CN102768974B - Wafer cleaning equipment - Google Patents
Wafer cleaning equipment Download PDFInfo
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- CN102768974B CN102768974B CN201210256981.7A CN201210256981A CN102768974B CN 102768974 B CN102768974 B CN 102768974B CN 201210256981 A CN201210256981 A CN 201210256981A CN 102768974 B CN102768974 B CN 102768974B
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Abstract
The invention discloses wafer cleaning equipment which comprises a frame, a wafer cleaning device, a wafer brushing device, a wafer drying device and a manipulator. The wafer cleaning device is arranged on the frame, the wafer brushing device is arranged on the frame and positioned on the lower side of the wafer cleaning device, the wafer drying device is arranged on the frame and positioned on the lower side of the wafer brushing device, and the manipulator is movably arranged on the frame and used for vertically clamping wafers and transporting the wafers. The wafer cleaning equipment in the embodiment has the advantages of effectiveness in cleaning and the like.
Description
Technical field
The present invention relates to field of semiconductor manufacture, in particular to a kind of wafer cleaning equipment.
Background technology
After CMP technique, need to clean wafer.Existing wafer cleaning equipment can secondary pollution wafer in the time of cleaning wafer.Therefore there is the poor defect of cleaning performance in existing wafer cleaning equipment.
Summary of the invention
The present invention one of is intended to solve the problems of the technologies described above at least to a certain extent or at least provides a kind of useful business to select.For this reason, one object of the present invention is to propose a kind of wafer cleaning equipment with advantages such as cleaning performance are good.
To achieve these goals, according to embodiments of the invention, a kind of wafer cleaning equipment is proposed.Described wafer cleaning equipment comprises: frame; Wafer cleaning device, described wafer cleaning device is located in described frame, described wafer cleaning device comprise have the second container cavity the second body, be located at the second wafer support mechanism in described the second container cavity and be located at the wafer cleaning mechanism on described the second body, the diapire of described the second container cavity is provided with the second notch of the diapire that connects along the vertical direction described the second container cavity for passing through wafer; Wafer brushing device, described wafer brushing device is located in described frame and is positioned at the downstream of described wafer cleaning device, described wafer brushing device comprises having the 3rd body of the 3rd container cavity and be located at the 3rd wafer support mechanism and the wafer scrub body in described the 3rd container cavity, and the diapire of described the 3rd container cavity is provided with the 3rd notch of the diapire that connects along the vertical direction described the 3rd container cavity for passing through wafer; Wafer drying device, described wafer drying device is located in described frame and is positioned at the downstream of described wafer brushing device, described wafer drying device comprises having the 4th body of the 4th container cavity and be located at the 4th wafer support mechanism and the drying wafer mechanism in described the 4th container cavity, and the diapire of described the 4th container cavity is provided with the 4th notch of the diapire that connects along the vertical direction described the 4th container cavity for passing through wafer; And manipulator, described manipulator is located in described frame movably for clamping vertically wafer and carrying wafer.
Connect along the vertical direction described second notch of the described diapire of described the second container cavity by setting on the described diapire of described the second container cavity at described wafer cleaning device according to the wafer cleaning equipment of the embodiment of the present invention, described the 3rd notch of the described diapire that connects along the vertical direction described the 3rd container cavity is set on the described diapire of described the 3rd container cavity of described wafer brushing device and described the 4th notch of the described diapire that connects along the vertical direction described the 4th container cavity is set on the described diapire of described the 4th container cavity of described wafer drying device, thereby can make described manipulator clamping and be positioned at all the time while carrying described wafer described wafer below, can avoid like this pollutant in described manipulator and drive unit (not shown) thereof or particle to drop and on described wafer, pollute described wafer, be that described wafer is cleaning, scrub with dry run in can not be subject to secondary pollution.Therefore, clean described wafer by utilizing according to the wafer cleaning equipment of the embodiment of the present invention, can avoid described wafer to be subject to pollutant on described manipulator and drive unit thereof or the pollution of particle, thereby can improve widely the cleanliness factor of described wafer.
In addition, wafer cleaning equipment according to the above embodiment of the present invention can also have following additional technical characterictic:
According to one embodiment of present invention, each in the described second to the 4th wafer support mechanism comprises: driving wheel on first and second; Motor, described motor is connected with driving wheel on described first and second for driving driving wheel rotation on described first and second; The first lower support wheel, described the first lower support wheel cooperates with driving wheel on described first and second and supports described wafer and described wafer is vertically directed; With the first lower support wheel driving moving part, described the first lower support wheel driving moving part is connected with described the first lower support wheel to drive described the first lower support wheel to move up and down and move left and right.Like this cleaning described wafer, while scrubbing described wafer and dry described wafer described in wafer vertically directed, therefore clean and scrub the particle getting off and can for example, together with cleaning fluid (deionized water), flow downward vertically along two surfaces of described wafer with chemical agent from described wafer, and can not stay on two surfaces of described wafer, thereby can improve widely the cleanliness factor of described wafer.
According to one embodiment of present invention, described wafer cleaning mechanism comprises: the first and second million sound shower nozzles, and described the first and second million sound shower nozzles arrange to be respectively used to clean two surfaces of described wafer at interval in the axial direction of described wafer; And million sound shower nozzle actuators, described million sound shower nozzle actuators are located on described the second body and are connected with described the first and second million sound shower nozzles to drive the radial translation of described the first and second million sound shower nozzles along described wafer.In the time cleaning described wafer, because described wafer can rotate and described the 1,000,000 sound shower nozzle and described the 2,000,000 sound shower nozzle can be along described wafers radially does rectilinear motion, therefore by synthetic these two kinds of motions, can clean the surface of whole described wafer rapidly.Therefore, can clean all sidedly, rapidly described wafer according to the described wafer cleaning mechanism of the described wafer cleaning equipment of the embodiment of the present invention, and the particle on described wafer and chemical agent all can be washed, thereby reach better cleaning performance.
According to one embodiment of present invention, described wafer scrub body comprises the first and second hairbrush, and described the first and second hairbrush relatively and at interval arrange to be respectively used to scrub two surfaces of described wafer.Described wafer scrub body has the advantages such as simple in structure, washing effect is good.
According to one embodiment of present invention, described drying wafer mechanism comprises the first and second nozzles, and described the first and second nozzles arrange to be respectively used to two jet surface nitrogen to described wafer at interval in the axial direction of described wafer.Described drying wafer mechanism has the advantages such as simple in structure, drying effect is good.
According to one embodiment of present invention, described wafer brushing device is two, a described wafer brushing device is positioned at the downstream of described wafer cleaning device, and described in another, wafer brushing device is positioned at the downstream of a described wafer brushing device and is positioned at the upstream side of described wafer drying device.By two described wafer brushing devices are set, can successively carry out scrubbing for twice to described wafer, thereby can further improve the cleanliness factor of described wafer.
According to one embodiment of present invention, described wafer cleaning equipment also comprises that wafer enters transition platform, described wafer enters the upstream side that transition platform is located in described frame and is positioned at described wafer cleaning device, described wafer enters transition platform and comprises having the first noumenon of the first container cavity and be located at the first wafer support mechanism in described the first container cavity, and the diapire of described the first container cavity is provided with the first notch of the diapire that connects along the vertical direction described the first container cavity for passing through wafer.Can improve widely according to the operating efficiency of the wafer cleaning equipment of the embodiment of the present invention like this.
According to one embodiment of present invention, described wafer cleaning equipment also comprises that wafer shifts out transition platform, described wafer shifts out the downstream that transition platform is located in described frame and is positioned at described wafer drying device, described wafer shifts out transition platform and comprises having the 5th body of the 5th container cavity and be located at the 5th wafer support mechanism in described the 5th container cavity, and the diapire of described the 5th container cavity is provided with the 5th notch of the diapire that connects along the vertical direction described the 5th container cavity for passing through wafer.Shift out described transition platform by wafer being set in the downstream of described wafer drying device, thus can be more easily, easily dried described wafer is carried away.
According to one embodiment of present invention, each in described the first wafer support mechanism and described the 5th wafer support mechanism comprises: support wheel on first and second; The second lower support wheel, described the second lower support wheel cooperates with support wheel on described first and second and supports described wafer and described wafer is vertically directed; With the second lower support wheel driving moving part, described the second lower support wheel driving moving part is connected with described the second lower support wheel to drive described the second lower support wheel to move up and down and move left and right.Can make so described manipulator more easily described wafer be carried.
According to one embodiment of present invention, described manipulator has multiple for clamping vertically the arm of wafer, wherein said first to the 5th supporting plane of wafer support mechanism and the clamping plane of multiple described arms are parallel to each other, the first preset distance described in adjacent described supporting plane interval the first preset distance and adjacent described clamping plane interval, the center of circle of the described first supporting plane to the 5th wafer support mechanism is located along the same line and the center of circle of the clamping plane of multiple described arms is located along the same line.Can multiple described wafers be cleaned respectively, be scrubbed and be dried simultaneously according to the wafer cleaning equipment of the embodiment of the present invention like this, and described manipulator can be carried multiple described wafers simultaneously, therefore has operating efficiency advantages of higher according to the wafer cleaning equipment of the embodiment of the present invention.
Additional aspect of the present invention and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Brief description of the drawings
Above-mentioned and/or additional aspect of the present invention and advantage accompanying drawing below combination is understood becoming the description of embodiment obviously and easily, wherein:
Fig. 1 is according to the structural representation of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 2 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 3 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 4 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 5 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 6 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 7 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 8 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention;
Fig. 9 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention; With
Figure 10 is according to the cutaway view of the wafer cleaning equipment of the embodiment of the present invention.
Embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Be exemplary below by the embodiment being described with reference to the drawings, be intended to for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of instructions such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of device or the element of instruction or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " be only for describing object, and can not be interpreted as instruction or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In description of the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the terms such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or connect integratedly; Can be mechanical connection, can be also electrical connection; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can understand as the case may be above-mentioned term concrete meaning in the present invention.
In the present invention, unless otherwise clearly defined and limited, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, also can comprise that the first and second features are not directly contacts but by the other feature contact between them.And, First Characteristic Second Characteristic " on ", " top " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is higher than Second Characteristic.First Characteristic Second Characteristic " under ", " below " and " below " comprise First Characteristic under Second Characteristic and tiltedly, or only represent that First Characteristic level height is less than Second Characteristic.
Describe according to the wafer cleaning equipment 10 of the embodiment of the present invention below with reference to Fig. 1 to Figure 10.As shown in Figures 1 to 10, comprise frame 700, wafer cleaning device 200, wafer brushing device 300, wafer drying device 400 and manipulator 600 according to the wafer cleaning equipment 10 of the embodiment of the present invention.
Wafer cleaning device 200 is located in frame 700, wafer cleaning device 200 comprise have the second container cavity 211 the second body 210, be located at the second wafer support mechanism in the second container cavity 211 and be located at the wafer cleaning mechanism on the second body 210, the second notch 212 that the diapire 213 of the second container cavity 211 is provided with the diapire 213 that connects along the vertical direction the second container cavity 211 for by wafer 800(above-below direction as shown in the arrow A of Fig. 1-Figure 10).
Wafer brushing device 300 is located in frame 700, and wafer brushing device 300 is positioned at the downstream of wafer cleaning device 200, wafer brushing device 300 comprises having the 3rd body 310 of the 3rd container cavity 311 and be located at the 3rd wafer support mechanism and the wafer scrub body in the 3rd container cavity 311, and the diapire 313 of the 3rd container cavity 311 is provided with the 3rd notch 312 of the diapire 313 that connects along the vertical direction the 3rd container cavity 311 for passing through wafer 800.
Wafer drying device 400 is located in frame 700, and wafer drying device 400 is positioned at the downstream of wafer brushing device 300, wafer drying device 400 comprises having the 4th body 410 of the 4th container cavity 411 and be located at the 4th wafer support mechanism and the drying wafer mechanism in the 4th container cavity 411, and the diapire 413 of the 4th container cavity 411 is provided with the 4th notch 412 of the diapire 413 that connects along the vertical direction the 4th container cavity 411 for passing through wafer 800.
Manipulator 600 is located in frame 700 identical with above-below direction with carrying wafer 800(vertical direction for clamping vertically wafer 800 movably).
In the time that manipulator 600 is carried wafer 800, manipulator 600 can first move to the below of wafer cleaning device 200, wafer brushing device 300 and wafer drying device 400.For example, the wafer 800 in manipulator 600 is carried wafer cleaning device 200 or wafer 800 is transported to wafer cleaning device 200 when interior, manipulator 600 can first move to the below of wafer cleaning device 200.Particularly, manipulator 600 can be positioned at the below of wafer 800, and manipulator 600 can clamp the bottom of wafer 800.
Describe and utilize according to the method for wafer cleaning equipment 10 cleaning wafers 800 of the embodiment of the present invention below with reference to Fig. 1 to Figure 10.First, manipulator 600 clamps wafer 800 and moves to the below of wafer cleaning device 200, then manipulator 600 moves up and wafer 800 is transported to from the second notch 212 of the diapire 213 of the second container cavity 211 in the second container cavity 211 of wafer cleaning device 200, described the second wafer support mechanism supports wafer 800 and manipulator 600 move down and leave wafer cleaning device 200 subsequently, and described wafer cleaning mechanism is cleaned wafer 800.
Then, manipulator 600 moves up and enters in the second container cavity 211 to take out the wafer 800 after cleaning by the second notch 212, then manipulator 600 moves to the below of wafer brushing device 300, manipulator 600 moves up and wafer 800 is transported to from the 3rd notch 312 of the diapire 313 of the 3rd container cavity 311 in the 3rd container cavity 311 of wafer brushing device 300, described the 3rd wafer support mechanism supports wafer 800 and manipulator 600 move down and leave wafer brushing device 300 subsequently, and described wafer scrub body is scrubbed wafer 800.
Finally, manipulator 600 moves up and enters in the 3rd container cavity 311 to take out the wafer 800 after scrubbing by the 3rd notch 312, then manipulator 600 moves to the below of wafer drying device 400, manipulator 600 moves up and wafer 800 is transported to from the 4th notch 412 of the diapire 413 of the 4th container cavity 411 in the 4th container cavity 411 of wafer drying device 400, described the 4th wafer support mechanism supports wafer 800 and manipulator 600 move down and leave wafer drying device 400 subsequently, and described drying wafer mechanism is dried wafer 800.
Connect along the vertical direction the second notch 212 of the diapire 213 of the second container cavity 211 by setting on the diapire 213 of the second container cavity 211 at wafer cleaning device 200 according to the wafer cleaning equipment 10 of the embodiment of the present invention, the 3rd notch 312 of the diapire 313 that connects along the vertical direction the 3rd container cavity 311 is set on the diapire 313 of the 3rd container cavity 311 of wafer brushing device 300 and the 4th notch 412 of the diapire 413 that connects along the vertical direction the 4th container cavity 411 is set on the diapire 413 of the 4th container cavity 411 of wafer drying device 400, thereby can make manipulator 600 clamping and carrying be positioned at all the time when wafer 800 wafer 800 below, can avoid like this pollutant in manipulator 600 and drive unit (not shown) thereof or the particle polluting wafer 800 on wafer 800 that drops, be that wafer 800 is cleaning, scrub with dry run in can not be subject to secondary pollution.Therefore, carry out cleaning wafer 800 by utilizing according to the wafer cleaning equipment 10 of the embodiment of the present invention, can avoid wafer 800 to be subject to pollutant on manipulator 600 and drive unit thereof or the pollution of particle, thereby can improve widely the cleanliness factor of wafer 800.
And, be wafer 800 in the vertical direction orientations because manipulator 600 clamps and carry wafer 800(vertically), therefore the pollutant washing or particle can along two of wafer 800 surface, (two surfaces of wafer 800 refer to two round sides of wafer 800, as follows) flow down vertically, and can not stay on two surfaces of wafer 800, thereby can improve widely the cleanliness factor of wafer 800.Therefore, there is the advantages such as cleaning performance is good according to the wafer cleaning equipment 10 of the embodiment of the present invention, can improve widely the cleanliness factor of wafer 800.
As shown in Figures 1 to 10, in some embodiments of the invention, each in described the second wafer support mechanism, described the 3rd wafer support mechanism and described the 4th wafer support mechanism can comprise on first driving wheel 222, motor (not shown), the first lower support wheel 223 and the first lower support wheel driving moving part (not shown) on driving wheel 221, second.
Described motor can be connected with driving wheel 222 on driving wheel on first 221 and second, and described motor can be for driving on first driving wheel 222 on driving wheel 221 and second to rotate.The first lower support wheel 223 supporting wafer 800 that can cooperate with driving wheel 222 on driving wheel on first 221 and second, and on the first lower support wheel 223, first, on driving wheel 221 and second, driving wheel 222 can be vertically directed by wafer 800.Described the first lower support wheel driving moving part can be connected with the first lower support wheel 223 so that described the first lower support wheel driving moving part can drive the first lower support wheel 223 to move up and down and move left and right (left and right directions is as shown in the arrow C in Fig. 1-Figure 10).
By driving wheel 222 and the first lower support wheel 223 on driving wheel 221, second is set on first, can wafer 800 is vertically directed.Like this at cleaning wafer 800, wafer 800 is vertically directed while scrubbing wafer 800 and dry wafer 800, therefore clean and scrub the particle getting off and can for example, together with cleaning fluid (deionized water), flow downward vertically along two surfaces of wafer 800 with chemical agent from wafer 800, and can not stay on two surfaces of wafer 800, thereby can improve widely the cleanliness factor of wafer 800.
As shown in Figure 1, in one embodiment of the invention, described wafer cleaning mechanism can comprise the 1,000,000 sound shower nozzle the 231, the 2,000,000 sound shower nozzle 232 and million sound shower nozzle actuator (not shown)s.The 1,000,000 sound shower nozzle the 231 and the 2,000,000 sound shower nozzle 232 can arrange to can be respectively used to two surfaces of cleaning wafer 800 at interval in the axial direction of wafer 800.Described million sound shower nozzle actuators can be located on the second body 210, and described million sound shower nozzle actuators can be connected with the 2,000,000 sound shower nozzle 232 with the 1,000,000 sound shower nozzle 231 to can drive the radial translation of the 1,000,000 sound shower nozzle the 231 and the 2,000,000 sound shower nozzle 232 along wafer 800.
In the time that wafer 800 is cleaned, be positioned on the first lower support wheel 223, first of the second container cavity 211 on driving wheel 221 and second driving wheel 222 supporting wafer 800 that cooperates, described motor can drive on first driving wheel 222 on driving wheel 221 and second to rotate, so on first on driving wheel 221 and second driving wheel 222 can drive wafer 800 to rotate.Meanwhile, described million sound shower nozzle actuators can drive the 1,000,000 sound shower nozzle the 231 and the 2,000,000 sound shower nozzle 232 cleaning fluid (for example deionized water) can be sprayed onto on two surfaces of wafer 800 along radial translation and the 1,000,000 sound shower nozzle the 231 and the 2,000,000 sound shower nozzle 232 of wafer 800.
And in the time of cleaning wafer 800, because wafer 800 can rotate and the 1,000,000 sound shower nozzle the 231 and the 2,000,000 sound shower nozzle 232 can be along wafer 800 radially does rectilinear motion, therefore by synthetic these two kinds of motions, can clean the surface of whole wafer 800 rapidly.Therefore, according to the described wafer cleaning mechanism of the wafer cleaning equipment 10 of the embodiment of the present invention can be all sidedly, cleaning wafer 800 rapidly, and the particle on wafer 800 and chemical agent all can be washed, thereby reach better cleaning performance.
As shown in Figures 1 to 10, in a specific embodiment of the present invention, described wafer scrub body can comprise that the first hairbrush 331 and the second hairbrush 332, the first hairbrush 331 and the second hairbrush 332 can relatively and at interval arrange to be respectively used to scrub two surfaces of wafer 800.Described wafer scrub body has the advantages such as simple in structure, washing effect is good.
In the time that wafer 800 is scrubbed, be positioned on the first lower support wheel 223, first of the 3rd container cavity 311 on driving wheel 221 and second driving wheel 222 supporting wafer 800 that cooperates, described motor can drive on first driving wheel 222 on driving wheel 221 and second to rotate, so on first on driving wheel 221 and second driving wheel 222 can drive wafer 800 to rotate.Meanwhile, the first hairbrush 331 and the second hairbrush 332 can rotate to two of wafer 800 surfaces are scrubbed along its axial direction.
As shown in Figures 1 to 10, advantageously, wafer brushing device 300 can be two, a wafer brushing device 300 can be positioned at the downstream of wafer cleaning device 200, another wafer brushing device 300 can be positioned at the downstream of a wafer brushing device 300, and another wafer brushing device 300 can be positioned at the upstream side of wafer drying device 400.By two wafer brushing devices 300 are set, can successively carry out scrubbing for twice to wafer 800, thereby can further improve the cleanliness factor of wafer 800.
In examples more of the present invention, as shown in Figure 1, described drying wafer mechanism can comprise that the first nozzle 431 and second nozzle 432, the first nozzles 431 and second nozzle 432 can arrange to can be respectively used to two jet surface nitrogen to wafer 800 at interval in the axial direction of wafer 800.Described drying wafer mechanism has the advantages such as simple in structure, drying effect is good.
In the time that wafer 800 is dried, be positioned on the first lower support wheel 223, first of the 4th container cavity 411 on driving wheel 221 and second driving wheel 222 supporting wafer 800 that cooperates, described motor can drive on first driving wheel 222 on driving wheel 221 and second to rotate, so on first on driving wheel 221 and second driving wheel 222 can drive wafer 800 to rotate.Meanwhile, the first nozzle 431 and second nozzle 432 can be to two of a wafer 800 jet surface nitrogen to be dried two of wafer 800 surfaces.
As shown in Figures 1 to 10, in an example of the present invention, wafer cleaning equipment 10 can also comprise that wafer enters transition platform 100, wafer enters transition platform 100 and can be located in frame 700, and wafer enters transition platform 100 and can be positioned at the upstream side of wafer cleaning device 200, wafer enters transition platform 100 can comprise having the first noumenon 110 of the first container cavity 111 and be located at the first wafer support mechanism in the first container cavity 111, on the diapire 113 of the first container cavity 111, can be provided with the first notch 112 of the diapire 113 that connects along the vertical direction the first container cavity 111 for passing through wafer 800.
Enter transition platform 100 by wafer being set at the upstream side of wafer cleaning device 200, can before wafer 800 is cleaned, wafer to be cleaned 800 be placed in the first container cavity 111 that wafer enters transition platform 100.In other words,, when a wafer 800 is cleaned, unwashed next one wafer 800 can be placed in the first container cavity 111 that wafer enters transition platform 100.Cleaning after this wafer 800, manipulator 600 can move to wafer and enter the below of transition platform 100, then manipulator 600 moves up and enters in the first container cavity 111 to take out next unwashed wafer 800 by the first notch 112, and then manipulator 600 moves to the below of wafer cleaning device 200 and according to foregoing mode, unwashed wafer 800 is transported in the second container cavity 211 to this wafer 800 is cleaned.Can improve widely like this according to the operating efficiency of the wafer cleaning equipment 10 of the embodiment of the present invention.
In another example of the present invention, as shown in Figures 1 to 10, wafer cleaning equipment 10 can also comprise that wafer shifts out transition platform 500, wafer shifts out transition platform 500 and can be located in frame 700, and wafer shifts out transition platform 500 and can be positioned at the downstream of wafer drying device 400, wafer shifts out transition platform 500 can comprise having the 5th body 510 of the 5th container cavity 511 and be located at the 5th wafer support mechanism in the 5th container cavity 511, on the diapire 513 of the 5th container cavity 511, can be provided with the 5th notch 512 of the diapire 513 that connects along the vertical direction the 5th container cavity 511 for passing through wafer 800.Shift out transition platform 500 by wafer being set in the downstream of wafer drying device 400, thus can be more easily, easily dried wafer 800 carryings are walked.
Manipulator 600 moves to the below of wafer drying device 400, then manipulator 600 moves up and enters in the 4th container cavity 411 to take out dried wafer 800 by the 4th notch 412, then the below that manipulator 600 moves to wafer and shifts out transition platform 500, manipulator 600 moves up and wafer 800 is transported in the 5th container cavity 511 that wafer shifts out transition platform 500 from the 5th notch 512 of the diapire 513 of the 5th container cavity 511, described the 5th wafer support mechanism supports wafer 800 and manipulator 600 move down and leave wafer and shift out transition platform 500 subsequently.Dried wafer 800 carryings that other manipulators shift out wafer in transition platform 500 are walked.
Particularly, upstream and downstream direction can be identical with left and right directions.As shown in Fig. 1-Figure 10, wafer cleaning device 200 can be located at wafer and enter the right side of transition platform 100, a wafer brushing device 300 can be located at the right side of wafer cleaning device 200, another wafer brushing device 300 can be located at the right side of a wafer brushing device 300, wafer drying device 400 can be located at the right side of another wafer brushing device 300, and wafer shifts out transition platform 500 and can be located at the right side of wafer drying device 400.
As shown in Fig. 1-Figure 10, in a concrete example of the present invention, each in described the first wafer support mechanism and described the 5th wafer support mechanism can comprise on first support wheel 122, the second lower support wheel 123 and the second lower support wheel driving moving part (not shown) on support wheel 121, second.
The second lower support wheel 123 supporting wafer 800 that can cooperate with support wheel 122 on support wheel on first 121 and second, and on the second lower support wheel 123, first, on support wheel 121 and second, support wheel 122 can be vertically directed by wafer 800.Described the second lower support wheel driving moving part can be connected with the second lower support wheel 123 to drive the second lower support wheel 123 to move up and down and move left and right.
By support wheel 122 and the second lower support wheel 123 on support wheel 121, second is set on first, can make wafer 800 vertically directed in the first container cavity 111 and the 5th container cavity 511, can make like this manipulator 600 more easily wafer 800 be carried.
On the diapire 113 of the first container cavity 111 of transition platform 100, the first notch 112 of the diapire 113 that connects along the vertical direction the first container cavity 111 is set and shifts out the 5th notch 512 that the diapire 513 that connects along the vertical direction the 5th container cavity 511 is set on the diapire 513 of the 5th container cavity 511 of transition platform 500 at wafer by entering at wafer according to the wafer cleaning equipment 10 of the embodiment of the present invention, thereby can make manipulator 600 clamping and carrying be positioned at all the time when wafer 800 wafer 800 below, can avoid like this pollutant in manipulator 600 and drive unit (not shown) thereof or the particle polluting wafer 800 on wafer 800 that drops, be that wafer 800 can not be subject to secondary pollution.Therefore, carry out cleaning wafer 800 by utilizing according to the wafer cleaning equipment 10 of the embodiment of the present invention, can avoid wafer 800 to be subject to pollutant on manipulator 600 and drive unit thereof or the pollution of particle, thereby can improve widely the cleanliness factor of wafer 800.
As shown in Fig. 1-Figure 10, in some embodiments of the invention, manipulator 600 can have multiple for clamping vertically the arm 610 of wafer 800, the supporting plane of wherein said the first wafer support mechanism, the supporting plane of described the second wafer support mechanism, the supporting plane of described the 3rd wafer support mechanism, the supporting plane of described the 4th wafer support mechanism, the clamping plane of the supporting plane of described the 5th wafer support mechanism and multiple arm 610 can be parallel to each other, adjacent described supporting plane can interval the first preset distance, and adjacent described clamping plane can interval described in the first preset distance, the supporting plane of described the first wafer support mechanism, the supporting plane of described the second wafer support mechanism, the supporting plane of described the 3rd wafer support mechanism, the center of circle of the supporting plane of the supporting plane of described the 4th wafer support mechanism and described the 5th wafer support mechanism can be located along the same line, and the center of circle of the clamping plane of multiple arms 610 can be located along the same line, multiple arms 610 of manipulator 600 can clamp simultaneously and carry wafer 800 like this.Particularly, each arm 610 can be positioned at the below of wafer 800, and each arm 610 can clamp the bottom of wafer 800.
Can multiple wafers 800 be cleaned respectively, scrub and are dried simultaneously according to the wafer cleaning equipment 10 of the embodiment of the present invention like this, and manipulator 600 can be carried multiple wafers 800 simultaneously, therefore has operating efficiency advantages of higher according to the wafer cleaning equipment 10 of the embodiment of the present invention.
Describe and multiple wafers 800 are cleaned respectively, scrubbed and dry process simultaneously according to the wafer cleaning equipment 10 of the embodiment of the present invention below with reference to Fig. 1-Figure 10.
As depicted in figs. 1 and 2, wafer enters in each in transition platform 100, wafer cleaning device 200, two wafer brushing devices 300 and wafer drying device 400 and is placed with a wafer 800, and manipulator 600 is positioned at wafer and enters transition platform 100, wafer cleaning device 200, wafer brushing device 300, wafer drying device 400 and wafer to shift out the below of transition platform 500 and multiple arms 610 of manipulator 600 relative with the 4th notch 412 with the first notch 112, the second notch 212, the 3rd notch 312 respectively on above-below direction.In other words, first arm 610 of manipulator 600 is relative with the first notch 112 on above-below direction, second arm 610 of manipulator 600 is relative with the second notch 212 on above-below direction, the 3rd arm 610 of manipulator 600 is relative with the 3rd notch 312 on above-below direction, the 4th arm 610 of manipulator 600 is relative, as follows with the 4th notch 412 on above-below direction.
As shown in Figure 3, wafer 800 in the wafer 800 in wafer cleaning device 200 cleans complete, two wafer brushing devices 300 scrub wafer 800 in complete and wafer drying device 400 dry after, manipulator 600 can move up and multiple arms 610 of manipulator 600 can be upward through respectively the first notch 112, the second notch 212, the 3rd notch 312 and the 4th notch 412 and clamp wafer 800.Because the center of circle of the supporting plane of the supporting plane of the supporting plane of the supporting plane of described the first wafer support mechanism, described the second wafer support mechanism, described the 3rd wafer support mechanism, described the 4th wafer support mechanism and the supporting plane of described the 5th wafer support mechanism is located along the same line and the center of circle of the clamping plane of multiple arms 610 of manipulator 600 is located along the same line, therefore can realizes and pick and place wafer 800 simultaneously.
Then, the first lower support wheel 223 and the second lower support wheel 123 can first move down again and move horizontally (being for example moved to the left) to depart from wafer 800, and wafer 800 is clamped on the arm 610 of manipulator 600 (as shown in Figure 4) vertically.Then, as shown in Figure 5, manipulator 600 can move down and multiple arms 610 of manipulator 600 can be passed down through respectively the first notch 112, the second notch 212, the 3rd notch 312 and the 4th notch 412.
Then, as shown in Figure 6, manipulator 600 downstream described in side shifting the first preset distance (described the first preset distance for example moves right, that is to say, manipulator 600 can move up and down and can movably be located in frame 700), now can utilize another manipulator that next wafer 800 is transported to wafer and enter in transition platform 100.Due to the supporting plane of described the first wafer support mechanism, the supporting plane of described the second wafer support mechanism, the supporting plane of described the 3rd wafer support mechanism, the supporting plane of described the 4th wafer support mechanism, the supporting plane of described the 5th wafer support mechanism equally spaced arrange and adjacent described clamping plane interval described in the first preset distance, the clamping plane of multiple arms 610 of manipulator 600 also equally spaced arranges and also the first preset distance described in interval of adjacent described clamping plane, therefore when manipulator 600 is downstream described in side shifting after the first preset distance, multiple arms 610 of manipulator 600 can be respectively on above-below direction and the second notch 212, the 3rd notch 312, the 4th notch 412 is relative with the 5th notch 512.
Then, as shown in Figure 7, manipulator 600 can move up and multiple arms 610 of manipulator 600 can be upward through respectively the second notch 212, the 3rd notch 312, the 4th notch 412 and the 5th notch 512, in the time that the wafer 800 on arm 610 contacts with support wheel 122 on support wheel 121 and second on driving wheel 222 or first on driving wheel on first 221 and second, manipulator 600 stops moving up.Wherein, wafer 800 in wafer cleaning device 200, wafer brushing device 300 and wafer drying device 400 contacts with driving wheel 222 on driving wheel on first 221 and second, and the wafer 800 that wafer shifts out in transition platform 500 contacts with support wheel 122 on support wheel on first 121 and second.Then, the first lower support wheel 223 and the second lower support wheel 123 can first move horizontally (for example moving right) move up again in case supporting wafer 800(as shown in Figure 8).
As shown in Figure 9, manipulator 600 can move down and multiple arms 610 of manipulator 600 can be passed down through respectively the second notch 212, the 3rd notch 312, the 4th notch 412 and the 5th notch 512.Then, as shown in figure 10, manipulator 600 upstream described in side shifting the first preset distance (being for example moved to the left described the first preset distance) to be returned to the position before carrying wafer 800, wait for and carry wafer 800(next time and get sheet and film releasing).Wafer 800 carryings that can utilize another manipulator that wafer is shifted out in transition platform 500 are walked.
There is the advantages such as cleaning performance is good according to the wafer cleaning equipment 10 of the embodiment of the present invention, can improve widely the cleanliness factor of wafer 800.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present invention or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And specific features, structure, material or the feature of description can be with suitable mode combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, those of ordinary skill in the art can change above-described embodiment within the scope of the invention in the situation that not departing from principle of the present invention and aim, amendment, replacement and modification.
Claims (10)
1. a wafer cleaning equipment, is characterized in that, comprising:
Frame;
Wafer cleaning device, described wafer cleaning device is located in described frame, described wafer cleaning device comprise have the second container cavity the second body, be located at the second wafer support mechanism in described the second container cavity and be located at the wafer cleaning mechanism on described the second body, the diapire of described the second container cavity is provided with the second notch of the diapire that connects along the vertical direction described the second container cavity for passing through wafer;
Wafer brushing device, described wafer brushing device is located in described frame and is positioned at the downstream of described wafer cleaning device, described wafer brushing device comprises having the 3rd body of the 3rd container cavity and be located at the 3rd wafer support mechanism and the wafer scrub body in described the 3rd container cavity, and the diapire of described the 3rd container cavity is provided with the 3rd notch of the diapire that connects along the vertical direction described the 3rd container cavity for passing through wafer;
Wafer drying device, described wafer drying device is located in described frame and is positioned at the downstream of described wafer brushing device, described wafer drying device comprises having the 4th body of the 4th container cavity and be located at the 4th wafer support mechanism and the drying wafer mechanism in described the 4th container cavity, and the diapire of described the 4th container cavity is provided with the 4th notch of the diapire that connects along the vertical direction described the 4th container cavity for passing through wafer; With
Manipulator, described manipulator is located in described frame movably for clamping vertically wafer and carrying wafer.
2. wafer cleaning equipment according to claim 1, is characterized in that, each in the described second to the 4th wafer support mechanism comprises:
Driving wheel on first and second;
Motor, described motor is connected with driving wheel on described first and second for driving driving wheel rotation on described first and second;
The first lower support wheel, described the first lower support wheel cooperates with driving wheel on described first and second and supports described wafer and described wafer is vertically directed; With
The first lower support wheel driving moving part, described the first lower support wheel driving moving part is connected with described the first lower support wheel to drive described the first lower support wheel to move up and down and move left and right.
3. wafer cleaning equipment according to claim 1, is characterized in that, described wafer cleaning mechanism comprises:
The first and second million sound shower nozzles, described the first and second million sound shower nozzles arrange to be respectively used to clean two surfaces of described wafer at interval in the axial direction of described wafer; And
Million sound shower nozzle actuators, described million sound shower nozzle actuators are located on described the second body and are connected with described the first and second million sound shower nozzles to drive the radial translation of described the first and second million sound shower nozzles along described wafer.
4. wafer cleaning equipment according to claim 1, is characterized in that, described wafer scrub body comprises the first and second hairbrush, and described the first and second hairbrush relatively and at interval arrange to be respectively used to scrub two surfaces of described wafer.
5. wafer cleaning equipment according to claim 1, it is characterized in that, described drying wafer mechanism comprises the first and second nozzles, and described the first and second nozzles arrange to be respectively used to two jet surface nitrogen to described wafer at interval in the axial direction of described wafer.
6. wafer cleaning equipment according to claim 1, it is characterized in that, described wafer brushing device is two, a described wafer brushing device is positioned at the downstream of described wafer cleaning device, and described in another, wafer brushing device is positioned at the downstream of a described wafer brushing device and is positioned at the upstream side of described wafer drying device.
7. wafer cleaning equipment according to claim 1, it is characterized in that, also comprise that wafer enters transition platform, described wafer enters the upstream side that transition platform is located in described frame and is positioned at described wafer cleaning device, described wafer enters transition platform and comprises having the first noumenon of the first container cavity and be located at the first wafer support mechanism in described the first container cavity, and the diapire of described the first container cavity is provided with the first notch of the diapire that connects along the vertical direction described the first container cavity for passing through wafer.
8. wafer cleaning equipment according to claim 7, it is characterized in that, also comprise that wafer shifts out transition platform, described wafer shifts out the downstream that transition platform is located in described frame and is positioned at described wafer drying device, described wafer shifts out transition platform and comprises having the 5th body of the 5th container cavity and be located at the 5th wafer support mechanism in described the 5th container cavity, and the diapire of described the 5th container cavity is provided with the 5th notch of the diapire that connects along the vertical direction described the 5th container cavity for passing through wafer.
9. wafer cleaning equipment according to claim 8, is characterized in that, each in described the first wafer support mechanism and described the 5th wafer support mechanism comprises:
Support wheel on first and second;
The second lower support wheel, described the second lower support wheel cooperates with support wheel on described first and second and supports described wafer and described wafer is vertically directed; With
The second lower support wheel driving moving part, described the second lower support wheel driving moving part is connected with described the second lower support wheel to drive described the second lower support wheel to move up and down and move left and right.
10. wafer cleaning equipment according to claim 8, it is characterized in that, described manipulator has multiple for clamping vertically the arm of wafer, wherein said first to the 5th supporting plane of wafer support mechanism and the clamping plane of multiple described arms are parallel to each other, the first preset distance described in adjacent described supporting plane interval the first preset distance and adjacent described clamping plane interval, the center of circle of the described first supporting plane to the 5th wafer support mechanism is located along the same line and the center of circle of the clamping plane of multiple described arms is located along the same line.
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| CN103386406B (en) * | 2013-08-08 | 2015-04-01 | 常州市科沛达超声工程设备有限公司 | Double-side scrubbing equipment between wafer production processes |
| CN105870045B (en) * | 2016-05-04 | 2018-05-18 | 中国电子科技集团公司第四十五研究所 | Wafter delivery appts and application method |
| CN105789096B (en) * | 2016-05-04 | 2019-02-05 | 中国电子科技集团公司第四十五研究所 | A kind of wafer cleaning equipment |
| CN109227359A (en) * | 2018-10-19 | 2019-01-18 | 清华大学 | The post-processing unit of chemical-mechanical polishing system and method, wafer |
| CN116387238B (en) * | 2023-06-05 | 2023-08-11 | 盛奕半导体科技(无锡)有限公司 | Ozone cleaning equipment and application thereof in semiconductor wet cleaning process |
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