BRPI1012070A2 - "dispositivo semicondutor" - Google Patents

"dispositivo semicondutor"

Info

Publication number
BRPI1012070A2
BRPI1012070A2 BRPI1012070A BRPI1012070A BRPI1012070A2 BR PI1012070 A2 BRPI1012070 A2 BR PI1012070A2 BR PI1012070 A BRPI1012070 A BR PI1012070A BR PI1012070 A BRPI1012070 A BR PI1012070A BR PI1012070 A2 BRPI1012070 A2 BR PI1012070A2
Authority
BR
Brazil
Prior art keywords
semiconductor device
semiconductor
Prior art date
Application number
BRPI1012070A
Other languages
English (en)
Inventor
Moriwaki Hiroyuki
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43356353&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI1012070(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BRPI1012070A2 publication Critical patent/BRPI1012070A2/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725Source or drain electrodes for field effect devices
    • H01L29/41733Source or drain electrodes for field effect devices for thin film transistors with insulated gate
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
BRPI1012070A 2009-06-18 2010-06-09 "dispositivo semicondutor" BRPI1012070A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009145795 2009-06-18
PCT/JP2010/059736 WO2010147032A1 (ja) 2009-06-18 2010-06-09 半導体装置

Publications (1)

Publication Number Publication Date
BRPI1012070A2 true BRPI1012070A2 (pt) 2018-06-12

Family

ID=43356353

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1012070A BRPI1012070A2 (pt) 2009-06-18 2010-06-09 "dispositivo semicondutor"

Country Status (7)

Country Link
US (1) US8921857B2 (pt)
EP (1) EP2445011B1 (pt)
JP (1) JP5406295B2 (pt)
CN (1) CN102804388B (pt)
BR (1) BRPI1012070A2 (pt)
RU (1) RU2501117C2 (pt)
WO (1) WO2010147032A1 (pt)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010058581A1 (ja) * 2008-11-20 2010-05-27 シャープ株式会社 シフトレジスタ
US20120082287A1 (en) * 2009-05-20 2012-04-05 Sharp Kabushiki Kaisha Shift register
US9373414B2 (en) * 2009-09-10 2016-06-21 Beijing Boe Optoelectronics Technology Co., Ltd. Shift register unit and gate drive device for liquid crystal display
EP2348531B1 (en) * 2010-01-26 2021-05-26 Samsung Electronics Co., Ltd. Thin film transistor and method of manufacturing the same
KR101570853B1 (ko) 2010-03-02 2015-11-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 펄스 신호 출력 회로 및 시프트 레지스터
DE112011100749B4 (de) * 2010-03-02 2015-06-11 Semiconductor Energy Laboratory Co., Ltd. Impulssignal-Ausgangsschaltung und Schieberegister
KR101838628B1 (ko) 2010-03-02 2018-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 펄스 신호 출력 회로 및 시프트 레지스터
TWI415052B (zh) 2010-12-29 2013-11-11 Au Optronics Corp 開關裝置與應用該開關裝置之移位暫存器電路
JP2012209543A (ja) 2011-03-11 2012-10-25 Semiconductor Energy Lab Co Ltd 半導体装置
US20140027769A1 (en) * 2011-04-08 2014-01-30 Sharp Kabushiki Kaisha Semiconductor device and display device
JP6076617B2 (ja) * 2011-05-13 2017-02-08 株式会社半導体エネルギー研究所 表示装置
US8718224B2 (en) 2011-08-05 2014-05-06 Semiconductor Energy Laboratory Co., Ltd. Pulse signal output circuit and shift register
KR20130043063A (ko) 2011-10-19 2013-04-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 반도체 장치의 제작 방법
US8962386B2 (en) * 2011-11-25 2015-02-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI493685B (zh) * 2012-02-10 2015-07-21 E Ink Holdings Inc 主動陣列基板上之靜電防護結構
US9159288B2 (en) * 2012-03-09 2015-10-13 Apple Inc. Gate line driver circuit for display element array
KR101697841B1 (ko) * 2012-04-20 2017-01-18 샤프 가부시키가이샤 표시 장치
US9817032B2 (en) * 2012-05-23 2017-11-14 Semiconductor Energy Laboratory Co., Ltd. Measurement device
US8704232B2 (en) 2012-06-12 2014-04-22 Apple Inc. Thin film transistor with increased doping regions
US9065077B2 (en) 2012-06-15 2015-06-23 Apple, Inc. Back channel etch metal-oxide thin film transistor and process
US9685557B2 (en) 2012-08-31 2017-06-20 Apple Inc. Different lightly doped drain length control for self-align light drain doping process
US8987027B2 (en) 2012-08-31 2015-03-24 Apple Inc. Two doping regions in lightly doped drain for thin film transistors and associated doping processes
US8748320B2 (en) 2012-09-27 2014-06-10 Apple Inc. Connection to first metal layer in thin film transistor process
US8999771B2 (en) 2012-09-28 2015-04-07 Apple Inc. Protection layer for halftone process of third metal
US9201276B2 (en) 2012-10-17 2015-12-01 Apple Inc. Process architecture for color filter array in active matrix liquid crystal display
KR101995714B1 (ko) * 2012-12-28 2019-07-04 엘지디스플레이 주식회사 표시장치
US9001297B2 (en) 2013-01-29 2015-04-07 Apple Inc. Third metal layer for thin film transistor with reduced defects in liquid crystal display
CN104969283B (zh) * 2013-02-26 2017-06-16 夏普株式会社 显示装置
US9088003B2 (en) 2013-03-06 2015-07-21 Apple Inc. Reducing sheet resistance for common electrode in top emission organic light emitting diode display
WO2014149682A1 (en) * 2013-03-19 2014-09-25 Applied Materials, Inc. Multilayer passivation or etch stop tft
KR102046997B1 (ko) * 2013-04-04 2019-11-21 삼성디스플레이 주식회사 박막 트랜지스터 및 유기 발광 표시 장치
US9287406B2 (en) 2013-06-06 2016-03-15 Macronix International Co., Ltd. Dual-mode transistor devices and methods for operating same
JP2015109424A (ja) * 2013-10-22 2015-06-11 株式会社半導体エネルギー研究所 半導体装置、該半導体装置の作製方法、及び該半導体装置に用いるエッチング溶液
US9510454B2 (en) * 2014-02-28 2016-11-29 Qualcomm Incorporated Integrated interposer with embedded active devices
JP6274968B2 (ja) * 2014-05-16 2018-02-07 ローム株式会社 半導体装置
JP5968372B2 (ja) * 2014-07-17 2016-08-10 学校法人 龍谷大学 磁場センサー
JP6459271B2 (ja) * 2014-07-23 2019-01-30 Tianma Japan株式会社 イメージセンサ及びその駆動方法
CN107112051B (zh) * 2014-10-28 2020-08-04 夏普株式会社 单位移位寄存器电路、移位寄存器电路、单位移位寄存器电路的控制方法及显示装置
TWI581317B (zh) * 2014-11-14 2017-05-01 群創光電股份有限公司 薄膜電晶體基板及具備該薄膜電晶體基板之顯示面板
WO2016079639A1 (ja) * 2014-11-20 2016-05-26 株式会社半導体エネルギー研究所 半導体装置、回路基板および電子機器
JP2016225587A (ja) * 2015-05-29 2016-12-28 株式会社神戸製鋼所 酸化物半導体層を含む薄膜トランジスタ
JP2017103408A (ja) 2015-12-04 2017-06-08 株式会社ジャパンディスプレイ 表示装置
KR102474698B1 (ko) * 2015-12-30 2022-12-05 엘지디스플레이 주식회사 게이트 드라이버 및 이를 포함하는 액정표시장치
CN105609138A (zh) * 2016-01-04 2016-05-25 京东方科技集团股份有限公司 一种移位寄存器、栅极驱动电路、显示面板及显示装置
CN105552134A (zh) * 2016-01-20 2016-05-04 中国科学院物理研究所 场效应二极管
WO2017150443A1 (ja) * 2016-03-02 2017-09-08 シャープ株式会社 アクティブマトリクス基板、およびアクティブマトリクス基板を備えた液晶表示装置
CN205621414U (zh) * 2016-04-26 2016-10-05 京东方科技集团股份有限公司 静电放电电路、阵列基板和显示装置
JP2017212295A (ja) * 2016-05-24 2017-11-30 東芝メモリ株式会社 半導体装置
CN109314317B (zh) * 2016-06-10 2020-10-23 夏普株式会社 扫描天线
CN106959562B (zh) * 2017-05-09 2021-01-08 惠科股份有限公司 一种显示面板
JP7064309B2 (ja) * 2017-10-20 2022-05-10 株式会社ジャパンディスプレイ ダイオード、トランジスタ、およびこれらを有する表示装置
JP6600017B2 (ja) * 2018-01-09 2019-10-30 ローム株式会社 半導体装置
WO2019186652A1 (ja) * 2018-03-26 2019-10-03 シャープ株式会社 表示装置の製造方法及び表示装置
CN112236867A (zh) * 2018-06-07 2021-01-15 堺显示器制品株式会社 薄膜晶体管及其制造方法
WO2019234891A1 (ja) * 2018-06-07 2019-12-12 堺ディスプレイプロダクト株式会社 薄膜トランジスタおよびその製造方法
CN112292751A (zh) * 2018-06-07 2021-01-29 堺显示器制品株式会社 薄膜晶体管及其制造方法
CN112236868A (zh) * 2018-06-07 2021-01-15 堺显示器制品株式会社 薄膜晶体管及其制造方法
US20220020702A1 (en) * 2018-12-04 2022-01-20 Hitachi Astemo, Ltd. Semiconductor Device and in-Vehicle Electronic Control Device Using the Same
KR20220026172A (ko) * 2020-08-25 2022-03-04 엘지디스플레이 주식회사 디스플레이 장치
CN113437099B (zh) * 2021-05-13 2023-10-31 北京大学深圳研究生院 光电探测器及其制造方法及相应的光电探测方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6179259A (ja) * 1984-09-26 1986-04-22 Seiko Instr & Electronics Ltd 薄膜トランジスタ装置
JPS63220289A (ja) 1987-03-10 1988-09-13 日本電気株式会社 薄膜トランジスタアレイ
JPH01218070A (ja) 1988-02-26 1989-08-31 Matsushita Electron Corp Mosトランジスタ
JPH05304171A (ja) 1992-04-27 1993-11-16 Toshiba Corp 薄膜トランジスタ
KR0130955B1 (ko) 1992-10-07 1998-04-14 쓰지 하루오 박막 트랜지스터의 제조방법 및 액정표시장치의 제조방법
JP3429034B2 (ja) 1992-10-07 2003-07-22 シャープ株式会社 半導体膜の製造方法
GB9226890D0 (en) * 1992-12-23 1993-02-17 Philips Electronics Uk Ltd An imaging device
US5501989A (en) * 1993-03-22 1996-03-26 Semiconductor Energy Laboratory Co., Ltd. Method of making semiconductor device/circuit having at least partially crystallized semiconductor layer
JPH0887893A (ja) 1994-09-19 1996-04-02 Fujitsu Ltd 半導体記憶装置
JP3090081B2 (ja) * 1997-03-12 2000-09-18 日本電気株式会社 半導体装置
TW405243B (en) * 1998-02-25 2000-09-11 Koninkl Philips Electronics Nv Semiconductor device comprising a mos transistor
JP2001028424A (ja) * 1999-07-13 2001-01-30 Sanyo Electric Co Ltd 半導体装置とその製造方法
JP4089858B2 (ja) 2000-09-01 2008-05-28 国立大学法人東北大学 半導体デバイス
KR100752602B1 (ko) * 2001-02-13 2007-08-29 삼성전자주식회사 쉬프트 레지스터와, 이를 이용한 액정 표시 장치
JP3989763B2 (ja) * 2002-04-15 2007-10-10 株式会社半導体エネルギー研究所 半導体表示装置
JP2005142494A (ja) * 2003-11-10 2005-06-02 Toshiba Corp 半導体集積回路
JP4207858B2 (ja) * 2004-07-05 2009-01-14 セイコーエプソン株式会社 半導体装置、表示装置及び電子機器
TWI271847B (en) * 2004-12-08 2007-01-21 Au Optronics Corp Electrostatic discharge protection circuit and method of electrostatic discharge protection
US7746299B2 (en) * 2005-01-31 2010-06-29 Toshiba Matsushita Display Technology Co., Ltd. Display, array substrate, and method of driving display
JP4987309B2 (ja) * 2005-02-04 2012-07-25 セイコーインスツル株式会社 半導体集積回路装置とその製造方法
US7687327B2 (en) * 2005-07-08 2010-03-30 Kovio, Inc, Methods for manufacturing RFID tags and structures formed therefrom
RU2308146C2 (ru) * 2005-12-13 2007-10-10 Общество с ограниченной ответственностью "Юник Ай Сиз" Устройство защиты выводов интегральных схем со структурой мдп от электростатических разрядов
KR101404542B1 (ko) * 2006-05-25 2014-06-09 삼성디스플레이 주식회사 액정 표시 장치
TWI346926B (en) 2006-08-29 2011-08-11 Au Optronics Corp Esd protection control circuit and lcd
JP2008140489A (ja) * 2006-12-04 2008-06-19 Seiko Epson Corp シフトレジスタ、走査線駆動回路、データ線駆動回路、電気光学装置及び電子機器
JP2008297297A (ja) 2007-06-04 2008-12-11 Hoyu Co Ltd 毛髪処理用組成物
JP5317712B2 (ja) * 2008-01-22 2013-10-16 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
KR101529575B1 (ko) * 2008-09-10 2015-06-29 삼성전자주식회사 트랜지스터, 이를 포함하는 인버터 및 이들의 제조방법
WO2010058581A1 (ja) 2008-11-20 2010-05-27 シャープ株式会社 シフトレジスタ
US8575713B2 (en) * 2009-02-19 2013-11-05 Sharp Kabushiki Kaisha Semiconductor device and display device

Also Published As

Publication number Publication date
RU2501117C2 (ru) 2013-12-10
CN102804388B (zh) 2016-08-03
JPWO2010147032A1 (ja) 2012-12-06
WO2010147032A1 (ja) 2010-12-23
JP5406295B2 (ja) 2014-02-05
US20120087460A1 (en) 2012-04-12
EP2445011A4 (en) 2013-07-24
RU2012101613A (ru) 2013-07-27
EP2445011B1 (en) 2018-01-10
CN102804388A (zh) 2012-11-28
EP2445011A1 (en) 2012-04-25
US8921857B2 (en) 2014-12-30

Similar Documents

Publication Publication Date Title
BRPI1012070A2 (pt) "dispositivo semicondutor"
DE112009000253B8 (de) Halbleitervorrichtung
DE602008000468D1 (de) Halbleiterbauelement
DE602008002784D1 (de) Halbleiterbauelement
HK1217138A1 (zh) 半導體器件
DE602007013318D1 (de) Halbleiterbauelement
DK2249392T3 (da) Omvendt ledende halvlederenhed
HK1195667A1 (zh) 半導體器件
TWI372466B (en) Semiconductor device
DE602007013972D1 (de) Halbleiterbauelement
EP2259326A4 (en) SEMICONDUCTOR DEVICE
EP2280416A4 (en) SEMICONDUCTOR COMPONENT
DE602007002105D1 (de) Halbleiterbauelement
EP2237327A4 (en) SEMICONDUCTOR DEVICE HOUSING
EP2109892A4 (en) SEMICONDUCTOR DEVICE
EP2061075A4 (en) SEMICONDUCTOR DEVICE
EP2325899A4 (en) SEMICONDUCTOR DEVICE
BRPI0820225A2 (pt) Dispositivo semicondutor e dispositivo de monitor
EP2264756A4 (en) SEMICONDUCTOR COMPONENT
EP2242107A4 (en) SEMICONDUCTOR COMPONENT
DE112008003200A5 (de) Strahlungsemittierender Halbleiterkörper
EP2139036A4 (en) SEMICONDUCTOR DEVICE
EP2320458A4 (en) SEMICONDUCTOR DEVICE
DE602008004858D1 (de) Halbleiterpaket
DK2161745T3 (da) Stakkede arrangementer indeholdende halvlederindretninger

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2476 DE 19-06-2018 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.

B350 Update of information on the portal [chapter 15.35 patent gazette]