CN100495652C - Semiconductor chip cleaning system - Google Patents

Abstract

The present invention related to a semiconductor wafer cleaning system comprising a preliminary cleaning station for removing particles on a wafer in advance by spraying deionized water thereon; a first cleaning station for cleaning remaining particles firstly by rotating frictionally a pair of brushes disposed to be contacted with a front surface and a back surface of the wafer and by spraying chemicals thereon through a chemical sprayer being provided independently; a first rinsing station for rinsing by spraying a cleaning liquid onto the firstly cleaned wafer at the first cleaning station; a second cleaning station for cleaning particles secondly remained on the front surface and the back surface of the wafer by spraying the chemicals onto the firstly rinsed cleaned wafer at the first rinsing station through a chemical sprayer being provided independently using the same structure and manner as those of the first cleaning station; a second rinsing station for rinsing by spraying the cleaning liquid onto the secondly cleaned wafer at the second cleaning station; and a dry station for drying the remained cleaning liquid using centrifugal force generated by rotating the rinsed wafer at the second rinsing station at a high speed. According to the present invention, a waiting time of entry into each cleaning station is minimized by processing a cleaning operation and a rinsing operation of a surface-polished wafer in a cleaning station and a rinsing station which are provided separately and independently thereby improves wafer productivity significantly by solving a delayed phenomenon in a whole process of wafer manufacturing.

Description

Semiconductor chip cleaning system

Technical field

The present invention relates to a kind of semiconductor chip cleaning system.More specifically, the present invention relates to a kind of semiconductor chip cleaning system, respectively by in each cleaning station, independently the wafer with polished surface being cleaned and flushing operation, it is the shortest that described semiconductor chip cleaning system makes wafer enter each stand-by period of cleaning the station, thereby improve wafer productivity by the delay phenomenon that solves in the entire wafer production process.

Background technology

In general, the manufacture process of semiconductor wafer comprises by using the step on chemical-mechanical polishing mathing (CMP instrument) the measure polished wafer surface of etc.ing, and wafer is cleaned step with the particle that produces in the steps such as removal polished wafer surface.

The step of clean wafer is carried out with multiple diverse ways by using the present known various semiconductor cleaning systems in this area.Usually, the step of clean wafer comprises, in a cleaning station with some chemical species injection to wafer surface, this wafer surface is cleaned, and the use pure water is that deionized water (DIW) washes described wafer surface; After wafer being moved to next cleaning station, repeat described injection and cleaning and flushing process several times; And after wafer is inserted dry station, finally make the wafer drying.That is to say that the cleaning course of chemicals and the flushing process of deionized water carry out respectively in a station.

Therefore, owing in the semiconductor chip cleaning system of prior art, clean and wash these two processes and in cleaning systems, carry out, therefore, in a station, carry out above-mentioned technical process and lose time.In addition, above-mentioned cleaning and flushing process must repeat several times in station subsequently, this adds up time waste greatly and causes time delay, thereby, the wafer that polishes on the workbench of polishing assembly need be waited for and enter cleaning systems, thereby whole technical process is caused hysteresis, and then owing to can not keep the whole process flow smoothness to carry out, and productivity ratio is reduced.

In other words, when using two or more chemicals to carry out cleaning course in the cleaning station, the flushing process that is used to neutralize need be avoided causing pH to impact owing to the difference of chemical composition between each cleaning course according to used chemicals.For this reason, use a pair of cleaning brush of being made by wet sponge, each brush is separately positioned near the both sides of wafers face, and the described wafer of grooming revolvably.Because the deionized water of Clean-chemicals and flushing usefulness selectively repeats to provide by each brush axle, therefore in starting stage that the cleaning that the different chemical thing is provided changes, owing to included deionized water in a brush, and can not in certain period, keep the concentration of different chemical thing exactly, thereby reduce cleaning effect.Therefore, need so that carry out normal cleaning course, cause productivity ratio to descend thus than the clean time of Changqing.

In addition, in existing cleaning systems, directly insert cleaning station by above-mentioned brush and clean immediately owing to polishing process pollutes bigger wafer, and do not carry out some preliminary clean, therefore the pollution of brush is even more serious, and cleaning capacity is descended.In addition, shorten the useful life of brush, thereby need frequent the replacing, causes the inconvenience of CMP tool maintenance and increase the technology cost.

And, after finishing some cleanings and flushing process, in the drying station that makes the wafer drying by high speed rotating, be used to grasp and rotate four clamping fingers that structure comprises that the while radially operates that grasp of wafer by each cleaning station.Under the condition of accurately not aiming in the flat zone position of wafer, when Jiang Ping district type wafer inserted the cleaning station, the clamping situation of each clamping finger was also inhomogeneous, thereby the wafer of high speed rotating is very easy to damage.Like this, necessarily require wafer aligned, thereby owing to the time that needs to aim at causes time delay to become the hysteresis of whole technology, this has reduced wafer productivity again.

In addition, the conventional semiconductor chip cleaning system has bigger structure, and in this structure, each cleaning, flushing and dry station are in line, thereby needs the cleaning systems of bigger space mounting and application prior art.

Summary of the invention

The objective of the invention is to solve prior art problems and a kind of semiconductor chip cleaning system is provided, by after each cleaning of carrying out wafer independently and flushing operation, the stand-by period that makes wafer enter each cleaning station is reduced to minimum, and in whole crystal grain manufacturing process, do not have delay phenomenon, and can improve wafer productivity.

Another object of the present invention provides a kind of semiconductor chip cleaning system, by the Supply Structure of chemicals is separated with the Supply Structure of deionized water, also shortens the required time of cleaning to improve cleaning effect, thereby improves wafer productivity.

A further object of the present invention provides a kind of semiconductor chip cleaning system, wafer by serious pollution in polishing process cleans under the condition of predetermined extent and carries out main cleaning course with brush, make cleaning capacity best and make the pollution minimum of brush, and, carry out the required cost benefit of whole technology and have owing to the brush prolongation in useful life.

Another object of the present invention provides a kind of semiconductor chip cleaning system, not only the wafer of rotation and drying crystal wafer grasps structure in the dry station by improving, how the wafer approach axis of no matter being imported can both keep the condition that grasps constant, even if thereby have wafer even rotation the time also can not damage wafer under fair speed rock-steady structure, and can realize a kind of rock-steady structure that has nothing to do with chip-type, thereby do not need to carry out independent wafer aligned, shorten the required time of whole technology.

A further object of the present invention provides a kind of semiconductor chip cleaning system, makes the space minimum of erecting tools by improving and compressing each cleaning, flushing and dry structural arrangement of standing, thereby makes the space availability ratio maximization.

In order to achieve the above object, comprise according to the semiconductor chip cleaning system of one aspect of the invention: the precleaning station, described precleaning station is by removing particle on the wafer spraying deionized water on the wafer in advance; The first cleaning station, the described first cleaning station be a pair of brush that contact with the wafer front and rear surfaces by the friction rotary setting, and by the independent chemical species injection device that is provided with chemical species injection on wafer, be used for cleaning for the first time the particle of remnants; First scouring stage, described first scouring stage washes by to spraying clean liquid on the clean chip for the first time at the first cleaning station; The second cleaning station, the described second cleaning station utilizes and identical structure and the mode in the first cleaning station, by the independent chemical species injection device that is provided with chemical species injection to washing for the first time on the clean chip at first scouring stage, be used for for the second time remaining particle on the clean wafer front and rear surfaces; Second scouring stage, described second scouring stage washes by to spraying clean liquid on the clean chip for the second time at the second cleaning station; And dry station, described dry station utilizes by the dry remaining clean liquid of the centrifugal force that wafer produced of high speed rotating second scouring stage flushing.

Here, preferably, first scouring stage comprises that also direction changes and conveyer, compare with the approach axis that the first time, clean chip entered first scouring stage, described direction change and conveyer for the first time the clean chip direction of motion that enters next technical process change 90 degree, and will the first time clean chip be sent in next technical process.

In addition, preferably, direction changes and conveyer comprises: rise and the decline plate, described rising is vertical setting with the decline plate, and rises and descend by certain linear motion device; A plurality of roller supports, described roller support be vertically fixed on rise with sidewall of decline plate on and parallel each other with the fixed interval (FI), and be arranged on the wafer that is used to send between the transmission conveyer from the previous process process, and can not form the interference between roller support and the transmission conveyer; And a plurality of directions change and transfer roller, described direction changes and transfer roller changes with described direction and transfer roller is separately positioned on the mode of roller internal stent and support, thereby the two ends of change of described direction and transfer roller can rotate between sidewall of rising and decline plate and roller support end.

In addition, preferably, the precleaning station comprises: wafer grasps and whirligig; And deionized water sprayer, described deionized water sprayer is installed on the top of wafer, passes through to spray deionized water and the bigger particle of main removal with the cascade shape when the supply high pressure de-ionized water; Wherein, described wafer grasps with whirligig and comprises: supporting bracket vertically is formed with in the described supporting bracket and rises and the decline guide rail; Rise and the decline plate, described rising and decline plate combine with rising and decline guide rail, so that by rising and the decline rail guidance; Cylinder body, described cylinder body can vertically stretch out and withdraw, so that rise and rising of decline plate and decline; And a plurality of guide reels, described guide reel drives rotation simultaneously by one or more drive sources, makes its rotation after grasping wafer, and rises and descend with rising and decline plate, so that do not disturb wafer when the loading and unloading wafer.

In addition, preferably, the first cleaning station and the second cleaning station comprise a pair of brush respectively, described brush passes through two surfaces of contact wafer in order to clean wafer, described brush is made by moistening sponge, in the brush free time, only when being used for the flow channel supplying deionized water of supplying deionized water, described moistening sponge can carry out moistening processing; And the chemical species injection device, described chemical species injection device is provided with towards two sides of wafer symmetrically, and only can flow through chemicals and spray chemicals.

In addition, preferably, dry station comprises: centre rotational axis, and described centre rotational axis extends upward, and the power rotation by coming from the drive unit transmission that is arranged at this centre rotational axis bottom; Five otch, described otch along the excircle of described centre rotational axis this centre rotational axis vertically on be formed equidistantly top at centre rotational axis; Joystick, described joystick radially pass described five otch respectively and stretch out, and have same distance, can move up and down along described otch respectively; Index arm, described index arm be vertical the setting in the mode that each index arm is connected in each joystick one end by swivel pin in rotatable state, thereby, each index arm when each control lever movement and each joystick be combined together; Grasp finger, the described finger that grasps forms with index arm is whole respectively at the top of index arm, and each grasps and refers to have the groove that can hold Waffer edge; Connector, described connector be arranged on index arm swivel pin the top and grasp between the finger, and in this connector, central axis pin is connected to support plate, when packing wafer into, be used for supporting wafers, and play the function of pivot, be used to carry out index arm and the relative swing that grasps between the finger.

According to chip cleaning system of the present invention, by in cleaning station that is provided with respectively and independently and scouring stage, carrying out the clean operation and the flushing operation of the wafer of surface finish, it is the shortest that realization enters the stand-by period at each cleaning station, thereby, and improve wafer productivity significantly by the delay phenomenon in the solution entire wafer manufacturing process.

In addition, by the structure of supplying chemical thing and deionized water is separated, realize the raising of cleaning effect, and, can also improve wafer productivity by shortening the cleaning time at each station.That is to say, be separated into by the chemical species injection device supplying chemical thing of independent setting and by the brush supplying deionized water by structure supplying chemical thing and deionized water, worry owing to composition difference between the different chemical thing causes chemical shock when a cleaning station uses two or more chemicals to carry out cleaning course with regard to noting be used in, can also make cleaning effect the best by the accurate concentration that keeps chemicals, therefore, improve wafer productivity by shortening cleaning time.

And, according to the present invention, can be implemented in brush carries out before the main cleaning course, by the precleaning station that can carry out the precleaning process is provided separately, under the state that the highly polluted wafer in polishing process end back is cleaned to a certain degree, use brush to carry out clean operation, thereby by the minimum clean-up performance the best that realizes of the pollution that makes brush, and, aspect system maintenance, has advantage owing to the technology cost has been saved in the prolongation in semiconductor chip cleaning system useful life.

In addition,, become five to grasp the finger type, can realize a kind of rock-steady structure by wafer being grasped architecture advances according to the present invention, thus the state that grasps how the wafer input direction all is maintained fixed, and when high speed rotating to wafer without any damage; And can obtain a kind of rock-steady structure, regardless of chip-type, for example flat district type or breach type do not need to carry out independent crystal grain and aim at, thereby improve wafer productivity by shortening the required time of whole technology.

In addition, according to the present invention, because in cleaning station, scouring stage and the dry station one has direction and change and conveyer, thereby of will clean in station, scouring stage and the dry station is improved to the arrangement of L type, make the reserves space minimum, therefore realize the utilance maximum that whole unit takes up space.

Description of drawings

Fig. 1 is according to the deployment structure of semiconductor chip cleaning system various piece of the present invention and the schematic diagram that is connected in a plane as polishing module and wafer receiver module with peripheral unit thereof;

Fig. 2 is the schematic diagram of primary structure that is applied to the precleaning station of cleaning systems of the present invention, and described precleaning station is used for removing bigger particle by the cascade type injector of deionized water;

Fig. 3 is the sectional view along the III of the line shown in Fig. 2-III intercepting;

Fig. 4 is applied to cleaning systems of the present invention to clean the perspective view of the primary structure at station by making the moistening first cleaning station and second of described brush;

Fig. 5 is applied to the vertical cross-section diagram that the deionized water fluidal texture in the brush at station is cleaned at the first cleaning station and second;

Fig. 6 is arranged on the perspective view of the primary structure of first scouring stage between the first cleaning station and the second cleaning station, and described first scouring stage is used for carrying out flushing process after the cleaning course at the first cleaning station, and is used to change the wafer handling direction;

Fig. 7 is the schematic top view that expression enters the state of the first scouring stage inside by the first cleaning station clean chip by the transmission conveyer;

Fig. 8 represents by thereby the direction change and the transfer roller that transmit between the conveyer are moved up wafer from transmitting the upwards schematic side elevation of the state of rising of conveyer;

Fig. 9 be expression be positioned at that direction changes and transfer roller on wafer be sent to the schematic top view of the state at the second cleaning station, wherein said wafer is in the direction of change along with the rotation of direction change and transfer roller;

Figure 10 is after the cleaning course at the second cleaning station, carries out the perspective view of primary structure of second scouring stage of flushing process;

Figure 11 is applied to the perspective view of primary structure that the present invention utilizes the drying station of centrifugal force.

Embodiment

Semiconductor chip cleaning system is according to the preferred embodiment of the present invention described below with reference to the accompanying drawings in more detail.

Fig. 1 to Figure 11 is the figure that explains according to semiconductor chip cleaning system C of the present invention.More specifically, Fig. 1 is according to the deployment structure of the various piece of semiconductor chip cleaning system C of the present invention and the schematic diagram that is connected in a plane as polishing module P and wafer receiver module F with peripheral unit thereof; Fig. 2 is the schematic diagram of primary structure that is applied to the precleaning station 10 of cleaning systems C of the present invention, and described precleaning station is used for removing bigger particle by the cascade type injector 18 of deionized water; Fig. 3 is the sectional view along line III shown in Figure 2-III intercepting; Fig. 4 is applied to cleaning systems C of the present invention to clean the perspective view of the primary structure at station 40 by making the described brush 21 first moistening cleaning stations 20 and second; Fig. 5 is applied to the vertical cross-section diagram that the deionized water fluidal texture in the brush 21 at station 40 is cleaned at the first cleaning station 20 and second; Fig. 6 is arranged on the perspective view of the primary structure of first scouring stage 30 between 20 and second cleaning, 40 stations, the first cleaning station, described first scouring stage 30 is used for carrying out flushing process after the cleaning course at the first cleaning station 20, and is used to change the direction of transfer of wafer 1; Fig. 7 to Fig. 9 explains that in order wafer 1 changes the schematic top view and the end view of the principle of direction and transmission by first scouring stage 30; Figure 10 is after the cleaning course at the second cleaning station 40, carries out the perspective view of primary structure of second scouring stage 50 of flushing process; Figure 11 is applied to the perspective view of primary structure that the present invention utilizes the drying station 60 of centrifugal force.

Usually, as shown in Figure 1, between polishing module P and wafer receiver module (front equipment end module) F, be provided with cleaning systems (cleaner module) C, polishing module P is equipped with one or more CMP instrument that is used for meticulous polished wafer 1, and wafer receiver module F is used to pile up multi-disc wafer 1 and receives them.

Be provided with one or more loading attachment 3 among the polishing module P, be used to move (loadings) wafer 1, perhaps the wafer 1 that polishes is moved (unloading) to subsequently cleaning systems C from workbench 2 on the workbench 2 of every CMP instrument, to polish.Manipulator 5 is connected with loading attachment 3, be used for after loading attachment 3 is caught wafer 1, wafer 1 is sent to the precleaning station 10 of cleaning systems C, perhaps be used at the manipulator (not shown) by another setting after the boxlike work stage 4 of wafer receiver module F is caught wafer 1, the wafer 1 that sends being sent to loading attachment 3.

Semiconductor cleaning systems C according to the present invention comprises: precleaning station 10, and described precleaning station 10 is by removing bigger particle on the wafer 1 spraying deionized water on the wafer 1 in advance; The first cleaning station 20, the described first cleaning station 20 is a pair of brush 21 that contacts with the front and rear surfaces of wafer 1 by the friction rotary setting, and by spray chemicals on wafer 1, is used for the remaining particle of cleaning for the first time; First scouring stage 30, described first scouring stage 30 washes by spraying clean liquid to the first time on the clean chip 1; The second cleaning station 40, identical structure and the mode of the described second cleaning station, 40 utilizations and the first cleaning station is used for cleaning for the second time the particle that remains on wafer 1 front and rear surfaces by spraying chemicals; Second scouring stage 50, described second scouring stage 50 washes by spraying clean liquid to the second time on the clean chip 1; And dry station 60, the centrifugal force that described dry station 60 will utilize the wafer 1 by the high speed rotating flushing to be produced makes the clean liquid drying of remnants.

Transmit conveyer (with reference to the transmission conveyer 70 shown in figure 6 and Figure 10) by each and carry out the transmission of wafer between each station of the present invention, described transmission conveyer passes the partition wall between each station and installs.

As shown in Figures 2 and 3, precleaning station 10 is used for grasping and rotating wafer 1 by four guide reels 16, and be used for spraying with eliminating particle with the cascade shape from deionized water sprayer (the DIW cutter) 18 that is installed in wafer 1 top, thereby as being used for by spraying deionized water to remove the precleaning process of the bigger particle on the wafer 1 by high pressure de-ionized water.

Deionized water sprayer (DIW cutter) 18 is installed on the sidewall at precleaning station 10 vertically downward.On deionized water sprayer 18 1 sides, be formed with the deionized water supply orifice 18a that is used for from outside supplying deionized water.When by deionized water supply orifice 18a supply high pressure de-ionized water, deionized water sprays with the cascade shape by the spray-hole that forms slotted hole, and particle is pushed to the edge of wafer 1.Like this, the cascade shape by high pressure is sprayed the eliminating particle effect that can obtain maximum.In some other embodiment, after spraying chemicals and carrying out chemical reaction, before carrying out the precleaning process, can carry out flushing process by deionized water sprayer 18 by deionized water.

Each guide reel 16 is designed for by the state that keeps the close attachment of wafer 1 surrounding edge in its groove and drives wafer 1 rotation.Guide reel 16 can move up and down in less width, and when entering or leaving precleaning station 10 with convenient wafer 1, each guide reel 16 can not disturb wafer 1.That is to say that the supporting bracket 11 that has through hole in appropriate position is vertically fixed on a side at precleaning station 10.Rising and decline guide rail 11a vertically are integrally formed in the outside of supporting bracket 11.Rising is connected with decline guide rail 11a with rising with decline plate 13, and rising and decline plate 13 can be along rising and decline guide rail 11a rising and decline.Cylinder body 12 is vertically fixed on supporting bracket 11 bottoms, and the lower end of rising and decline plate 13 1 ends integrally is connected the piston rod 12a of cylinder body 12, thereby rising and decline plate 13 rise and descend by the driving of cylinder body 12.An end of housing 17 that is used to hold the roll shaft 16a of each guide reel 16 integrally is fixed on by through hole and rises and decline plate 13, thereby can be with rising and decline plate 13 rise and descend.Here, be equipped with at housing 17 tops and can open the lid 17a that safeguards.Roll shaft 16a is contained in the housing 17 and by bearing 16d and rotatably supports.Driven pulley 16c is separately fixed on the roll shaft 16a, is used for the engagement by band 15b.Motor 14 is fixed on a side of rising and decline plate 13, the driven pulley 16b that forms on driving pulley 14a that 14 one ends of motor form and the roll shaft 16a at arbitrary guide reel 16 is by band 15a engagement, like this, each guide reel 16 rotation simultaneously with the rotation of driving pulley 14a.

Therefore, the present invention designs that rise in the position and decline plate 13, housing 17, each guide reel 16 and motor 14 all rise and descend with the operation of cylinder body 12.

Simultaneously, as shown in Figure 4, the first cleaning station 20 comprises a pair of guide reel 23, a pair of brush 21 and a pair of chemical species injection device 26 that supports and rotate wafer 1 lateral edges.The first cleaning station 20 is the brush 21 that contacts with wafer 1 front and rear surfaces by the friction rotary setting, and sprays chemicals by the chemical species injection device 26 that is provided with separately, as the main cleaning course that is used for cleaning for the first time residual particles.

As shown in Figure 4 and Figure 5, brush 21 is made by moistening sponge such as porous PVA, and is formed with countless tiny contact protrusion 21a on the outer surface of brush 21.Brush 21 is by the two sides of direct contact wafer 1, under the effect of the physical force that produces of rotatablely moving, carries out the function that brushes away particles such as medium size particle and small sized particles.And brush 21 is pressed the fixed-direction rotation, make wafer have the trend of moving towards guide reel 23, and the gap that brush 21 is designed between the brush 21 can be regulated.In addition, brush 21 has hollow cylindrical, and brush axle 22 is inserted in wherein by hollow space.The two ends of brush axle 22 are rotatably installed on the two side at precleaning station 10.Be formed with the flow channel 22a that is used for supplying deionized water in brush axle 22 inside, radial direction along brush axle 22 inwalls is formed with a plurality of hole 22b that are used to spray deionized water, like this, flow channel 22a that can be by being used for supplying deionized water and be used to spray the hole 22b of deionized water to brush 21 supplying deionized waters.Here, by brush 21 supplying deionized waters as making brush remain on a kind of measure of appropriate moisture state during the free time when brush 21.

As (referring to Fig. 3) shown in the structure of the guide reel 16 at precleaning station 10, each guide reel 23 has syndeton, and in this syndeton, the roll shaft 23a that are contained in the housing 25 cooperate with pivot 24, to pass through to be with (not shown) driven roller.Each guide reel 23 also has the function of stop, when causing wafer 1 to travel forward by the rotation of brush 21, and the edge of described stop supporting wafers 1.In addition, the pivot 24 that is used for driven roller has makes the swing mechanism of (perhaps along two side directions) of each guide reel 23 in fixing angular range, so that can not disturb the motion of wafer 1.

In addition, chemical species injection device 26 has hollow cylindrical, is formed with the flow channel 26a that is used for the supplying chemical thing in hollow space.On the outer surface of chemical species injection device 26, be formed with a plurality of injection nozzle 26b.Chemical species injection device 26 is symmetricly set on wafer 1 two sides.

Simultaneously, as shown in Figure 6, first scouring stage 30 washes this wafer by spraying clean liquid (for example, deionized water etc.) in the first time on the clean chip 1, and comprises transmission conveyer 70 and a pair of clean liquid injector 37 that is used for forwarding along the direction of motion wafer 1.

Transmitting conveyer 70 comprises: be set in parallel in conveyer belt wheel 71, the 71a that transmits conveyer 70 both sides with predetermined gap, be connected the conveyer band 72 between conveyer belt wheel 71, the 71a, and the conveyer support 73 that is used to support conveyer belt wheel 71,71a.Here, conveyer belt wheel 71a is different slightly on its structure with another conveyer belt wheel 71.But the variation between them is that simple designs changes, and promptly conveyer belt wheel 71a has two short part-structures that separate, and changes and conveyer to prevent interference radiating way, and this will be discussed in more detail below.

Clean liquid injector 37 is different with the structure of the above-mentioned first cleaning station 20 chemical species injection devices 26.That is to say that clean liquid injector 37 has hollow cylindrical, in hollow space, be formed with the flow channel 37a that is used to supply clean liquid, and be formed with a plurality of injection nozzle 37b on the outer surface.

And, except the structure of first scouring stage 30, the present invention comprises that also direction changes and transfer roller device (RAT: the right angle transmits), this device is designed for after wafer enters the process and flushing process thereof of first scouring stage 30, when the cleaner process that wafer 1 is moved to subsequently, with direction of motion change 90 degree of wafer 1.Like this, each station changes to the L type from being arranged in parallel of prior art and arranges, therefore be arranged to connect peripheral unit as polishing module P and wafer receiver module F etc., this provides a kind of structure of making cramped construction, can be applied to comprise the whole unit of cleaning systems, and the efficient maximum that whole unit is taken up space.

In other words, direction changes and transfer roller device (RAT) is set to: rise and the rising and the 33 vertical settings of decline plate of decline by certain linear electric machine (for example, the rising at precleaning station 10 with lowering means etc.); A plurality of roller supports 32 be vertically fixed on rise and a sidewall of decline plate 33 on and parallel to each other with the fixed interval (FI), and be arranged on respective rollers support 32 inside; And change and transfer roller 31 is separately positioned on a plurality of directions changes and the transfer roller 31 that the mode of roller support 32 inside supports with direction, like this, direction change and the two ends of transfer roller 31 can rise and an end of sidewall of decline plate 33 and roller support 32 between rotate.All directions change and transfer roller 31 is arranged between the conveyer belt wheel 71a that transmits conveyer 70, and can the phase mutual interference.

Therefore, direction changes and transfer roller 31 is transmitting between the conveyer 70 along with rising and the rising of decline plate 33 and descending motion and rise and descend, without any interference.The principle that direction changes and the direction of conveyer realization wafer 1 changes and transmits will sequentially be described with reference to the drawings below.

At first, shown in the plane graph of Fig. 7, wafer 1 enters first scouring stage 30 on resting on the conveyer band 72 that transmits conveyer 70 after the process that finishes the first cleaning station 20, spray deionized waters by clean liquid injector 73 then and carry out flushing process.Then, shown in the end view of Fig. 8, when rising and 33 risings of decline plate, place conveyer band 72 following directions change and the transfer rollers 31 that transmit conveyer 70 transmitting the position that rises between the conveyer 70 a little more than conveyer band 72, therefore the wafer 1 that will be on the conveyer band 72 lifts.Under this state, shown in the plane graph of Fig. 9,, be in top movement of wafers direction and change 90 degree when direction changes and transfer roller 31 forwards to when forwarding direction, wafer 1 enters second cleaning and stands 40.

Simultaneously, the second cleaning station 40 is used for by spraying chemicals residual particles on clean wafer 1 front and rear surfaces for the second time, and these chemicals can be identical or different with the used chemicals in the first cleaning station 20.The second cleaning station 40 has structure and the methods (referring to Fig. 4 and Fig. 5) identical with the first cleaning station 20, therefore omits its specific explanations here, represents identical parts with identical reference number in the first cleaning station 20 and the second cleaning station 40.

And as shown in figure 10, second scouring stage 50 is used for realizing by spray clean liquid (for example, deionized water etc.) on second clean chip 1 final flushing.Second scouring stage 50 comprises the transmission conveyer 70 that is used to transmit wafer 1, and is installed in wafer 1 top and is used for clean liquid injector 51 to wafer 1 jet surface deionized water.Reference number 51b represents injection nozzle, ultrasonic unit (Mega-sonic) can be installed in addition second scouring stage 50 as a kind of selection, thereby can carry out cleaning course simultaneously by ultrasound procedure, thereby can realize the effect of final cleaning more effectively.

Independent and wash wafer 1 fully by second scouring stage 50, flushing process of the present invention can be more effective than the flushing process of prior art, in the flushing process of prior art, cleaning process is being carried out simultaneously at drying station 60 subsequently, therefore can estimate that the processing time that shortens dry station has obvious effects more, and this is the principal element of delay phenomenon in the present whole cleaning course.

Simultaneously, as shown in figure 11, (SRD: the spin rinse drying) 60 are used to make wafer 1 high speed rotating of final flushing, and utilize its centrifugal force to make remaining clean liquid such as deionized water drying at dry station.Dry station 60 comprises the finger gripping device, is used to grasp wafer 1 and makes its high speed rotating.

Refer to that gripping device is to be used for equidistantly grasping the edge of wafer 1 and making its high speed rotating.In referring to gripping device, centre rotational axis 65 extends upward, the power drive rotation that centre rotational axis 65 is transmitted by the drive unit 66 that is arranged on the bottom.At the top of centre rotational axis 65, be formed with five otch equidistantly at its longitudinal direction along centre rotational axis 65 circumferential peripheries.Joystick 64 radially passes five otch respectively and stretches out, and has same distance and also can move up and down along five otch.Index arm 62 vertically is provided with in the mode that each index arm 62 is connected in each joystick 64 1 end by swivel pin 64a in rotatable state, thereby each index arm 62 cooperates with each joystick 64 when each joystick 64 motion.At the top of index arm 62, grasp finger 61 and form integral body with index arm 62 respectively, each grasps and refers to that 61 have the groove that can hold wafer 1 edge.At the swivel pin 64a of index arm 62 and grasp and be provided with connector between referring to 61.In connector, central axis pin 63 is connected to support plate, is used for supporting wafers 1 when packing wafer 1 into, and plays the function of pivot, to carry out index arm 62 and to grasp the relative swing that refers between 61.

Grasp and refer to that 61 have the operating structure that is similar to a finger, as finger each other with the fixed interval (FI) widely separately after, finger tips grasps the edge of disk etc.

By the structure of above-mentioned finger gripping device, five grasp and refer to that 61 grasp the wafer 1 that is loaded on the support plate securely, thereby can rotate simultaneously when central shaft 65 rotations.When unloading wafer 1, by mechanical handling joystick 64 is shunk to the center position of centre rotational axis 65, and the bottom of pulling index arm 62, thereby, grasp and refer to that 61 top is round radially launching as the central axis pin 63 of pivotal point and unclamping wafer 1.When grasping wafer 1, carry out the operation opposite with aforesaid operations, therefore omit its detailed description here.

And five grasp finger 61 along the circumferential periphery disposed at equal distance, thereby grasp distance maintenance 72 degree that refer between 61.Particularly, though flat district type wafer 1 when input without any alignment function, at least four effectively grasp and refer to that 61 grasp the periphery of wafer 1, cover 216 degree, far surpass 180 degree, thereby can keep the firm state that grasps.This makes the stability of this device obviously be better than having four prior art structural instability states that grasp finger, and wherein the prior art structure effectively grasps finger by at least three and only grasps 180 degree scopes along wafer perimeter when importing flat district type wafer 1 without any alignment function.

Therefore, be five and grasp and refer to 61 types to make the present invention, can both realize being maintained fixed the rock-steady structure of the state of grasping regardless of wafer 1 input direction by wafer being grasped architecture advances, and when the wafer high speed rotating to wafer without any damage.

Those of ordinary skills are understood that easily the quantity that grasps finger 61 can be carried out different designs according to flat district type wafer or breach type wafer.In other words, grasp and refer to that type can be designed for five of flat district type wafer respectively and grasp and refer to 61, be used for three or four of breach type wafer and grasp and refer to 61.But no matter the type of wafer 1 how, above-mentioned arbitrary grasping refers to that structure can be applied to according in the dry station 60 according to the present invention.Five structures that grasp finger are more preferably, so that directly input and handle wafer 1, and without any need for the operation of extra wafer aligned, and wafer etc. for example.

In addition,, if desired, can comprise deionized water or nitrogen jet device in addition, be used for before carrying out dry run, spray deionized water (or nitrogen) and also carry out final flushing process at drying 60 tops of standing.In this case, when low speed rotation refers to gripping device, the injection deionized water also carries out after the flushing process, when high speed rotating refers to gripping device, spray nitrogen, thereby realize the improvement of drying property, and the reaction by the oxygen that exists in nitrogen and the air, the anti-oxidant treatment on realization wafer 1 surface.

Though the execution mode has with reference to the accompanying drawings been described the present invention, this is construed as indicative, rather than restrictive.Therefore, those of ordinary skills are noted that and can imagine the execution mode that obtains carrying out various modification and equivalence, and should fall within the scope of the present invention.Therefore, range of the present invention and scope should be limited by claim.

Industrial usability

Chip cleaning system of the present invention is by in the cleaning station and scouring stage that arrange respectively and independently Carry out clean operation and the flushing operation of the wafer of surface finish, make wafer enter the wait at each cleaning station Shortest time, thereby by the delay phenomenon in the whole wafer fabrication process of solution, and improve significantly brilliant Sheet productivity ratio.

Claims (6)

1. semiconductor chip cleaning system comprises:

The precleaning station, described precleaning station is by removing particle on the wafer spraying deionized water on the wafer in advance;

A pair of brush that the first cleaning station, the described first cleaning station contacts with the wafer front-back by the friction rotation and the chemical species injection device by independent setting on wafer, clean the particle of remnants with chemical species injection for the first time;

First scouring stage, described first scouring stage washes by spray clean liquid on the first cleaning station clean chip first time;

The second cleaning station, the described second cleaning station utilizes and identical structure and the mode in the first cleaning station, by the independent chemical species injection device that is provided with chemical species injection to washing for the first time on the clean chip at first scouring stage, come the particle of clean wafer front-back remnants for the second time;

Second scouring stage, described second scouring stage washes by spray clean liquid on the second cleaning station clean chip second time; And

The dry station, described dry station utilize the centrifugal force by the wafer generation of high speed rotating second scouring stage flushing to come dry remaining clean liquid.

2. semiconductor chip cleaning system according to claim 1,

Wherein first scouring stage comprises that also direction changes and conveyer, compare with the approach axis that the first time, clean chip entered first scouring stage, with enter subsequently cleaner process the first time clean chip the direction of motion change 90 degree, and clean chip is sent in the described cleaner process subsequently for the first time.

3. semiconductor chip cleaning system according to claim 2,

Wherein said direction changes and conveyer comprises: rise and the decline plate, described rising and decline plate are vertically disposed and pass through a linear motion device and rise and descend; A plurality of roller supports, described roller support is vertically fixed on the sidewall of rising and decline plate abreast with the fixed interval (FI) to each other, and be arranged on the wafer that is used to send between the transmission conveyer from prior process, and do not form the interference between roller support and the transmission conveyer; And a plurality of directions change and transfer roller, described direction changes and the supporting way of transfer roller is that described direction changes and transfer roller is separately positioned on the roller internal stent, thereby direction change and transfer roller two ends can rotate between sidewall of rising and decline plate and end of roller support.

4. semiconductor chip cleaning system according to claim 1,

Wherein said precleaning station comprises: wafer grasps and whirligig; And deionized water sprayer, described deionized water sprayer is contained in the wafer top, removes bulky grain by spraying deionized water with the cascade shape when the supply high pressure de-ionized water;

And described wafer grasps with whirligig and comprises: supporting bracket vertically forms in the described supporting bracket and rises and the decline guide rail; Rise and the decline plate, described rising and decline plate combine with rising and decline guide rail, so that by rising and the guiding of decline guide rail; Cylinder body, this cylinder body are vertically fixed on described supporting bracket bottom, and the lower end of described rising and decline plate integrally is connected the piston rod of described cylinder body, thereby described rising and decline plate rise and descend by the driving of described cylinder body; And a plurality of guide reels, described guide reel drives rotation simultaneously by one or more drive sources, after grasping wafer, make its rotation, the roll shaft of described each guide reel is contained in the housing, one end overall fixed of this housing is on rising and decline plate, thereby rise and descend with rising and decline plate, so that when the loading and unloading wafer, do not disturb wafer.

5. semiconductor chip cleaning system according to claim 1,

The wherein said first cleaning station and the second cleaning station comprise respectively: a pair of brush, described brush comes clean wafer by two surfaces of contact wafer, described brush is made by moistening sponge, only carries out moistening processing can be at supplying deionized water the time through the flow channel of supplying deionized water when brush is idle; And the chemical species injection device, described chemical species injection device is provided with towards two sides of wafer symmetrically, and can only flow through chemicals and spray chemicals.

6. semiconductor chip cleaning system according to claim 1,

Wherein said dry station comprises: centre rotational axis, and described centre rotational axis extends upward, and can rotate under the power of the drive unit transmission that is arranged at its bottom; 5 otch, described otch at the centre rotational axis top in its neighboring equidistantly along its vertical formation; Joystick, described joystick radially pass described 5 otch respectively and stretch out, and have same distance, can move up and down along otch respectively; Index arm, described index arm is vertically arranged, mounting means is that each index arm is connected each joystick one end by swivel pin with rotatable state, thus each index arm when each control lever movement and each joystick be combined together; Grasp finger, the described finger that grasps forms integral body with index arm respectively at the index arm top, and each grasps and refers to have the groove that can receive Waffer edge; Connector, described connector are in the swivel pin top of index arm and grasp between the finger, and in connector, central axis pin is connected to support plate, when packing wafer into, be used for supporting wafers, and play the function of pivot, carry out index arm and the relative swing that grasps between the finger.

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