AU2001234169A1 - Group iii nitride compound semiconductor and method for manufacturing the same - Google Patents

Group iii nitride compound semiconductor and method for manufacturing the same

Info

Publication number
AU2001234169A1
AU2001234169A1 AU2001234169A AU3416901A AU2001234169A1 AU 2001234169 A1 AU2001234169 A1 AU 2001234169A1 AU 2001234169 A AU2001234169 A AU 2001234169A AU 3416901 A AU3416901 A AU 3416901A AU 2001234169 A1 AU2001234169 A1 AU 2001234169A1
Authority
AU
Australia
Prior art keywords
manufacturing
same
compound semiconductor
group iii
iii nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234169A
Inventor
Yuta Tezen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Publication of AU2001234169A1 publication Critical patent/AU2001234169A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H01L33/007Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/0242Crystalline insulating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639Preparation of substrate for selective deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02647Lateral overgrowth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02647Lateral overgrowth
    • H01L21/0265Pendeoepitaxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/025Physical imperfections, e.g. particular concentration or distribution of impurities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00Special growth methods for semiconductor lasers
    • H01S2304/12Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0206Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/0213Sapphire, quartz or diamond based substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • H01S5/32341Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
AU2001234169A 2000-03-14 2001-02-23 Group iii nitride compound semiconductor and method for manufacturing the same Abandoned AU2001234169A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-71350 2000-03-14
JP2000071350A JP2001267242A (en) 2000-03-14 2000-03-14 Group iii nitride-based compound semiconductor and method of manufacturing the same
PCT/JP2001/001396 WO2001069662A1 (en) 2000-03-14 2001-02-23 Group iii nitride compound semiconductor and method for manufacturing the same

Publications (1)

Publication Number Publication Date
AU2001234169A1 true AU2001234169A1 (en) 2001-09-24

Family

ID=18589947

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234169A Abandoned AU2001234169A1 (en) 2000-03-14 2001-02-23 Group iii nitride compound semiconductor and method for manufacturing the same

Country Status (7)

Country Link
US (2) US6967122B2 (en)
EP (1) EP1265272A4 (en)
JP (1) JP2001267242A (en)
KR (2) KR100623564B1 (en)
CN (2) CN1274008C (en)
AU (1) AU2001234169A1 (en)
WO (1) WO2001069662A1 (en)

Families Citing this family (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002008985A (en) * 2000-06-21 2002-01-11 Nichia Chem Ind Ltd Method of manufacturing nitride semiconductor, and nitride semiconductor substrate
JP3556916B2 (en) * 2000-09-18 2004-08-25 三菱電線工業株式会社 Manufacturing method of semiconductor substrate
JP4092927B2 (en) 2002-02-28 2008-05-28 豊田合成株式会社 Group III nitride compound semiconductor, group III nitride compound semiconductor element, and method for manufacturing group III nitride compound semiconductor substrate
US7008839B2 (en) 2002-03-08 2006-03-07 Matsushita Electric Industrial Co., Ltd. Method for manufacturing semiconductor thin film
KR100461238B1 (en) * 2002-03-09 2004-12-14 엘지전자 주식회사 Method for forming GaN epitaxy layer
JP3968566B2 (en) * 2002-03-26 2007-08-29 日立電線株式会社 Nitride semiconductor crystal manufacturing method, nitride semiconductor wafer, and nitride semiconductor device
US8294172B2 (en) 2002-04-09 2012-10-23 Lg Electronics Inc. Method of fabricating vertical devices using a metal support film
US20030189215A1 (en) 2002-04-09 2003-10-09 Jong-Lam Lee Method of fabricating vertical structure leds
US6841802B2 (en) * 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode
JP2004153089A (en) 2002-10-31 2004-05-27 Toyoda Gosei Co Ltd Group iii nitride-based compound semiconductor light emitting element and its manufacturing method
JP2004153090A (en) 2002-10-31 2004-05-27 Toyoda Gosei Co Ltd Group iii nitride-based compound semiconductor light emitting element and its manufacturing method
JP4211358B2 (en) * 2002-11-01 2009-01-21 日亜化学工業株式会社 Nitride semiconductor, nitride semiconductor device and manufacturing method thereof
US7524691B2 (en) * 2003-01-20 2009-04-28 Panasonic Corporation Method of manufacturing group III nitride substrate
KR100504180B1 (en) * 2003-01-29 2005-07-28 엘지전자 주식회사 crystal growth method of nitride compound semiconductor
US7276423B2 (en) * 2003-12-05 2007-10-02 International Rectifier Corporation III-nitride device and method with variable epitaxial growth direction
JP4540347B2 (en) * 2004-01-05 2010-09-08 シャープ株式会社 Nitride semiconductor laser device and manufacturing method thereof
EP1571241A1 (en) * 2004-03-01 2005-09-07 S.O.I.T.E.C. Silicon on Insulator Technologies Method of manufacturing a wafer
US9524869B2 (en) 2004-03-11 2016-12-20 Epistar Corporation Nitride-based semiconductor light-emitting device
US8562738B2 (en) 2004-03-11 2013-10-22 Epistar Corporation Nitride-based light-emitting device
US7928424B2 (en) * 2004-03-11 2011-04-19 Epistar Corporation Nitride-based light-emitting device
US7157297B2 (en) * 2004-05-10 2007-01-02 Sharp Kabushiki Kaisha Method for fabrication of semiconductor device
JP2005322786A (en) * 2004-05-10 2005-11-17 Sharp Corp Nitride semiconductor element and its manufacturing method
JP4651312B2 (en) * 2004-06-10 2011-03-16 シャープ株式会社 Manufacturing method of semiconductor device
US20060017064A1 (en) * 2004-07-26 2006-01-26 Saxler Adam W Nitride-based transistors having laterally grown active region and methods of fabricating same
KR100638609B1 (en) 2004-08-04 2006-10-26 삼성전기주식회사 Growth method of nitride semiconductor single crystal and manufacturation method of nitride semiconductor device by using the same
CN100365767C (en) * 2004-09-17 2008-01-30 同济大学 Substrate processing method for improving gallium nitride base material epitaxial layer quality
US7633097B2 (en) * 2004-09-23 2009-12-15 Philips Lumileds Lighting Company, Llc Growth of III-nitride light emitting devices on textured substrates
KR100580751B1 (en) * 2004-12-23 2006-05-15 엘지이노텍 주식회사 Nitride semiconductor led and fabrication method thereof
CN100435360C (en) * 2004-12-27 2008-11-19 北京大学 Method for preparing LED chip with 2D natural scattered faces for outputting light
US10374120B2 (en) * 2005-02-18 2019-08-06 Koninklijke Philips N.V. High efficiency solar cells utilizing wafer bonding and layer transfer to integrate non-lattice matched materials
US20080035052A1 (en) * 2005-02-23 2008-02-14 Genesis Photonics Inc. Method for manufacturing a semiconductor substrate
CN1697205A (en) * 2005-04-15 2005-11-16 南昌大学 Method for preparing film of indium-gallium-aluminum-nitrogen on silicon substrate and light emitting device
US8101498B2 (en) 2005-04-21 2012-01-24 Pinnington Thomas Henry Bonded intermediate substrate and method of making same
US20060270201A1 (en) * 2005-05-13 2006-11-30 Chua Soo J Nano-air-bridged lateral overgrowth of GaN semiconductor layer
CN100372137C (en) * 2005-05-27 2008-02-27 晶能光电(江西)有限公司 Indium gallium aluminum nitrogen luminous device with up-down cathode strucure and manufacturing method thereof
JP5015440B2 (en) * 2005-09-29 2012-08-29 株式会社デンソー Manufacturing method of semiconductor substrate
US20090233414A1 (en) * 2005-10-20 2009-09-17 Shah Pankaj B Method for fabricating group III-nitride high electron mobility transistors (HEMTs)
CN100474642C (en) * 2005-10-27 2009-04-01 晶能光电(江西)有限公司 Indium gallium aluminium nitrogen semi-conductor luminous element containing metallic chromium substrate and manufacturing method thereof
JP2007161525A (en) * 2005-12-14 2007-06-28 Univ Of Tokushima Base material for semiconductor device and method of manufacturing the base material
JP5187610B2 (en) * 2006-03-29 2013-04-24 スタンレー電気株式会社 Nitride semiconductor wafer or nitride semiconductor device and manufacturing method thereof
JP4637781B2 (en) * 2006-03-31 2011-02-23 昭和電工株式会社 GaN-based semiconductor light emitting device manufacturing method
US20070243703A1 (en) * 2006-04-14 2007-10-18 Aonex Technololgies, Inc. Processes and structures for epitaxial growth on laminate substrates
JP5180189B2 (en) * 2006-04-25 2013-04-10 ナショナル ユニヴァーシティー オブ シンガポール Method of zinc oxide film growth on epitaxial laterally abnormally grown gallium nitride templates
JP5076656B2 (en) * 2006-06-19 2012-11-21 日亜化学工業株式会社 Nitride semiconductor laser device
TW200845135A (en) * 2006-12-12 2008-11-16 Univ California Crystal growth of M-plane and semi-polar planes of (Al, In, Ga, B)N on various substrates
US7663148B2 (en) * 2006-12-22 2010-02-16 Philips Lumileds Lighting Company, Llc III-nitride light emitting device with reduced strain light emitting layer
US20080149946A1 (en) * 2006-12-22 2008-06-26 Philips Lumileds Lighting Company, Llc Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light
KR101008287B1 (en) * 2006-12-30 2011-01-13 주식회사 에피밸리 Iii-nitride semiconductor light emitting device
US7732301B1 (en) 2007-04-20 2010-06-08 Pinnington Thomas Henry Bonded intermediate substrate and method of making same
KR101283261B1 (en) * 2007-05-21 2013-07-11 엘지이노텍 주식회사 Light emitting device and mehtod for manufacturing the same
US20090278233A1 (en) * 2007-07-26 2009-11-12 Pinnington Thomas Henry Bonded intermediate substrate and method of making same
KR101459754B1 (en) * 2007-09-06 2014-11-13 엘지이노텍 주식회사 Semiconductor light emitting device and fabrication method thereof
TW200929602A (en) * 2007-12-28 2009-07-01 Advanced Optoelectronic Tech Light-emitting device of III-nitride based semiconductor and manufacturing method thereof
JP5353113B2 (en) * 2008-01-29 2013-11-27 豊田合成株式会社 Method for producing group III nitride compound semiconductor
JP5167974B2 (en) * 2008-06-16 2013-03-21 豊田合成株式会社 Group III nitride compound semiconductor light emitting device and method of manufacturing the same
TWI413279B (en) * 2008-06-20 2013-10-21 Toyoda Gosei Kk Group iii nitride semiconductor light emitting device, process for producing the same, and lamp
JP2010040867A (en) * 2008-08-06 2010-02-18 Showa Denko Kk Group iii nitride semiconductor laminated structure and method of manufacturing same
US8803189B2 (en) * 2008-08-11 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. III-V compound semiconductor epitaxy using lateral overgrowth
CN101853808B (en) 2008-08-11 2014-01-29 台湾积体电路制造股份有限公司 Method of forming a circuit structure
JP5293592B2 (en) * 2008-12-26 2013-09-18 豊田合成株式会社 Group III nitride semiconductor manufacturing method and template substrate
JP5293591B2 (en) * 2008-12-26 2013-09-18 豊田合成株式会社 Group III nitride semiconductor manufacturing method and template substrate
US8680581B2 (en) 2008-12-26 2014-03-25 Toyoda Gosei Co., Ltd. Method for producing group III nitride semiconductor and template substrate
CN101840971B (en) * 2009-03-17 2012-09-05 展晶科技(深圳)有限公司 Light-emitting diode and manufacturing method thereof
EP2439316A4 (en) * 2009-06-01 2014-01-29 Mitsubishi Chem Corp Nitride semiconductor crystal and method for manufacturing same
JP2012530027A (en) * 2009-06-15 2012-11-29 コリア エレクトロニクス テクノロジ インスティチュート Heterogeneous substrate, nitride semiconductor device using the same, and manufacturing method thereof
CN101719465B (en) * 2009-11-27 2015-10-21 晶能光电(江西)有限公司 The manufacture method of silicon substrate GaN-based semiconductor material
JP5667360B2 (en) * 2009-12-21 2015-02-12 住友化学株式会社 Semiconductor substrate, electronic device, and method for manufacturing semiconductor substrate
KR20120103683A (en) 2009-12-25 2012-09-19 소코 가가쿠 가부시키가이샤 Template for epitaxial growth and process for producing same
JP2011146589A (en) * 2010-01-15 2011-07-28 Stanley Electric Co Ltd Semiconductor light-emitting element and method of manufacturing the same
EP2384816B1 (en) * 2010-05-04 2018-04-04 IMEC vzw Method of manufacturing a nanochannel device
US8659031B2 (en) * 2010-06-07 2014-02-25 Soko Kagaku Co., Ltd. Method of producing template for epitaxial growth and nitride semiconductor device
TW201145564A (en) * 2010-06-14 2011-12-16 Tera Xtal Technology Corp Method of making light emitting diodes
CN102437260B (en) * 2010-09-29 2016-02-10 展晶科技(深圳)有限公司 Gallium nitride based ultraviolet light-emitting diode and manufacture method thereof
TWI419367B (en) * 2010-12-02 2013-12-11 Epistar Corp Optoelectronic device and method for manufacturing the same
TWI495155B (en) * 2010-12-02 2015-08-01 Epistar Corp Optoelectronic device and method for manufacturing the same
TWI458129B (en) * 2010-12-21 2014-10-21 Lextar Electronics Corp Light emitting diode chip structure and fabrication method thereof
CN102651438B (en) * 2011-02-28 2015-05-13 比亚迪股份有限公司 Substrate, preparation method thereof and chip with substrate
JP2012246216A (en) * 2011-05-25 2012-12-13 Agency For Science Technology & Research Method for forming nanostructure on substrate and use of the same
KR20130035024A (en) 2011-09-29 2013-04-08 삼성전자주식회사 High electron mobility transistor and method of manufacturing the same
CN102339919A (en) * 2011-10-21 2012-02-01 西安重装渭南光电科技有限公司 Epitaxial structure and process for LEDs (light-emitting diodes)
KR20130047813A (en) * 2011-10-31 2013-05-09 삼성전자주식회사 Semiconductor device comprising iii-v group compound semiconductor layer and method of manufacturing the same
CN103247725B (en) * 2012-02-08 2016-01-20 郭磊 A kind of semiconductor structure and forming method thereof
CN103247517B (en) * 2012-02-08 2016-06-01 郭磊 A kind of semiconductor structure and forming method thereof
KR101381988B1 (en) * 2012-06-21 2014-04-07 서울바이오시스 주식회사 Vertical light emitting diode and method of fabricating the same
KR101878754B1 (en) 2012-09-13 2018-07-17 삼성전자주식회사 Method of manufacturing large area gallium nitride substrate
US8927398B2 (en) * 2013-01-04 2015-01-06 International Business Machines Corporation Group III nitrides on nanopatterned substrates
KR101603207B1 (en) 2013-01-29 2016-03-14 삼성전자주식회사 Manufacturing methdo of nano sturucture semiconductor light emitting device
TWM459528U (en) * 2013-02-26 2013-08-11 Phecda Technology Co Ltd Substrate for light emitting device and light emitting device
TWM460410U (en) * 2013-02-26 2013-08-21 Phecda Technology Co Ltd Light-emitting element substrate and light emitting element
US20150325741A1 (en) * 2013-08-21 2015-11-12 Sharp Kabushiki Kaisha Nitride semiconductor light emitting device
FR3010228B1 (en) 2013-08-30 2016-12-30 St Microelectronics Tours Sas PROCESS FOR TREATING A GALLIUM NITRIDE LAYER HAVING DISLOCATIONS
US9064699B2 (en) 2013-09-30 2015-06-23 Samsung Electronics Co., Ltd. Methods of forming semiconductor patterns including reduced dislocation defects and devices formed using such methods
US9640422B2 (en) * 2014-01-23 2017-05-02 Intel Corporation III-N devices in Si trenches
WO2015163908A1 (en) * 2014-04-25 2015-10-29 The Texas State University-San Marcos Material selective regrowth structure and method
JP6555261B2 (en) * 2014-06-20 2019-08-07 ソニー株式会社 Light emitting device and manufacturing method thereof
JP5869064B2 (en) * 2014-07-17 2016-02-24 創光科学株式会社 Epitaxial growth template and manufacturing method thereof
KR101645574B1 (en) * 2014-08-19 2016-08-16 주식회사 소프트에피 Method of growing iii-nitride semiconductor layer
CN104393167A (en) * 2014-09-25 2015-03-04 中国科学院物理研究所 Hall strip micro device
CN106018964B (en) * 2016-05-16 2019-02-12 云南瑞博检测技术股份有限公司 A kind of electrical parameter detection platform for thin-film material and micro-nano structure
JP6686876B2 (en) * 2016-12-28 2020-04-22 豊田合成株式会社 Semiconductor structure and semiconductor device
TWI757331B (en) * 2017-08-31 2022-03-11 晶元光電股份有限公司 Semiconductor device and manufacturing method thereof
US20190198709A1 (en) 2017-12-22 2019-06-27 Lumileds Llc Iii-nitride multi-color on wafer micro-led enabled by tunnel junctions
JP6998798B2 (en) * 2018-03-02 2022-01-18 株式会社サイオクス GaN laminate and its manufacturing method
CN110137323A (en) * 2019-05-29 2019-08-16 福建兆元光电有限公司 LED chip and manufacturing method with AlN buffer layer
US11211527B2 (en) 2019-12-19 2021-12-28 Lumileds Llc Light emitting diode (LED) devices with high density textures
US11264530B2 (en) * 2019-12-19 2022-03-01 Lumileds Llc Light emitting diode (LED) devices with nucleation layer
US11581450B2 (en) * 2020-06-11 2023-02-14 Globalfoundries U.S. Inc. Photodiode and/or pin diode structures with one or more vertical surfaces
CN114335173A (en) * 2020-10-12 2022-04-12 联华电子股份有限公司 Semiconductor element and manufacturing method thereof
CN117438515B (en) * 2023-12-21 2024-03-29 江西乾照半导体科技有限公司 LED chip roughening method and LED chip

Family Cites Families (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143944B2 (en) 1972-03-15 1976-11-25
JPS49149679U (en) 1973-04-27 1974-12-25
JPS51137393A (en) 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for semiconductor light emitting device
JPS5534646A (en) 1978-08-30 1980-03-11 Sumitomo Metal Ind Ltd Heating method for furnace body in blowing-in of shaft furnace
JPS57115849A (en) 1981-01-12 1982-07-19 Fujitsu Ltd Manufacture of substrate for semiconductor device
JPS5833882A (en) 1981-08-21 1983-02-28 Mitsubishi Electric Corp Manufacture of light emitting diode
JPH01316459A (en) 1988-06-15 1989-12-21 Murata Mfg Co Ltd In-line sputtering device and method
JP2768988B2 (en) * 1989-08-17 1998-06-25 三菱電機株式会社 End face coating method
JPH06105797B2 (en) 1989-10-19 1994-12-21 昭和電工株式会社 Semiconductor substrate and manufacturing method thereof
JP2623464B2 (en) 1990-04-27 1997-06-25 豊田合成株式会社 Gallium nitride based compound semiconductor light emitting device
JPH0484418A (en) 1990-07-27 1992-03-17 Nec Corp Method of heteroepitaxial development of iii-v group compound semiconductor for different types of substrates
JPH04303920A (en) 1991-03-29 1992-10-27 Nec Corp Insulating film/iii-v compound semiconductor stacked structure on group iv substrate
JP2954743B2 (en) 1991-05-30 1999-09-27 京セラ株式会社 Method for manufacturing semiconductor light emitting device
JPH05110206A (en) 1991-10-16 1993-04-30 Kubota Corp Method and apparatus for producing light emitting semiconductor element
JP3352712B2 (en) 1991-12-18 2002-12-03 浩 天野 Gallium nitride based semiconductor device and method of manufacturing the same
JPH05283744A (en) 1991-12-20 1993-10-29 Toshiba Corp Semiconductor element
JP2751963B2 (en) 1992-06-10 1998-05-18 日亜化学工業株式会社 Method for growing indium gallium nitride semiconductor
JPH07249830A (en) 1994-03-10 1995-09-26 Hitachi Ltd Manufacture of semiconductor light-emitting element
JPH07273367A (en) 1994-04-01 1995-10-20 Mitsubishi Cable Ind Ltd Manufacture of semiconductor substrate and light-emitting device
JP3974667B2 (en) 1994-08-22 2007-09-12 ローム株式会社 Manufacturing method of semiconductor light emitting device
JPH0864791A (en) 1994-08-23 1996-03-08 Matsushita Electric Ind Co Ltd Epitaxial growth method
JP3326545B2 (en) 1994-09-30 2002-09-24 ローム株式会社 Semiconductor light emitting device
JPH08222812A (en) * 1995-02-17 1996-08-30 Matsushita Electric Ind Co Ltd Method for crystal growth of gallium nitride based compound semiconductor
JPH08274411A (en) 1995-03-31 1996-10-18 Hitachi Ltd Semiconductor laser
WO1997011518A1 (en) 1995-09-18 1997-03-27 Hitachi, Ltd. Semiconductor material, method of producing the semiconductor material, and semiconductor device
JPH0992882A (en) * 1995-09-25 1997-04-04 Mitsubishi Electric Corp Light emitting semiconductor device and manufacturing method thereof
JP3396356B2 (en) 1995-12-11 2003-04-14 三菱電機株式会社 Semiconductor device and method of manufacturing the same
US5798536A (en) * 1996-01-25 1998-08-25 Rohm Co., Ltd. Light-emitting semiconductor device and method for manufacturing the same
JPH09307193A (en) 1996-05-20 1997-11-28 Nichia Chem Ind Ltd Nitride semiconductor laser element and its manufacture
JP3139445B2 (en) 1997-03-13 2001-02-26 日本電気株式会社 GaN-based semiconductor growth method and GaN-based semiconductor film
JPH11191657A (en) 1997-04-11 1999-07-13 Nichia Chem Ind Ltd Growing method of nitride semiconductor and nitride semiconductor device
US6153010A (en) * 1997-04-11 2000-11-28 Nichia Chemical Industries Ltd. Method of growing nitride semiconductors, nitride semiconductor substrate and nitride semiconductor device
DE19715572A1 (en) * 1997-04-15 1998-10-22 Telefunken Microelectron Selective epitaxy of III-V nitride semiconductor layers
JPH10321954A (en) 1997-05-15 1998-12-04 Fuji Electric Co Ltd Group iii nitride semiconductor element and manufacture thereof
JP3551751B2 (en) 1997-05-16 2004-08-11 日亜化学工業株式会社 Method for growing nitride semiconductor
EP1007768A4 (en) * 1997-07-03 2003-07-16 Cbl Technologies Elimination of thermal mismatch defects in epitaxially deposited films through the separation of the substrate from the film at the growth temperature
JP3189877B2 (en) 1997-07-11 2001-07-16 日本電気株式会社 Crystal growth method of low dislocation gallium nitride
JPH1143398A (en) 1997-07-22 1999-02-16 Mitsubishi Cable Ind Ltd Substrate for growing gallium nitride-based crystal and use thereof
JP3930161B2 (en) 1997-08-29 2007-06-13 株式会社東芝 Nitride-based semiconductor device, light-emitting device, and manufacturing method thereof
JPH11135770A (en) 1997-09-01 1999-05-21 Sumitomo Chem Co Ltd Iii-v compd. semiconductor, manufacture thereof and semiconductor element
JPH11145519A (en) 1997-09-02 1999-05-28 Toshiba Corp Semiconductor light-emitting element, semiconductor light-emitting device, and image-display device
US6266355B1 (en) * 1997-09-12 2001-07-24 Sdl, Inc. Group III-V nitride laser devices with cladding layers to suppress defects such as cracking
JP3491538B2 (en) 1997-10-09 2004-01-26 日亜化学工業株式会社 Method for growing nitride semiconductor and nitride semiconductor device
JPH11135832A (en) 1997-10-26 1999-05-21 Toyoda Gosei Co Ltd Gallium nitride group compound semiconductor and manufacture therefor
JP3036495B2 (en) * 1997-11-07 2000-04-24 豊田合成株式会社 Method for manufacturing gallium nitride-based compound semiconductor
JP3456413B2 (en) 1997-11-26 2003-10-14 日亜化学工業株式会社 Method for growing nitride semiconductor and nitride semiconductor device
JP3620269B2 (en) 1998-02-27 2005-02-16 豊田合成株式会社 GaN-based semiconductor device manufacturing method
US6051849A (en) * 1998-02-27 2000-04-18 North Carolina State University Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer
JP3839580B2 (en) 1998-03-09 2006-11-01 株式会社リコー Manufacturing method of semiconductor substrate
JPH11274082A (en) 1998-03-24 1999-10-08 Fuji Electric Co Ltd Group iii nitride semiconductor and fabrication thereof, and group iii nitride semiconductor device
US6500257B1 (en) 1998-04-17 2002-12-31 Agilent Technologies, Inc. Epitaxial material grown laterally within a trench and method for producing same
JP3436128B2 (en) 1998-04-28 2003-08-11 日亜化学工業株式会社 Method for growing nitride semiconductor and nitride semiconductor device
JPH11330546A (en) 1998-05-12 1999-11-30 Fuji Electric Co Ltd Iii nitride semiconductor material and its manufacture
JP4390090B2 (en) 1998-05-18 2009-12-24 シャープ株式会社 GaN crystal film manufacturing method
JP3460581B2 (en) 1998-05-28 2003-10-27 日亜化学工業株式会社 Method for growing nitride semiconductor and nitride semiconductor device
US6265289B1 (en) * 1998-06-10 2001-07-24 North Carolina State University Methods of fabricating gallium nitride semiconductor layers by lateral growth from sidewalls into trenches, and gallium nitride semiconductor structures fabricated thereby
JP4352473B2 (en) * 1998-06-26 2009-10-28 ソニー株式会社 Manufacturing method of semiconductor device
US6606335B1 (en) 1998-07-14 2003-08-12 Fujitsu Limited Semiconductor laser, semiconductor device, and their manufacture methods
US6319742B1 (en) * 1998-07-29 2001-11-20 Sanyo Electric Co., Ltd. Method of forming nitride based semiconductor layer
JP3316479B2 (en) 1998-07-29 2002-08-19 三洋電機株式会社 Semiconductor device, semiconductor light emitting device, and method of manufacturing semiconductor device
JP3987660B2 (en) 1998-07-31 2007-10-10 シャープ株式会社 Nitride semiconductor structure, manufacturing method thereof, and light emitting device
US6335546B1 (en) * 1998-07-31 2002-01-01 Sharp Kabushiki Kaisha Nitride semiconductor structure, method for producing a nitride semiconductor structure, and light emitting device
JP2000044121A (en) 1998-08-03 2000-02-15 Murata Mach Ltd Sliver guide creel for spinning machine
JP3201475B2 (en) * 1998-09-14 2001-08-20 松下電器産業株式会社 Semiconductor device and method of manufacturing the same
JP3592553B2 (en) * 1998-10-15 2004-11-24 株式会社東芝 Gallium nitride based semiconductor device
JP2000150959A (en) 1998-11-18 2000-05-30 Hitachi Ltd Gallium nitride compound semiconductor light emitting element
JP2000174393A (en) 1998-12-04 2000-06-23 Fuji Electric Co Ltd Group iii nitride semiconductor, its manufacture and group iii nitride semiconductor device
JP4304750B2 (en) 1998-12-08 2009-07-29 日亜化学工業株式会社 Nitride semiconductor growth method and nitride semiconductor device
JP3659050B2 (en) 1998-12-21 2005-06-15 日亜化学工業株式会社 Nitride semiconductor growth method and nitride semiconductor device
JP2000261106A (en) 1999-01-07 2000-09-22 Matsushita Electric Ind Co Ltd Semiconductor light emitting element, its manufacture and optical disk device
JP3594826B2 (en) * 1999-02-09 2004-12-02 パイオニア株式会社 Nitride semiconductor light emitting device and method of manufacturing the same
JP3770014B2 (en) * 1999-02-09 2006-04-26 日亜化学工業株式会社 Nitride semiconductor device
WO2000055893A1 (en) * 1999-03-17 2000-09-21 Mitsubishi Cable Industries, Ltd. Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
JP4288743B2 (en) 1999-03-24 2009-07-01 日亜化学工業株式会社 Nitride semiconductor growth method
JP4231189B2 (en) 1999-04-14 2009-02-25 パナソニック株式会社 Method for producing group III nitride compound semiconductor substrate
TW464953B (en) 1999-04-14 2001-11-21 Matsushita Electronics Corp Method of manufacturing III nitride base compound semiconductor substrate
JP2001044121A (en) 1999-06-07 2001-02-16 Agilent Technol Inc Epitaxial layer structure and manufacture thereof
JP3786544B2 (en) 1999-06-10 2006-06-14 パイオニア株式会社 Nitride semiconductor device manufacturing method and device manufactured by the method
JP2000357820A (en) * 1999-06-15 2000-12-26 Pioneer Electronic Corp Gallium nitride semiconductor light emitting element and its manufacture
JP3791246B2 (en) * 1999-06-15 2006-06-28 日亜化学工業株式会社 Nitride semiconductor growth method, nitride semiconductor device manufacturing method using the same, and nitride semiconductor laser device manufacturing method
JP4005275B2 (en) * 1999-08-19 2007-11-07 日亜化学工業株式会社 Nitride semiconductor device
JP4274504B2 (en) 1999-09-20 2009-06-10 キヤノン株式会社 Semiconductor thin film structure
JP2001111174A (en) 1999-10-06 2001-04-20 Fuji Photo Film Co Ltd Substrate for semiconductor device and method of fabrication thereof and semiconductor device using that substrate
JP4055304B2 (en) 1999-10-12 2008-03-05 豊田合成株式会社 Method for producing gallium nitride compound semiconductor
JP2001122693A (en) * 1999-10-22 2001-05-08 Nec Corp Ground substrate for crystal growth and method of producing substrate using the same
US6521514B1 (en) * 1999-11-17 2003-02-18 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates
AU2430401A (en) * 1999-12-13 2001-06-18 North Carolina State University Methods of fabricating gallium nitride layers on textured silicon substrates, and gallium nitride semiconductor structures fabricated thereby
JP3518455B2 (en) 1999-12-15 2004-04-12 日亜化学工業株式会社 Method for manufacturing nitride semiconductor substrate
US6380108B1 (en) * 1999-12-21 2002-04-30 North Carolina State University Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on weak posts, and gallium nitride semiconductor structures fabricated thereby
JP2001185493A (en) * 1999-12-24 2001-07-06 Toyoda Gosei Co Ltd Method of manufacturing group iii nitride-based compound semiconductor, and group iii nitride based compound semiconductor device
JP4432180B2 (en) * 1999-12-24 2010-03-17 豊田合成株式会社 Group III nitride compound semiconductor manufacturing method, group III nitride compound semiconductor device, and group III nitride compound semiconductor
US6355497B1 (en) * 2000-01-18 2002-03-12 Xerox Corporation Removable large area, low defect density films for led and laser diode growth
US6403451B1 (en) * 2000-02-09 2002-06-11 Noerh Carolina State University Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts
JP2001313259A (en) * 2000-04-28 2001-11-09 Toyoda Gosei Co Ltd Method for producing iii nitride based compound semiconductor substrate and semiconductor element
JP3988018B2 (en) 2001-01-18 2007-10-10 ソニー株式会社 Crystal film, crystal substrate and semiconductor device

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US20060060866A1 (en) 2006-03-23
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CN1624876A (en) 2005-06-08

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