AU2001257584A1 - Wafer preparation systems and methods for preparing wafers - Google Patents

Wafer preparation systems and methods for preparing wafers

Info

Publication number
AU2001257584A1
AU2001257584A1 AU2001257584A AU5758401A AU2001257584A1 AU 2001257584 A1 AU2001257584 A1 AU 2001257584A1 AU 2001257584 A AU2001257584 A AU 2001257584A AU 5758401 A AU5758401 A AU 5758401A AU 2001257584 A1 AU2001257584 A1 AU 2001257584A1
Authority
AU
Australia
Prior art keywords
methods
preparation systems
wafer preparation
preparing wafers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001257584A
Inventor
David T. Frost
Oliver David Jones
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001257584A1 publication Critical patent/AU2001257584A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/906—Cleaning of wafer as interim step

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU2001257584A 2000-03-31 2001-03-22 Wafer preparation systems and methods for preparing wafers Abandoned AU2001257584A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09540421 2000-03-31
US09/540,421 US6482678B1 (en) 2000-03-31 2000-03-31 Wafer preparation systems and methods for preparing wafers
PCT/US2001/040362 WO2001078118A1 (en) 2000-03-31 2001-03-22 Wafer preparation systems and methods for preparing wafers

Publications (1)

Publication Number Publication Date
AU2001257584A1 true AU2001257584A1 (en) 2001-10-23

Family

ID=24155382

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001257584A Abandoned AU2001257584A1 (en) 2000-03-31 2001-03-22 Wafer preparation systems and methods for preparing wafers

Country Status (9)

Country Link
US (1) US6482678B1 (en)
EP (1) EP1269523B1 (en)
JP (1) JP4731785B2 (en)
KR (1) KR100779443B1 (en)
CN (1) CN1205647C (en)
AU (1) AU2001257584A1 (en)
DE (1) DE60128338T2 (en)
TW (1) TW494452B (en)
WO (1) WO2001078118A1 (en)

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Publication number Priority date Publication date Assignee Title
US6949411B1 (en) * 2001-12-27 2005-09-27 Lam Research Corporation Method for post-etch and strip residue removal on coral films
US20040200409A1 (en) * 2002-12-16 2004-10-14 Applied Materials, Inc. Scrubber with integrated vertical marangoni drying
WO2005009633A1 (en) * 2003-07-22 2005-02-03 Arizona Board Of Regents System and method of dry contract cleaning for removing particles from semiconductor wafers
CN102354675A (en) * 2011-11-02 2012-02-15 上海宏力半导体制造有限公司 Vertical processing device and method of wafer
CN102768974B (en) * 2012-07-23 2014-11-26 清华大学 Wafer cleaning equipment
WO2014033055A1 (en) 2012-08-27 2014-03-06 Aktiebolaget Electrolux Robot positioning system
TWI478264B (en) * 2013-02-25 2015-03-21 Grand Plastic Technology Corp Multi-functional substrate processing apparatus
JP6198234B2 (en) 2013-04-15 2017-09-20 アクティエボラゲット エレクトロラックス Robot vacuum cleaner with protruding side brush
CN110448222A (en) 2013-04-15 2019-11-15 伊莱克斯公司 Robotic vacuum cleaner
WO2015090405A1 (en) 2013-12-19 2015-06-25 Aktiebolaget Electrolux Sensing climb of obstacle of a robotic cleaning device
US9811089B2 (en) 2013-12-19 2017-11-07 Aktiebolaget Electrolux Robotic cleaning device with perimeter recording function
WO2015090398A1 (en) 2013-12-19 2015-06-25 Aktiebolaget Electrolux Robotic vacuum cleaner with side brush moving in spiral pattern
US10209080B2 (en) 2013-12-19 2019-02-19 Aktiebolaget Electrolux Robotic cleaning device
WO2015090404A1 (en) 2013-12-19 2015-06-25 Aktiebolaget Electrolux Prioritizing cleaning areas
CN105744872B (en) 2013-12-19 2020-01-14 伊莱克斯公司 Adaptive speed control of rotating side brushes
WO2015090399A1 (en) 2013-12-19 2015-06-25 Aktiebolaget Electrolux Robotic cleaning device and method for landmark recognition
US10231591B2 (en) 2013-12-20 2019-03-19 Aktiebolaget Electrolux Dust container
KR102325130B1 (en) 2014-07-10 2021-11-12 에이비 엘렉트로룩스 Method for detecting a measurement error in a robotic cleaning device
KR102271782B1 (en) 2014-09-08 2021-06-30 에이비 엘렉트로룩스 Robotic vacuum cleaner
EP3190939B1 (en) 2014-09-08 2021-07-21 Aktiebolaget Electrolux Robotic vacuum cleaner
EP3230814B1 (en) 2014-12-10 2021-02-17 Aktiebolaget Electrolux Using laser sensor for floor type detection
EP3229983B1 (en) 2014-12-12 2019-02-20 Aktiebolaget Electrolux Side brush and robotic cleaner
US10678251B2 (en) 2014-12-16 2020-06-09 Aktiebolaget Electrolux Cleaning method for a robotic cleaning device
EP3234714B1 (en) 2014-12-16 2021-05-12 Aktiebolaget Electrolux Experience-based roadmap for a robotic cleaning device
KR102343513B1 (en) 2015-04-17 2021-12-28 에이비 엘렉트로룩스 Robot cleaning device and control method of robot cleaning device
KR102445064B1 (en) 2015-09-03 2022-09-19 에이비 엘렉트로룩스 system of robot cleaning device
CN108603935A (en) 2016-03-15 2018-09-28 伊莱克斯公司 The method that robotic cleaning device and robotic cleaning device carry out cliff detection
WO2017194102A1 (en) 2016-05-11 2017-11-16 Aktiebolaget Electrolux Robotic cleaning device
JP7243967B2 (en) 2017-06-02 2023-03-22 アクチエボラゲット エレクトロルックス Method for Detecting Level Differences on a Surface in Front of a Robotic Cleaning Device
WO2019063066A1 (en) 2017-09-26 2019-04-04 Aktiebolaget Electrolux Controlling movement of a robotic cleaning device
CN111009482B (en) * 2019-12-18 2022-06-07 福建北电新材料科技有限公司 Wafer cleaning device and wafer cleaning equipment
CN114937618A (en) * 2022-04-22 2022-08-23 浙江富芯微电子科技有限公司 Double-sided scrubber and method for cleaning silicon carbide wafer surface

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4722752A (en) 1986-06-16 1988-02-02 Robert F. Orr Apparatus and method for rinsing and drying silicon wafers
JP3493676B2 (en) 1992-11-25 2004-02-03 ソニー株式会社 Method and apparatus for cleaning semiconductor substrate
JP3347814B2 (en) * 1993-05-17 2002-11-20 大日本スクリーン製造株式会社 Substrate cleaning / drying processing method and processing apparatus
TW363903B (en) * 1996-03-11 1999-07-11 Memc Electronic Materials Spa Apparatus for use in automatically cleaning semiconductor wafers and methods for drying a semiconductor wafer in the automatic drying machine
US6230753B1 (en) * 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
JPH10189530A (en) * 1996-12-20 1998-07-21 Dainippon Screen Mfg Co Ltd Rotary substrate drier
JPH10189528A (en) 1996-12-27 1998-07-21 Dainippon Screen Mfg Co Ltd Apparatus and method for cleaning of substrate
JP3643218B2 (en) * 1997-08-13 2005-04-27 大日本スクリーン製造株式会社 Substrate processing method, processing apparatus therefor, and computer-readable recording medium on which processing program is recorded
US5916374A (en) 1998-02-09 1999-06-29 International Business Machines Corporation Optimized in-line mask cleaning system
JP3980210B2 (en) * 1998-02-27 2007-09-26 株式会社東芝 Wafer drying apparatus and wafer drying method
US5913981A (en) * 1998-03-05 1999-06-22 Micron Technology, Inc. Method of rinsing and drying semiconductor wafers in a chamber with a moveable side wall

Also Published As

Publication number Publication date
TW494452B (en) 2002-07-11
JP4731785B2 (en) 2011-07-27
KR100779443B1 (en) 2007-11-26
CN1439168A (en) 2003-08-27
US6482678B1 (en) 2002-11-19
JP2003530714A (en) 2003-10-14
EP1269523B1 (en) 2007-05-09
DE60128338D1 (en) 2007-06-21
WO2001078118A1 (en) 2001-10-18
CN1205647C (en) 2005-06-08
KR20020087439A (en) 2002-11-22
DE60128338T2 (en) 2008-01-10
EP1269523A1 (en) 2003-01-02

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