CN103231303B - Chemical-mechanical polisher - Google Patents
Chemical-mechanical polisher Download PDFInfo
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- CN103231303B CN103231303B CN201310180314.XA CN201310180314A CN103231303B CN 103231303 B CN103231303 B CN 103231303B CN 201310180314 A CN201310180314 A CN 201310180314A CN 103231303 B CN103231303 B CN 103231303B
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- 238000004140 cleaning Methods 0.000 claims abstract description 65
- 238000001035 drying Methods 0.000 claims abstract description 58
- 230000001680 brushing effect Effects 0.000 claims abstract description 50
- 238000005498 polishing Methods 0.000 claims abstract description 39
- 230000007704 transition Effects 0.000 claims abstract description 17
- 230000000712 assembly Effects 0.000 claims abstract description 9
- 238000000429 assembly Methods 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 9
- 238000005201 scrubbing Methods 0.000 claims description 6
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 description 270
- 239000002245 particle Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 230000003749 cleanliness Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 239000013043 chemical agent Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000012512 characterization method Methods 0.000 description 2
- 230000009189 diving Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of chemical-mechanical polisher.Described chemical-mechanical polisher comprises: for the brilliant box loading attachment of storing wafer; For carrying the wafer transfer device of wafer; First manipulator; Chemical-mechanical polishing mathing; For placing the wafer transition apparatus of wafer; Second manipulator; Wafer cleaning device, wafer cleaning device comprises the first noumenon with the first container cavity, the wafer cleaning assembly being located at the first wafer support assembly in the first container cavity and being located on the first noumenon; Wafer brushing device, wafer brushing device comprises second body with the second container cavity and the wafer brush assemblies be located in the second container cavity and the second wafer support assembly; Wafer drying device, wafer drying device comprises the 3rd body and the drying wafer assembly be located in the 3rd container cavity and the 3rd wafer support assembly with the 3rd container cavity; With the 3rd manipulator.According to the chemical-mechanical polisher of the embodiment of the present invention, there is the advantages such as cleaning performance is good.
Description
Technical field
The present invention relates to a kind of chemical-mechanical polisher.
Background technology
There is the defect of cleaning performance difference in existing chemical-mechanical polisher.
Summary of the invention
The present invention one of is intended to solve the problems of the technologies described above at least to a certain extent or at least provides a kind of useful business to select.For this reason, one object of the present invention is to propose a kind of chemical-mechanical polisher.
To achieve these goals, according to embodiments of the invention, a kind of chemical-mechanical polisher is proposed.Described chemical-mechanical polisher comprises: for the brilliant box loading attachment of storing wafer; For carrying the wafer transfer device of wafer; For wafer to be transported to the first manipulator of described wafer transfer device from described brilliant box loading attachment, described first manipulator is located between described brilliant box loading attachment and described wafer transfer device; Chemical-mechanical polishing mathing; For placing the wafer transition apparatus of wafer; For wafer being transported to described chemical-mechanical polishing mathing from described wafer transfer device and being transported to the second manipulator of described wafer transition apparatus from described chemical-mechanical polishing mathing, described second manipulator is located at described wafer transfer device, between described wafer transition apparatus and described chemical-mechanical polishing mathing; Wafer cleaning device, the wafer cleaning assembly that described wafer cleaning device comprises the first noumenon with the first container cavity, the first wafer support assembly being located at supporting wafer vertically in described first container cavity and is located on described the first noumenon, the first side wall of described first container cavity is provided with the first notch of the first side wall of through described first container cavity in left-right direction; Wafer brushing device, described wafer brushing device comprises the second wafer support assembly of second body with the second container cavity and the wafer brush assemblies be located in described second container cavity and supporting wafer vertically, and the first side wall of described second container cavity is provided with the second notch of the first side wall of through described second container cavity in left-right direction; Wafer drying device, described wafer drying device comprises the 3rd wafer support assembly of the 3rd body with the 3rd container cavity and the drying wafer assembly be located in described 3rd container cavity and supporting wafer vertically, the first side wall of described 3rd container cavity is provided with the 3rd notch of the first side wall of through described 3rd container cavity in left-right direction, and the second sidewall of described 3rd container cavity is provided with the 4th notch of the second sidewall of through described 3rd container cavity in left-right direction; And at described wafer transition apparatus, described wafer cleaning device, carry the 3rd manipulator of wafer between described wafer brushing device and described wafer drying device, described 3rd manipulator be located at described wafer transition apparatus, described wafer cleaning device, between described wafer brushing device and described wafer drying device.
Chemical-mechanical polisher according to the embodiment of the present invention passes through at described wafer cleaning device, arranging in described wafer brushing device and described wafer drying device can the described first wafer support assembly of supporting wafer vertically, described second wafer support assembly and described 3rd wafer support assembly, thus in cleaning, scrub and during described dry wafer, make described wafer be in vertical duty, the pollutant washed and particle can (two surfaces of described wafer refer to two round sides of described wafer along two of a described wafer surface, as follows) flow down vertically, and can not stay on two surfaces of described wafer, the cleaning performance of described wafer can be improved thus widely, avoid cleaning not thoroughly and the possibility of secondary pollution.
And, the first notch that the first side wall of through described first container cavity is in left-right direction set is passed through according to the chemical-mechanical polisher of the embodiment of the present invention, second notch of the first side wall of through described second container cavity in left-right direction, 3rd notch of the first side wall of through described 3rd container cavity and the 4th notch of the second sidewall of through described 3rd container cavity in left-right direction in left-right direction, thus can from described wafer cleaning device, pick and place described wafer the side vertical of described wafer brushing device and described wafer drying device, pollutant in wafer transfer mechanism (described first manipulator and described 3rd manipulator and drive unit thereof) and particle can not enter into described wafer cleaning device, the inside of described wafer brushing device and described wafer drying device, avoid the pollution to described wafer.
Therefore, according to the chemical-mechanical polisher of the embodiment of the present invention, there is the advantages such as cleaning performance is good.
In addition, chemical-mechanical polisher according to the above embodiment of the present invention can also have following additional technical characteristic:
According to one embodiment of present invention, each in described first wafer support assembly and described second wafer support assembly comprises: the first driving wheel and the second driving wheel; Motor, described motor to be located on described the first noumenon and to be connected for driving described first driving wheel and described second driving wheel to rotate with described first driving wheel with described second driving wheel; Pinch roller, described pinch roller cooperates with described first driving wheel and described second driving wheel and supports described wafer and described wafer is vertically directed; With pinch roller actuator, described pinch roller actuator is located on described the first noumenon and with described pinch roller and is connected to drive described pinch roller to move up and down.
Cleaning described wafer, when scrubbing described wafer and the described wafer of drying, described wafer can be vertically directed like this, therefore from the cleaning of described wafer with scrub the particle that gets off and chemical agent and can flow downward vertically along with two surfaces along described wafer together with cleaning fluid (such as deionized water), and can not stay on two surfaces of described wafer, thus the cleanliness factor of described wafer can be improved widely.
According to one embodiment of present invention, described drying wafer assembly comprises: water tank, and described water tank can be located on described 3rd body up or down, and the roof of described water tank is provided with the notch of through along the vertical direction described roof for passing through wafer; Water tank actuator, described water tank actuator is located on described 3rd body and with described water tank and is connected to drive described water tank to move up and down; With IPA drying system, described IPA drying system is located on described water tank for the described wafer of drying.Described drying wafer assembly has the advantages such as structure is simple, drying effect is good.
According to one embodiment of present invention, described 3rd wafer support assembly comprises: support, and described is erected on described 3rd body; Lower gripper jaw support, described lower gripper jaw support is L shape, and the vertical limb of described lower gripper jaw support is connected with described support and the lower end of described vertical limb is stretched in described water tank; Gripper jaw on gripper jaw and second on first; Upper gripper jaw actuator, it is upper and be connected to drive on described first gripper jaw on gripper jaw and described second to move up and down with gripper jaw on gripper jaw on described first and described second that described upper gripper jaw actuator is located at described support and in described lower gripper jaw support; With lower gripper jaw, described lower gripper jaw is located on the horizontal limb of described lower gripper jaw support, and wherein said lower gripper jaw cooperates with gripper jaw on gripper jaw and second on described first and supports described wafer and described wafer is vertically directed.
According to one embodiment of present invention, described wafer cleaning assembly comprises: the 1,000,000 sound shower nozzle and the 2,000,000 sound shower nozzle, described 1,000,000 sound shower nozzle and described 2,000,000 sound shower nozzle being axially located at interval in described first container cavity to be respectively used to clean two surfaces of described wafer at described wafer; With million sound shower nozzle actuators, described million sound shower nozzle actuators are located at and are connected with described 2,000,000 sound shower nozzle on described the first noumenon and with described 1,000,000 sound shower nozzle to drive described 1,000,000 sound shower nozzle and described 2,000,000 sound shower nozzle along the radial translation of described wafer.
According to one embodiment of present invention, described wafer brush assemblies comprises the first hairbrush and the second hairbrush, and described first hairbrush and described second hairbrush are arranged to be respectively used to two surfaces scrubbing described wafer relatively and at interval.Described wafer brush assemblies has the advantages such as structure is simple, washing effect is good thus.
According to one embodiment of present invention, described chemical-mechanical polisher also comprises frame, described wafer cleaning device, described wafer brushing device and described wafer drying device are located in described frame, wherein said wafer brushing device is positioned at the downstream of described wafer cleaning device, and described wafer drying device is positioned at the downstream of described wafer brushing device.Can install described wafer cleaning device, described wafer brushing device and described wafer drying device more easily, firmly thus.
According to one embodiment of present invention, described wafer brushing device is two, a described wafer brushing device is positioned at the downstream of described wafer cleaning device, wafer brushing device described in another is positioned at the downstream of a described wafer brushing device and is positioned at the upstream side of described wafer drying device, described chemical-mechanical polishing mathing is multiple, and multiple described chemical-mechanical polishing mathing is arranged side by side.By arranging two described wafer brushing devices, can successively carry out scrubbing for twice to described wafer, thus the cleanliness factor of described wafer can be improved further.
According to one embodiment of present invention, each in described first manipulator, described second manipulator and described 3rd manipulator comprises pedestal and is arranged on the arm on described pedestal.
According to one embodiment of present invention, described pedestal is arranged movably, and described arm is two and each described arm is joint arm.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the top view of the chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 2 is the structural representation of the chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 3 is the structural representation of the chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 4 is the structural representation of the chemical-mechanical polishing mathing of chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 5 is the partial structurtes schematic diagram of the chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 6 is the partial structurtes schematic diagram of the chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 7 is the partial structurtes schematic diagram of the chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 8 is the partial structurtes schematic diagram of the chemical-mechanical polisher according to the embodiment of the present invention;
Fig. 9 is the partial structurtes schematic diagram of the chemical-mechanical polisher according to the embodiment of the present invention;
Figure 10 is the structural representation of the wafer cleaning device of chemical-mechanical polisher according to the embodiment of the present invention;
Figure 11 is the structural representation of the wafer brushing device of chemical-mechanical polisher according to the embodiment of the present invention;
Figure 12 is the structural representation of the wafer drying device of chemical-mechanical polisher according to the embodiment of the present invention.
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the present invention, and can not limitation of the present invention be interpreted as.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " first " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " first " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature fisrt feature it " on " or D score can comprise first and directly contact with fisrt feature, also can comprise first and fisrt feature be not directly contact but by the other characterisation contact between them.And, fisrt feature fisrt feature " on ", " top " and " above " comprise fisrt feature directly over fisrt feature and oblique upper, or only represent that fisrt feature level height is higher than fisrt feature.Fisrt feature fisrt feature " under ", " below " and " below " comprise fisrt feature immediately below fisrt feature and tiltedly below, or only represent that fisrt feature level height is less than fisrt feature.
Below with reference to Fig. 1-Figure 12, the chemical-mechanical polisher 10 according to the embodiment of the present invention is described.As shown in Fig. 1-Figure 12, the brilliant box loading attachment 900 for storing wafer 800 is comprised according to the chemical-mechanical polisher 10 of the embodiment of the present invention, for carrying the wafer transfer device 500 of wafer 800, for wafer 800 to be transported to the first manipulator 710 of wafer transfer device 500 from brilliant box loading attachment 900, chemical-mechanical polishing mathing 100, for placing the wafer transition apparatus 600 of wafer 800, for wafer 800 is transported to chemical-mechanical polishing mathing 100 and chemically mechanical polisher 100 is transported to the second manipulator 720 of wafer transition apparatus 600 from wafer transfer device 500, wafer cleaning device 200, wafer brushing device 300, wafer drying device 400 and at wafer transition apparatus 600, wafer cleaning device 200, the 3rd manipulator 730 of wafer 800 is carried between wafer brushing device 300 and wafer drying device 400.
First manipulator 710 is located between brilliant box loading attachment 900 and wafer transfer device 500, and the second manipulator 720 is located at wafer transfer device 500, between wafer transition apparatus 600 and chemical-mechanical polishing mathing 100.The wafer cleaning assembly that wafer cleaning device 200 comprises the first noumenon 210 with the first container cavity, the first wafer support assembly being located at supporting wafer 800 vertically in the first container cavity and is located on the first noumenon 210, the first side wall of the first container cavity is provided with the first notch 212 of the first side wall of through first container cavity in left-right direction.Wafer brushing device 300 comprises the second wafer support assembly of second body 310 and the wafer brush assemblies be located in the second container cavity 311 with the second container cavity 311 and supporting wafer 800 vertically, and the first side wall of the second container cavity 311 is provided with the second notch 312 of the first side wall of through second container cavity 311 in left-right direction.
Wafer drying device 400 comprises the 3rd wafer support assembly of the 3rd body 410 and the drying wafer assembly be located in the 3rd container cavity with the 3rd container cavity and supporting wafer 800 vertically.The second sidewall that the first side wall of the 3rd container cavity is provided with the 3rd notch the 412, three container cavity of the first side wall of through 3rd container cavity is in left-right direction provided with the 4th notch of the second sidewall of through 3rd container cavity in left-right direction.3rd manipulator 730 be located at wafer transition apparatus 600, wafer cleaning device 200, between wafer brushing device 300 and wafer drying device 400.Wherein, left and right directions is as shown in the arrow A in Fig. 1, and above-below direction is as shown in the arrow B in Figure 10-Figure 12.
The method utilizing and carry out chemically mechanical polishing according to chemical-mechanical polisher 10 pairs of wafers 800 of the embodiment of the present invention is described referring to Fig. 1-Figure 12.
First, utilize the first manipulator 710 to take out unpolished wafer 800 from brilliant box loading attachment 900, and be put into by wafer 800 on the side of wafer transfer device 500, wafer 800 is transferred to the opposite side of wafer transfer device 500 by wafer transfer device 500.Wafer 800 is taken away and is put on chemical-mechanical polishing mathing 100 by the second manipulator 720 from wafer transfer device 500, and chemical-mechanical polishing mathing 100 pairs of wafers 800 carry out chemically mechanical polishing.After treating wafer 800 polishing, wafer 800 is taken away by the second manipulator 720, is put on wafer transition apparatus 600.Wafer 800 is taken away and is put in wafer cleaning device 200 wafer 800 to clean the wafer 800 after polishing by the first notch 212 by the 3rd manipulator 730.After treating that wafer 800 cleans, wafer 800 is taken out and is put in wafer brushing device 300 wafer 800 to scrub wafer 800 by the second notch 312 by the 3rd manipulator 730.After treating that wafer 800 is scrubbed, wafer 800 is taken out and is put in wafer drying device 400 wafer 800 to carry out drying to wafer 800 by the 3rd notch 412 by the 3rd manipulator 730.After treating wafer 800 drying, wafer 800 to be taken out by the 4th notch and is put into by wafer 800 in brilliant box loading attachment 900 by the first manipulator 710 from wafer drying device 400, now completes polishing to this wafer 800.
Chemical-mechanical polisher 10 according to the embodiment of the present invention passes through at wafer cleaning device 200, arranging in wafer brushing device 300 and wafer drying device 400 can the described first wafer support assembly of supporting wafer vertically, described second wafer support assembly and described 3rd wafer support assembly, thus in cleaning, scrub and during dry wafer 800, make wafer 800 be in vertical duty, the pollutant washed and particle can (two surfaces of wafer 800 refer to two round sides of wafer 800 along two of wafer 800 surface, as follows) flow down vertically, and can not stay on two surfaces of wafer 800, the cleaning performance of wafer 800 can be improved thus widely, avoid cleaning not thoroughly and the possibility of secondary pollution.
And, chemical-mechanical polisher 10 according to the embodiment of the present invention passes through the first notch 212 arranging the first side wall of through first container cavity in left-right direction, second notch 312 of the first side wall of through second container cavity 311 in left-right direction, 3rd notch 412 of the first side wall of through 3rd container cavity and the 4th notch of the second sidewall of through 3rd container cavity in left-right direction in left-right direction, thus can from wafer cleaning device 200, pick and place wafer 800 side vertical of wafer brushing device 300 and wafer drying device 400, pollutant in wafer transfer mechanism (the first manipulator 710 and the 3rd manipulator 730 and drive unit thereof) and particle can not enter into wafer cleaning device 200, the inside of wafer brushing device 300 and wafer drying device 400, avoid the pollution to wafer 800.
Therefore, according to the chemical-mechanical polisher 10 of the embodiment of the present invention, there is the advantages such as cleaning performance is good.
Particularly, the first side wall of the 3rd container cavity can be relative with the second sidewall of the 3rd container cavity.
As shown in Figure 10 and Figure 11, in some embodiments of the invention, each in described first wafer support assembly and described second wafer support assembly can comprise the first driving wheel 221, second driving wheel 222 (the first driving wheel 221 and the second driving wheel 222 can drive described wafer to rotate), motor (not shown), pinch roller (not shown) and pinch roller actuator 250.Motor 230 can be located on the first noumenon 210 and motor 230 can be connected for driving the first driving wheel 221 and the second driving wheel 222 to rotate with the second driving wheel 222 with the first driving wheel 221.Pinch roller 240 can cooperate with the first driving wheel 221 and the second driving wheel 222 and support described wafer and described wafer is vertically directed.Pinch roller actuator 250 can be located on the first noumenon 210, and pinch roller actuator 250 can be connected to drive pinch roller 240 to move up and down with pinch roller 240.Can be vertically directed by wafer 800.Like this cleaning wafer 800, scrub wafer 800 and dry wafer 800 time wafer 800 can be vertically directed, therefore clean from wafer 800 and scrub the particle that gets off and chemical agent and can flow downward vertically along with two surfaces along wafer 800 together with cleaning fluid (such as deionized water), and can not stay on two surfaces of wafer 800, thus the cleanliness factor of wafer 800 can be improved widely.
As shown in Figure 10, in one embodiment of the invention, described wafer cleaning assembly can comprise the 1,000,000 sound shower nozzle the 260, the 2,000,000 sound shower nozzle 270 and million sound shower nozzle actuators 280.1,000,000 sound shower nozzle the 260 and the 2,000,000 sound shower nozzle 270 can being axially located in the first container cavity can be respectively used to two surfaces of cleaning wafer 800 at wafer 800 at interval.Million sound shower nozzle actuators 280 can be located on the first noumenon 210, and million sound shower nozzle actuators 280 can be connected with the 2,000,000 sound shower nozzle 270 with the 1,000,000 sound shower nozzle 260 the 1,000,000 sound shower nozzle the 260 and the 2,000,000 sound shower nozzle 270 can be driven along the radial translation of wafer 800.
When cleaning wafer 800, the first driving wheel 221 and the second driving wheel 222 can be utilized to drive wafer 800 to rotate.Meanwhile, million sound shower nozzle actuators 280 can drive the 1,000,000 sound shower nozzle the 260 and the 2,000,000 sound shower nozzle 270 along the radial translation of wafer 800 and cleaning fluid (such as deionized water) can be sprayed onto on two surfaces of wafer 800 by the 1,000,000 sound shower nozzle the 260 and the 2,000,000 sound shower nozzle 270.
And when cleaning wafer 800, because wafer 800 can rotate and the 1,000,000 sound shower nozzle the 260 and the 2,000,000 sound shower nozzle 270 can do rectilinear motion along the radial direction of wafer 800, therefore by synthesis these two kinds motions, can clean the surface of whole wafer 800 rapidly.Therefore, according to the described wafer cleaning assembly of the wafer cleaning equipment 10 of the embodiment of the present invention can all sidedly, cleaning wafer 800 rapidly, and the particle on wafer 800 and chemical agent all can be washed, thus to reach better cleaning performance.
As shown in figure 11 (not shown second notch 312 of Figure 11), in a specific embodiment of the present invention, described wafer brush assemblies can comprise the first hairbrush 331 and the second hairbrush 332, first hairbrush 331 and the second hairbrush 332 can relatively and arrange to be respectively used to scrub two surfaces of wafer 800 at interval.Described wafer brush assemblies has the advantages such as structure is simple, washing effect is good.
When scrubbing wafer 800, the first driving wheel 221 and the second driving wheel 222 can be utilized to drive wafer 800 to rotate.Meanwhile, the first hairbrush 331 and the second hairbrush 332 can rotate to scrub two surfaces of wafer 800 along its axial direction.
In examples more of the present invention, as shown in figure 12 (not shown 3rd notch 412 of Figure 12 and the 4th notch), described drying wafer assembly can comprise water tank 30, water tank actuator 40 and IPA drying system 50.Water tank 30 can be located on the 3rd body 410 up or down, and the notch 31 that the roof 32 of water tank 30 is provided with through along the vertical direction roof 32 is for by wafer 800.Water tank actuator 40 is located on the 3rd body 410, and water tank actuator 40 is connected with water tank 30 to drive water tank 30 to move up and down.IPA drying system 50 is located on water tank 30 for dry wafer 800.Described drying wafer assembly has the advantages such as structure is simple, drying effect is good.
As shown in figure 12, in some embodiments of the invention, described 3rd wafer support assembly can to comprise on support 21, lower gripper jaw support 22, first gripper jaw 24, upper gripper jaw actuator 25 and lower gripper jaw 26 on gripper jaw 23, second.
Support 21 can be located on the 3rd body 410.Lower gripper jaw support 22 can be L shape, the vertical limb of lower gripper jaw support 22 can be connected with support 21, and vertically the lower end of limb can be stretched in water tank 30 (roof 32 of water tank 30 can be provided with the through hole of through along the vertical direction roof 32 for the lower end by vertical limb).Upper gripper jaw actuator 25 can be located in support 21 and lower gripper jaw support 22, and upper gripper jaw actuator 25 can be connected with gripper jaw 24 on gripper jaw on first 23 and second to drive on first gripper jaw 24 on gripper jaw 23 and second to move up and down.Lower gripper jaw 26 can be located on the horizontal limb of lower gripper jaw support 22, wherein plays gripper jaw 26 can to cooperate with gripper jaw 24 on gripper jaw on first 23 and second supporting wafer 800 and can be vertically directed by wafer 800.
Wafer cleaning device 200 can be application number is the wafer cleaning device disclosed in the patent application of 201110452447.9, wafer brushing device 300 can be application number is the wafer brushing device disclosed in the patent application of 201110448814.8, and wafer drying device 400 can be application number is the wafer drying device disclosed in the patent application of 201210240809.2.The application quotes in full the patent application that application number is 201110452447.9,201110448814.8 and 201210240809.2.
As shown in Figure 1-Figure 3, in an example of the present invention, chemical-mechanical polisher 10 can also comprise frame 201, and wafer cleaning device 200, wafer brushing device 300 and wafer drying device 400 can be located in frame 201.Wherein, wafer brushing device 300 can be positioned at the downstream of wafer cleaning device 200, and wafer drying device 400 can be positioned at the downstream of wafer brushing device 300.Can install wafer cleaning device 200, wafer brushing device 300 and wafer drying device 400 more easily, firmly thus.
As shown in Figure 1-Figure 3, advantageously, wafer brushing device 300 can be two, a wafer brushing device 300 can be positioned at the downstream of wafer cleaning device 200, another wafer brushing device 300 can be positioned at the downstream of a wafer brushing device 300, and another wafer brushing device 300 can be positioned at the upstream side of wafer drying device 400.By arranging two wafer brushing devices 300, can successively carry out scrubbing for twice to wafer 800, thus the cleanliness factor of wafer 800 can be improved further.
As shown in Figure 4, in some embodiments of the invention, chemical-mechanical polishing mathing 100 can comprise workbench 110, polishing disk 120, trimmer 130, polishing fluid conveyer 140, rubbing head support, loading/unloading platform 160 and rubbing head 170.Specifically, polishing disk 120 can be arranged on the upper surface of workbench 110, on the upper surface that trimmer 130 and polishing fluid conveyer 140 can be arranged on workbench 110 respectively and contiguous polishing disk 120.Described rubbing head support can be arranged on the upper surface of workbench 110, and loading/unloading platform 160 can be arranged on the upper surface of workbench 110.Rubbing head 170 can be rotatable and can be arranged on movably between polishing disk 120 and loading/unloading platform 160 on described rubbing head support.
Particularly, described rubbing head support can comprise horizontal base plate 151 and support side plate 152, horizontal base plate 151 can be formed with groove 153 through in the thickness direction thereof, and groove 153 can to extend towards the longitudinal other end of level at longitudinal open at one end of horizontal base plate 151.In other words, one end of groove 153 can be opened wide and the other end can be closed.Support side plate 152 can be connected with horizontal base plate 151 respectively and the both lateral sides that can lay respectively at groove 153 for support level substrate 151, wherein described longitudinal one end of horizontal base plate 151 can extend beyond support side plate 152 in the vertical to form cantilever end, and described cantilever end can reach the top of polishing disk 120.
In a concrete example of the present invention, as shown in Figure 4, the upper end of support side plate 152 can be connected with the bottom surface of horizontal base plate 151 respectively.Two horizontal base plates 151 can lay respectively at the both sides of groove 153 in the horizontal, and the left end of horizontal base plate 151 can extend longitudinally the left side exceeding support side plate 152, thus the left end of horizontal base plate 151 can form described cantilever end.The right-hand member of horizontal base plate 151 can extend support side plate 152, also can be concordant with them.Described rubbing head support is similar to the form of diving tower, therefore also can be called diving platform-type rubbing head support.The basal surface of support side plate 152 can be positioned in same level, thus when on the workbench 110 that support side plate 152 is installed to chemical-mechanical polishing mathing 100, can ensure horizontal base plate 151 level.Particularly, horizontal base plate 151 can be U-shaped, and the blind end of groove 153 is arc.
As shown in Figure 4, in one embodiment of the invention, workbench 110 can be general rectangular framework.Described rubbing head support can be arranged on workbench 110, and the described cantilever end of the horizontal base plate 151 of described rubbing head support can extend to above polishing disk 120.On the upper surface that loading/unloading platform 160 can be arranged on workbench 110 and can between the below of described rubbing head support, two support side plate 152.Such as, the center of polishing disk 120 and loading/unloading platform 160 can be positioned on the longitudinal centre line of the groove 153 on horizontal base plate 151.
In an example of the present invention, as shown in Figure 4, on the upper surface of horizontal base plate 151, can be provided with two parallel guide rails 154 in the both lateral sides of groove 153, rubbing head 170 can be supported on guide rail 154 by bolster 155.Particularly, can be provided with slide block in the below of bolster 155, described slide block can be supported on guide rail 154 movably.Can be provided with drive motors 156 on bolster 155, the output shaft of drive motors 156 can be connected with the rubbing head 170 below bolster 155 by decelerator, to drive rubbing head 170 to rotate.Bolster 155 can be driven by servomotor 157 and longitudinally move on guide rail 154 and swing, thus rubbing head 170 can be moved to above polishing disk 120 respectively and above loading/unloading platform 160.
Chemical-mechanical polishing mathing 100 can be multiple, and multiple chemical-mechanical polishing mathing 100 can be arranged side by side.Chemically mechanical polishing can be carried out better thus to wafer 800.
As shown in Figure 1-Figure 3, each in the first manipulator 710, second manipulator 720 and the 3rd manipulator 730 can comprise pedestal 711 and be arranged on the arm 712 on pedestal 711.Advantageously, pedestal 711 can be arranged movably, and arm 712 can be for two and each arm 712 is joint arm.
In the description of this description, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and describe embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, those of ordinary skill in the art can change above-described embodiment within the scope of the invention when not departing from principle of the present invention and aim, revising, replacing and modification.
Claims (10)
1. a chemical-mechanical polisher, is characterized in that, comprising:
For the brilliant box loading attachment of storing wafer;
For carrying the wafer transfer device of wafer;
For wafer to be transported to the first manipulator of described wafer transfer device from described brilliant box loading attachment, described first manipulator is located between described brilliant box loading attachment and described wafer transfer device;
Chemical-mechanical polishing mathing;
For placing the wafer transition apparatus of wafer;
For wafer being transported to described chemical-mechanical polishing mathing from described wafer transfer device and being transported to the second manipulator of described wafer transition apparatus from described chemical-mechanical polishing mathing, described second manipulator is located at described wafer transfer device, between described wafer transition apparatus and described chemical-mechanical polishing mathing;
Wafer cleaning device, the wafer cleaning assembly that described wafer cleaning device comprises the first noumenon with the first container cavity, the first wafer support assembly being located at supporting wafer vertically in described first container cavity and is located on described the first noumenon, the first side wall of described first container cavity is provided with the first notch of the first side wall of through described first container cavity in left-right direction;
Wafer brushing device, described wafer brushing device comprises the second wafer support assembly of second body with the second container cavity and the wafer brush assemblies be located in described second container cavity and supporting wafer vertically, and the first side wall of described second container cavity is provided with the second notch of the first side wall of through described second container cavity in left-right direction;
Wafer drying device, described wafer drying device comprises the 3rd wafer support assembly of the 3rd body with the 3rd container cavity and the drying wafer assembly be located in described 3rd container cavity and supporting wafer vertically, the first side wall of described 3rd container cavity is provided with the 3rd notch of the first side wall of through described 3rd container cavity in left-right direction, and the second sidewall of described 3rd container cavity is provided with the 4th notch of the second sidewall of through described 3rd container cavity in left-right direction; With
For at described wafer transition apparatus, described wafer cleaning device, carry the 3rd manipulator of wafer between described wafer brushing device and described wafer drying device, described 3rd manipulator be located at described wafer transition apparatus, described wafer cleaning device, between described wafer brushing device and described wafer drying device.
2. chemical-mechanical polisher according to claim 1, is characterized in that, described first wafer support assembly comprises:
First driving wheel and the second driving wheel;
Motor, described motor to be located on described the first noumenon and to be connected for driving described first driving wheel and described second driving wheel to rotate with described first driving wheel with described second driving wheel;
Pinch roller, described pinch roller cooperates with described first driving wheel and described second driving wheel and supports described wafer and described wafer is vertically directed; With
Pinch roller actuator, described pinch roller actuator is located on described the first noumenon and with described pinch roller and is connected to drive described pinch roller to move up and down.
3. chemical-mechanical polisher according to claim 1, is characterized in that, drying wafer assembly comprises:
Water tank, described water tank can be located on described 3rd body up or down, and the roof of described water tank is provided with the notch of through along the vertical direction described roof for passing through wafer;
Water tank actuator, described water tank actuator is located on described 3rd body and with described water tank and is connected to drive described water tank to move up and down; With
IPA drying system, described IPA drying system is located on described water tank for the described wafer of drying.
4. chemical-mechanical polisher according to claim 3, is characterized in that, described 3rd wafer support assembly comprises:
Support, described is erected on described 3rd body;
Lower gripper jaw support, described lower gripper jaw support is L shape, and the vertical limb of described lower gripper jaw support is connected with described support and the lower end of described vertical limb is stretched in described water tank;
Gripper jaw on gripper jaw and second on first;
Upper gripper jaw actuator, it is upper and be connected to drive on described first gripper jaw on gripper jaw and described second to move up and down with gripper jaw on gripper jaw on described first and described second that described upper gripper jaw actuator is located at described support and in described lower gripper jaw support; With
Lower gripper jaw, described lower gripper jaw is located on the horizontal limb of described lower gripper jaw support, and wherein said lower gripper jaw cooperates with gripper jaw on gripper jaw and second on described first and supports described wafer and described wafer is vertically directed.
5. chemical-mechanical polisher according to claim 1, is characterized in that, described wafer cleaning assembly comprises:
1,000,000 sound shower nozzle and the 2,000,000 sound shower nozzle, described 1,000,000 sound shower nozzle and described 2,000,000 sound shower nozzle being axially located at interval in described first container cavity to be respectively used to clean two surfaces of described wafer at described wafer; With
Million sound shower nozzle actuators, described million sound shower nozzle actuators are located at and are connected with described 2,000,000 sound shower nozzle on described the first noumenon and with described 1,000,000 sound shower nozzle to drive described 1,000,000 sound shower nozzle and described 2,000,000 sound shower nozzle along the radial translation of described wafer.
6. chemical-mechanical polisher according to claim 1, it is characterized in that, described wafer brush assemblies comprises the first hairbrush and the second hairbrush, and described first hairbrush and described second hairbrush are arranged to be respectively used to two surfaces scrubbing described wafer relatively and at interval.
7. the chemical-mechanical polisher according to any one of claim 1-5, it is characterized in that, also comprise frame, described wafer cleaning device, described wafer brushing device and described wafer drying device are located in described frame, wherein said wafer brushing device is positioned at the downstream of described wafer cleaning device, and described wafer drying device is positioned at the downstream of described wafer brushing device.
8. chemical-mechanical polisher according to claim 7, it is characterized in that, described wafer brushing device is two, a described wafer brushing device is positioned at the downstream of described wafer cleaning device, wafer brushing device described in another is positioned at the downstream of a described wafer brushing device and is positioned at the upstream side of described wafer drying device, described chemical-mechanical polishing mathing is multiple, and multiple described chemical-mechanical polishing mathing is arranged side by side.
9. chemical-mechanical polisher according to claim 1, is characterized in that, each in described first manipulator, described second manipulator and described 3rd manipulator comprises pedestal and is arranged on the arm on described pedestal.
10. chemical-mechanical polisher according to claim 9, is characterized in that, described pedestal is arranged movably, and described arm is two and each described arm is joint arm.
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103831709B (en) * | 2014-03-17 | 2016-04-20 | 上海华虹宏力半导体制造有限公司 | chemical mechanical polishing device and method thereof |
| CN105598827B (en) * | 2016-01-05 | 2018-05-22 | 天津华海清科机电科技有限公司 | Chemical-mechanical polishing mathing |
| CN105619239A (en) * | 2016-02-26 | 2016-06-01 | 上海华力微电子有限公司 | Scratching-preventing chemical mechanical grinding device and chemical mechanical grinding method thereof |
| CN107866410B (en) * | 2016-09-26 | 2021-07-06 | 上海新昇半导体科技有限公司 | Integrated method and equipment for cleaning, drying and storing semiconductor crystal box |
| JP2018134710A (en) * | 2017-02-22 | 2018-08-30 | 株式会社荏原製作所 | Polishing device and polishing method of substrate |
| CN109732474A (en) * | 2019-01-30 | 2019-05-10 | 杭州众硅电子科技有限公司 | A kind of chemical-mechanical polisher and its wafer exchange mechanism and wafer transfer method |
| CN111180369A (en) * | 2020-02-20 | 2020-05-19 | 天津中环领先材料技术有限公司 | Semiconductor polished wafer cleaning equipment and cleaning method |
| CN111604810B (en) * | 2020-07-24 | 2020-11-03 | 杭州众硅电子科技有限公司 | Wafer transmission equipment, chemical mechanical planarization device and wafer transmission method |
| CN114871928B (en) * | 2022-04-29 | 2023-05-26 | 北京晶亦精微科技股份有限公司 | Mechanical planarization apparatus |
| CN116845014B (en) * | 2023-09-01 | 2023-11-21 | 苏州智程半导体科技股份有限公司 | Groove type wafer cleaning and drying equipment |
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