FR2927175B1 - Dispositif d'inspection de plaquettes semi-conductrices - Google Patents

Dispositif d'inspection de plaquettes semi-conductrices

Info

Publication number
FR2927175B1
FR2927175B1 FR0800597A FR0800597A FR2927175B1 FR 2927175 B1 FR2927175 B1 FR 2927175B1 FR 0800597 A FR0800597 A FR 0800597A FR 0800597 A FR0800597 A FR 0800597A FR 2927175 B1 FR2927175 B1 FR 2927175B1
Authority
FR
France
Prior art keywords
semiconductor wafers
inspecting semiconductor
inspecting
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0800597A
Other languages
English (en)
Other versions
FR2927175A1 (fr
Inventor
Philippe Gastaldo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unity Semiconductor SAS
Original Assignee
Altatech Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altatech Semiconductor filed Critical Altatech Semiconductor
Priority to FR0800597A priority Critical patent/FR2927175B1/fr
Priority to US12/101,674 priority patent/US20090195786A1/en
Priority to PCT/FR2009/000115 priority patent/WO2009112704A1/fr
Publication of FR2927175A1 publication Critical patent/FR2927175A1/fr
Application granted granted Critical
Publication of FR2927175B1 publication Critical patent/FR2927175B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
FR0800597A 2008-02-05 2008-02-05 Dispositif d'inspection de plaquettes semi-conductrices Active FR2927175B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0800597A FR2927175B1 (fr) 2008-02-05 2008-02-05 Dispositif d'inspection de plaquettes semi-conductrices
US12/101,674 US20090195786A1 (en) 2008-02-05 2008-04-11 Device for inspecting semi-conductor wafers
PCT/FR2009/000115 WO2009112704A1 (fr) 2008-02-05 2009-02-02 Dispositif d'inspection de plaquettes semi-conductrices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0800597A FR2927175B1 (fr) 2008-02-05 2008-02-05 Dispositif d'inspection de plaquettes semi-conductrices

Publications (2)

Publication Number Publication Date
FR2927175A1 FR2927175A1 (fr) 2009-08-07
FR2927175B1 true FR2927175B1 (fr) 2011-02-18

Family

ID=39731249

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0800597A Active FR2927175B1 (fr) 2008-02-05 2008-02-05 Dispositif d'inspection de plaquettes semi-conductrices

Country Status (3)

Country Link
US (1) US20090195786A1 (fr)
FR (1) FR2927175B1 (fr)
WO (1) WO2009112704A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI512865B (zh) * 2008-09-08 2015-12-11 Rudolph Technologies Inc 晶圓邊緣檢查技術
FR2959864B1 (fr) 2010-05-06 2013-01-18 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices en mouvement.
US9658169B2 (en) 2013-03-15 2017-05-23 Rudolph Technologies, Inc. System and method of characterizing micro-fabrication processes
JP6295497B2 (ja) * 2014-09-08 2018-03-20 キリンテクノシステム株式会社 回転検出装置および該回転検出装置を備えた検査装置
FR3026485B1 (fr) * 2014-09-29 2016-09-23 Altatech Semiconductor Procede et systeme d'inspection de plaquettes pour l'electronique, l'optique ou l'optoelectronique
FR3026484B1 (fr) * 2014-09-29 2018-06-15 Altatech Semiconductor Procede et systeme d'inspection de plaquettes transparentes pour l'electronique, l'optique ou l'optoelectronique
FR3049710B1 (fr) * 2016-03-31 2020-06-19 Unity Semiconductor Procede et systeme d'inspection par effet doppler laser de plaquettes pour la microelectronique ou l'optique
WO2018152202A1 (fr) * 2017-02-14 2018-08-23 Massachusetts Institute Of Technology Systèmes et procédés pour microscopie automatisée
FR3076618B1 (fr) * 2018-01-05 2023-11-24 Unity Semiconductor Procede et systeme d'inspection optique d'un substrat
FR3087011B1 (fr) * 2018-10-08 2022-12-30 Unity Semiconductor Dispositif d’inspection optique en champ sombre

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030830A (en) * 1976-01-05 1977-06-21 Atlantic Research Corporation Process and apparatus for sensing defects on a smooth surface
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
US4775877A (en) * 1985-10-29 1988-10-04 Canon Kabushiki Kaisha Method and apparatus for processing a plate-like workpiece
US4850693A (en) * 1988-05-23 1989-07-25 The United States Of America As Represented By The United States Department Of Energy Compact portable diffraction moire interferometer
US5124931A (en) * 1988-10-14 1992-06-23 Tokyo Electron Limited Method of inspecting electric characteristics of wafers and apparatus therefor
JPH04298060A (ja) * 1991-03-26 1992-10-21 Tokyo Electron Ltd ウエハの位置合わせ装置
US5523839A (en) * 1994-02-28 1996-06-04 Minnesota Mining & Manufacturing Differential optical interferometric profilomenty for real time manufacturing control
FR2722290B1 (fr) * 1994-07-07 1996-08-30 Schneider Electric Sa Dispositif optique de detection de caracteristiques de particules en mouvement
US5548195A (en) * 1994-12-22 1996-08-20 International Business Machines Corporation Compensated servo control stage positioning apparatus
JP2877119B2 (ja) * 1996-12-26 1999-03-31 日本電気株式会社 移動体の速度測定装置
JPH1154407A (ja) * 1997-08-05 1999-02-26 Nikon Corp 位置合わせ方法
US6806951B2 (en) * 2000-09-20 2004-10-19 Kla-Tencor Technologies Corp. Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen
WO2002039099A2 (fr) * 2000-11-13 2002-05-16 Koninklijke Philips Electronics N.V. Mesure de defauts de surface
US20040227954A1 (en) * 2003-05-16 2004-11-18 Tong Xie Interferometer based navigation device
US7352444B1 (en) * 2004-06-24 2008-04-01 Cypress Semiconductor Corp. Method for arranging and rotating a semiconductor wafer within a photolithography tool prior to exposing the wafer
US20060256345A1 (en) * 2005-05-12 2006-11-16 Kla-Tencor Technologies Corp. Interferometry measurement in disturbed environments
US7433052B2 (en) * 2005-07-07 2008-10-07 Mitutoyo Corporation Systems and methods for tilt and range measurement
JP5175743B2 (ja) * 2006-12-14 2013-04-03 アイエス・テクノロジー・ジャパン株式会社 円板保持装置および欠陥異物検出装置

Also Published As

Publication number Publication date
US20090195786A1 (en) 2009-08-06
WO2009112704A1 (fr) 2009-09-17
FR2927175A1 (fr) 2009-08-07
WO2009112704A8 (fr) 2010-01-28

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