FR2843486B1 - Procede d'elaboration de couches minces de semi-conducteur comprenant une etape de finition - Google Patents

Procede d'elaboration de couches minces de semi-conducteur comprenant une etape de finition

Info

Publication number
FR2843486B1
FR2843486B1 FR0210208A FR0210208A FR2843486B1 FR 2843486 B1 FR2843486 B1 FR 2843486B1 FR 0210208 A FR0210208 A FR 0210208A FR 0210208 A FR0210208 A FR 0210208A FR 2843486 B1 FR2843486 B1 FR 2843486B1
Authority
FR
France
Prior art keywords
thin films
semiconductor thin
finishing step
producing semiconductor
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0210208A
Other languages
English (en)
Other versions
FR2843486A1 (fr
Inventor
Bruno Ghyselen
Cecile Aulnette
Benedite Osternaud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Priority to FR0210208A priority Critical patent/FR2843486B1/fr
Priority to US10/637,078 priority patent/US6908774B2/en
Priority to US10/637,094 priority patent/US20040087042A1/en
Priority to PCT/IB2003/003640 priority patent/WO2004015759A2/fr
Priority to AU2003263391A priority patent/AU2003263391A1/en
Priority to EP03784416A priority patent/EP1547143B1/fr
Priority to EP10155844A priority patent/EP2190010A2/fr
Priority to AT03784416T priority patent/ATE484847T1/de
Priority to DE60334555T priority patent/DE60334555D1/de
Priority to JP2004527229A priority patent/JP4684650B2/ja
Priority to TW092122092A priority patent/TWI298919B/zh
Publication of FR2843486A1 publication Critical patent/FR2843486A1/fr
Application granted granted Critical
Publication of FR2843486B1 publication Critical patent/FR2843486B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
FR0210208A 2002-08-12 2002-08-12 Procede d'elaboration de couches minces de semi-conducteur comprenant une etape de finition Expired - Fee Related FR2843486B1 (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FR0210208A FR2843486B1 (fr) 2002-08-12 2002-08-12 Procede d'elaboration de couches minces de semi-conducteur comprenant une etape de finition
US10/637,094 US20040087042A1 (en) 2002-08-12 2003-08-06 Method and apparatus for adjusting the thickness of a layer of semiconductor material
US10/637,078 US6908774B2 (en) 2002-08-12 2003-08-06 Method and apparatus for adjusting the thickness of a thin layer of semiconductor material
AU2003263391A AU2003263391A1 (en) 2002-08-12 2003-08-11 A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine
EP03784416A EP1547143B1 (fr) 2002-08-12 2003-08-11 Procede de preparation d'une couche mince, ledit procede comprenant une etape de correction de l'epaisseur par oxydation sacrificielle et machine associee
EP10155844A EP2190010A2 (fr) 2002-08-12 2003-08-11 Procédé de préparation d'une fine couche de matériau semi-conducteur
PCT/IB2003/003640 WO2004015759A2 (fr) 2002-08-12 2003-08-11 Procede de preparation d'une couche mince, ledit procede comprenant une etape de correction de l'epaisseur par oxydation sacrificielle et machine associee
AT03784416T ATE484847T1 (de) 2002-08-12 2003-08-11 Verfahren zur herstellung einer dünnen schicht, einschliesslich eines schrittes des korrigierens der dicke durch hilfsoxidation und zugehörige vorrichtung
DE60334555T DE60334555D1 (de) 2002-08-12 2003-08-11 Verfahren zur herstellung einer dünnen schicht, einschliesslich eines schrittes des korrigierens der dicke durch hilfsoxidation und zugehörige vorrichtung
JP2004527229A JP4684650B2 (ja) 2002-08-12 2003-08-11 薄層を形成する方法、犠牲酸化によって厚みを補正するステップを含む方法、及び関連する機械
TW092122092A TWI298919B (en) 2002-08-12 2003-08-12 A method of preparing a thin layer, the method including a step of correcting thickness by sacrificial oxidation, and an associated machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0210208A FR2843486B1 (fr) 2002-08-12 2002-08-12 Procede d'elaboration de couches minces de semi-conducteur comprenant une etape de finition

Publications (2)

Publication Number Publication Date
FR2843486A1 FR2843486A1 (fr) 2004-02-13
FR2843486B1 true FR2843486B1 (fr) 2005-09-23

Family

ID=30471069

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0210208A Expired - Fee Related FR2843486B1 (fr) 2002-08-12 2002-08-12 Procede d'elaboration de couches minces de semi-conducteur comprenant une etape de finition

Country Status (1)

Country Link
FR (1) FR2843486B1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW346649B (en) * 1996-09-24 1998-12-01 Tokyo Electron Co Ltd Method for wet etching a film
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
TW455973B (en) * 1999-04-05 2001-09-21 Applied Materials Inc Endpoint detection in the fabrication of electronic devices
FR2797714B1 (fr) * 1999-08-20 2001-10-26 Soitec Silicon On Insulator Procede de traitement de substrats pour la microelectronique et substrats obtenus par ce procede
US6950196B2 (en) * 2000-09-20 2005-09-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen

Also Published As

Publication number Publication date
FR2843486A1 (fr) 2004-02-13

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100430