CN116288583A - Novel electroplating silver-plating process and equipment for laser pump source chip base - Google Patents
Novel electroplating silver-plating process and equipment for laser pump source chip base Download PDFInfo
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- CN116288583A CN116288583A CN202310567812.3A CN202310567812A CN116288583A CN 116288583 A CN116288583 A CN 116288583A CN 202310567812 A CN202310567812 A CN 202310567812A CN 116288583 A CN116288583 A CN 116288583A
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- chip base
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- pump source
- laser pump
- source chip
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- 238000007747 plating Methods 0.000 title claims abstract description 54
- 238000009713 electroplating Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000008569 process Effects 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- 238000001035 drying Methods 0.000 claims abstract description 48
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052709 silver Inorganic materials 0.000 claims abstract description 44
- 239000004332 silver Substances 0.000 claims abstract description 44
- 238000011010 flushing procedure Methods 0.000 claims abstract description 40
- 238000012546 transfer Methods 0.000 claims abstract description 34
- 238000004140 cleaning Methods 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052802 copper Inorganic materials 0.000 claims abstract description 22
- 239000010949 copper Substances 0.000 claims abstract description 22
- 238000005406 washing Methods 0.000 claims abstract description 16
- 239000002253 acid Substances 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 10
- 230000003647 oxidation Effects 0.000 claims abstract description 4
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims abstract description 4
- 230000000670 limiting effect Effects 0.000 claims description 41
- 239000007921 spray Substances 0.000 claims description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 31
- 230000000007 visual effect Effects 0.000 claims description 14
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000003921 oil Substances 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 239000003344 environmental pollutant Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 230000002427 irreversible effect Effects 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- -1 organic matters Substances 0.000 claims description 3
- 239000007800 oxidant agent Substances 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 231100000719 pollutant Toxicity 0.000 claims description 3
- 239000013049 sediment Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 150000003568 thioethers Chemical class 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 238000000861 blow drying Methods 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 abstract 1
- 230000009471 action Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004904 shortening Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of chip processing, and discloses a novel process and equipment for plating silver on a laser pump source chip base, wherein the novel process comprises the following steps: raw material processing, degreasing cleaning, acid cleaning, anodic oxidation, copper plating, silver plating, washing, drying and cleaning treatment; and provides a laser pump source chip base electroplating silver plating device, comprising: the device comprises a horizontal conveying belt, a transfer module, a flushing mechanism, a drying mechanism, a control console, a shell, a vision module and a vision clamping mechanical arm; the flushing mechanism is arranged at the front side of the horizontal conveying belt and is positioned in front of the right-side transfer module; the drying mechanism is arranged at the front side of the horizontal conveying belt and is positioned in front of the left transfer module. The novel process and the equipment for electroplating silver on the laser pump source chip base aim at the technical defects of the processing steps in the process for electroplating silver on the laser pump source chip base, and the cleaning efficiency is improved and the damage to the surface of the chip base is reduced by combining a flushing mode and an air flow blow-drying mode.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a novel electroplating silver plating process and equipment for a laser pump source chip base.
Background
The laser pump source chip is an important semiconductor laser device, and is commonly used in the fields of pumping of laser, optical fiber communication and the like, in the production process of the laser pump source chip, the background technology of base electroplating silver plating is one of the important steps, the technology mainly improves the coupling efficiency between a pump laser and a pump source chip by electroplating a layer of silver on a chip base, and improves the electro-optical conversion efficiency of the laser pump source.
In the prior art, the steps of the electroplating silver plating technology of the laser pump source chip base comprise: the chip base of the current processing technology needs to be subjected to final treatment after silver plating, the existing final treatment mode adopts mechanical cleaning to hardly remove fine stains and oxides on the surface, and the surface of the chip base is possibly scratched or damaged in the cleaning process.
Disclosure of Invention
The invention aims to provide a novel electroplating silver-plating process and equipment for a laser pump source chip base, which at least solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: a novel electroplating silver plating process for a laser pump source chip base comprises the following steps:
step one: raw material processing: placing silicon wafer materials and the like into deionized water for cleaning, removing dust and dirt on the surface, cutting the materials by using laser cutting equipment according to a cutting plan, and detecting cutting quality and testing line width precision and linearity;
step two: and (3) oil removal and cleaning: the deionized water is adopted for cleaning, so that impurities on the surface of the chip are removed rapidly and efficiently, dirt and organic substance residues on the surface of the chip base, grease, oxide layers and other impurities are removed thoroughly, and the surface is ensured to be clean, uniform and flat;
step three: acid washing: sulfuric acid is used as an acid pickling agent, and the workpiece subjected to oil removal and cleaning is subjected to acid pickling to remove various pollutants such as sulfides, organic matters, sediments, oxides and the like;
step four: anodic oxidation: alumina is used as an anodic oxidant;
step five: copper plating: copper plating operation is carried out on the surface of the chip, so that a copper plating layer is formed on the surface of the chip, and the thickness of the copper plating layer is between 0.5 and 5 mu m;
step six: silver plating: silver chloride is used as electrolytic silver plating solution, and a silver plating layer is formed on the surface of the chip copper plating layer;
step seven: washing: repeatedly cleaning the chip base by using washing equipment and adopting ionized water;
step eight: and (3) drying: drying by using heating equipment, detecting the surface temperature of the chip base in the drying process, and avoiding irreversible influence on the chip in the heating process;
step nine: cleaning: and checking whether the quality and thickness of the copper and silver layers meet the requirements, carrying out final treatment on the surfaces of the copper and silver layers, and completely removing pollution and impurities existing on the surfaces by using a laser pump source chip base electroplating silver plating device to ensure that the quality and appearance of the product meet the qualified requirements.
A laser pump source chip mount electroplating silver plating apparatus comprising: the device comprises a horizontal conveying belt, a transfer module, a flushing mechanism, a drying mechanism, a control console, a shell, a vision module and a vision clamping mechanical arm; the number of the transfer modules is two, and the two transfer modules are respectively arranged at the left end and the right end of the rear side of the horizontal conveying belt; the flushing mechanism is arranged at the front side of the horizontal conveying belt and is positioned in front of the right-side transfer module; the drying mechanism is arranged at the front side of the horizontal conveying belt and is positioned in front of the left transfer module; the control console is arranged in front of the right of the horizontal conveying belt and is electrically connected with the horizontal conveying belt and the transfer module respectively; the shell is fixedly arranged at the top end of the horizontal conveying belt and positioned at the inner sides of the left transfer module and the right transfer module; the vision module is arranged on the front side of the shell and is electrically connected with the control console; the number of the visual clamping mechanical arms is four, the four visual clamping mechanical arms are respectively and fixedly arranged at four corners of the top end of the shell, and the visual clamping mechanical arms are electrically connected with the control console.
Preferably, the flushing mechanism comprises: the flushing mechanism comprises a flushing mechanism shell, a pump body, a water supply pipeline, a fixed spray head, a three-way connecting valve, a supporting mechanical arm and an electric sucking disc; the flushing mechanism shell is arranged at the right front part of the horizontal conveying belt; the pump body is arranged at the bottom end of the front side of the flushing mechanism shell and is electrically connected with the control console; the water supply pipeline is arranged at the top of the inner cavity of the flushing mechanism shell, and the water supply pipeline is connected with the pump body through a guide pipe; the number of the fixed spray heads is two, and the two fixed spray heads are respectively arranged at the left side and the right side of the top end of the water supply pipeline; the number of the three-way connecting valves is two, and the two three-way connecting valves are respectively in threaded connection with the left side and the right side of the interior of the water supply pipeline; the supporting mechanical arm is fixedly arranged at the bottom end of the inner cavity of the flushing mechanism shell and is electrically connected with the control console; the electric sucking disc is arranged at the moving end of the supporting mechanical arm, and the electric sucking disc is electrically connected with the control console.
Preferably, the flushing mechanism further comprises: the device comprises a rectangular shell, a limit guide rail, a moving block, a first electric push rod and a moving nozzle; the rectangular shell is arranged in the inner cavity of the flushing mechanism shell along the left-right direction and is positioned at the front side of the top of the supporting mechanical arm; the number of the limiting guide rails is two, and the two limiting guide rails are respectively arranged at the front end and the rear end of the left side and the right side of the bottom end of the inner cavity of the rectangular shell; the number of the moving blocks is two, the two moving blocks are respectively sleeved at the tops of the front limiting guide rail and the rear limiting guide rail, and the tops of the limiting guide rails extend out of the upper surface of the rectangular shell from the top opening of the rectangular shell; the number of the first electric pushing rods is two, the two first electric pushing rods are respectively arranged on the front side and the rear side of the middle part of the inner cavity of the rectangular shell, the first electric pushing rods on the front side and the rear side are respectively fixedly connected with the bottom ends of the front moving block and the rear moving block through the bottom end opening of the rectangular shell, and the first electric pushing rods are electrically connected with the control console; the number of the movable spray heads is two, the two movable spray heads are respectively arranged at the tops of the left movable block and the right movable block, and the left movable spray head and the right movable spray head are respectively connected with the two three-way connecting valves through connecting pipes.
Preferably, the drying mechanism includes: the device comprises a drying mechanism shell, an air pump, a fixed seat, a mounting plate, a second electric push rod, a limiting rod, a first connecting rod and a base; the drying mechanism shell is arranged at the front side of the horizontal conveying belt; the air pump is arranged at the bottom end of the front side of the drying mechanism shell and is electrically connected with the control console; the number of the fixing seats is two, and the two fixing seats are respectively arranged at the left side and the right side of the bottom end of the inner cavity of the drying mechanism shell; the number of the mounting plates is two, and the two mounting plates are respectively arranged at the top ends of the outer sides of the left fixing seat and the right fixing seat; the number of the second electric push rods is two, one ends of the two second electric push rods are rotatably connected to the front ends of the outer sides of the left mounting plate and the right mounting plate through pin shafts, and the second electric push rods are electrically connected with the control console; the number of the limiting rods is two, one end of each limiting rod is respectively connected to the front and rear ends of the inner side and the outer side of the left mounting plate and the right mounting plate through a pin shaft in a rotating manner, and the other ends of the left electric push rod and the right electric push rod are respectively connected with the outer bottom ends of the left limiting rods and the right limiting rods through pin shafts in a rotating manner; the number of the first connecting rods is two, and the two first connecting rods are rotationally connected to the inner sides of the corners of the left and right groups of limiting rods along the front-back direction through pin shafts; the number of the bases is two, the two bases are rotationally connected to the outer sides of the other ends of the left and right groups of limiting rods along the front-back direction through pin shafts, and the left and right bases are fixedly connected through screws.
Preferably, the limiting rod is L-shaped.
Preferably, the drying mechanism further comprises: the spray head device comprises a mounting rack, a guide rail rack, a moving plate, a gear, a rotating rod, a second connecting rod, a spray head pipe, a servo motor, a cam, a spring rod and a rack rod; the number of the mounting frames is two, and the two mounting frames are respectively arranged at the upper end and the lower end of the rear side of the inner cavity of the drying mechanism shell; the guide rail frame is arranged at the inner sides of the upper mounting frame and the lower mounting frame along the up-down direction; the number of the moving plates is two, and the two moving plates are respectively sleeved on the upper side and the lower side of the outer wall of the guide rail frame; the number of the gears is two, and the two gears are respectively connected with the inner sides of the upper mounting frame and the lower mounting frame through pin shaft seats in a rotating way; the number of the rotating rods is two, and one ends of the two rotating rods are respectively connected with the rear sides of the axle centers of the upper gear and the lower gear by screws; the number of the second connecting rods is two, one ends of the two second connecting rods are respectively connected with the other ends of the upper rotating rod and the lower rotating rod in a rotating way through pin shafts, and the other ends of the two second connecting rods are respectively connected with the inner sides of the upper moving plate and the lower moving plate in a rotating way through pin shafts; the number of the spray head pipes is two, each spray head pipe is two, and the two spray head pipes are respectively arranged at the left end and the right end of the inner side of the upper moving plate and the lower moving plate along the front-back direction; the servo motor is fixedly arranged at the left side of the bottom end of the mounting frame, the output end of the servo motor extends into the inner side of the mounting frame, and the servo motor is electrically connected with the control console; the number of the cams is two, and the two cams are respectively connected to the upper side and the lower side of the output end of the servo motor through screws; the number of the spring rods is two, the two spring rods are respectively inserted into the left sides of the upper end and the lower end of the inner side of the fixed seat, and the left sides of the upper spring rod and the lower spring rod are respectively contacted with the outer sides of the upper cam and the lower cam; the number of the rack bars is two, the two rack bars are respectively arranged on the right sides of the upper spring bar and the lower spring bar, and the upper rack bar and the lower rack bar are respectively meshed with the upper gear and the lower gear.
Compared with the prior art, the invention has the beneficial effects that:
1. carry the work piece through horizontal conveyer belt, right side shift module adsorbs the below work piece and carries to flushing mechanism shell inner chamber, supports the electronic sucking disc of arm drive and drives the work piece and remove to flushing mechanism shell inner chamber, and the pump body pumps into inside deionized water to the supply line inner chamber and carries out the top to the work piece by fixed shower nozzle, and the removal shower nozzle washes the work piece bottom, and the first electric push rod in both sides shortens the drive movable block through self extension and drives the removal shower nozzle to inboard or outside reciprocating motion to improve bottom cleaning area.
2. The horizontal conveying belt is used for continuously conveying the workpiece to the lower side of the left side transfer module, the second electric push rods on the left side and the right side drive the rear side limiting rods to rotate to the rear side by taking the connection part with the rotation of the pin shafts of the second electric push rods as the top point, the base is driven to translate and lift to the inner side of the mounting frame to the upper side of the rear side, the servo motor drives the cams on the upper side and the lower side to rotate and intermittently contact with the spring rods, the spring rods drive the rack rods to reciprocate left and right, the gear drives the rotating rods under the action of the rotating force of the rack rods, the moving plates are driven to move to the upper side and the lower side of the workpiece inwards under the cooperation of the spray head pipe, and high-pressure air flow in the air pump is sprayed to the outside through the spray head pipe so as to dry the workpiece.
Therefore, aiming at the technical defects existing in the processing steps in the electroplating silver plating process of the laser pump source chip base, the washing and air flow drying modes are combined, the washing efficiency is improved, the damage to the surface of the chip base is reduced, and better washing effect and process quality are achieved.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is an exploded view of fig. 1.
Fig. 3 is an exploded view of the flushing mechanism of fig. 1.
Fig. 4 is an enlarged view at a of fig. 3.
Fig. 5 is an exploded view of the drying mechanism of fig. 1.
Fig. 6 is an enlarged view at B of fig. 5.
In the figure: 1. a horizontal conveyor belt; 2. a transfer module; 3. a flushing mechanism; 31. a flushing mechanism housing; 32. a pump body; 33. a water supply line; 34. fixing the spray head; 35. a three-way connecting valve; 36. supporting a mechanical arm; 37. an electric suction cup; 38. a rectangular housing; 39. a spacing guide rail; 310. a moving block; 311. a first electrical push rod; 312. moving the spray head; 4. a drying mechanism; 41. a drying mechanism housing; 42. an air pump; 43. a fixing seat; 44. a mounting plate; 45. a second electric push rod; 46. a limit rod; 47. a first connecting rod; 48. a base; 49. a mounting frame; 410. a guide rail frame; 411. a moving plate; 412. a gear; 413. a rotating lever; 414. a second connecting rod; 415. a shower nozzle pipe; 416. a servo motor; 417. a cam; 418. a spring rod; 419. a rack bar; 5. a console; 6. a housing; 7. a vision module; 8. visual clamping mechanical arm.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-6, the present invention provides a technical solution: a novel electroplating silver plating process for a laser pump source chip base comprises the following steps:
step one: raw material processing: placing silicon wafer materials and the like into deionized water for cleaning, removing dust and dirt on the surface, cutting the materials by using laser cutting equipment according to a cutting plan, and detecting cutting quality and testing line width precision and linearity;
step two: and (3) oil removal and cleaning: the deionized water is adopted for cleaning, so that impurities on the surface of the chip are removed rapidly and efficiently, dirt and organic substance residues on the surface of the chip base, grease, oxide layers and other impurities are removed thoroughly, and the surface is ensured to be clean, uniform and flat;
step three: acid washing: sulfuric acid is used as an acid pickling agent, and the workpiece subjected to oil removal and cleaning is subjected to acid pickling to remove various pollutants such as sulfides, organic matters, sediments, oxides and the like;
step four: anodic oxidation: alumina is used as an anodic oxidant;
step five: copper plating: copper plating operation is carried out on the surface of the chip, so that a copper plating layer is formed on the surface of the chip, and the thickness of the copper plating layer is between 0.5 and 5 mu m;
step six: silver plating: silver chloride is used as electrolytic silver plating solution, and a silver plating layer is formed on the surface of the chip copper plating layer;
step seven: washing: repeatedly cleaning the chip base by using washing equipment and adopting ionized water;
step eight: and (3) drying: drying by using heating equipment, detecting the surface temperature of the chip base in the drying process, and avoiding irreversible influence on the chip in the heating process;
step nine: cleaning: and checking whether the quality and thickness of the copper and silver layers meet the requirements, carrying out final treatment on the surfaces of the copper and silver layers, and completely removing pollution and impurities existing on the surfaces by using a laser pump source chip base electroplating silver plating device to ensure that the quality and appearance of the product meet the qualified requirements.
A laser pump source chip mount electroplating silver plating apparatus comprising: the device comprises a horizontal conveying belt 1, a transfer module 2, a flushing mechanism 3, a drying mechanism 4, a control console 5, a shell 6, a vision module 7 and a vision clamping mechanical arm 8; the number of the transfer modules 2 is two, the two transfer modules 2 are respectively arranged at the left end and the right end of the rear side of the horizontal conveying belt 1, and the horizontal conveying belt 1 is controlled by a control console 5 to convey workpieces from right to left; the flushing mechanism 3 is arranged at the front side of the horizontal conveying belt 1 and is positioned in front of the right side transfer module 2; the drying mechanism 4 is arranged at the front side of the horizontal conveying belt 1 and is positioned in front of the left transfer module 2; the control console 5 is arranged in front of the right of the horizontal conveying belt 1, the control console 5 is respectively and electrically connected with the horizontal conveying belt 1 and the transfer module 2, and a preset program is arranged in the control console 5 and can be automatically controlled according to a logic program after being started by a worker; the shell 6 is fixedly arranged at the top end of the horizontal conveying belt 1 and positioned at the inner sides of the left and right transfer modules 2; the vision module 7 is arranged on the front side of the shell 6, the vision module 7 is electrically connected with the console 5, and the vision clamping mechanical arm 8 can send detected image information to the inside of the vision module 7 for display; the quantity of vision centre gripping arm 8 is four, and four vision centre gripping arms 8 are fixed mounting respectively in the top four corners of casing 6, vision centre gripping arm 8 and control cabinet 5 electric connection, and vision centre gripping arm 8 accessible control cabinet 5 control, the inside outward appearance that is provided with the visual monitoring module detectable work piece of vision centre gripping arm 8 and to the adjustment position behind the work piece centre gripping.
As a preferred solution, as shown in fig. 3 and 4, the flushing mechanism 3 includes: the flushing mechanism comprises a flushing mechanism shell 31, a pump body 32, a water supply pipeline 33, a fixed spray head 34, a three-way connecting valve 35, a supporting mechanical arm 36, an electric sucking disc 37, a rectangular shell 38, a limiting guide rail 39, a moving block 310, a first electric push rod 311 and a moving spray head 312; the flushing mechanism shell 31 is arranged at the right front part of the horizontal conveying belt 1, the bottom end of the inner cavity of the flushing mechanism shell 31 is provided with a bucket shape, and the bottom end of the inner cavity is provided with a water outlet, so that the waste water cleaned inside can be treated; the pump body 32 is arranged at the bottom end of the front side of the flushing mechanism shell 31, the pump body 32 is electrically connected with the control console 5, the pump body 32 can be controlled by the control console 5, and the storage tank is arranged in the pump body 32 and can be filled with deionized water; the water supply pipeline 33 is arranged at the top of the inner cavity of the flushing mechanism shell 31, and the water supply pipeline 33 is connected with the pump body 32 through a conduit; the number of the fixed spray heads 34 is two, and the two fixed spray heads 34 are respectively arranged at the left side and the right side of the top end of the water supply pipeline 33; the number of the three-way connecting valves 35 is two, and the two three-way connecting valves 35 are respectively in threaded connection with the left side and the right side of the interior of the water supply pipeline 33; the supporting mechanical arm 36 is fixedly arranged at the bottom end of the inner cavity of the flushing mechanism shell 31, the supporting mechanical arm 36 is electrically connected with the control console 5, the supporting mechanical arm 36 can be controlled by the control console 5, and the supporting mechanical arm 36 can drive the electric sucking disc 37 to move and fold; the electric sucking disc 37 is arranged at the moving end of the supporting mechanical arm 36, the electric sucking disc 37 is electrically connected with the control console 5, the electric sucking disc 37 can be controlled by the control console 5, and the electric sucking disc 37 can adsorb and fix a workpiece; the rectangular housing 38 is disposed in the inner cavity of the flushing mechanism housing 31 in the left-right direction and is located at the top front side of the supporting mechanical arm 36; the number of the limit guide rails 39 is two, and the two limit guide rails 39 are respectively arranged at the front and rear ends of the left side and the right side of the bottom end of the inner cavity of the rectangular shell 38; the number of the moving blocks 310 is two, the two moving blocks 310 are respectively sleeved at the tops of the front limit guide rail 39 and the rear limit guide rail 39, the tops of the limit guide rails 39 extend out of the upper surface of the rectangular housing 38 from the top opening of the rectangular housing 38, and the moving blocks 310 can move outwards or inwards on the outer wall of the limit guide rail 39; the number of the first electric push rods 311 is two, the two first electric push rods 311 are respectively arranged at the front side and the rear side of the middle part of the inner cavity of the rectangular shell 38, the first electric push rods 311 at the front side and the rear side are respectively fixedly connected with the bottom ends of the front moving block 310 and the rear moving block 310 through the bottom end opening of the rectangular shell 38, the first electric push rods 311 are electrically connected with the control console 5, the first electric push rods 311 can be controlled through the control console 5, and the first electric push rods 311 drive the moving blocks 310 to move outwards or inwards through self-elongation shortening; the number of the movable sprayers 312 is two, the two movable sprayers 312 are respectively arranged at the top parts of the left movable block 310 and the right movable block 310, and the left movable sprayers 312 and the right movable sprayers 312 are respectively connected with the two three-way connecting valves 35 through connecting pipes.
As a preferred embodiment, as shown in fig. 5 and 6, the drying mechanism 4 includes: the drying mechanism comprises a drying mechanism shell 41, an air pump 42, a fixed seat 43, a mounting plate 44, a second electric push rod 45, a limiting rod 46, a first connecting rod 47, a base 48, a mounting frame 49, a guide rail frame 410, a moving plate 411, a gear 412, a rotating rod 413, a second connecting rod 414, a spray head pipe 415, a servo motor 416, a cam 417, a spring rod 418 and a rack bar 419; the drying mechanism housing 41 is provided on the front side of the horizontal conveyance belt 1; the air pump 42 is arranged at the bottom end of the front side of the drying mechanism shell 41, the air pump 42 is electrically connected with the control console 5, the air pump 42 can be controlled by the control console 5, and high-pressure air flow can be generated in the air pump 42 and is sprayed out by the spray head pipe 415; the number of the fixing seats 43 is two, and the two fixing seats 43 are respectively arranged at the left side and the right side of the bottom end of the inner cavity of the drying mechanism shell 41; the number of the mounting plates 44 is two, and the two mounting plates 44 are respectively arranged at the outer top ends of the left fixing seat 43 and the right fixing seat 43; the number of the second electric push rods 45 is two, one end of each second electric push rod 45 is rotationally connected to the front ends of the outer sides of the left mounting plate 44 and the right mounting plate 44 through a pin shaft, the second electric push rods 45 are electrically connected with the console 5, the second electric push rods 45 can be controlled through the console 5, the second electric push rods 45 extend, shorten and drive the limiting rods 46 at the corresponding positions to move, and the second electric push rods 45 can rotate by taking the rotating connection parts of the pin shafts of the mounting plates 44 as shafts in the process of extending and shortening; the number of the limiting rods 46 is two, the number of each limiting rod 46 is two, one end of each limiting rod 46 is respectively connected with the front end and the rear end of the inner side and the outer side of the left mounting plate 44 and the right mounting plate 44 through pin shafts in a rotating way, the other ends of the left second electric push rods 45 and the right second electric push rods 45 are connected with the outer bottom ends of the left limiting rods 46 and the right rear limiting rods 46 through pin shafts in a rotating way, the limiting rods 46 are L-shaped, the inner sides and the outer sides of the limiting rods 46 of the front side and the rear side of each group are arranged in a staggered way, the limiting rods 46 can rotate by taking the rotating connection parts of the limiting rods 46 and the pin shafts of the mounting plates 44 as shafts, and the limiting rods 46, the first connecting rods 47 and the mounting plates 44 form a parallelogram structure; the number of the first connecting rods 47 is two, and the two first connecting rods 47 are rotationally connected to the inner sides of the corners of the left and right groups of limiting rods 46 along the front-back direction through pin shafts; the number of the bases 48 is two, the two bases 48 are rotationally connected to the outer sides of the other ends of the left and right limiting rods 46 along the front-back direction through pin shafts, and the left and right bases 48 are fixedly connected through screws; the number of the mounting frames 49 is two, and the two mounting frames 49 are respectively arranged at the upper end and the lower end of the rear side of the inner cavity of the drying mechanism shell 41; the rail frame 410 is provided inside the upper and lower mounting frames 49 in the up-down direction; the number of the moving plates 411 is two, the two moving plates 411 are respectively sleeved on the upper side and the lower side of the outer wall of the guide rail frame 410, and the moving plates 411 can move inside and outside the outer wall of the guide rail frame 410; the number of the gears 412 is two, and the two gears 412 are respectively connected with the inner sides of the upper mounting frame 49 and the lower mounting frame 49 through pin shaft seats in a rotating way; the number of the rotating rods 413 is two, and one end of each rotating rod 413 is respectively connected with the rear sides of the axes of the upper gear 412 and the lower gear 412 through screws; the number of the second connecting rods 414 is two, one end of each second connecting rod 414 is respectively connected with the other ends of the upper rotating rod 413 and the lower rotating rod 413 through a pin shaft in a rotating way, and the other ends of the two second connecting rods 414 are respectively connected with the inner sides of the upper moving plate 411 and the lower moving plate 411 through pin shafts in a rotating way; the number of the shower head pipes 415 is two, the number of each shower head pipe 415 is two, and the two shower head pipes 415 are respectively arranged at the left and right ends of the inner sides of the upper moving plate 411 and the lower moving plate 411 along the front-back direction; the servo motor 416 is fixedly arranged at the left side of the bottom end of the mounting frame 49, the output end of the servo motor 416 extends into the inner side of the mounting frame 49, the servo motor 416 is electrically connected with the console 5, the servo motor 416 can be controlled by the console 5, and the servo motor 416 drives the cams 417 on the upper side and the lower side to rotate; the number of the cams 417 is two, and the two cams 417 are respectively connected with the upper side and the lower side of the output end of the servo motor 416 by screws; the number of the spring rods 418 is two, the two spring rods 418 are respectively inserted into the left sides of the upper end and the lower end of the inner side of the fixed seat 43, the left sides of the upper spring rod 418 and the lower spring rod 418 are respectively contacted with the outer sides of the upper cam 417 and the lower cam 417, springs are arranged in the spring rods 418, and the spring rods 418 can move left and right under the elastic action of the springs; the number of the rack bars 419 is two, and the two rack bars 419 are provided on the right side of the upper and lower spring bars 418, respectively, and the upper and lower rack bars 419 are engaged with the upper and lower gears 412, respectively.
The laser pump source chip base electroplating silver plating equipment has the following working principle:
step 1: the worker places the chip base workpiece on the top of the horizontal conveying belt 1 and controls the control console 5 to start, a program is preset in the control console 5 to control the horizontal conveying belt 1 to start and convey the chip base workpiece from right to left, a program is preset in the control console 5 to control the transfer module 2, the supporting mechanical arm 36, the electric sucking disc 37, the pump body 32 and the first electric push rod 311 to start, the right side transfer module 2 adsorbs and conveys the lower workpiece to the inner cavity of the flushing mechanism shell 31, the supporting mechanical arm 36 drives the electric sucking disc 37 to move to the rear side to the designated access position below the right side transfer module 2, the electric sucking disc 37 adsorbs and fixes the rear side to the lower workpiece, the supporting mechanical arm 36 drives the electric sucking disc 37 to drive the workpiece to move to the inner cavity of the flushing mechanism shell 31, the pump body 32 pumps the inner deionized water into the inner cavity of the water supply pipeline 33, the top of the workpiece is washed through the fixed spray head 34, deionized water in the water supply pipeline 33 is sprayed out by the movable spray head 312 under the split flow of the three-way connecting valve 35, the movable spray head 312 washes the bottom of the workpiece, the first electric push rods 311 on two sides drive the movable block 310 to move inwards or outwards through self-extension and shortening, the movable block 310 drives the movable spray head 312 to reciprocate inwards or outwards under the limit action of the limit guide rail 39 so as to improve the cleaning area of the movable spray head 312 to the bottom of the workpiece, the supporting mechanical arm 36 drives the electric suction disc 37 to move to the lower access position of the right side transfer module 2 after cleaning, the right side transfer module 2 carries and moves the cleaned workpiece to the top of the horizontal conveying belt 1, the horizontal conveying belt 1 moves the workpiece to the inner cavity of the shell 6, the control platform 5 is internally preset with the program to control the visual clamping mechanical arm 8 and the visual module 7 to start, the position of the workpiece is adjusted after the four-side visual clamping mechanical arm 8 clamps the workpiece, and an image information is sent to the inside of the visual module 7 by a camera arranged in the visual clamping mechanical arm 8 for display so that a worker can observe whether the workpiece is cleaned;
step 2: the horizontal conveying belt 1 continues to convey the workpiece to the lower part of the left side transfer module 2, a program control transfer module 2, a second electric push rod 45, a servo motor 416 and a wind pump 42 are preset in the control console 5, the left side transfer module 2 adsorbs the lower workpiece and conveys the lower workpiece to the inner cavity of the drying mechanism shell 41, the left side second electric push rod 45 stretches and drives the rear side limiting rod 46 to rotate towards the rear side by taking the hinge pin rotation connection part of the second electric push rod 45 as the top point, then under the limiting action of the front side limiting rod 46 and the first connecting rod 47, the driving base 48 horizontally lifts to the inner side of the mounting frame 49 upwards, the servo motor 416 drives the upper and lower cams 417 to rotate, and then the proximal hub end and the distal hub end of the cam 417 intermittently contact with the spring rod 418, so that the spring rod 418 drives the rack rod 419 to reciprocate left and right, the gear wheel 413 drives one end of the rotating rod 413 to intermittently rotate clockwise or anticlockwise under the action of the rotating force of the rack rod 419, and the rotating rod 413 drives the rotating plate to push or stretch towards the inner side under the action of the second connecting rod 419 to move towards the outer side under the limiting action of the first connecting rod 47, the rotating plate is matched with the first connecting rod 47 to move towards the outer side, the upper side of the workpiece is conveyed towards the inner side of the horizontal conveying pipe 415, and then the workpiece is conveyed towards the inner side of the upper side of the drying nozzle 1 through the horizontal conveying pipe is continuously, and the drying pipe 415 is conveyed towards the inner side through the inner side of the top of the drying pipe is continuously, and then horizontally matched with the drying pipe 415 is conveyed towards the inner side is moved towards the inner side, and is moved outside, and is moved towards the drying side is moved;
therefore, aiming at the technical defects existing in the processing steps in the electroplating silver plating process of the laser pump source chip base, the washing and air flow drying modes are combined, the washing efficiency is improved, the damage to the surface of the chip base is reduced, and better washing effect and process quality are achieved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A novel electroplating silver plating process for a laser pump source chip base is characterized by comprising the following steps of:
step one: raw material processing: placing the silicon wafer material into deionized water for cleaning, removing dust and dirt on the surface, cutting the material by using laser cutting equipment according to a cutting plan, and detecting cutting quality and testing line width precision and linearity;
step two: and (3) oil removal and cleaning: the deionized water is adopted for cleaning, so that impurities on the surface of the chip are removed rapidly and efficiently, dirt and organic substance residues on the surface of the chip base, grease and oxide layer impurities are removed thoroughly, and the surface is ensured to be clean, uniform and flat;
step three: acid washing: sulfuric acid is used as an acid pickling agent, and the workpiece subjected to oil removal and cleaning is subjected to acid pickling to remove various pollutants such as sulfides, organic matters, sediments and oxides;
step four: anodic oxidation: alumina is used as an anodic oxidant;
step five: copper plating: copper plating operation is carried out on the surface of the chip, so that a copper plating layer is formed on the surface of the chip, and the thickness of the copper plating layer is between 0.5 and 5 mu m;
step six: silver plating: silver chloride is used as electrolytic silver plating solution, and a silver plating layer is formed on the surface of the chip copper plating layer;
step seven: washing: repeatedly cleaning the chip base by using washing equipment and adopting ionized water;
step eight: and (3) drying: drying by using heating equipment, detecting the surface temperature of the chip base in the drying process, and avoiding irreversible influence on the chip in the heating process;
step nine: cleaning: and checking whether the quality and thickness of the copper and silver layers meet the requirements, carrying out final treatment on the surfaces of the copper and silver layers, and completely removing pollution and impurities existing on the surfaces by using a laser pump source chip base electroplating silver plating device to ensure that the quality and appearance of the product meet the qualified requirements.
2. The laser pump source chip base electroplating silver plating equipment is applied to the novel laser pump source chip base electroplating silver plating process as set forth in claim 1, and is characterized in that: in step nine, the laser pump source chip base electroplating silver plating equipment comprises:
a horizontal conveyor belt (1);
the number of the transfer modules (2) is two, and the two transfer modules (2) are respectively arranged at the left end and the right end of the rear side of the horizontal conveying belt (1);
the flushing mechanism (3) is arranged at the front side of the horizontal conveying belt (1) and is positioned in front of the right-side transfer module (2);
the drying mechanism (4) is arranged at the front side of the horizontal conveying belt (1) and is positioned in front of the left transfer module (2);
the control console (5) is arranged in front of the right side of the horizontal conveying belt (1), and the control console (5) is electrically connected with the horizontal conveying belt (1) and the transfer module (2) respectively;
the shell (6) is fixedly arranged at the top end of the horizontal conveying belt (1) and positioned at the inner sides of the left and right transfer modules (2);
the vision module (7) is arranged on the front side of the shell (6), and the vision module (7) is electrically connected with the control console (5);
the visual clamping mechanical arms (8), the quantity of visual clamping mechanical arms (8) is four, four visual clamping mechanical arms (8) are respectively fixedly installed at the top four corners of the shell (6), and the visual clamping mechanical arms (8) are electrically connected with the control console (5).
3. The laser pump source chip base electroplating silver plating apparatus of claim 2, wherein: the flushing mechanism (3) comprises:
a flushing mechanism housing (31) provided in front of the right of the horizontal conveyor belt (1);
the pump body (32) is arranged at the bottom end of the front side of the flushing mechanism shell (31), and the pump body (32) is electrically connected with the control console (5);
the water supply pipeline (33) is arranged at the top of the inner cavity of the flushing mechanism shell (31), and the water supply pipeline (33) is connected with the pump body (32) through a guide pipe;
the number of the fixed spray heads (34) is two, and the two fixed spray heads (34) are respectively arranged at the left side and the right side of the top end of the water supply pipeline (33);
the three-way connecting valves (35), the number of the three-way connecting valves (35) is two, and the two three-way connecting valves (35) are respectively connected with the left side and the right side of the inside of the water supply pipeline (33) in a threaded manner;
the supporting mechanical arm (36) is fixedly arranged at the bottom end of the inner cavity of the flushing mechanism shell (31), and the supporting mechanical arm (36) is electrically connected with the control console (5);
the electric sucking disc (37) is arranged at the moving end of the supporting mechanical arm (36), and the electric sucking disc (37) is electrically connected with the console (5).
4. A laser pump source chip mount electro-plating silver plating apparatus according to claim 3, wherein: the flushing mechanism (3) further comprises:
a rectangular housing (38) which is arranged in the inner cavity of the flushing mechanism housing (31) along the left-right direction and is positioned at the front side of the top of the supporting mechanical arm (36);
the number of the limit guide rails (39) is two, and the two limit guide rails (39) are respectively arranged at the front end and the rear end of the left side and the right side of the bottom end of the inner cavity of the rectangular shell (38);
the number of the moving blocks (310) is two, the two moving blocks (310) are respectively sleeved at the tops of the front limit guide rail and the rear limit guide rail (39), and the tops of the limit guide rails (39) extend out of the upper surface of the rectangular housing (38) from the top opening of the rectangular housing (38);
the number of the first electric push rods (311) is two, the two first electric push rods (311) are respectively arranged at the front side and the rear side of the middle part of the inner cavity of the rectangular shell (38), the first electric push rods (311) at the front side and the rear side are respectively fixedly connected with the bottom ends of the front moving block (310) and the rear moving block (310) through the bottom end opening of the rectangular shell (38), and the first electric push rods (311) are electrically connected with the control console (5);
the movable spray heads (312), the number of the movable spray heads (312) is two, the two movable spray heads (312) are respectively arranged at the tops of the left movable block (310) and the right movable block (310), and the left movable spray heads (312) and the right movable spray heads (312) are respectively connected with the two three-way connecting valves (35) through connecting pipes.
5. The laser pump source chip base electroplating silver plating apparatus according to claim 4, wherein: the drying mechanism (4) comprises:
a drying mechanism housing (41) provided on the front side of the horizontal conveyor belt (1);
the air pump (42) is arranged at the bottom end of the front side of the drying mechanism shell (41), and the air pump (42) is electrically connected with the console (5);
the number of the fixing seats (43) is two, and the two fixing seats (43) are respectively arranged at the left side and the right side of the bottom end of the inner cavity of the drying mechanism shell (41);
the number of the mounting plates (44) is two, and the two mounting plates (44) are respectively arranged at the outer top ends of the left fixing seat (43) and the right fixing seat (43);
the number of the second electric push rods (45) is two, one ends of the two second electric push rods (45) are rotatably connected to the front ends of the outer sides of the left mounting plate (44) and the right mounting plate (44) through pin shafts, and the second electric push rods (45) are electrically connected with the console (5);
the limiting rods (46) are two in number, each limiting rod (46) is two in number, one end of each limiting rod (46) is respectively connected to the front and rear ends of the inner side and the outer side of the left mounting plate (44) and the right mounting plate (44) through a pin shaft in a rotating mode, and the other ends of the left electric push rod and the right electric push rod (45) are connected with the outer side bottom ends of the left limiting rod and the right rear limiting rod (46) through pin shafts in a rotating mode;
the two first connecting rods (47) are connected to the inner sides of the corners of the left and right groups of limiting rods (46) in a rotating manner along the front-back direction through pin shafts;
the two bases (48) are rotatably connected to the outer sides of the other ends of the left and right limiting rods (46) along the front-rear direction through pin shafts, and the left and right bases (48) are fixedly connected through screws.
6. The laser pump source chip base electroplating silver plating apparatus according to claim 5, wherein: the limiting rod (46) is L-shaped.
7. The laser pump source chip base electroplating silver plating apparatus according to claim 5, wherein: the drying mechanism (4) further comprises:
the number of the mounting frames (49) is two, and the two mounting frames (49) are respectively arranged at the upper end and the lower end of the rear side of the inner cavity of the drying mechanism shell (41);
a guide rail frame (410) which is arranged at the inner sides of the upper and lower mounting frames (49) along the up-down direction;
the movable plates (411) are two in number, and the two movable plates (411) are respectively sleeved on the upper side and the lower side of the outer wall of the guide rail frame (410);
the number of the gears (412) is two, and the two gears (412) are respectively connected with the inner sides of the upper mounting frame (49) and the lower mounting frame (49) through pin shaft seats in a rotating way;
the number of the rotating rods (413) is two, and one ends of the two rotating rods (413) are respectively connected with the rear sides of the axes of the upper gear (412) and the lower gear (412) through screws;
the two second connecting rods (414), one end of each second connecting rod (414) is respectively connected with the other ends of the upper rotating rod (413) and the lower rotating rod (413) through a pin shaft in a rotating way, and the other ends of the two second connecting rods (414) are respectively connected with the inner sides of the upper moving plate (411) and the lower moving plate (411) through pin shafts in a rotating way;
the number of the spray head pipes (415) is two, the number of each spray head pipe (415) is two, and the two spray head pipes (415) are respectively arranged at the left end and the right end of the inner side of the upper moving plate (411) and the lower moving plate along the front-back direction;
the servo motor (416) is fixedly arranged at the left side of the bottom end of the mounting frame (49), the output end of the servo motor (416) extends into the inner side of the mounting frame (49), and the servo motor (416) is electrically connected with the control console (5);
the number of the cams (417) is two, and the two cams (417) are respectively connected to the upper side and the lower side of the output end of the servo motor (416) through screws;
the number of the spring rods (418) is two, the two spring rods (418) are respectively inserted into the left sides of the upper end and the lower end of the inner side of the fixed seat (43), and the left sides of the upper spring rod and the lower spring rod (418) are respectively contacted with the outer sides of the upper cam (417) and the lower cam (417);
the number of the rack bars (419) is two, the two rack bars (419) are respectively arranged on the right sides of the upper spring bar (418) and the lower spring bar (418), and the upper rack bar (419) and the lower rack bar (419) are respectively meshed with the upper gear (412) and the lower gear (412).
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| CN202310567812.3A CN116288583B (en) | 2023-05-19 | 2023-05-19 | Novel electroplating silver-plating process and equipment for laser pump source chip base |
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