AU2001239776A1 - Silicon wafer manufacturing system and method - Google Patents

Silicon wafer manufacturing system and method

Info

Publication number
AU2001239776A1
AU2001239776A1 AU2001239776A AU3977601A AU2001239776A1 AU 2001239776 A1 AU2001239776 A1 AU 2001239776A1 AU 2001239776 A AU2001239776 A AU 2001239776A AU 3977601 A AU3977601 A AU 3977601A AU 2001239776 A1 AU2001239776 A1 AU 2001239776A1
Authority
AU
Australia
Prior art keywords
silicon wafer
manufacturing system
wafer manufacturing
silicon
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001239776A
Inventor
Kris Madeyski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intergen Co
Original Assignee
Intergen Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intergen Co filed Critical Intergen Co
Publication of AU2001239776A1 publication Critical patent/AU2001239776A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
AU2001239776A 2000-03-09 2001-03-01 Silicon wafer manufacturing system and method Abandoned AU2001239776A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/521,926 US6482661B1 (en) 2000-03-09 2000-03-09 Method of tracking wafers from ingot
US09521926 2000-03-09
PCT/US2001/004936 WO2001066361A1 (en) 2000-03-09 2001-03-01 Silicon wafer manufacturing system and method

Publications (1)

Publication Number Publication Date
AU2001239776A1 true AU2001239776A1 (en) 2001-09-17

Family

ID=24078701

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001239776A Abandoned AU2001239776A1 (en) 2000-03-09 2001-03-01 Silicon wafer manufacturing system and method

Country Status (3)

Country Link
US (1) US6482661B1 (en)
AU (1) AU2001239776A1 (en)
WO (1) WO2001066361A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4071476B2 (en) * 2001-03-21 2008-04-02 株式会社東芝 Semiconductor wafer and method for manufacturing semiconductor wafer
US7192791B2 (en) * 2003-06-19 2007-03-20 Brooks Automation, Inc. Semiconductor wafer having an edge based identification feature
US8034643B2 (en) * 2003-09-19 2011-10-11 Tinggi Technologies Private Limited Method for fabrication of a semiconductor device
US6797585B1 (en) * 2003-10-07 2004-09-28 Lsi Logic Corporation Nonintrusive wafer marking
NO20040756L (en) 2004-02-20 2005-08-22 Renewable Energy Corp Method and system for establishing compliance and traceability between wafers and solar cells
US20070011883A1 (en) * 2005-07-06 2007-01-18 Chang Ming Y Mark having identifying device
US8577119B2 (en) * 2006-02-24 2013-11-05 Hitachi High-Technologies Corporation Wafer surface observing method and apparatus
US20080156780A1 (en) * 2006-12-29 2008-07-03 Sergei Voronov Substrate markings
CN101785107B (en) 2007-06-13 2012-07-04 楷能洁有限公司 Method for marking wafers
JP2009064801A (en) * 2007-09-04 2009-03-26 Disco Abrasive Syst Ltd Wafer
DE102010010886A1 (en) * 2010-03-10 2011-09-15 Siltronic Ag Process for processing a semiconductor wafer
JP2012049285A (en) 2010-08-26 2012-03-08 Shin Etsu Chem Co Ltd Substrate for solar cell and the solar cell
DE102010060695B4 (en) * 2010-11-22 2015-10-08 Hanwha Q.CELLS GmbH Method for marking semiconductor wafers
DE102010060908A1 (en) * 2010-11-30 2012-05-31 Q-Cells Se Method for marking semiconductor wafer used in manufacturing process of solar cell, involves printing information including process parameters in edge of wafer
FR3009380B1 (en) * 2013-08-02 2015-07-31 Commissariat Energie Atomique PROCESS FOR LOCATING A PLATELET IN ITS INGOT

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05121521A (en) * 1991-10-29 1993-05-18 Komatsu Electron Metals Co Ltd Apparatus and method for manufacture of semiconductor wafer
US5876819A (en) * 1995-02-17 1999-03-02 Mitsubishi Denki Kabushiki Kaisha Crystal orientation detectable semiconductor substrate, and methods of manufacturing and using the same
JP2943673B2 (en) * 1995-10-31 1999-08-30 日本電気株式会社 Apparatus and method for manufacturing semiconductor substrate
US6024814A (en) * 1995-11-30 2000-02-15 Nippei Toyama Corporation Method for processing ingots
JP3213563B2 (en) * 1997-03-11 2001-10-02 株式会社スーパーシリコン研究所 Manufacturing method of notchless wafer
JPH10256105A (en) * 1997-03-11 1998-09-25 Super Silicon Kenkyusho:Kk Wafer with laser mark
US6109529A (en) * 1997-05-06 2000-08-29 Nelson, Jr.; George N. Bar code identification and record assembly
US6112738A (en) * 1999-04-02 2000-09-05 Memc Electronics Materials, Inc. Method of slicing silicon wafers for laser marking

Also Published As

Publication number Publication date
US6482661B1 (en) 2002-11-19
WO2001066361A1 (en) 2001-09-13

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