GB9618897D0
(en)
|
1996-09-10 |
1996-10-23 |
Bio Rad Micromeasurements Ltd |
Micro defects in silicon wafers
|
US7630086B2
(en)
*
|
1997-09-22 |
2009-12-08 |
Kla-Tencor Corporation |
Surface finish roughness measurement
|
US7688435B2
(en)
*
|
1997-09-22 |
2010-03-30 |
Kla-Tencor Corporation |
Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect
|
US7083327B1
(en)
*
|
1999-04-06 |
2006-08-01 |
Thermal Wave Imaging, Inc. |
Method and apparatus for detecting kissing unbond defects
|
KR100702741B1
(ko)
*
|
1999-06-29 |
2007-04-03 |
어플라이드 머티어리얼스, 인코포레이티드 |
반도체 장치 제조를 위한 집적식 임계치수 제어
|
US8531678B2
(en)
|
1999-07-09 |
2013-09-10 |
Nova Measuring Instruments, Ltd. |
Method and system for measuring patterned structures
|
IL130874A
(en)
|
1999-07-09 |
2002-12-01 |
Nova Measuring Instr Ltd |
System and method for measuring pattern structures
|
EP1143504A4
(en)
*
|
1999-09-28 |
2005-10-12 |
Matsushita Electric Ind Co Ltd |
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
|
FR2810108B1
(fr)
*
|
2000-06-09 |
2004-04-02 |
France Telecom |
Ellipsometre spectroscopique a faible bruit
|
US7317531B2
(en)
*
|
2002-12-05 |
2008-01-08 |
Kla-Tencor Technologies Corporation |
Apparatus and methods for detecting overlay errors using scatterometry
|
US7541201B2
(en)
|
2000-08-30 |
2009-06-02 |
Kla-Tencor Technologies Corporation |
Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
|
IL138552A
(en)
*
|
2000-09-19 |
2006-08-01 |
Nova Measuring Instr Ltd |
Measurement of transverse displacement by optical method
|
US6891610B2
(en)
*
|
2000-09-20 |
2005-05-10 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining an implant characteristic and a presence of defects on a specimen
|
US6891627B1
(en)
|
2000-09-20 |
2005-05-10 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining a critical dimension and overlay of a specimen
|
US7130029B2
(en)
*
|
2000-09-20 |
2006-10-31 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining an adhesion characteristic and a thickness of a specimen
|
US6625497B2
(en)
*
|
2000-11-20 |
2003-09-23 |
Applied Materials Inc. |
Semiconductor processing module with integrated feedback/feed forward metrology
|
US6365422B1
(en)
*
|
2001-01-22 |
2002-04-02 |
Advanced Micro Devices, Inc. |
Automated variation of stepper exposure dose based upon across wafer variations in device characteristics, and system for accomplishing same
|
KR100403862B1
(ko)
*
|
2001-01-26 |
2003-11-01 |
어플라이드비전텍(주) |
반도체 웨이퍼 검사 장치 및 그 방법
|
US6597446B2
(en)
*
|
2001-03-22 |
2003-07-22 |
Sentec Corporation |
Holographic scatterometer for detection and analysis of wafer surface deposits
|
US20030002043A1
(en)
*
|
2001-04-10 |
2003-01-02 |
Kla-Tencor Corporation |
Periodic patterns and technique to control misalignment
|
WO2002088677A1
(en)
*
|
2001-04-26 |
2002-11-07 |
Therma-Wave, Inc. |
Measurement system cluster
|
US7089075B2
(en)
*
|
2001-05-04 |
2006-08-08 |
Tokyo Electron Limited |
Systems and methods for metrology recipe and model generation
|
DE10124609B4
(de)
*
|
2001-05-17 |
2012-12-27 |
Aixtron Se |
Verfahren zum Abscheiden aktiver Schichten auf Substraten
|
CA2450148A1
(en)
*
|
2001-06-08 |
2002-12-19 |
University Of Maine |
Spectroscopy instrument using broadband modulation and statistical estimation
|
US7006221B2
(en)
*
|
2001-07-13 |
2006-02-28 |
Rudolph Technologies, Inc. |
Metrology system with spectroscopic ellipsometer and photoacoustic measurements
|
US6847464B1
(en)
*
|
2001-08-02 |
2005-01-25 |
Zygo Corporation |
Measurement of photolithographic features
|
US6900888B2
(en)
*
|
2001-09-13 |
2005-05-31 |
Hitachi High-Technologies Corporation |
Method and apparatus for inspecting a pattern formed on a substrate
|
US6940592B2
(en)
*
|
2001-10-09 |
2005-09-06 |
Applied Materials, Inc. |
Calibration as well as measurement on the same workpiece during fabrication
|
KR20040062609A
(ko)
*
|
2001-11-02 |
2004-07-07 |
가부시키 가이샤 에바라 세이사꾸쇼 |
내장형 검사장치를 구비한 반도체 제조장치 및 그것을위한 방법
|
US6856384B1
(en)
|
2001-12-13 |
2005-02-15 |
Nanometrics Incorporated |
Optical metrology system with combined interferometer and ellipsometer
|
US7032816B2
(en)
*
|
2001-12-28 |
2006-04-25 |
Kimberly-Clark Worldwide, Inc. |
Communication between machines and feed-forward control in event-based product manufacturing
|
US8799113B2
(en)
*
|
2001-12-28 |
2014-08-05 |
Binforma Group Limited Liability Company |
Quality management by validating a bill of materials in event-based product manufacturing
|
US7035877B2
(en)
|
2001-12-28 |
2006-04-25 |
Kimberly-Clark Worldwide, Inc. |
Quality management and intelligent manufacturing with labels and smart tags in event-based product manufacturing
|
US20040032581A1
(en)
*
|
2002-01-15 |
2004-02-19 |
Mehrdad Nikoonahad |
Systems and methods for inspection of specimen surfaces
|
US7236847B2
(en)
*
|
2002-01-16 |
2007-06-26 |
Kla-Tencor Technologies Corp. |
Systems and methods for closed loop defect reduction
|
US6847443B1
(en)
*
|
2002-01-17 |
2005-01-25 |
Rudolph Technologies, Inc. |
System and method for multi-wavelength, narrow-bandwidth detection of surface defects
|
US7175503B2
(en)
|
2002-02-04 |
2007-02-13 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
|
US6721939B2
(en)
*
|
2002-02-19 |
2004-04-13 |
Taiwan Semiconductor Manufacturing Co., Ltd |
Electron beam shot linearity monitoring
|
US7049586B2
(en)
*
|
2002-02-21 |
2006-05-23 |
Applied Material Israel, Ltd. |
Multi beam scanning with bright/dark field imaging
|
US7169685B2
(en)
*
|
2002-02-25 |
2007-01-30 |
Micron Technology, Inc. |
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
|
JP4030787B2
(ja)
*
|
2002-03-04 |
2008-01-09 |
東京エレクトロン株式会社 |
基板加熱方法、基板加熱装置及び塗布、現像装置
|
TWI252516B
(en)
*
|
2002-03-12 |
2006-04-01 |
Toshiba Corp |
Determination method of process parameter and method for determining at least one of process parameter and design rule
|
US6886423B2
(en)
*
|
2002-03-27 |
2005-05-03 |
Rudolph Technologies, Inc. |
Scalable, automated metrology system and method of making the system
|
TW531822B
(en)
*
|
2002-03-29 |
2003-05-11 |
Taiwan Semiconductor Mfg |
Method for controlling inter-field critical dimensions of wafer
|
US6792328B2
(en)
*
|
2002-03-29 |
2004-09-14 |
Timbre Technologies, Inc. |
Metrology diffraction signal adaptation for tool-to-tool matching
|
JP4106948B2
(ja)
*
|
2002-03-29 |
2008-06-25 |
東京エレクトロン株式会社 |
被処理体の跳上り検出装置、被処理体の跳上り検出方法、プラズマ処理装置及びプラズマ処理方法
|
US7322250B1
(en)
*
|
2002-04-09 |
2008-01-29 |
Rockwell Automation Technologies, Inc. |
System and method for sensing torque on a rotating shaft
|
TWI273217B
(en)
*
|
2002-04-17 |
2007-02-11 |
Accent Optical Tech Inc |
Scatterometric measurement of undercut multi-layer diffracting structures
|
KR101010492B1
(ko)
*
|
2002-04-18 |
2011-01-21 |
어플라이드 머티어리얼스, 인코포레이티드 |
전자기 방사선의 스캐닝에 의한 열 플럭스 프로세싱
|
US20070258085A1
(en)
*
|
2006-05-02 |
2007-11-08 |
Robbins Michael D |
Substrate illumination and inspection system
|
US6978189B1
(en)
*
|
2002-05-28 |
2005-12-20 |
Advanced Micro Devices, Inc. |
Matching data related to multiple metrology tools
|
US6775015B2
(en)
*
|
2002-06-18 |
2004-08-10 |
Timbre Technologies, Inc. |
Optical metrology of single features
|
US6819844B2
(en)
*
|
2002-06-20 |
2004-11-16 |
The Boeing Company |
Fiber-optic based surface spectroscopy
|
US7167766B2
(en)
*
|
2002-06-28 |
2007-01-23 |
Tokyo Electron Limited |
Controlling a material processing tool and performance data
|
US7012438B1
(en)
|
2002-07-10 |
2006-03-14 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining a property of an insulating film
|
SG102718A1
(en)
*
|
2002-07-29 |
2004-03-26 |
Asml Holding Nv |
Lithography tool having a vacuum reticle library coupled to a vacuum chamber
|
US6826451B2
(en)
*
|
2002-07-29 |
2004-11-30 |
Asml Holding N.V. |
Lithography tool having a vacuum reticle library coupled to a vacuum chamber
|
US6908774B2
(en)
|
2002-08-12 |
2005-06-21 |
S.O. I. Tec Silicon On Insulator Technologies S.A. |
Method and apparatus for adjusting the thickness of a thin layer of semiconductor material
|
FR2843486B1
(fr)
*
|
2002-08-12 |
2005-09-23 |
Soitec Silicon On Insulator |
Procede d'elaboration de couches minces de semi-conducteur comprenant une etape de finition
|
AU2003263391A1
(en)
*
|
2002-08-12 |
2004-02-25 |
S.O.I.Tec Silicon On Insulator Technologies |
A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine
|
US20040087042A1
(en)
*
|
2002-08-12 |
2004-05-06 |
Bruno Ghyselen |
Method and apparatus for adjusting the thickness of a layer of semiconductor material
|
FR2843487B1
(fr)
*
|
2002-08-12 |
2005-10-14 |
|
Procede d'elaboration de couche mince comprenant une etape de correction d'epaisseur par oxydation sacrificielle, et machine associee
|
DE10239548A1
(de)
*
|
2002-08-23 |
2004-03-04 |
Leica Microsystems Semiconductor Gmbh |
Vorrichtung und Verfahren zur Inspektion eines Objekts
|
JP2004146782A
(ja)
*
|
2002-08-29 |
2004-05-20 |
Advanced Lcd Technologies Development Center Co Ltd |
結晶化状態のin−situモニタリング方法
|
US7139081B2
(en)
|
2002-09-09 |
2006-11-21 |
Zygo Corporation |
Interferometry method for ellipsometry, reflectometry, and scatterometry measurements, including characterization of thin film structures
|
US7869057B2
(en)
|
2002-09-09 |
2011-01-11 |
Zygo Corporation |
Multiple-angle multiple-wavelength interferometer using high-NA imaging and spectral analysis
|
US6963393B2
(en)
*
|
2002-09-23 |
2005-11-08 |
Applied Materials, Inc. |
Measurement of lateral diffusion of diffused layers
|
US20040207836A1
(en)
*
|
2002-09-27 |
2004-10-21 |
Rajeshwar Chhibber |
High dynamic range optical inspection system and method
|
US6934032B1
(en)
*
|
2002-09-30 |
2005-08-23 |
Advanced Micro Devices, Inc. |
Copper oxide monitoring by scatterometry/ellipsometry during nitride or BLOK removal in damascene process
|
US6954678B1
(en)
*
|
2002-09-30 |
2005-10-11 |
Advanced Micro Devices, Inc. |
Artificial intelligence system for track defect problem solving
|
US6724476B1
(en)
*
|
2002-10-01 |
2004-04-20 |
Advanced Micro Devices, Inc. |
Low defect metrology approach on clean track using integrated metrology
|
US7968354B1
(en)
*
|
2002-10-04 |
2011-06-28 |
Kla-Tencor Technologies Corp. |
Methods for correlating backside and frontside defects detected on a specimen and classification of backside defects
|
TW564513B
(en)
*
|
2002-10-21 |
2003-12-01 |
Au Optronics Corp |
Testing apparatus for polysilicon thin film crystal quality, test and control method thereof
|
TW577135B
(en)
*
|
2002-10-21 |
2004-02-21 |
Au Optronics Corp |
Die size control for polysilicon film and the inspection method thereof
|
KR100492159B1
(ko)
*
|
2002-10-30 |
2005-06-02 |
삼성전자주식회사 |
기판 검사 장치
|
US6875622B1
(en)
*
|
2002-11-01 |
2005-04-05 |
Advanced Micro Devices, Inc. |
Method and apparatus for determining electromagnetic properties of a process layer using scatterometry measurements
|
US7248062B1
(en)
|
2002-11-04 |
2007-07-24 |
Kla-Tencor Technologies Corp. |
Contactless charge measurement of product wafers and control of corona generation and deposition
|
JP3878107B2
(ja)
*
|
2002-11-06 |
2007-02-07 |
株式会社日立ハイテクノロジーズ |
欠陥検査方法及びその装置
|
KR100540865B1
(ko)
*
|
2002-11-06 |
2006-01-11 |
삼성전자주식회사 |
농도 측정방법 및 이를 이용한 반도체 소자의 불순물 농도측정방법
|
US7931028B2
(en)
*
|
2003-08-26 |
2011-04-26 |
Jay Harvey H |
Skin injury or damage prevention method using optical radiation
|
US20040090629A1
(en)
*
|
2002-11-08 |
2004-05-13 |
Emmanuel Drege |
Diffraction order selection for optical metrology simulation
|
US7239933B2
(en)
*
|
2002-11-11 |
2007-07-03 |
Micron Technology, Inc. |
Substrate supports for use with programmable material consolidation apparatus and systems
|
US6867862B2
(en)
*
|
2002-11-20 |
2005-03-15 |
Mehrdad Nikoonahad |
System and method for characterizing three-dimensional structures
|
US7440105B2
(en)
*
|
2002-12-05 |
2008-10-21 |
Kla-Tencor Technologies Corporation |
Continuously varying offset mark and methods of determining overlay
|
WO2004053426A1
(en)
|
2002-12-05 |
2004-06-24 |
Kla-Tencor Technologies Corporation |
Apparatus and methods for detecting overlay errors using scatterometry
|
US7112961B2
(en)
*
|
2002-12-13 |
2006-09-26 |
Applied Materials, Inc. |
Method and apparatus for dynamically measuring the thickness of an object
|
US6895360B2
(en)
*
|
2002-12-17 |
2005-05-17 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determination
|
US6800852B2
(en)
*
|
2002-12-27 |
2004-10-05 |
Revera Incorporated |
Nondestructive characterization of thin films using measured basis spectra
|
US7006224B2
(en)
*
|
2002-12-30 |
2006-02-28 |
Applied Materials, Israel, Ltd. |
Method and system for optical inspection of an object
|
JP3867048B2
(ja)
*
|
2003-01-08 |
2007-01-10 |
株式会社日立ハイテクノロジーズ |
モノクロメータ及びそれを用いた走査電子顕微鏡
|
US6950190B2
(en)
*
|
2003-01-09 |
2005-09-27 |
Therma-Wave, Inc. |
Scatterometry for junction metrology
|
US8564780B2
(en)
|
2003-01-16 |
2013-10-22 |
Jordan Valley Semiconductors Ltd. |
Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work pieces
|
US7126131B2
(en)
|
2003-01-16 |
2006-10-24 |
Metrosol, Inc. |
Broad band referencing reflectometer
|
US20080246951A1
(en)
*
|
2007-04-09 |
2008-10-09 |
Phillip Walsh |
Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work-pieces
|
US7116429B1
(en)
*
|
2003-01-18 |
2006-10-03 |
Walecki Wojciech J |
Determining thickness of slabs of materials by inventors
|
JP4652667B2
(ja)
*
|
2003-02-13 |
2011-03-16 |
キヤノン株式会社 |
面位置計測方法及び走査型露光装置
|
JP2007524807A
(ja)
*
|
2003-02-26 |
2007-08-30 |
レイモンド, ジェイ. キャストンガイ, |
球形光散乱及び遠視野位相の測定
|
KR100538092B1
(ko)
*
|
2003-02-27 |
2005-12-21 |
삼성전자주식회사 |
불순물 농도의 수직 분포 모니터링 방법 및 장치
|
US7081369B2
(en)
|
2003-02-28 |
2006-07-25 |
Intel Corporation |
Forming a semiconductor device feature using acquired parameters
|
US7106454B2
(en)
|
2003-03-06 |
2006-09-12 |
Zygo Corporation |
Profiling complex surface structures using scanning interferometry
|
US7324214B2
(en)
|
2003-03-06 |
2008-01-29 |
Zygo Corporation |
Interferometer and method for measuring characteristics of optically unresolved surface features
|
DE10311855B4
(de)
*
|
2003-03-17 |
2005-04-28 |
Infineon Technologies Ag |
Anordnung zum Übertragen von Informationen/Strukturen auf Wafer unter Verwendung eines Stempels
|
WO2004095113A2
(en)
*
|
2003-03-26 |
2004-11-04 |
Cargill, Incorporated |
An automated polarized light microscope combined with a spectroscopy/spectral imaging apparatus
|
JP4220287B2
(ja)
*
|
2003-03-31 |
2009-02-04 |
株式会社東芝 |
パターン欠陥検査装置
|
US7916308B2
(en)
*
|
2003-04-01 |
2011-03-29 |
Seagate Technology Llc |
Method and optical profiler
|
US7352456B2
(en)
|
2003-04-08 |
2008-04-01 |
Kla-Tencor Technologies Corp. |
Method and apparatus for inspecting a substrate using a plurality of inspection wavelength regimes
|
GB0308182D0
(en)
*
|
2003-04-09 |
2003-05-14 |
Aoti Operating Co Inc |
Detection method and apparatus
|
JP4408025B2
(ja)
*
|
2003-04-24 |
2010-02-03 |
株式会社リコー |
位置ずれパターン検出装置、光書込み装置、画像形成装置及び複写機
|
US6968253B2
(en)
|
2003-05-07 |
2005-11-22 |
Kla-Tencor Technologies Corp. |
Computer-implemented method and carrier medium configured to generate a set of process parameters for a lithography process
|
TW200506375A
(en)
*
|
2003-05-16 |
2005-02-16 |
Tokyo Electron Ltd |
Inspection apparatus
|
WO2004107422A2
(en)
*
|
2003-05-27 |
2004-12-09 |
Ebara Corporation |
Plating apparatus and plating method
|
TWI283817B
(en)
*
|
2003-05-30 |
2007-07-11 |
Tokyo Electron Ltd |
Method of operating a process control system and method of operating an advanced process control system
|
US7365834B2
(en)
*
|
2003-06-24 |
2008-04-29 |
Kla-Tencor Technologies Corporation |
Optical system for detecting anomalies and/or features of surfaces
|
JP2005015885A
(ja)
*
|
2003-06-27 |
2005-01-20 |
Ebara Corp |
基板処理方法及び装置
|
US6822472B1
(en)
|
2003-06-27 |
2004-11-23 |
International Business Machines Corporation |
Detection of hard mask remaining on a surface of an insulating layer
|
US7608468B1
(en)
*
|
2003-07-02 |
2009-10-27 |
Kla-Tencor Technologies, Corp. |
Apparatus and methods for determining overlay and uses of same
|
US7280200B2
(en)
*
|
2003-07-18 |
2007-10-09 |
Ade Corporation |
Detection of a wafer edge using collimated light
|
US7106434B1
(en)
|
2003-07-28 |
2006-09-12 |
Kla-Tencor Technologies, Inc. |
Inspection tool
|
US7153185B1
(en)
*
|
2003-08-18 |
2006-12-26 |
Applied Materials, Inc. |
Substrate edge detection
|
US6829056B1
(en)
|
2003-08-21 |
2004-12-07 |
Michael Barnes |
Monitoring dimensions of features at different locations in the processing of substrates
|
DE10339227B4
(de)
*
|
2003-08-26 |
2014-05-28 |
Byk Gardner Gmbh |
Verfahren und Vorrichtung zur Charakterisierung von Oberflächen
|
JP4607517B2
(ja)
*
|
2003-09-03 |
2011-01-05 |
東京エレクトロン株式会社 |
プラズマ処理装置
|
EP2256487B1
(en)
*
|
2003-09-04 |
2019-11-06 |
KLA-Tencor Corporation |
Methods for inspection of a specimen using different inspection parameters
|
US7430898B1
(en)
*
|
2003-09-04 |
2008-10-07 |
Kla-Tencor Technologies Corp. |
Methods and systems for analyzing a specimen using atomic force microscopy profiling in combination with an optical technique
|
JP4880888B2
(ja)
*
|
2003-09-09 |
2012-02-22 |
セイコーインスツル株式会社 |
半導体装置の製造方法
|
JP4761431B2
(ja)
*
|
2003-09-09 |
2011-08-31 |
セイコーインスツル株式会社 |
半導体装置の製造方法
|
JP4880889B2
(ja)
*
|
2003-09-09 |
2012-02-22 |
セイコーインスツル株式会社 |
半導体装置の製造方法
|
US7289225B2
(en)
|
2003-09-15 |
2007-10-30 |
Zygo Corporation |
Surface profiling using an interference pattern matching template
|
CN100465788C
(zh)
*
|
2003-10-27 |
2009-03-04 |
三星电子株式会社 |
光刻装置
|
US7304310B1
(en)
*
|
2003-11-21 |
2007-12-04 |
Kla-Tencor Technologies Corp. |
Methods and systems for inspecting a specimen using light scattered in different wavelength ranges
|
CA2552650C
(en)
*
|
2004-01-07 |
2014-09-30 |
Identification International, Inc. |
Low power fingerprint capture system, apparatus, and method
|
US20050157308A1
(en)
*
|
2004-01-15 |
2005-07-21 |
Andrei Brunfeld |
Apparatus and method for measuring thickness variation of wax film
|
KR100568254B1
(ko)
*
|
2004-02-06 |
2006-04-07 |
삼성전자주식회사 |
문턱 전압 조절이 가능한 전자 소자의 제조 방법과 이에사용되는 이온 주입기 조절기 및 이온 주입 시스템
|
US7019835B2
(en)
*
|
2004-02-19 |
2006-03-28 |
Molecular Imprints, Inc. |
Method and system to measure characteristics of a film disposed on a substrate
|
US7415317B2
(en)
*
|
2004-02-25 |
2008-08-19 |
Micron Technology, Inc. |
Method and system for correlating and combining production and non-production data for analysis
|
US7395130B2
(en)
*
|
2004-02-27 |
2008-07-01 |
Micron Technology, Inc. |
Method and system for aggregating and combining manufacturing data for analysis
|
US7523076B2
(en)
*
|
2004-03-01 |
2009-04-21 |
Tokyo Electron Limited |
Selecting a profile model for use in optical metrology using a machine learning system
|
US7078712B2
(en)
*
|
2004-03-18 |
2006-07-18 |
Axcelis Technologies, Inc. |
In-situ monitoring on an ion implanter
|
WO2005092025A2
(en)
*
|
2004-03-22 |
2005-10-06 |
Kla-Tencor Technologies Corp. |
Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis
|
US7388677B2
(en)
*
|
2004-03-22 |
2008-06-17 |
Timbre Technologies, Inc. |
Optical metrology optimization for repetitive structures
|
US20050211896A1
(en)
*
|
2004-03-23 |
2005-09-29 |
International Business Machines Corporation |
Pt coating initiated by indirect electron beam for resist contact hole metrology
|
TWI249615B
(en)
*
|
2004-03-26 |
2006-02-21 |
Optimax Tech Corp |
Method and device for testing polarization sheet
|
DE102004015326A1
(de)
*
|
2004-03-30 |
2005-10-20 |
Leica Microsystems |
Vorrichtung und Verfahren zur Inspektion eines Halbleiterbauteils
|
US20050220984A1
(en)
*
|
2004-04-02 |
2005-10-06 |
Applied Materials Inc., A Delaware Corporation |
Method and system for control of processing conditions in plasma processing systems
|
TW200540939A
(en)
*
|
2004-04-22 |
2005-12-16 |
Olympus Corp |
Defect inspection device and substrate manufacturing system using the same
|
US7076320B1
(en)
*
|
2004-05-04 |
2006-07-11 |
Advanced Micro Devices, Inc. |
Scatterometry monitor in cluster process tool environment for advanced process control (APC)
|
US7301149B2
(en)
*
|
2004-05-06 |
2007-11-27 |
The Board Of Trustees Of The University Of Illinois |
Apparatus and method for determining a thickness of a deposited material
|
JP4357355B2
(ja)
*
|
2004-05-07 |
2009-11-04 |
株式会社日立ハイテクノロジーズ |
パターン検査方法及びその装置
|
US7773216B2
(en)
*
|
2004-05-10 |
2010-08-10 |
Panasonic Corporation |
Composite sheet material selection method for use in ultra-fast laser patterning
|
US7254290B1
(en)
*
|
2004-05-10 |
2007-08-07 |
Lockheed Martin Corporation |
Enhanced waveguide metrology gauge collimator
|
JP4714427B2
(ja)
*
|
2004-05-14 |
2011-06-29 |
株式会社荏原製作所 |
基板上に形成された薄膜の研磨方法
|
US7349079B2
(en)
*
|
2004-05-14 |
2008-03-25 |
Kla-Tencor Technologies Corp. |
Methods for measurement or analysis of a nitrogen concentration of a specimen
|
US7564552B2
(en)
*
|
2004-05-14 |
2009-07-21 |
Kla-Tencor Technologies Corp. |
Systems and methods for measurement of a specimen with vacuum ultraviolet light
|
US7359052B2
(en)
*
|
2004-05-14 |
2008-04-15 |
Kla-Tencor Technologies Corp. |
Systems and methods for measurement of a specimen with vacuum ultraviolet light
|
US7067819B2
(en)
*
|
2004-05-14 |
2006-06-27 |
Kla-Tencor Technologies Corp. |
Systems and methods for measurement or analysis of a specimen using separated spectral peaks in light
|
JP2007537455A
(ja)
*
|
2004-05-14 |
2007-12-20 |
ケイエルエイ−テンコー・テクノロジーズ・コーポレーション |
試験体の測定または分析のためのシステムおよび方法
|
US7142311B2
(en)
*
|
2004-05-18 |
2006-11-28 |
Zygo Corporation |
Methods and systems for determining optical properties using low-coherence interference signals
|
KR100541820B1
(ko)
*
|
2004-05-28 |
2006-01-11 |
삼성전자주식회사 |
반도체 소자 제조를 위한 파티클 검출장치
|
IL162290A
(en)
*
|
2004-06-01 |
2013-06-27 |
Nova Measuring Instr Ltd |
Optical measurement system
|
US7397596B2
(en)
*
|
2004-07-28 |
2008-07-08 |
Ler Technologies, Inc. |
Surface and subsurface detection sensor
|
US7239389B2
(en)
*
|
2004-07-29 |
2007-07-03 |
Applied Materials, Israel, Ltd. |
Determination of irradiation parameters for inspection of a surface
|
US7327448B2
(en)
*
|
2004-07-29 |
2008-02-05 |
Optech Ventures Llc |
Laser-ultrasonic detection of flip chip attachment defects
|
KR100568703B1
(ko)
*
|
2004-08-10 |
2006-04-07 |
삼성전자주식회사 |
금속막의 두께 측정 방법 및 이를 수행하기 위한 장치
|
US7663097B2
(en)
*
|
2004-08-11 |
2010-02-16 |
Metrosol, Inc. |
Method and apparatus for accurate calibration of a reflectometer by using a relative reflectance measurement
|
US7282703B2
(en)
*
|
2004-08-11 |
2007-10-16 |
Metrosol, Inc. |
Method and apparatus for accurate calibration of a reflectometer by using a relative reflectance measurement
|
US7399975B2
(en)
*
|
2004-08-11 |
2008-07-15 |
Metrosol, Inc. |
Method and apparatus for performing highly accurate thin film measurements
|
US7511265B2
(en)
*
|
2004-08-11 |
2009-03-31 |
Metrosol, Inc. |
Method and apparatus for accurate calibration of a reflectometer by using a relative reflectance measurement
|
US7804059B2
(en)
*
|
2004-08-11 |
2010-09-28 |
Jordan Valley Semiconductors Ltd. |
Method and apparatus for accurate calibration of VUV reflectometer
|
US7052921B1
(en)
*
|
2004-09-03 |
2006-05-30 |
Advanced Micro Devices, Inc. |
System and method using in situ scatterometry to detect photoresist pattern integrity during the photolithography process
|
JP2006093634A
(ja)
*
|
2004-09-27 |
2006-04-06 |
Advanced Lcd Technologies Development Center Co Ltd |
半導体装置、レーザ光の光強度分布測定方法レーザアニール装置および結晶化方法
|
US20060077403A1
(en)
*
|
2004-10-13 |
2006-04-13 |
Zaidi Shoaib H |
Optical system and method for measuring small dimensions
|
JP4537834B2
(ja)
*
|
2004-11-16 |
2010-09-08 |
富士通セミコンダクター株式会社 |
半導体装置の製造方法
|
US8084260B2
(en)
*
|
2004-11-24 |
2011-12-27 |
Applied Biosystems, Llc |
Spectral calibration method and system for multiple instruments
|
US20060114478A1
(en)
*
|
2004-11-26 |
2006-06-01 |
Applied Materials, Inc. |
Evaluating effects of tilt angle in ion implantation
|
US7280229B2
(en)
*
|
2004-12-03 |
2007-10-09 |
Timbre Technologies, Inc. |
Examining a structure formed on a semiconductor wafer using machine learning systems
|
US20070091325A1
(en)
*
|
2005-01-07 |
2007-04-26 |
Mehrdad Nikoonahad |
Multi-channel optical metrology
|
US7884947B2
(en)
|
2005-01-20 |
2011-02-08 |
Zygo Corporation |
Interferometry for determining characteristics of an object surface, with spatially coherent illumination
|
JP4768754B2
(ja)
|
2005-01-20 |
2011-09-07 |
ザイゴ コーポレーション |
オブジェクト表面の特徴を求める干渉計
|
US20060164649A1
(en)
*
|
2005-01-24 |
2006-07-27 |
Eliezer Rosengaus |
Multi-spectral techniques for defocus detection
|
WO2006078025A1
(ja)
|
2005-01-24 |
2006-07-27 |
Nikon Corporation |
計測方法、計測システム、検査方法、検査システム、露光方法及び露光システム
|
US7593100B2
(en)
*
|
2005-01-24 |
2009-09-22 |
Nikon Corporation |
Measuring method, measuring system, inspecting method, inspecting system, exposure method and exposure system, in which information as to the degree of the flatness of an object is pre-obtained
|
US7478019B2
(en)
*
|
2005-01-26 |
2009-01-13 |
Kla-Tencor Corporation |
Multiple tool and structure analysis
|
US6955931B1
(en)
*
|
2005-02-10 |
2005-10-18 |
Advanced Micro Devices, Inc. |
Method for detecting silicide encroachment of a gate electrode in a semiconductor arrangement
|
US7408641B1
(en)
*
|
2005-02-14 |
2008-08-05 |
Kla-Tencor Technologies Corp. |
Measurement systems configured to perform measurements of a specimen and illumination subsystems configured to provide illumination for a measurement system
|
US7179665B1
(en)
|
2005-02-17 |
2007-02-20 |
Midwest Research Institute |
Optical method for determining the doping depth profile in silicon
|
US20060187466A1
(en)
*
|
2005-02-18 |
2006-08-24 |
Timbre Technologies, Inc. |
Selecting unit cell configuration for repeating structures in optical metrology
|
US20060186406A1
(en)
*
|
2005-02-18 |
2006-08-24 |
Texas Instruments Inc. |
Method and system for qualifying a semiconductor etch process
|
US20060196527A1
(en)
*
|
2005-02-23 |
2006-09-07 |
Tokyo Electron Limited |
Method of surface processing substrate, method of cleaning substrate, and programs for implementing the methods
|
US8547522B2
(en)
*
|
2005-03-03 |
2013-10-01 |
Asml Netherlands B.V. |
Dedicated metrology stage for lithography applications
|
US20060219947A1
(en)
*
|
2005-03-03 |
2006-10-05 |
Asml Netherlands B.V. |
Dedicated metrology stage for lithography applications
|
US7918293B1
(en)
|
2005-03-09 |
2011-04-05 |
Us Synthetic Corporation |
Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume
|
US7148073B1
(en)
|
2005-03-15 |
2006-12-12 |
Kla-Tencor Technologies Corp. |
Methods and systems for preparing a copper containing substrate for analysis
|
KR100882883B1
(ko)
*
|
2005-03-29 |
2009-02-10 |
가부시키가이샤 히다치 고쿠사이 덴키 |
반도체 제조장치
|
US7421414B2
(en)
*
|
2005-03-31 |
2008-09-02 |
Timbre Technologies, Inc. |
Split machine learning systems
|
US7351980B2
(en)
*
|
2005-03-31 |
2008-04-01 |
Kla-Tencor Technologies Corp. |
All-reflective optical systems for broadband wafer inspection
|
US7115866B1
(en)
*
|
2005-04-28 |
2006-10-03 |
Kla-Tencor Technologies, Inc. |
Site stepping for electron beam micro analysis
|
US7420163B2
(en)
*
|
2005-04-29 |
2008-09-02 |
Revera Incorporated |
Determining layer thickness using photoelectron spectroscopy
|
US7161669B2
(en)
|
2005-05-06 |
2007-01-09 |
Kla- Tencor Technologies Corporation |
Wafer edge inspection
|
JP5059297B2
(ja)
*
|
2005-05-09 |
2012-10-24 |
株式会社日立ハイテクノロジーズ |
電子線式観察装置
|
US7315384B2
(en)
*
|
2005-05-10 |
2008-01-01 |
Asml Netherlands B.V. |
Inspection apparatus and method of inspection
|
US7477958B2
(en)
*
|
2005-05-11 |
2009-01-13 |
International Business Machines Corporation |
Method of release and product flow management for a manufacturing facility
|
DE102005025291B4
(de)
*
|
2005-06-02 |
2019-07-25 |
Byk-Gardner Gmbh |
Verfahren und Vorrichtung zur Bestimmung von Oberflächeneigenschaften
|
US7358199B2
(en)
*
|
2005-06-09 |
2008-04-15 |
United Microelectronics Corp. |
Method of fabricating semiconductor integrated circuits
|
US7279657B2
(en)
*
|
2005-06-13 |
2007-10-09 |
Applied Materials, Inc. |
Scanned rapid thermal processing with feed forward control
|
US7433034B1
(en)
|
2005-06-17 |
2008-10-07 |
Nanometrics Incorporated |
Darkfield defect inspection with spectral contents
|
US20070009010A1
(en)
*
|
2005-06-23 |
2007-01-11 |
Koji Shio |
Wafer temperature measuring method and apparatus
|
US20070000434A1
(en)
*
|
2005-06-30 |
2007-01-04 |
Accent Optical Technologies, Inc. |
Apparatuses and methods for detecting defects in semiconductor workpieces
|
TWI391645B
(zh)
*
|
2005-07-06 |
2013-04-01 |
Nanometrics Inc |
晶圓或其他工作表面下污染物及缺陷非接觸測量之差分波長光致發光
|
TWI439684B
(zh)
*
|
2005-07-06 |
2014-06-01 |
Nanometrics Inc |
具自晶圓或其他工件特定材料層所發射光致發光信號優先偵測之光致發光成像
|
US20070008526A1
(en)
*
|
2005-07-08 |
2007-01-11 |
Andrzej Buczkowski |
Apparatus and method for non-contact assessment of a constituent in semiconductor workpieces
|
US7433056B1
(en)
*
|
2005-07-15 |
2008-10-07 |
Kla-Tencor Technologies Corporation |
Scatterometry metrology using inelastic scattering
|
JP2007027478A
(ja)
*
|
2005-07-19 |
2007-02-01 |
Sharp Corp |
エッチング方法およびエッチング装置
|
US7394067B1
(en)
|
2005-07-20 |
2008-07-01 |
Kla-Tencor Technologies Corp. |
Systems and methods for reducing alteration of a specimen during analysis for charged particle based and other measurement systems
|
DE102005038034B3
(de)
*
|
2005-08-09 |
2007-05-10 |
Leica Microsystems Semiconductor Gmbh |
Vorrichtung und Verfahren zur Inspektion der Oberfläche eines Wafers
|
US8039792B2
(en)
*
|
2005-08-15 |
2011-10-18 |
Baker Hughes Incorporated |
Wide band gap semiconductor photodetector based gamma ray detectors for well logging applications
|
US7763845B2
(en)
*
|
2005-08-15 |
2010-07-27 |
Baker Hughes Incorporated |
Downhole navigation and detection system
|
US7893703B2
(en)
*
|
2005-08-19 |
2011-02-22 |
Kla-Tencor Technologies Corp. |
Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer
|
US7410815B2
(en)
*
|
2005-08-25 |
2008-08-12 |
Nanometrics Incorporated |
Apparatus and method for non-contact assessment of a constituent in semiconductor substrates
|
US7538371B2
(en)
*
|
2005-09-01 |
2009-05-26 |
United Microelectronics Corp. |
CMOS image sensor integrated with 1-T SRAM and fabrication method thereof
|
CN101297192B
(zh)
*
|
2005-09-09 |
2012-05-30 |
萨克米伊莫拉机械合作社合作公司 |
用于直观监测物体的方法和设备
|
US20070059849A1
(en)
*
|
2005-09-12 |
2007-03-15 |
Interuniversitair Microelktronica Centrum (Imec) |
Method and system for BARC optimization for high numerical aperture applications
|
US7781349B2
(en)
*
|
2005-09-12 |
2010-08-24 |
Imec |
Method and system for optimizing a BARC stack
|
US7289200B1
(en)
|
2005-10-04 |
2007-10-30 |
Itt Manufacturing Enterprises, Inc. |
Confocal reflectommeter/ellipsometer to inspect low-temperature fusion seals
|
TWI289091B
(en)
*
|
2005-10-06 |
2007-11-01 |
Ind Tech Res Inst |
Apparatus for endpoint detection during polishing
|
WO2007044786A2
(en)
|
2005-10-11 |
2007-04-19 |
Zygo Corporation |
Interferometry method and system including spectral decomposition
|
US7864919B1
(en)
|
2005-10-18 |
2011-01-04 |
Smith International, Inc. |
Nondestructive method of measuring a region within an ultra-hard polycrystalline construction
|
US7397553B1
(en)
|
2005-10-24 |
2008-07-08 |
Kla-Tencor Technologies Corporation |
Surface scanning
|
US7277819B2
(en)
*
|
2005-10-31 |
2007-10-02 |
Eastman Kodak Company |
Measuring layer thickness or composition changes
|
EP1946040B1
(en)
*
|
2005-11-07 |
2017-03-22 |
Cardinal CG Company |
Method and apparatus for identifying photocatalytic coatings
|
US20070115464A1
(en)
*
|
2005-11-21 |
2007-05-24 |
Harding Kevin G |
System and method for inspection of films
|
US7371590B2
(en)
*
|
2005-11-21 |
2008-05-13 |
General Electric Company |
Integrated inspection system and defect correction method
|
US20070116350A1
(en)
*
|
2005-11-21 |
2007-05-24 |
Cheverton Mark A |
Method for detecting the alignment of films for automated defect detection
|
US20070114693A1
(en)
*
|
2005-11-21 |
2007-05-24 |
Buckley Paul W |
Methods for improving mold quality for use in the manufacture of liquid crystal display components
|
US20070122920A1
(en)
*
|
2005-11-29 |
2007-05-31 |
Bornstein William B |
Method for improved control of critical dimensions of etched structures on semiconductor wafers
|
JP4762702B2
(ja)
*
|
2005-12-08 |
2011-08-31 |
富士フイルム株式会社 |
メッキ厚モニタ装置およびメッキ停止装置
|
US7522263B2
(en)
*
|
2005-12-27 |
2009-04-21 |
Asml Netherlands B.V. |
Lithographic apparatus and method
|
KR100650888B1
(ko)
*
|
2005-12-29 |
2006-11-28 |
동부일렉트로닉스 주식회사 |
구리 금속 배선의 에지 비드 제거 공정 모니터링 방법
|
KR100735613B1
(ko)
*
|
2006-01-11 |
2007-07-04 |
삼성전자주식회사 |
이온주입설비의 디스크 어셈블리
|
US8148900B1
(en)
|
2006-01-17 |
2012-04-03 |
Kla-Tencor Technologies Corp. |
Methods and systems for providing illumination of a specimen for inspection
|
US20070164205A1
(en)
*
|
2006-01-17 |
2007-07-19 |
Truche Jean L |
Method and apparatus for mass spectrometer diagnostics
|
US20070176119A1
(en)
*
|
2006-01-30 |
2007-08-02 |
Accent Optical Technologies, Inc. |
Apparatuses and methods for analyzing semiconductor workpieces
|
EP1979926A2
(de)
*
|
2006-02-03 |
2008-10-15 |
Carl Zeiss NTS GmbH |
Fokussier- und positionierhilfseinrichtung für ein teilchenoptisches rastermikroskop
|
WO2007092950A2
(en)
*
|
2006-02-09 |
2007-08-16 |
Kla-Tencor Technologies Corporation |
Methods and systems for determining a characteristic of a wafer
|
JP2007240432A
(ja)
*
|
2006-03-10 |
2007-09-20 |
Omron Corp |
欠陥検査装置および欠陥検査方法
|
US9068917B1
(en)
*
|
2006-03-14 |
2015-06-30 |
Kla-Tencor Technologies Corp. |
Systems and methods for inspection of a specimen
|
JP5185506B2
(ja)
*
|
2006-03-23 |
2013-04-17 |
株式会社日立ハイテクノロジーズ |
荷電粒子線パターン測定装置
|
US7619731B2
(en)
*
|
2006-03-30 |
2009-11-17 |
Tokyo Electron Limited |
Measuring a damaged structure formed on a wafer using optical metrology
|
US7324193B2
(en)
|
2006-03-30 |
2008-01-29 |
Tokyo Electron Limited |
Measuring a damaged structure formed on a wafer using optical metrology
|
US7623978B2
(en)
*
|
2006-03-30 |
2009-11-24 |
Tokyo Electron Limited |
Damage assessment of a wafer using optical metrology
|
US7576851B2
(en)
*
|
2006-03-30 |
2009-08-18 |
Tokyo Electron Limited |
Creating a library for measuring a damaged structure formed on a wafer using optical metrology
|
US7436505B2
(en)
*
|
2006-04-04 |
2008-10-14 |
Kla-Tencor Technologies Corp. |
Computer-implemented methods and systems for determining a configuration for a light scattering inspection system
|
US7999949B2
(en)
*
|
2006-04-24 |
2011-08-16 |
Raintree Scientific Instruments (Shanghai) Corporation |
Spectroscopic ellipsometers
|
US7508504B2
(en)
*
|
2006-05-02 |
2009-03-24 |
Accretech Usa, Inc. |
Automatic wafer edge inspection and review system
|
US20090122304A1
(en)
*
|
2006-05-02 |
2009-05-14 |
Accretech Usa, Inc. |
Apparatus and Method for Wafer Edge Exclusion Measurement
|
US20090116727A1
(en)
*
|
2006-05-02 |
2009-05-07 |
Accretech Usa, Inc. |
Apparatus and Method for Wafer Edge Defects Detection
|
US7616734B1
(en)
*
|
2006-05-09 |
2009-11-10 |
Smith International, Inc. |
Multi-step method of nondestructively measuring a region within an ultra-hard polycrystalline construction
|
US7558369B1
(en)
|
2006-05-09 |
2009-07-07 |
Smith International, Inc. |
Nondestructive method of measuring a region within an ultra-hard polycrystalline construction
|
US7567344B2
(en)
*
|
2006-05-12 |
2009-07-28 |
Corning Incorporated |
Apparatus and method for characterizing defects in a transparent substrate
|
US7528944B2
(en)
*
|
2006-05-22 |
2009-05-05 |
Kla-Tencor Technologies Corporation |
Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
|
US7469164B2
(en)
*
|
2006-06-26 |
2008-12-23 |
Nanometrics Incorporated |
Method and apparatus for process control with in-die metrology
|
US8280649B2
(en)
*
|
2006-06-27 |
2012-10-02 |
Nec Corporation |
Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing program
|
US7705331B1
(en)
|
2006-06-29 |
2010-04-27 |
Kla-Tencor Technologies Corp. |
Methods and systems for providing illumination of a specimen for a process performed on the specimen
|
US7525673B2
(en)
*
|
2006-07-10 |
2009-04-28 |
Tokyo Electron Limited |
Optimizing selected variables of an optical metrology system
|
US7526354B2
(en)
|
2006-07-10 |
2009-04-28 |
Tokyo Electron Limited |
Managing and using metrology data for process and equipment control
|
US20080013107A1
(en)
*
|
2006-07-11 |
2008-01-17 |
Tokyo Electron Limited |
Generating a profile model to characterize a structure to be examined using optical metrology
|
TWI428559B
(zh)
|
2006-07-21 |
2014-03-01 |
Zygo Corp |
在低同調干涉下系統性效應之補償方法和系統
|
JP4307470B2
(ja)
*
|
2006-08-08 |
2009-08-05 |
株式会社日立ハイテクノロジーズ |
荷電粒子線装置、試料加工方法及び半導体検査装置
|
US7935942B2
(en)
*
|
2006-08-15 |
2011-05-03 |
Varian Semiconductor Equipment Associates, Inc. |
Technique for low-temperature ion implantation
|
US7667835B2
(en)
*
|
2006-08-28 |
2010-02-23 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Apparatus and method for preventing copper peeling in ECP
|
US7856939B2
(en)
|
2006-08-28 |
2010-12-28 |
Transitions Optical, Inc. |
Recirculation spin coater with optical controls
|
US20080055597A1
(en)
*
|
2006-08-29 |
2008-03-06 |
Jie-Wei Sun |
Method for characterizing line width roughness (lwr) of printed features
|
US8126205B2
(en)
*
|
2006-09-25 |
2012-02-28 |
Cambridge Research & Instrumentation, Inc. |
Sample imaging and classification
|
JP4981410B2
(ja)
*
|
2006-10-31 |
2012-07-18 |
株式会社日立ハイテクノロジーズ |
走査型電子顕微鏡、走査型電子顕微鏡を用いたパターンの複合検査方法、および走査型電子顕微鏡の制御装置
|
US7417750B2
(en)
*
|
2006-11-07 |
2008-08-26 |
Tokyo Electron Limited |
Consecutive measurement of structures formed on a semiconductor wafer using an angle-resolved spectroscopic scatterometer
|
US8184288B2
(en)
*
|
2006-11-29 |
2012-05-22 |
Macronix International Co., Ltd. |
Method of depositing a silicon-containing material by utilizing a multi-step fill-in process in a deposition machine
|
US8520194B2
(en)
*
|
2006-11-29 |
2013-08-27 |
Macronix International Co., Ltd. |
Method of forming a deposited material by utilizing a multi-step deposition/etch/deposition (D/E/D) process
|
US20080129986A1
(en)
|
2006-11-30 |
2008-06-05 |
Phillip Walsh |
Method and apparatus for optically measuring periodic structures using orthogonal azimuthal sample orientations
|
WO2008070635A2
(en)
*
|
2006-12-01 |
2008-06-12 |
Coherix, Inc. |
Method and system for determining a critical dimension of an object
|
US7728969B2
(en)
*
|
2006-12-05 |
2010-06-01 |
Kla-Tencor Technologies Corp. |
Methods and systems for identifying defect types on a wafer
|
US7904845B2
(en)
*
|
2006-12-06 |
2011-03-08 |
Kla-Tencor Corp. |
Determining locations on a wafer to be reviewed during defect review
|
US20080135774A1
(en)
*
|
2006-12-08 |
2008-06-12 |
Asml Netherlands B.V. |
Scatterometer, a lithographic apparatus and a focus analysis method
|
US7700488B2
(en)
*
|
2007-01-16 |
2010-04-20 |
International Business Machines Corporation |
Recycling of ion implantation monitor wafers
|
US8034718B2
(en)
*
|
2006-12-12 |
2011-10-11 |
International Business Machines Corporation |
Method to recover patterned semiconductor wafers for rework
|
EP2097713A4
(en)
|
2006-12-22 |
2010-09-15 |
Zygo Corp |
DEVICE AND METHOD FOR MEASURING SURFACE PROPERTIES
|
JP2008171911A
(ja)
*
|
2007-01-10 |
2008-07-24 |
Tokyo Electron Ltd |
ラフネス評価方法及びシステム
|
US7554654B2
(en)
*
|
2007-01-26 |
2009-06-30 |
Kla-Tencor Corporation |
Surface characteristic analysis
|
US7889355B2
(en)
|
2007-01-31 |
2011-02-15 |
Zygo Corporation |
Interferometry for lateral metrology
|
WO2008103994A2
(en)
*
|
2007-02-23 |
2008-08-28 |
Rudolph Technologies, Inc. |
Wafer fabrication monitoring systems and methods, including edge bead removal processing
|
US7764387B2
(en)
*
|
2007-03-02 |
2010-07-27 |
Applied Kinetics, Inc. |
Apparatus and method for measuring suspension and head assemblies in a stack
|
US7724375B1
(en)
*
|
2007-03-15 |
2010-05-25 |
Kla-Tencor Corporation |
Method and apparatus for increasing metrology or inspection tool throughput
|
US7639351B2
(en)
*
|
2007-03-20 |
2009-12-29 |
Tokyo Electron Limited |
Automated process control using optical metrology with a photonic nanojet
|
US7949618B2
(en)
*
|
2007-03-28 |
2011-05-24 |
Tokyo Electron Limited |
Training a machine learning system to determine photoresist parameters
|
US7567353B2
(en)
*
|
2007-03-28 |
2009-07-28 |
Tokyo Electron Limited |
Automated process control using optical metrology and photoresist parameters
|
US7772016B2
(en)
*
|
2007-04-04 |
2010-08-10 |
International Business Machines Corporation |
Method for composition control of a metal compound film
|
US7812936B2
(en)
*
|
2007-04-09 |
2010-10-12 |
Identification International, Inc. |
Fingerprint imaging system
|
US7511835B2
(en)
*
|
2007-04-12 |
2009-03-31 |
Tokyo Electron Limited |
Optical metrology using a support vector machine with simulated diffraction signal inputs
|
US7483809B2
(en)
*
|
2007-04-12 |
2009-01-27 |
Tokyo Electron Limited |
Optical metrology using support vector machine with profile parameter inputs
|
US7372583B1
(en)
*
|
2007-04-12 |
2008-05-13 |
Tokyo Electron Limited |
Controlling a fabrication tool using support vector machine
|
US7671978B2
(en)
|
2007-04-24 |
2010-03-02 |
Xyratex Technology Limited |
Scatterometer-interferometer and method for detecting and distinguishing characteristics of surface artifacts
|
DE102007020624A1
(de)
*
|
2007-04-30 |
2008-11-06 |
Surface Systems + Technology Gmbh + Co. Kg |
Vorrichtung zur Bestimmung einer mechanischen Eigenschaft einer zu untersuchenden Probe
|
US7920676B2
(en)
*
|
2007-05-04 |
2011-04-05 |
Xradia, Inc. |
CD-GISAXS system and method
|
US20110073982A1
(en)
*
|
2007-05-25 |
2011-03-31 |
Armstrong J Joseph |
Inspection system using back side illuminated linear sensor
|
US20080318345A1
(en)
*
|
2007-06-22 |
2008-12-25 |
Persing Harold M |
Plasma ion implantation process control using reflectometry
|
US8213021B2
(en)
*
|
2007-06-29 |
2012-07-03 |
Veeco Metrology, Inc. |
Interferometric measurement of non-homogeneous multi-material surfaces
|
US7683299B2
(en)
*
|
2007-07-09 |
2010-03-23 |
Bio-Rad Laboratories, Inc. |
Extended dynamic range system design using a photomultiplier tube and solid state detector
|
US7635843B1
(en)
*
|
2007-07-13 |
2009-12-22 |
Xilinx, Inc. |
In-line reliability test using E-beam scan
|
US7619746B2
(en)
|
2007-07-19 |
2009-11-17 |
Zygo Corporation |
Generating model signals for interferometry
|
US8611639B2
(en)
*
|
2007-07-30 |
2013-12-17 |
Kla-Tencor Technologies Corp |
Semiconductor device property extraction, generation, visualization, and monitoring methods
|
DE102007035833B3
(de)
*
|
2007-07-31 |
2009-03-12 |
Advanced Micro Devices, Inc., Sunnyvale |
Fortgeschrittene automatische Abscheideprofilzielsteuerung und Kontrolle durch Anwendung von fortgeschrittener Polierendpunktsystemrückkopplung
|
US7915570B2
(en)
|
2007-08-03 |
2011-03-29 |
National Instruments Corporation |
Smart camera with an integrated lighting controller
|
DE102007036811B3
(de)
*
|
2007-08-03 |
2008-12-18 |
Vistec Semiconductor Systems Gmbh |
Vorrichtung und Verfahren zum Erfassen der gesamten Oberfläche eines Wafers
|
JP2009065146A
(ja)
*
|
2007-08-15 |
2009-03-26 |
Sony Corp |
半導体薄膜の形成方法および半導体薄膜の検査装置
|
WO2009024978A2
(en)
*
|
2007-08-21 |
2009-02-26 |
Camtek Ltd. |
Method and system for low cost inspection
|
US7567885B2
(en)
*
|
2007-08-23 |
2009-07-28 |
Sokudo Co., Ltd. |
Method and system for determining object height
|
JP4950813B2
(ja)
*
|
2007-08-30 |
2012-06-13 |
大日本スクリーン製造株式会社 |
分光エリプソメータ、膜厚測定装置および分光エリプソメータのフォーカス調整方法
|
US7782452B2
(en)
|
2007-08-31 |
2010-08-24 |
Kla-Tencor Technologies Corp. |
Systems and method for simultaneously inspecting a specimen with two distinct channels
|
US8337278B2
(en)
*
|
2007-09-24 |
2012-12-25 |
Applied Materials, Inc. |
Wafer edge characterization by successive radius measurements
|
US8072611B2
(en)
|
2007-10-12 |
2011-12-06 |
Zygo Corporation |
Interferometric analysis of under-resolved features
|
JP5102580B2
(ja)
*
|
2007-10-18 |
2012-12-19 |
株式会社日立ハイテクノロジーズ |
荷電粒子線応用装置
|
JP5222954B2
(ja)
|
2007-11-13 |
2013-06-26 |
ザイゴ コーポレーション |
偏光スキャンを利用した干渉計
|
US8264693B2
(en)
|
2007-12-06 |
2012-09-11 |
The Regents Of The University Of Michigan |
Method and system for measuring at least one property including a magnetic property of a material using pulsed laser sources
|
EP2232195B1
(en)
|
2007-12-14 |
2015-03-18 |
Zygo Corporation |
Analyzing surface structure using scanning interferometry
|
US7678588B2
(en)
*
|
2008-01-22 |
2010-03-16 |
United Microelectronics Corp. |
Method for constructing module for optical critical dimension (OCD) and measuring method of module for optical critical dimension using the module
|
US7732303B2
(en)
|
2008-01-31 |
2010-06-08 |
International Business Machines Corporation |
Method for recycling of ion implantation monitor wafers
|
FR2927175B1
(fr)
*
|
2008-02-05 |
2011-02-18 |
Altatech Semiconductor |
Dispositif d'inspection de plaquettes semi-conductrices
|
US20090219537A1
(en)
*
|
2008-02-28 |
2009-09-03 |
Phillip Walsh |
Method and apparatus for using multiple relative reflectance measurements to determine properties of a sample using vacuum ultra violet wavelengths
|
US8134698B1
(en)
|
2008-03-14 |
2012-03-13 |
Kla-Tencor Corporation |
Dynamic range extension in surface inspection systems
|
US8239811B2
(en)
*
|
2008-03-24 |
2012-08-07 |
International Business Machines Corporation |
System and method for wireless and dynamic intra-process measurement of integrated circuit parameters
|
US8097474B2
(en)
*
|
2008-03-24 |
2012-01-17 |
International Business Machines Corporation |
Integrated circuit chip design flow methodology including insertion of on-chip or scribe line wireless process monitoring and feedback circuitry
|
DE102008001812B4
(de)
*
|
2008-05-15 |
2013-05-29 |
Carl Zeiss Microscopy Gmbh |
Positioniereinrichtung für ein Teilchenstrahlgerät
|
US7912658B2
(en)
*
|
2008-05-28 |
2011-03-22 |
Kla-Tencor Corp. |
Systems and methods for determining two or more characteristics of a wafer
|
US8094926B2
(en)
*
|
2008-06-06 |
2012-01-10 |
Kabushiki Kaisha Toshiba |
Ultrafine pattern discrimination using transmitted/reflected workpiece images for use in lithography inspection system
|
WO2009152046A1
(en)
|
2008-06-11 |
2009-12-17 |
Kla-Tencor Corporation |
Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof
|
US8494802B2
(en)
|
2008-06-19 |
2013-07-23 |
Kla-Tencor Corp. |
Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
|
KR101443058B1
(ko)
*
|
2008-06-25 |
2014-09-24 |
삼성전자주식회사 |
막질 디멘젼 분석에서의 반도체 제조설비 및 그의 제조방법
|
JP2010027743A
(ja)
*
|
2008-07-16 |
2010-02-04 |
Ebara Corp |
インプリント用ガラス基板、レジストパターン形成方法、インプリント用ガラス基板の検査方法及び検査装置
|
JP5352144B2
(ja)
*
|
2008-07-22 |
2013-11-27 |
株式会社荏原製作所 |
荷電粒子ビーム検査方法及び装置
|
US8269960B2
(en)
*
|
2008-07-24 |
2012-09-18 |
Kla-Tencor Corp. |
Computer-implemented methods for inspecting and/or classifying a wafer
|
US20100041220A1
(en)
*
|
2008-08-12 |
2010-02-18 |
Advanced Micro Devices, Inc. |
Methods for uniformly optically annealing regions of a semiconductor substrate
|
CN101666626B
(zh)
*
|
2008-09-03 |
2012-02-29 |
睿励科学仪器(上海)有限公司 |
一种椭偏测量的方法及其装置
|
US8495919B1
(en)
|
2008-09-19 |
2013-07-30 |
Fort Wayne Metals Research Products Corporation |
Test apparatus and method for determining at least one characteristic of a plurality of test specimens
|
JP5233012B2
(ja)
*
|
2008-10-03 |
2013-07-10 |
日新イオン機器株式会社 |
イオン注入装置
|
US7972552B1
(en)
*
|
2008-11-12 |
2011-07-05 |
Hrl Laboratories, Llc |
Method to locate and eliminate manufacturing defects in a quartz resonator gyro
|
JP5289006B2
(ja)
*
|
2008-11-19 |
2013-09-11 |
株式会社東芝 |
パターン形成方法およびプログラム
|
US8120781B2
(en)
|
2008-11-26 |
2012-02-21 |
Zygo Corporation |
Interferometric systems and methods featuring spectral analysis of unevenly sampled data
|
JP5492405B2
(ja)
*
|
2008-12-02 |
2014-05-14 |
株式会社日立ハイテクノロジーズ |
荷電粒子線装置
|
DE102008044375A1
(de)
*
|
2008-12-05 |
2010-06-10 |
Robert Bosch Gmbh |
Optisches Messgerät
|
US8060330B2
(en)
*
|
2008-12-12 |
2011-11-15 |
Lam Research Corporation |
Method and system for centering wafer on chuck
|
US8983787B1
(en)
*
|
2008-12-12 |
2015-03-17 |
Martin M. Liphardt |
Method of evaluating data quality
|
US8600703B1
(en)
*
|
2008-12-12 |
2013-12-03 |
J.A. Woollam Co., Inc |
Method of evaluating data quality
|
JP5166551B2
(ja)
*
|
2008-12-16 |
2013-03-21 |
株式会社日立ハイテクノロジーズ |
電子線装置およびそれを用いた電子線応用装置、並びに電子源加工方法
|
US8809779B2
(en)
*
|
2008-12-19 |
2014-08-19 |
Hermes Microvision, Inc. |
Method and system for heating substrate in vacuum environment and method and system for identifying defects on substrate
|
SG163442A1
(en)
*
|
2009-01-13 |
2010-08-30 |
Semiconductor Technologies & Instruments |
System and method for inspecting a wafer
|
SG164292A1
(en)
*
|
2009-01-13 |
2010-09-29 |
Semiconductor Technologies & Instruments Pte |
System and method for inspecting a wafer
|
SG164293A1
(en)
*
|
2009-01-13 |
2010-09-29 |
Semiconductor Technologies & Instruments Pte |
System and method for inspecting a wafer
|
EP2389459B1
(en)
*
|
2009-01-21 |
2014-03-26 |
George Atanasoff |
Methods and systems for control of a surface modification process
|
US8135560B2
(en)
*
|
2009-01-30 |
2012-03-13 |
Applied Materials, Inc. |
Sensor system for semiconductor manufacturing apparatus
|
DE102009008063A1
(de)
|
2009-02-09 |
2010-08-19 |
Carl Zeiss Nts Gmbh |
Teilchenstrahlsystem
|
KR101493048B1
(ko)
*
|
2009-02-27 |
2015-02-13 |
삼성전자주식회사 |
반도체 소자 측정 장치 및 이를 사용한 반도체 소자 측정 방법
|
US20100279435A1
(en)
*
|
2009-04-30 |
2010-11-04 |
Applied Materials, Inc. |
Temperature control of chemical mechanical polishing
|
US20100279438A1
(en)
*
|
2009-05-01 |
2010-11-04 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Apparatus and method of in-situ identification for contamination control in semiconductor fabrication
|
US8288646B2
(en)
*
|
2009-05-06 |
2012-10-16 |
UltraSolar Technology, Inc. |
Pyroelectric solar technology apparatus and method
|
US8269980B1
(en)
|
2009-05-11 |
2012-09-18 |
Engineering Synthesis Design, Inc. |
White light scanning interferometer with simultaneous phase-shifting module
|
ES2513866T3
(es)
|
2009-05-13 |
2014-10-27 |
Sio2 Medical Products, Inc. |
Revestimiento e inspección de recipientes
|
US7985188B2
(en)
|
2009-05-13 |
2011-07-26 |
Cv Holdings Llc |
Vessel, coating, inspection and processing apparatus
|
US9545360B2
(en)
|
2009-05-13 |
2017-01-17 |
Sio2 Medical Products, Inc. |
Saccharide protective coating for pharmaceutical package
|
US8153987B2
(en)
|
2009-05-22 |
2012-04-10 |
Jordan Valley Semiconductors Ltd. |
Automated calibration methodology for VUV metrology system
|
US10768611B2
(en)
*
|
2009-06-16 |
2020-09-08 |
Applied Materials, Inc. |
Counter and timer constraints
|
JP5486219B2
(ja)
*
|
2009-06-18 |
2014-05-07 |
パナソニック液晶ディスプレイ株式会社 |
フォトレジストのパターニング検査方法
|
US9458536B2
(en)
|
2009-07-02 |
2016-10-04 |
Sio2 Medical Products, Inc. |
PECVD coating methods for capped syringes, cartridges and other articles
|
FR2948192B1
(fr)
*
|
2009-07-20 |
2011-07-22 |
Commissariat Energie Atomique |
Procede de caracterisation optique
|
US8712571B2
(en)
*
|
2009-08-07 |
2014-04-29 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Method and apparatus for wireless transmission of diagnostic information
|
US8441639B2
(en)
|
2009-09-03 |
2013-05-14 |
Kla-Tencor Corp. |
Metrology systems and methods
|
EP2293051A1
(de)
*
|
2009-09-05 |
2011-03-09 |
Umicore AG & Co. KG |
Verfahren und Vorrichtung zur Identifizierung von Autokatalysatoren
|
CN102549374B
(zh)
*
|
2009-09-30 |
2015-05-13 |
Og技术公司 |
具有自行校准的便携式成像测量的方法及装置
|
US20110195636A1
(en)
*
|
2010-02-11 |
2011-08-11 |
United Microelectronics Corporation |
Method for Controlling Polishing Wafer
|
US8334986B2
(en)
*
|
2010-02-25 |
2012-12-18 |
Corning Incorporated |
Methods and apparatus for the measurement of film thickness
|
DE102010003112A1
(de)
*
|
2010-03-22 |
2011-09-22 |
Osram Opto Semiconductors Gmbh |
Verfahren zur Kontrolle einer zwischen einer Metallschicht und einer Halbleiterschicht ausgebildeten Grenzfläche
|
US8108805B2
(en)
*
|
2010-03-26 |
2012-01-31 |
Tokyo Electron Limited |
Simplified micro-bridging and roughness analysis
|
JP2011209090A
(ja)
*
|
2010-03-30 |
2011-10-20 |
Hitachi Ltd |
平滑面検査装置
|
US11624115B2
(en)
|
2010-05-12 |
2023-04-11 |
Sio2 Medical Products, Inc. |
Syringe with PECVD lubrication
|
WO2011151530A1
(fr)
*
|
2010-05-31 |
2011-12-08 |
Arcelormittal Investigacion Y Desarrollo, S.L. |
Procede et dispositif de mesure de l'epaisseur d'une couche de revetement sur une bande en defilement
|
DE102010031227A1
(de)
*
|
2010-07-12 |
2012-01-12 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Vorrichtung zur Prüfung von Mikrostrukturierungsqualität
|
CN103119704A
(zh)
|
2010-07-23 |
2013-05-22 |
第一太阳能有限公司 |
在线计量系统及方法
|
CN103080731B
(zh)
*
|
2010-07-30 |
2016-08-17 |
第一太阳能有限公司 |
光致发光测量工具和相关方法
|
US8873028B2
(en)
*
|
2010-08-26 |
2014-10-28 |
Apple Inc. |
Non-destructive stress profile determination in chemically tempered glass
|
JP5725781B2
(ja)
*
|
2010-09-28 |
2015-05-27 |
キヤノン株式会社 |
被検体情報取得装置
|
US8175452B1
(en)
*
|
2010-10-26 |
2012-05-08 |
Complete Genomics, Inc. |
Method and system for imaging high density biochemical arrays with sub-pixel alignment
|
US9878101B2
(en)
|
2010-11-12 |
2018-01-30 |
Sio2 Medical Products, Inc. |
Cyclic olefin polymer vessels and vessel coating methods
|
US20120323506A1
(en)
*
|
2010-11-23 |
2012-12-20 |
Andrew Payshin King |
Semiconductor Defect Signal Capturing and Statistical System and Method
|
US8867041B2
(en)
|
2011-01-18 |
2014-10-21 |
Jordan Valley Semiconductor Ltd |
Optical vacuum ultra-violet wavelength nanoimprint metrology
|
US8565379B2
(en)
|
2011-03-14 |
2013-10-22 |
Jordan Valley Semiconductors Ltd. |
Combining X-ray and VUV analysis of thin film layers
|
JP5752454B2
(ja)
*
|
2011-03-23 |
2015-07-22 |
東京エレクトロン株式会社 |
プラズマ処理装置及び温度測定方法
|
US9272095B2
(en)
|
2011-04-01 |
2016-03-01 |
Sio2 Medical Products, Inc. |
Vessels, contact surfaces, and coating and inspection apparatus and methods
|
US8384405B2
(en)
*
|
2011-04-20 |
2013-02-26 |
Tdk Corporation |
Method for performing burn-in test
|
US9064740B2
(en)
*
|
2011-04-20 |
2015-06-23 |
Koninklijke Philips N.V. |
Measurement device and method for vapour deposition applications
|
US8942842B2
(en)
*
|
2011-04-28 |
2015-01-27 |
Applied Materials, Inc. |
Varying optical coefficients to generate spectra for polishing control
|
CA2778083A1
(en)
|
2011-05-24 |
2012-11-24 |
Discovery Metals, Llc |
Ambient reflectivity absorption system for identifying precious or semi-precious materials and associated methods
|
DE102011077567B4
(de)
*
|
2011-06-15 |
2013-05-29 |
Leibniz-Institut Für Polymerforschung Dresden E.V. |
Verfahren und vorrichtung zur ermittlung der oberflächentopografie von beschichteten, reflektierenden oberflächen
|
US20130017762A1
(en)
*
|
2011-07-15 |
2013-01-17 |
Infineon Technologies Ag |
Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
|
JP2013042114A
(ja)
*
|
2011-07-19 |
2013-02-28 |
Canon Inc |
描画装置、及び、物品の製造方法
|
KR20140045991A
(ko)
*
|
2011-07-25 |
2014-04-17 |
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 |
객체 특성화 및 제조공정 모니터링을 위한 방법 및 장치
|
JP5834584B2
(ja)
*
|
2011-07-25 |
2015-12-24 |
ソニー株式会社 |
情報処理装置、情報処理方法、プログラム及び蛍光スペクトルの強度補正方法
|
WO2013066446A1
(en)
|
2011-08-01 |
2013-05-10 |
The Trustees Of Columbia University In The City Of New York |
Conjugates of nano-diamond and magnetic or metallic particles
|
JP6276180B2
(ja)
*
|
2011-08-11 |
2018-02-07 |
ケーエルエー−テンカー コーポレイション |
高速回転チャックを有するシステムにおける空気流管理
|
JP5721586B2
(ja)
*
|
2011-08-12 |
2015-05-20 |
大塚電子株式会社 |
光学特性測定装置および光学特性測定方法
|
US20140212020A1
(en)
*
|
2011-08-12 |
2014-07-31 |
Bt Imaging Pty Ltd |
Photoluminescence imaging of doping variations in semiconductor wafers
|
JP2013061185A
(ja)
*
|
2011-09-12 |
2013-04-04 |
Toshiba Corp |
パターン検査装置およびパターン検査方法
|
WO2013040446A1
(en)
*
|
2011-09-16 |
2013-03-21 |
The Trustees Of Columbia University In The City Of New York |
High-precision ghz clock generation using spin states in diamond
|
US8982362B2
(en)
|
2011-10-04 |
2015-03-17 |
First Solar, Inc. |
System and method for measuring layer thickness and depositing semiconductor layers
|
US9117149B2
(en)
|
2011-10-07 |
2015-08-25 |
Industrial Technology Research Institute |
Optical registration carrier
|
US9632045B2
(en)
|
2011-10-19 |
2017-04-25 |
The Trustees Of Columbia University In The City Of New York |
Systems and methods for deterministic emitter switch microscopy
|
US9090854B2
(en)
|
2011-10-25 |
2015-07-28 |
Lam Research Ag |
Method and apparatus for processing wafer-shaped articles
|
JP5933222B2
(ja)
*
|
2011-11-08 |
2016-06-08 |
東京エレクトロン株式会社 |
温度制御方法、制御装置及びプラズマ処理装置
|
GB201119352D0
(en)
|
2011-11-09 |
2011-12-21 |
Advanced Sensors Ltd |
Apparatus and method for determining the amounts of two or more substances present in a liquid
|
JP6095678B2
(ja)
|
2011-11-11 |
2017-03-15 |
エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド |
薬剤パッケージ用の不動態化、pH保護又は滑性皮膜、被覆プロセス及び装置
|
US11116695B2
(en)
|
2011-11-11 |
2021-09-14 |
Sio2 Medical Products, Inc. |
Blood sample collection tube
|
US9534883B1
(en)
|
2011-11-22 |
2017-01-03 |
Engineering Synthesis Design, Inc. |
Methods for determining error in an interferometry system
|
US8969833B1
(en)
|
2011-12-16 |
2015-03-03 |
Us Synthetic Corporation |
Method and system for perceiving a boundary between a first region and a second region of a superabrasive volume
|
WO2013096734A1
(en)
*
|
2011-12-22 |
2013-06-27 |
University Of Pittsburgh - Of The Commonwealth System Of Higher Education |
Method and apparatus to enhance light illuminating intensity and diffusivity
|
KR101829676B1
(ko)
*
|
2011-12-29 |
2018-02-20 |
삼성전자주식회사 |
웨이퍼 열 처리 방법
|
US20130171350A1
(en)
*
|
2011-12-29 |
2013-07-04 |
Intermolecular Inc. |
High Throughput Processing Using Metal Organic Chemical Vapor Deposition
|
US9423436B2
(en)
|
2012-02-21 |
2016-08-23 |
Varel International Ind., L.P. |
Method and apparatus to assess the thermal damage caused to a PCD cutter using capacitance spectroscopy
|
US9423370B2
(en)
|
2012-02-21 |
2016-08-23 |
Varel International Ind., L.P |
Use of capacitance to analyze polycrystalline diamond
|
US9377428B2
(en)
|
2012-02-21 |
2016-06-28 |
Varel International Ind., L.P. |
Non-destructive leaching depth measurement using capacitance spectroscopy
|
CN105549341A
(zh)
|
2012-02-21 |
2016-05-04 |
Asml荷兰有限公司 |
检查设备和方法
|
US20130214768A1
(en)
*
|
2012-02-21 |
2013-08-22 |
Varel International Ind., L.P. |
Use of Eddy Currents to Analyze Polycrystalline Diamond
|
US9128031B2
(en)
|
2012-02-21 |
2015-09-08 |
Varel International Ind., L.P. |
Method to improve the leaching process
|
US8879073B2
(en)
*
|
2012-02-24 |
2014-11-04 |
Kla-Tencor Corporation |
Optical metrology using targets with field enhancement elements
|
US8848191B2
(en)
|
2012-03-14 |
2014-09-30 |
Honeywell International Inc. |
Photoacoustic sensor with mirror
|
US9410890B2
(en)
*
|
2012-03-19 |
2016-08-09 |
Kla-Tencor Corporation |
Methods and apparatus for spectral luminescence measurement
|
US10801975B2
(en)
|
2012-05-08 |
2020-10-13 |
Kla-Tencor Corporation |
Metrology tool with combined X-ray and optical scatterometers
|
CN103453395A
(zh)
*
|
2012-05-30 |
2013-12-18 |
财团法人工业技术研究院 |
光源装置
|
DE102012104874B4
(de)
*
|
2012-06-05 |
2016-05-19 |
Technische Universität München |
Optisches Messsystem mit Polarisationskompensation, sowie entsprechendes Verfahren
|
DE102012104844B4
(de)
*
|
2012-06-05 |
2017-06-29 |
Heliatek Gmbh |
Optisches System und Verfahren zur Überwachung und Kontrolle fotoaktiver Bauelemente im Produktionsprozess
|
US9628676B2
(en)
|
2012-06-07 |
2017-04-18 |
Complete Genomics, Inc. |
Imaging systems with movable scan mirrors
|
US9488823B2
(en)
|
2012-06-07 |
2016-11-08 |
Complete Genomics, Inc. |
Techniques for scanned illumination
|
US9182341B2
(en)
*
|
2012-06-13 |
2015-11-10 |
Kla-Tencor Corporation |
Optical surface scanning systems and methods
|
EP2865003A1
(en)
|
2012-06-26 |
2015-04-29 |
Kla-Tencor Corporation |
Scanning in angle-resolved reflectometry and algorithmically eliminating diffraction from optical metrology
|
US10013518B2
(en)
*
|
2012-07-10 |
2018-07-03 |
Kla-Tencor Corporation |
Model building and analysis engine for combined X-ray and optical metrology
|
NL2009367C2
(en)
*
|
2012-08-27 |
2014-03-03 |
Stichting Vu Vumc |
Microscopic imaging apparatus and method to detect a microscopic image.
|
US8860937B1
(en)
*
|
2012-10-24 |
2014-10-14 |
Kla-Tencor Corp. |
Metrology systems and methods for high aspect ratio and large lateral dimension structures
|
KR101241007B1
(ko)
*
|
2012-10-26 |
2013-03-11 |
나노씨엠에스(주) |
엑스선을 이용한 박막층의 두께 측정 방법 및 장치
|
WO2014071061A1
(en)
|
2012-11-01 |
2014-05-08 |
Sio2 Medical Products, Inc. |
Coating inspection method
|
US8830464B2
(en)
*
|
2012-11-06 |
2014-09-09 |
Kla-Tencor Corporation |
Film thickness, refractive index, and extinction coefficient determination for film curve creation and defect sizing in real time
|
US9244028B2
(en)
|
2012-11-07 |
2016-01-26 |
Tribogenics, Inc. |
Electron excited x-ray fluorescence device
|
EP2920567B1
(en)
|
2012-11-16 |
2020-08-19 |
SiO2 Medical Products, Inc. |
Method and apparatus for detecting rapid barrier coating integrity characteristics
|
KR101336946B1
(ko)
|
2012-11-27 |
2013-12-04 |
한국기초과학지원연구원 |
발열 분포 측정을 이용한 불량 분석 장치 및 방법
|
EP2925903B1
(en)
|
2012-11-30 |
2022-04-13 |
Si02 Medical Products, Inc. |
Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like
|
US9764093B2
(en)
|
2012-11-30 |
2017-09-19 |
Sio2 Medical Products, Inc. |
Controlling the uniformity of PECVD deposition
|
US9718164B2
(en)
*
|
2012-12-06 |
2017-08-01 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Polishing system and polishing method
|
US9354185B2
(en)
*
|
2012-12-21 |
2016-05-31 |
Advanced Micro Devices, Inc. |
3D imaging with multiple irradiation frequencies
|
US9630927B2
(en)
*
|
2014-01-17 |
2017-04-25 |
Taiwan Semiconductor Manufacturing Company Limited |
Method and manufacturing system
|
US11885738B1
(en)
*
|
2013-01-22 |
2024-01-30 |
J.A. Woollam Co., Inc. |
Reflectometer, spectrophotometer, ellipsometer or polarimeter system including sample imaging system that simultaneously meet the scheimpflug condition and overcomes keystone error
|
US20140242880A1
(en)
*
|
2013-02-26 |
2014-08-28 |
Applied Materials, Inc. |
Optical model with polarization direction effects for comparison to measured spectrum
|
US20140242881A1
(en)
*
|
2013-02-27 |
2014-08-28 |
Applied Materials, Inc. |
Feed forward parameter values for use in theoretically generating spectra
|
EP2961858B1
(en)
|
2013-03-01 |
2022-09-07 |
Si02 Medical Products, Inc. |
Coated syringe.
|
US9305753B2
(en)
*
|
2013-03-06 |
2016-04-05 |
Kla-Tencor Corporation |
Thickness change monitor wafer for in situ film thickness monitoring
|
EP2971228B1
(en)
|
2013-03-11 |
2023-06-21 |
Si02 Medical Products, Inc. |
Coated packaging
|
US9937099B2
(en)
|
2013-03-11 |
2018-04-10 |
Sio2 Medical Products, Inc. |
Trilayer coated pharmaceutical packaging with low oxygen transmission rate
|
US9052190B2
(en)
*
|
2013-03-12 |
2015-06-09 |
Kla-Tencor Corporation |
Bright-field differential interference contrast system with scanning beams of round and elliptical cross-sections
|
US9863042B2
(en)
|
2013-03-15 |
2018-01-09 |
Sio2 Medical Products, Inc. |
PECVD lubricity vessel coating, coating process and apparatus providing different power levels in two phases
|
TWI683382B
(zh)
*
|
2013-03-15 |
2020-01-21 |
應用材料股份有限公司 |
具有光學測量的旋轉氣體分配組件
|
DE102013207243B4
(de)
*
|
2013-04-22 |
2019-10-02 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Vorrichtung und verfahren zur herstellung einer struktur aus aushärtbarem material durch abformung
|
US9857291B2
(en)
|
2013-05-16 |
2018-01-02 |
Kla-Tencor Corporation |
Metrology system calibration refinement
|
US20140356986A1
(en)
*
|
2013-05-31 |
2014-12-04 |
International Business Machines Corporation |
Precision controlled collapse chip connection mapping
|
US9995850B2
(en)
*
|
2013-06-06 |
2018-06-12 |
Kla-Tencor Corporation |
System, method and apparatus for polarization control
|
US9535018B2
(en)
|
2013-07-08 |
2017-01-03 |
Kla-Tencor Corporation |
Combined x-ray and optical metrology
|
WO2015006233A1
(en)
*
|
2013-07-09 |
2015-01-15 |
Kla-Tencor Corporation |
Aperture alignment in scatterometry metrology systems
|
US9778213B2
(en)
|
2013-08-19 |
2017-10-03 |
Kla-Tencor Corporation |
Metrology tool with combined XRF and SAXS capabilities
|
US9281253B2
(en)
*
|
2013-10-29 |
2016-03-08 |
Applied Materials, Inc. |
Determination of gain for eddy current sensor
|
JP5680731B2
(ja)
*
|
2013-11-06 |
2015-03-04 |
株式会社Screenセミコンダクターソリューションズ |
基板処理装置および検査周辺露光システム
|
US9293298B2
(en)
*
|
2013-12-23 |
2016-03-22 |
Kla-Tencor Corp. |
Defect discovery and inspection sensitivity optimization using automated classification of corresponding electron beam images
|
TWI504886B
(zh)
*
|
2013-12-26 |
2015-10-21 |
Machvision Inc |
印刷電路板之防焊層裂縫現象及異色現象的檢測方法及檢測設備
|
KR20150085956A
(ko)
*
|
2014-01-17 |
2015-07-27 |
삼성전자주식회사 |
반도체 소자의 계측 방법, 반도체 계측 시스템, 및 이들을 이용한 반도체 소자의 제조방법
|
US9588066B2
(en)
|
2014-01-23 |
2017-03-07 |
Revera, Incorporated |
Methods and systems for measuring periodic structures using multi-angle X-ray reflectance scatterometry (XRS)
|
DE102014003145A1
(de)
|
2014-03-04 |
2015-09-10 |
Carl Zeiss Microscopy Gmbh |
Verfahren zur Korrektur der sphärischen Aberration bei mikroskopischen Anwendungen
|
EP3693493A1
(en)
|
2014-03-28 |
2020-08-12 |
SiO2 Medical Products, Inc. |
Antistatic coatings for plastic vessels
|
US20150316468A1
(en)
*
|
2014-04-30 |
2015-11-05 |
Nova Measuring Instruments Ltd. |
Method and system for optical characterization of patterned samples
|
US9784690B2
(en)
*
|
2014-05-12 |
2017-10-10 |
Kla-Tencor Corporation |
Apparatus, techniques, and target designs for measuring semiconductor parameters
|
US10012606B1
(en)
|
2014-06-24 |
2018-07-03 |
Kla-Tencor Corporation |
X-ray based metrology with primary and secondary illumination sources
|
KR101563165B1
(ko)
*
|
2014-06-26 |
2015-10-26 |
주식회사 이오테크닉스 |
웨이퍼 다이들의 마킹방법
|
WO2016003575A2
(en)
*
|
2014-07-02 |
2016-01-07 |
Applied Materials, Inc. |
Localized stress modulation for overlay and epe
|
US10151986B2
(en)
|
2014-07-07 |
2018-12-11 |
Kla-Tencor Corporation |
Signal response metrology based on measurements of proxy structures
|
US10883924B2
(en)
|
2014-09-08 |
2021-01-05 |
The Research Foundation Of State University Of New York |
Metallic gratings and measurement methods thereof
|
JP6219251B2
(ja)
*
|
2014-09-17 |
2017-10-25 |
東芝メモリ株式会社 |
半導体製造装置
|
FR3026484B1
(fr)
*
|
2014-09-29 |
2018-06-15 |
Altatech Semiconductor |
Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique
|
US10210606B2
(en)
|
2014-10-14 |
2019-02-19 |
Kla-Tencor Corporation |
Signal response metrology for image based and scatterometry overlay measurements
|
KR101683548B1
(ko)
*
|
2014-10-14 |
2016-12-08 |
(주)오로스 테크놀로지 |
전자 빔을 이용한 오버레이 측정장치와 이의 측정방법
|
US10215559B2
(en)
|
2014-10-16 |
2019-02-26 |
Kla-Tencor Corporation |
Metrology of multiple patterning processes
|
US10139352B2
(en)
*
|
2014-10-18 |
2018-11-27 |
Kla-Tenor Corporation |
Measurement of small box size targets
|
US9710728B2
(en)
|
2014-10-28 |
2017-07-18 |
Kla-Tencor Corporation |
Image based signal response metrology
|
US9739719B2
(en)
|
2014-10-31 |
2017-08-22 |
Kla-Tencor Corporation |
Measurement systems having linked field and pupil signal detection
|
US20160139032A1
(en)
*
|
2014-11-19 |
2016-05-19 |
Kla-Tencor Corporation |
Inspection system and method using an off-axis unobscured objective lens
|
US10345095B1
(en)
|
2014-11-20 |
2019-07-09 |
Kla- Tencor Corporation |
Model based measurement systems with improved electromagnetic solver performance
|
US9543219B2
(en)
|
2014-12-02 |
2017-01-10 |
Globalfoundries Inc. |
Void monitoring device for measurement of wafer temperature variations
|
KR20160066448A
(ko)
|
2014-12-02 |
2016-06-10 |
삼성전자주식회사 |
표면 검사 방법
|
US10072921B2
(en)
|
2014-12-05 |
2018-09-11 |
Kla-Tencor Corporation |
Methods and systems for spectroscopic beam profile metrology having a first two dimensional detector to detect collected light transmitted by a first wavelength dispersive element
|
EP3234500A4
(en)
|
2014-12-19 |
2018-07-04 |
University of Utah Research Foundation |
Interferometry system and associated methods
|
US10324050B2
(en)
|
2015-01-14 |
2019-06-18 |
Kla-Tencor Corporation |
Measurement system optimization for X-ray based metrology
|
US9470639B1
(en)
|
2015-02-03 |
2016-10-18 |
Kla-Tencor Corporation |
Optical metrology with reduced sensitivity to grating anomalies
|
US9709437B2
(en)
*
|
2015-02-18 |
2017-07-18 |
City University Of Hong Kong |
System and method for detecting a defect in a structure member
|
US10185303B2
(en)
|
2015-02-21 |
2019-01-22 |
Kla-Tencor Corporation |
Optimizing computational efficiency by multiple truncation of spatial harmonics
|
US9970863B2
(en)
|
2015-02-22 |
2018-05-15 |
Kla-Tencor Corporation |
Optical metrology with reduced focus error sensitivity
|
US10365225B1
(en)
|
2015-03-04 |
2019-07-30 |
Kla-Tencor Corporation |
Multi-location metrology
|
US10502549B2
(en)
|
2015-03-24 |
2019-12-10 |
Kla-Tencor Corporation |
Model-based single parameter measurement
|
KR20160121206A
(ko)
|
2015-04-10 |
2016-10-19 |
삼성전자주식회사 |
오버레이 에러의 검출 방법 및 이를 이용한 반도체 장치의 제조 방법
|
EP3081901A1
(en)
|
2015-04-17 |
2016-10-19 |
Hennecke Systems GmbH |
Inspection method and device for inspecting a surface pattern
|
KR102512180B1
(ko)
|
2015-04-28 |
2023-03-20 |
케이엘에이 코포레이션 |
계산 효율적인 x 선 기반의 오버레이 측정
|
US10030965B2
(en)
|
2015-05-08 |
2018-07-24 |
Kla-Tencor Corporation |
Model-based hot spot monitoring
|
JP6194922B2
(ja)
*
|
2015-05-13 |
2017-09-13 |
トヨタ自動車株式会社 |
不透明積層体の層厚み測定方法
|
US10094774B2
(en)
|
2015-08-12 |
2018-10-09 |
Industrial Technology Research Institute |
Scattering measurement system and method
|
CN116982977A
(zh)
|
2015-08-18 |
2023-11-03 |
Sio2医药产品公司 |
具有低氧气传输速率的药物和其他包装
|
US10380728B2
(en)
|
2015-08-31 |
2019-08-13 |
Kla-Tencor Corporation |
Model-based metrology using images
|
DE102015217091B4
(de)
*
|
2015-09-07 |
2017-05-11 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V |
Anordnung zur Bestimmung der erreichbaren Haftfestigkeit vor Ausbildung einer stoffschlüssigen Verbindung an einer Oberfläche eines Fügepartners
|
US10101676B2
(en)
|
2015-09-23 |
2018-10-16 |
KLA—Tencor Corporation |
Spectroscopic beam profile overlay metrology
|
US10620420B2
(en)
*
|
2015-09-23 |
2020-04-14 |
Filmetrics, Inc. |
Optical system for use with microscope
|
US10352695B2
(en)
|
2015-12-11 |
2019-07-16 |
Kla-Tencor Corporation |
X-ray scatterometry metrology for high aspect ratio structures
|
US9921152B2
(en)
|
2016-01-15 |
2018-03-20 |
Kla-Tencor Corporation |
Systems and methods for extended infrared spectroscopic ellipsometry
|
US9679822B1
(en)
|
2016-02-22 |
2017-06-13 |
Alpha And Omega Semiconductor Incorporated |
Method for monitoring epitaxial growth geometry shift
|
TWI579396B
(zh)
*
|
2016-03-18 |
2017-04-21 |
萬國半導體股份有限公司 |
監控外延層幾何形狀發生漂移的方法
|
US10504759B2
(en)
|
2016-04-04 |
2019-12-10 |
Kla-Tencor Corporation |
Semiconductor metrology with information from multiple processing steps
|
US10451412B2
(en)
|
2016-04-22 |
2019-10-22 |
Kla-Tencor Corporation |
Apparatus and methods for detecting overlay errors using scatterometry
|
US10041873B2
(en)
|
2016-05-02 |
2018-08-07 |
Kla-Tencor Corporation |
Porosity measurement of semiconductor structures
|
US10145674B2
(en)
*
|
2016-05-02 |
2018-12-04 |
Kla-Tencor Corporation |
Measurement of semiconductor structures with capillary condensation
|
US10281263B2
(en)
|
2016-05-02 |
2019-05-07 |
Kla-Tencor Corporation |
Critical dimension measurements with gaseous adsorption
|
US11313809B1
(en)
|
2016-05-04 |
2022-04-26 |
Kla-Tencor Corporation |
Process control metrology
|
US9728470B1
(en)
*
|
2016-05-10 |
2017-08-08 |
Infineon Technologies Austria Ag |
Semiconductor structure and methods
|
JP6279013B2
(ja)
*
|
2016-05-26 |
2018-02-14 |
Ckd株式会社 |
三次元計測装置
|
WO2017207269A1
(en)
*
|
2016-06-03 |
2017-12-07 |
Asml Holding N.V. |
Alignment system wafer stack beam analyzer
|
US9921104B2
(en)
|
2016-06-11 |
2018-03-20 |
Kla-Tencor Corporation |
Simultaneous multi-angle spectroscopy
|
JP6547695B2
(ja)
|
2016-06-21 |
2019-07-24 |
株式会社デンソー |
冷凍サイクル装置
|
US11162781B2
(en)
|
2016-06-23 |
2021-11-02 |
University Of Utah Research Foundation |
Interferometry systems and methods
|
EP3475649A4
(en)
|
2016-06-23 |
2020-04-22 |
University of Utah Research Foundation |
INTERFEROMETRY SYSTEM AND RELATED METHODS
|
KR102595300B1
(ko)
*
|
2016-07-04 |
2023-10-31 |
삼성전자주식회사 |
검사 방법 및 시스템, 및 이를 이용한 반도체 패키지의 제조 방법
|
KR101806114B1
(ko)
|
2016-08-01 |
2017-12-07 |
주식회사 트윔 |
초고속 패널 얼라인 시스템
|
GB201613988D0
(en)
|
2016-08-16 |
2016-09-28 |
Micromass Uk Ltd And Leco Corp |
Mass analyser having extended flight path
|
US10438825B2
(en)
|
2016-08-29 |
2019-10-08 |
Kla-Tencor Corporation |
Spectral reflectometry for in-situ process monitoring and control
|
US10458912B2
(en)
|
2016-08-31 |
2019-10-29 |
Kla-Tencor Corporation |
Model based optical measurements of semiconductor structures with anisotropic dielectric permittivity
|
JP7164289B2
(ja)
*
|
2016-09-05 |
2022-11-01 |
東京エレクトロン株式会社 |
半導体プロセッシング中のオーバレイを制御するための湾曲を制御する応力の位置特定チューニング
|
US10215693B2
(en)
|
2016-09-29 |
2019-02-26 |
Kla-Tencor Corporation |
Infrared spectroscopic reflectometer for measurement of high aspect ratio structures
|
WO2018071716A1
(en)
|
2016-10-13 |
2018-04-19 |
Kla-Tencor Corporation |
Metrology systems and methods for process control
|
US10712145B2
(en)
|
2016-10-20 |
2020-07-14 |
Kla-Tencor Corporation |
Hybrid metrology for patterned wafer characterization
|
TWI728197B
(zh)
|
2016-10-24 |
2021-05-21 |
美商克萊譚克公司 |
整合至一計量及/或檢測工具中之製程模組
|
JP6864096B2
(ja)
|
2016-12-19 |
2021-04-21 |
エーエスエムエル ネザーランズ ビー.ブイ. |
計測センサ、リソグラフィ装置および内でのデバイス製造方法
|
JP7227909B2
(ja)
|
2017-01-13 |
2023-02-22 |
アプライド マテリアルズ インコーポレイテッド |
インシトゥ監視からの測定値の、抵抗率に基づく調整
|
KR101922973B1
(ko)
|
2017-01-25 |
2018-11-28 |
(주)엘립소테크놀러지 |
4-반사경을 적용한 마이크로 스폿 분광 타원계
|
CN106647147B
(zh)
*
|
2017-02-15 |
2022-05-17 |
苏州德创测控科技有限公司 |
一种非共面的图像采集装置
|
US10690602B2
(en)
|
2017-02-17 |
2020-06-23 |
Kla-Tencor Corporation |
Methods and systems for measurement of thick films and high aspect ratio structures
|
US10732516B2
(en)
|
2017-03-01 |
2020-08-04 |
Kla Tencor Corporation |
Process robust overlay metrology based on optical scatterometry
|
US11022877B2
(en)
|
2017-03-13 |
2021-06-01 |
Applied Materials, Inc. |
Etch processing system having reflective endpoint detection
|
GB2560951B
(en)
|
2017-03-29 |
2020-06-17 |
Redlux Ltd |
Inspection of components for imperfections
|
US10042592B1
(en)
|
2017-03-31 |
2018-08-07 |
Konica Minolta Laboratory U.S.A., Inc. |
Method to determine the best printing device amongst a group of printing devices using an in-line spectrophotometer
|
US9940074B1
(en)
*
|
2017-03-31 |
2018-04-10 |
Konica Minolta Laboratory U.S.A., Inc. |
Method to determine the best printing device amongst a group of printing devices using an in-line spectrophotometer
|
US10444162B2
(en)
|
2017-04-03 |
2019-10-15 |
Samsung Electronics Co., Ltd. |
Method of testing an object and apparatus for performing the same
|
GB2567794B
(en)
|
2017-05-05 |
2023-03-08 |
Micromass Ltd |
Multi-reflecting time-of-flight mass spectrometers
|
GB2563571B
(en)
|
2017-05-26 |
2023-05-24 |
Micromass Ltd |
Time of flight mass analyser with spatial focussing
|
EP3662503A1
(en)
|
2017-08-06 |
2020-06-10 |
Micromass UK Limited |
Ion injection into multi-pass mass spectrometers
|
US11081332B2
(en)
|
2017-08-06 |
2021-08-03 |
Micromass Uk Limited |
Ion guide within pulsed converters
|
US11239067B2
(en)
|
2017-08-06 |
2022-02-01 |
Micromass Uk Limited |
Ion mirror for multi-reflecting mass spectrometers
|
US11295944B2
(en)
|
2017-08-06 |
2022-04-05 |
Micromass Uk Limited |
Printed circuit ion mirror with compensation
|
WO2019030477A1
(en)
|
2017-08-06 |
2019-02-14 |
Anatoly Verenchikov |
ACCELERATOR FOR MASS SPECTROMETERS WITH MULTIPASSES
|
US11049712B2
(en)
|
2017-08-06 |
2021-06-29 |
Micromass Uk Limited |
Fields for multi-reflecting TOF MS
|
WO2019030475A1
(en)
|
2017-08-06 |
2019-02-14 |
Anatoly Verenchikov |
MASS SPECTROMETER WITH MULTIPASSAGE
|
US10699969B2
(en)
*
|
2017-08-30 |
2020-06-30 |
Kla-Tencor Corporation |
Quick adjustment of metrology measurement parameters according to process variation
|
US10898986B2
(en)
|
2017-09-15 |
2021-01-26 |
Applied Materials, Inc. |
Chattering correction for accurate sensor position determination on wafer
|
US10365211B2
(en)
|
2017-09-26 |
2019-07-30 |
Kla-Tencor Corporation |
Systems and methods for metrology beam stabilization
|
US10732515B2
(en)
|
2017-09-27 |
2020-08-04 |
Kla-Tencor Corporation |
Detection and measurement of dimensions of asymmetric structures
|
US10551166B2
(en)
*
|
2017-10-11 |
2020-02-04 |
Kla-Tencor Corporation |
Optical measurement of a highly absorbing film layer over highly reflective film stacks
|
EP3474074A1
(en)
|
2017-10-17 |
2019-04-24 |
ASML Netherlands B.V. |
Scatterometer and method of scatterometry using acoustic radiation
|
KR102450776B1
(ko)
*
|
2017-10-27 |
2022-10-05 |
삼성전자주식회사 |
레이저 가공 방법, 기판 다이싱 방법 및 이를 수행하기 위한 기판 가공 장치
|
KR102369936B1
(ko)
|
2017-12-08 |
2022-03-03 |
삼성전자주식회사 |
광학 측정 방법
|
JP7012538B2
(ja)
*
|
2018-01-11 |
2022-01-28 |
株式会社ディスコ |
ウエーハの評価方法
|
DE112019000022T5
(de)
*
|
2018-01-31 |
2019-10-24 |
Asml Netherlands B.V. |
Verfahren zum Kennzeichnen von Substraten auf der Basis von Prozessparametern
|
WO2019164452A1
(en)
*
|
2018-02-22 |
2019-08-29 |
Agency For Science, Technology And Research |
Methods and apparatus for fluorescence microscopy
|
US11036898B2
(en)
|
2018-03-15 |
2021-06-15 |
Kla-Tencor Corporation |
Measurement models of nanowire semiconductor structures based on re-useable sub-structures
|
US11519869B2
(en)
|
2018-03-20 |
2022-12-06 |
Kla Tencor Corporation |
Methods and systems for real time measurement control
|
CN108461412A
(zh)
*
|
2018-03-22 |
2018-08-28 |
北京北方华创微电子装备有限公司 |
在线监测系统及半导体加工设备
|
US11056366B2
(en)
*
|
2018-03-23 |
2021-07-06 |
Kla Corporation |
Sample transport device with integrated metrology
|
TWI825075B
(zh)
|
2018-04-03 |
2023-12-11 |
美商應用材料股份有限公司 |
針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
|
GB201806507D0
(en)
|
2018-04-20 |
2018-06-06 |
Verenchikov Anatoly |
Gridless ion mirrors with smooth fields
|
US11441893B2
(en)
|
2018-04-27 |
2022-09-13 |
Kla Corporation |
Multi-spot analysis system with multiple optical probes
|
GB201807626D0
(en)
|
2018-05-10 |
2018-06-27 |
Micromass Ltd |
Multi-reflecting time of flight mass analyser
|
GB201807605D0
(en)
|
2018-05-10 |
2018-06-27 |
Micromass Ltd |
Multi-reflecting time of flight mass analyser
|
GB201808530D0
(en)
|
2018-05-24 |
2018-07-11 |
Verenchikov Anatoly |
TOF MS detection system with improved dynamic range
|
WO2019229871A1
(ja)
*
|
2018-05-30 |
2019-12-05 |
株式会社日立ハイテクノロジーズ |
ウエハ検査装置およびウエハ検査方法
|
KR20190139652A
(ko)
|
2018-06-08 |
2019-12-18 |
삼성전자주식회사 |
검사 계측 장치 그리고 그의 검사 계측 방법
|
TW202000993A
(zh)
|
2018-06-20 |
2020-01-01 |
美商維克精密表面處理股份有限公司 |
凸塊底層金屬蝕刻製程期間使底切最小化之裝置及方法
|
US11069583B2
(en)
|
2018-06-20 |
2021-07-20 |
Veeco Instruments Inc. |
Apparatus and method for the minimization of undercut during a UBM etch process
|
WO2019246478A1
(en)
*
|
2018-06-22 |
2019-12-26 |
Northwestern University |
Systems and methods for interferometric multifocus microscopy
|
JP7287987B2
(ja)
|
2018-06-27 |
2023-06-06 |
アプライド マテリアルズ インコーポレイテッド |
化学機械研磨の温度制御
|
GB201810573D0
(en)
|
2018-06-28 |
2018-08-15 |
Verenchikov Anatoly |
Multi-pass mass spectrometer with improved duty cycle
|
US10761398B2
(en)
*
|
2018-06-29 |
2020-09-01 |
Mitutoyo Corporation |
Imaging ellipsometer system utilizing a tunable acoustic gradient lens
|
JP7114736B2
(ja)
*
|
2018-11-12 |
2022-08-08 |
株式会社日立ハイテク |
画像形成方法及び画像形成システム
|
US10942135B2
(en)
|
2018-11-14 |
2021-03-09 |
Kla Corporation |
Radial polarizer for particle detection
|
US11060846B2
(en)
|
2018-12-19 |
2021-07-13 |
Kla Corporation |
Scatterometry based methods and systems for measurement of strain in semiconductor structures
|
WO2020128593A1
(en)
*
|
2018-12-20 |
2020-06-25 |
Arcelormittal |
Measure of the degree of crystallinity of a polymer coating on a metal substrate
|
US10801953B2
(en)
|
2019-01-11 |
2020-10-13 |
Kla-Tencor Corporation |
Semiconductor metrology based on hyperspectral imaging
|
US10804167B2
(en)
|
2019-01-24 |
2020-10-13 |
Kla-Tencor Corporation |
Methods and systems for co-located metrology
|
US11137350B2
(en)
|
2019-01-28 |
2021-10-05 |
Kla Corporation |
Mid-infrared spectroscopy for measurement of high aspect ratio structures
|
GB201901411D0
(en)
|
2019-02-01 |
2019-03-20 |
Micromass Ltd |
Electrode assembly for mass spectrometer
|
US11635344B2
(en)
|
2019-02-01 |
2023-04-25 |
Optikos Corporation |
Portable optic metrology thermal chamber module and method therefor
|
US10948423B2
(en)
|
2019-02-17 |
2021-03-16 |
Kla Corporation |
Sensitive particle detection with spatially-varying polarization rotator and polarizer
|
CN113439240A
(zh)
*
|
2019-02-19 |
2021-09-24 |
Asml控股股份有限公司 |
量测系统、光刻设备和方法
|
US11016024B2
(en)
*
|
2019-02-19 |
2021-05-25 |
Kla Corporation |
Air scattering standard for light scattering based optical instruments and tools
|
US11060982B2
(en)
|
2019-03-17 |
2021-07-13 |
Kla Corporation |
Multi-dimensional model of optical dispersion
|
JP7299728B2
(ja)
*
|
2019-03-22 |
2023-06-28 |
ファスフォードテクノロジ株式会社 |
半導体製造装置および半導体装置の製造方法
|
KR102180113B1
(ko)
*
|
2019-04-30 |
2020-11-18 |
한양대학교 산학협력단 |
두께 측정 장치
|
TW202110575A
(zh)
|
2019-05-29 |
2021-03-16 |
美商應用材料股份有限公司 |
用於化學機械研磨系統的蒸氣處置站
|
US11628478B2
(en)
|
2019-05-29 |
2023-04-18 |
Applied Materials, Inc. |
Steam cleaning of CMP components
|
US11633833B2
(en)
|
2019-05-29 |
2023-04-25 |
Applied Materials, Inc. |
Use of steam for pre-heating of CMP components
|
TW202113331A
(zh)
*
|
2019-06-10 |
2021-04-01 |
日商東京威力科創股份有限公司 |
基板處理裝置、基板檢查方法及記錄媒體
|
EP3994523A1
(en)
|
2019-07-02 |
2022-05-11 |
ASML Netherlands B.V. |
Metrology method and associated metrology and lithographic apparatuses
|
US11897079B2
(en)
|
2019-08-13 |
2024-02-13 |
Applied Materials, Inc. |
Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
|
CN110473798B
(zh)
*
|
2019-08-19 |
2021-10-19 |
上海华力微电子有限公司 |
一种晶圆表面超小尺寸缺陷检测方法
|
US11460418B2
(en)
|
2019-08-26 |
2022-10-04 |
Kla Corporation |
Methods and systems for semiconductor metrology based on wavelength resolved soft X-ray reflectometry
|
CN110567985B
(zh)
*
|
2019-10-14 |
2021-10-08 |
重庆大学 |
一种基于深度学习的自适应齿轮点蚀定量评估与检测装置
|
US10895727B1
(en)
|
2019-10-19 |
2021-01-19 |
SequLITE Genomics US, Inc. |
Microscope for locating structures on the inner surface of a fluidic channel
|
WO2021081804A1
(en)
*
|
2019-10-30 |
2021-05-06 |
Yangtze Memory Technologies Co., Ltd |
Method for calibrating verticality of particle beam and system applied to semiconductor fabrication process
|
CN110927170B
(zh)
*
|
2019-12-04 |
2022-03-08 |
中国工程物理研究院激光聚变研究中心 |
缺陷确定方法、装置及系统
|
TWI721720B
(zh)
*
|
2019-12-19 |
2021-03-11 |
由田新技股份有限公司 |
光源裝置及光學檢測系統
|
US11698251B2
(en)
|
2020-01-07 |
2023-07-11 |
Kla Corporation |
Methods and systems for overlay measurement based on soft X-ray Scatterometry
|
CN111398175B
(zh)
*
|
2020-03-05 |
2021-09-07 |
南京大学 |
一种声速自适应的光声-超声双模态显微镜成像方法
|
CN115280460A
(zh)
*
|
2020-03-13 |
2022-11-01 |
Asml荷兰有限公司 |
多带电粒子束检查中的调平传感器
|
WO2021231427A1
(en)
|
2020-05-14 |
2021-11-18 |
Applied Materials, Inc. |
Technique for training neural network for use in in-situ monitoring during polishing and polishing system
|
CN115605447A
(zh)
*
|
2020-05-26 |
2023-01-13 |
法国圣戈班玻璃厂(Fr) |
用于估计涂覆有单层或多层的透明基材的质量功能的方法
|
US11780047B2
(en)
|
2020-06-24 |
2023-10-10 |
Applied Materials, Inc. |
Determination of substrate layer thickness with polishing pad wear compensation
|
EP4171873A1
(en)
|
2020-06-29 |
2023-05-03 |
Applied Materials, Inc. |
Temperature and slurry flow rate control in cmp
|
WO2022006008A1
(en)
|
2020-06-29 |
2022-01-06 |
Applied Materials, Inc. |
Control of steam generation for chemical mechanical polishing
|
US11577358B2
(en)
|
2020-06-30 |
2023-02-14 |
Applied Materials, Inc. |
Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
|
US11919123B2
(en)
|
2020-06-30 |
2024-03-05 |
Applied Materials, Inc. |
Apparatus and method for CMP temperature control
|
JPWO2022059202A1
(ja)
|
2020-09-18 |
2022-03-24 |
|
|
EP3970898A1
(en)
*
|
2020-09-18 |
2022-03-23 |
Laser Systems & Solutions of Europe |
System and method to minimize irradiation non uniformity
|
US20230273253A1
(en)
*
|
2020-09-29 |
2023-08-31 |
Hitachi High-Tech Corporation |
Semiconductor inspection device and method for inspecting semiconductor sample
|
TWI759913B
(zh)
*
|
2020-10-16 |
2022-04-01 |
天虹科技股份有限公司 |
原子層沉積薄膜厚度的檢測系統及檢測方法
|
US11487848B2
(en)
*
|
2021-01-29 |
2022-11-01 |
Applied Materials, Inc. |
Process abnormality identification using measurement violation analysis
|
DE102021206564A1
(de)
*
|
2021-06-24 |
2022-12-29 |
Carl Zeiss Smt Gmbh |
Endpunktbestimmung durch induzierte desorption von gasen und analyse der wiederbedeckung
|
CN113777048B
(zh)
*
|
2021-08-11 |
2023-07-25 |
华中科技大学 |
一种共轴超快光谱椭偏仪及测量方法
|
US11747269B2
(en)
|
2021-11-09 |
2023-09-05 |
Warsaw Orthopedic, Inc. |
Systems and methods for identifying a coating on an implant
|
US20230195060A1
(en)
*
|
2021-12-21 |
2023-06-22 |
Applied Materials, Inc. |
Substrate support characterization to build a digital twin
|