 2012-07-16 |
WO2012067990A1 (en) | 2012-05-24 |
CN102884623A (zh) | 2013-01-16 |
US8637991B2 (en) | 2014-01-28 |
US8623706B2 (en) | 2014-01-07 |
CN103325779A (zh) | 2013-09-25 |
EP2631945A3 (en) | 2013-10-09 |
KR101075241B1 (ko) | 2011-11-01 |
CN102884623B (zh) | 2016-08-10 |
EP2537182A1 (en) | 2012-12-26 |
US20130260513A1 (en) | 2013-10-03 |
EP2631945A2 (en) | 2013-08-28 |
JP2013526084A (ja) | 2013-06-20 |
US8659164B2 (en) | 2014-02-25 |
US8957527B2 (en) | 2015-02-17 |
US20140167287A1 (en) | 2014-06-19 |
US20130032387A1 (en) | 2013-02-07 |
US20120119380A1 (en) | 2012-05-17 |
TWI469274B (zh) | 2015-01-11 |
EP2537182B1 (en) | 2015-10-28 |
EP2631945B1 (en) | 2015-11-11 |
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