CN111383965A - Rotary type washing and drying device - Google Patents
Rotary type washing and drying device Download PDFInfo
- Publication number
- CN111383965A CN111383965A CN202010149358.6A CN202010149358A CN111383965A CN 111383965 A CN111383965 A CN 111383965A CN 202010149358 A CN202010149358 A CN 202010149358A CN 111383965 A CN111383965 A CN 111383965A
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- Prior art keywords
- cleaning
- drying
- frame
- supporting shell
- cleaning frame
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001035 drying Methods 0.000 title claims abstract description 39
- 238000005406 washing Methods 0.000 title claims abstract description 24
- 238000004140 cleaning Methods 0.000 claims abstract description 100
- 239000007788 liquid Substances 0.000 claims abstract description 47
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 36
- 238000003756 stirring Methods 0.000 claims description 10
- 238000007602 hot air drying Methods 0.000 claims description 9
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 238000001802 infusion Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 230000001680 brushing effect Effects 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002178 crystalline material Substances 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005201 scrubbing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the field of washing and drying equipment, and particularly discloses a rotary washing and drying device which comprises a machine base, a cleaning frame, a liquid tank, a supporting shell and a cleaning mechanism, wherein the supporting shell and the cleaning frame are fixedly arranged on the end surface of the machine base; the supporting shell is arranged on the inner side of the cleaning rack, two sides of the supporting shell are both connected with a fixed base, and the top of the supporting shell is provided with a fixed rack; the cleaning mechanism comprises a driving assembly, a cleaning brush, a box body and a cleaning frame, the box body is fixedly arranged on two sides of the top of the cleaning frame, and a rotating disc is arranged in the box body; the driving assembly is provided with a motor, a rotating rod and a transmission rod, the motor is fixedly arranged at the top end of the supporting shell, and the output end of the motor is connected with the rotating rod. According to the invention, the wafer is dried in and out by cleaning and then drying the wafer, so that the wafer is prevented from being polluted by external environment in the process, the occupied area of equipment is saved, and a better cleaning effect is realized by washing and brushing.
Description
Technical Field
The invention relates to the field of washing and drying equipment, in particular to a rotary washing and drying device.
Background
A wafer refers to a substrate (also called a substrate) from which semiconductor transistors or integrated circuits are fabricated. Since it is a crystalline material, it is called a wafer because it is circular in shape. The substrate material is silicon, germanium, etc. Since silicon is most commonly used, if the crystalline material is not specified, it is often referred to as a silicon wafer. Various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.
In the semiconductor integrated circuit manufacturing process, the cleaning and drying of wafers are indispensable process requirements in the production of semiconductor devices. The cleaning of the wafer is mainly used for removing particles such as organic matters, inorganic matters, metal residues and the like in the process of the wafer. The drying of the wafer is mainly to dry the surface of the wafer after the wafer is cleaned, so as to avoid secondary pollution of the wafer caused by the adsorption of tiny particles on the wet surface. In the conventional process, the cleaning process and the drying process are performed separately, that is, the wafer is cleaned in one chamber and then enters another chamber to perform the drying process. This method carries significant disadvantages: the cleaning and drying processes are carried out in different chambers, so that the wet wafers after cleaning are in danger of being polluted by the external environment in the transferring process, and the cleaning and drying processes are carried out separately, so that at least two process chambers are inevitably needed, the occupied space of the equipment is inevitably increased, and the overall cost of the equipment is also increased.
Disclosure of Invention
The present invention is directed to a rotary washing and drying device, which solves the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: a rotary washing and drying device comprises a machine base, a cleaning frame, a liquid tank, a supporting shell and a cleaning mechanism, wherein the supporting shell and the cleaning frame are fixedly arranged on the end face of the machine base; the supporting shell is arranged on the inner side of the cleaning frame, two sides of the supporting shell are both connected with a fixed base, and the top of the supporting shell is provided with a fixed frame; the cleaning mechanism comprises a driving assembly, a cleaning brush, a box body and a cleaning frame, the box body is fixedly arranged on two sides of the top of the cleaning frame, and a rotating disc is arranged in the box body; the drive assembly has motor, dwang and transfer line, and the motor is adorned admittedly and is being supported the casing top, and the motor output even has the dwang, and the dwang middle part is equipped with first bevel gear, and the dwang top stretches into the liquid incasement and is connected with the stirring tooth.
Preferably, the transmission rod is provided with two second bevel gears, the end parts of the two second bevel gears are respectively provided with a second bevel gear matched with the first bevel gear, and the end parts of the transmission rod extend into the box body and are connected with the rotating disc.
Preferably, the liquid tank is filled with cleaning liquid, the end parts of the two sides of the liquid tank are connected with liquid conveying pipes, the liquid conveying pipes extend into the inner side of the cleaning frame and are connected with a cleaning frame, and a cleaning head close to the fixed base is arranged on the cleaning frame.
Preferably, the fixed base is used for placing the wafer and is provided with an adsorption groove for fixing the wafer, and a drying rack opposite to the washing rack is arranged above the fixed base.
Preferably, the supporting shell has a cavity, a hot air drying box is installed in the cavity of the supporting shell, an outlet of the hot air drying box is connected with an air conveying pipe, the air conveying pipe is connected with a drying frame, and an air outlet hole is formed in one side, close to the fixed base, of the drying frame.
Preferably, the rotating disc is connected with a support plate through a connecting shaft, the support plate extends out of the box body and extends to the position right above the fixed base, the bottom end of the support plate is connected with a cleaning brush, and the cleaning brush is in contact with the surface of the wafer.
Preferably, the lower part of the fixed base is provided with a liquid collecting tank, and the liquid collecting tank is used for collecting the liquid output by the flushing frame.
Preferably, the infusion tube is provided with a valve, and the outside of the cleaning frame is provided with a control box connected with the motor.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the wafer is dried in and out by cleaning and drying the wafer firstly, so that the wafer is prevented from being polluted by the external environment in the process, the occupied area of equipment is saved, a better cleaning effect is realized by washing and brushing, and the wafer cleaning efficiency is further improved. The cleaning device comprises a cleaning box, a rotating rod, a first bevel gear, a second bevel gear, a transmission rod, a support plate and a cleaning brush, wherein the cleaning is to clean the cleaning liquid in the liquid box, namely the cleaning liquid is output to a cleaning rack through a liquid conveying pipe and is cleaned by a cleaning head on the cleaning rack, the rotating rod is driven by a motor to rotate in the cleaning mode, the first bevel gear on the rotating rod is meshed with and drives the two second bevel gears, the two transmission rods are further driven to rotate, the transmission rods drive the rotating disk in the box to rotate, the support plate on the rotating; the rotating rod can also drive the stirring teeth to rotate, and the stirring teeth can stir in the liquid tank, so that the cleaning liquid is uniformly mixed, and the cleaning effect is improved; after cleaning, hot air can be output to the air conveying pipe through the hot air drying box, and is conveyed to the drying rack through the air conveying pipe, and is blown out from the air outlet hole on the drying rack, and the wafer can be dried by the hot air. And the rotating disc drives the support plate to do reciprocating motion, so that the wafer can be intermittently scrubbed, the wafer can be washed during scrubbing, and the cleaning efficiency is high and good.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of A of FIG. 1;
fig. 3 is a schematic view of the internal structure of the support housing according to the present invention.
In the figure: 1. a machine base; 2. a cleaning frame; 3. a liquid tank; 31. a transfusion tube; 4. a support housing; 41. a hot air drying box; 42. a wind delivery pipe; 5. a fixed base; 6. a fixed mount; 7. a drive assembly; 71. a motor; 72. rotating the rod; 73. a transmission rod; 74. a first bevel gear; 75. stirring teeth; 76. a second bevel gear; 8. cleaning brushes; 9. a box body; 10. a washing rack; 11. rotating the disc; 12. a drying rack; 13. a support plate; 14. a liquid collecting tank.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-3, the present invention provides a technical solution: a rotary type washing and drying device comprises a machine base 1, a cleaning frame 2, a liquid tank 3, a supporting shell 4 and a cleaning mechanism, wherein the supporting shell 4 and the cleaning frame 2 are fixedly arranged on the end face of the machine base 1, the cleaning mechanism is arranged on the inner side of the cleaning frame 2, and the liquid tank 3 is fixedly arranged at the top of the cleaning frame 2; the supporting shell 4 is arranged on the inner side of the cleaning frame 2, two sides of the supporting shell 4 are both connected with fixed bases 5, and the top of the supporting shell 4 is provided with a fixed frame 6; the cleaning mechanism comprises a driving assembly 7, a cleaning brush 8, a box body 9 and a washing frame 10, the box body 9 is fixedly arranged on two sides of the top of the cleaning frame 2, and a rotating disc 11 is arranged in the box body 9; the driving assembly 7 is provided with a motor 71, a rotating rod 72 and a transmission rod 73, the motor 71 is fixedly arranged at the top end of the supporting shell 4, the output end of the motor 71 is connected with the rotating rod 72, a first bevel gear 74 is arranged in the middle of the rotating rod 72, and the top of the rotating rod 72 extends into the liquid tank 3 and is connected with stirring teeth 75.
Further, the transmission rod 73 is provided with two second bevel gears 76 at the ends thereof for engaging with the first bevel gears 75, and the ends of the transmission rod 73 extend into the case 9 and are connected to the rotating disc 11.
Furthermore, the liquid tank 3 is filled with cleaning liquid, the end parts of the two sides of the liquid tank 3 are connected with liquid conveying pipes 31, the liquid conveying pipes 31 extend into the inner side of the cleaning frame 2 and are connected with a cleaning frame 10, and a cleaning head close to the fixed base 5 is arranged on the cleaning frame 10.
Further, the fixed base 5 is used for placing the wafer and is provided with an adsorption tank for fixing the wafer, and a drying rack 12 opposite to the washing rack 10 is arranged above the fixed base 5.
Further, the supporting shell 4 is provided with a cavity, a hot air drying box 41 is installed in the cavity of the supporting shell 4, an outlet of the hot air drying box 41 is connected with an air conveying pipe 42, the air conveying pipe 42 is connected with the drying rack 12, and an air outlet is formed in one side, close to the fixed base 5, of the drying rack 12.
Further, a support plate 13 is connected to the rotating disc 11 through a connecting shaft, the support plate 13 extends out of the box 9 and extends to a position right above the fixed base 5, a cleaning brush 8 is connected to the bottom end of the support plate 13, and the cleaning brush 8 is in contact with the surface of the wafer.
Further, a liquid collecting groove 14 is formed in the lower portion of the fixed base 5, and the liquid collecting groove 14 is used for collecting liquid output by the washing rack 10.
Furthermore, a valve is arranged on the infusion tube 31, and a control box connected with the motor 71 is arranged outside the cleaning frame 2.
The working principle is as follows:
according to the invention, the wafer is dried in and out after being cleaned, so that the wafer is prevented from being polluted by external environment in the process, and the occupied area of equipment is saved; the cleaning is realized by two modes of flushing and brushing, so that the cleaning effect is better, and the cleaning efficiency of the wafer is further improved. The cleaning is to clean the cleaning liquid in the liquid tank 3, that is, the cleaning liquid is output to the washing rack 10 through the liquid conveying pipe 31 and is cleaned by the washing head on the washing rack 10, and the cleaning is to drive the rotating rod 72 to rotate through the motor 71, so that the first bevel gear 74 on the rotating rod 72 is meshed with and drives the two second bevel gears 76, and further the two transmission rods 72 are driven to rotate, the transmission rods 72 drive the rotating disc 11 in the tank 9 to rotate, the rotating disc 11 drives the support plate 13 thereon to reciprocate, and the support plate 13 drives the cleaning brush 8 to brush the wafer to and fro, so that the use effect is good in cooperation with the cleaning; the rotating rod 72 also drives the stirring teeth 75 to rotate, so that the stirring teeth 75 can stir in the liquid tank 3, cleaning liquid is uniformly mixed, and the cleaning effect is improved; after cleaning, hot air can be output to the air delivery pipe 42 through the hot air drying box 41, and is delivered to the drying rack 12 through the air delivery pipe 42, and is blown out from an air outlet hole on the drying rack 12, and the wafer can be dried by the hot air; and the rotary rotating disc 11 drives the support plate 13 to do reciprocating motion, so that the wafer can be intermittently scrubbed, the wafer can be washed during scrubbing, and the cleaning efficiency is high and good.
It is worth noting that: the whole device is controlled by the master control device, and the control device and the matched equipment are common equipment, so that the device belongs to the existing mature technology, and the electrical connection relation and the specific circuit structure are not repeated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A rotary washing and drying device is characterized by comprising a machine base (1), a cleaning frame (2), a liquid tank (3), a supporting shell (4) and a cleaning mechanism, wherein the supporting shell (4) and the cleaning frame (2) are fixedly arranged on the end face of the machine base (1), the cleaning mechanism is arranged on the inner side of the cleaning frame (2), and the liquid tank (3) is fixedly arranged on the top of the cleaning frame (2); the support shell (4) is arranged on the inner side of the cleaning frame (2), two sides of the support shell (4) are both connected with fixed bases (5), and the top of the support shell (4) is provided with a fixed frame (6);
the cleaning mechanism comprises a driving assembly (7), a cleaning brush (8), a box body (9) and a washing frame (10), the box body (9) is fixedly arranged on two sides of the top of the cleaning frame (2), and a rotating disc (11) is arranged in the box body (9); the driving assembly (7) is provided with a motor (71), a rotating rod (72) and a transmission rod (73), the motor (71) is fixedly arranged at the top end of the supporting shell (4), the output end of the motor (71) is connected with the rotating rod (72), a first bevel gear (74) is arranged in the middle of the rotating rod (72), and the top of the rotating rod (72) extends into the liquid tank (3) and is connected with stirring teeth (75).
2. A rotary rinsing and drying apparatus as claimed in claim 1, further comprising: the transmission rod (73) is provided with two second bevel gears (76) which are respectively matched with the first bevel gears (75) at the end parts, and the end parts of the transmission rod (73) extend into the box body (9) and are connected with the rotating disc (11).
3. A rotary rinsing and drying apparatus as claimed in claim 1, further comprising: the cleaning liquid is filled in the liquid tank (3), the end parts of the two sides of the liquid tank (3) are connected with liquid conveying pipes (31), the liquid conveying pipes (31) extend into the inner side of the cleaning frame (2) and are connected with a cleaning frame (10), and a cleaning head close to the fixed base (5) is arranged on the cleaning frame (10).
4. A rotary rinsing and drying apparatus as claimed in claim 1, further comprising: the fixed base (5) is used for placing wafers and provided with an adsorption groove for fixing the wafers, and a drying rack (12) opposite to the washing rack (10) is arranged above the fixed base (5).
5. A rotary washing and drying apparatus as claimed in claim 1 or 4, wherein: the supporting shell (4) is provided with a cavity, a hot air drying box (41) is installed in the cavity of the supporting shell (4), an outlet of the hot air drying box (41) is connected with an air conveying pipe (42), the air conveying pipe (42) is connected with a drying rack (12), and an air outlet hole is formed in one side, close to the fixed base (5), of the drying rack (12).
6. A rotary rinsing and drying apparatus as claimed in claim 2, further comprising: even there is extension board (13) through the connecting axle on rolling disc (11), and extension board (13) stretch out outside box (9) and extend to fixed baseplate (5) directly over, and extension board (13) bottom even has cleaning brush (8), and cleaning brush (8) and wafer surface contact.
7. A rotary rinsing and drying apparatus as claimed in claim 3, further comprising: and a liquid collecting groove (14) is formed in the lower portion of the fixed base (5), and the liquid collecting groove (14) is used for collecting liquid output by the washing frame (10).
8. A rotary rinsing and drying apparatus as claimed in claim 2, further comprising: a valve is arranged on the infusion tube (31), and a control box connected with a motor (71) is arranged outside the cleaning frame (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010149358.6A CN111383965A (en) | 2020-03-04 | 2020-03-04 | Rotary type washing and drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010149358.6A CN111383965A (en) | 2020-03-04 | 2020-03-04 | Rotary type washing and drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111383965A true CN111383965A (en) | 2020-07-07 |
Family
ID=71218717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010149358.6A Pending CN111383965A (en) | 2020-03-04 | 2020-03-04 | Rotary type washing and drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111383965A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114289355A (en) * | 2021-11-19 | 2022-04-08 | 杭州中欣晶圆半导体股份有限公司 | Film forming system and film forming method for reducing adsorption of particles on surface of wafer |
| CN115732313A (en) * | 2022-01-30 | 2023-03-03 | 江苏亚电科技有限公司 | Cleaning method of horizontal wafer cleaning device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108955205A (en) * | 2018-07-04 | 2018-12-07 | 鲍振宇 | It is a kind of for cleaning and drying the device of workpiece |
| CN208256637U (en) * | 2018-06-25 | 2018-12-18 | 世巨科技（合肥）有限公司 | A kind of self-desiccation apparatus for cleansing semiconductor wafer |
| CN209312731U (en) * | 2019-01-24 | 2019-08-27 | 深圳市正和兴电子有限公司 | A kind of wafer cleaning drying device |
| CN209947800U (en) * | 2019-04-30 | 2020-01-14 | 铜陵市峰华电子有限公司 | Wafer cleaning and drying equipment |
-
2020
- 2020-03-04 CN CN202010149358.6A patent/CN111383965A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208256637U (en) * | 2018-06-25 | 2018-12-18 | 世巨科技（合肥）有限公司 | A kind of self-desiccation apparatus for cleansing semiconductor wafer |
| CN108955205A (en) * | 2018-07-04 | 2018-12-07 | 鲍振宇 | It is a kind of for cleaning and drying the device of workpiece |
| CN209312731U (en) * | 2019-01-24 | 2019-08-27 | 深圳市正和兴电子有限公司 | A kind of wafer cleaning drying device |
| CN209947800U (en) * | 2019-04-30 | 2020-01-14 | 铜陵市峰华电子有限公司 | Wafer cleaning and drying equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114289355A (en) * | 2021-11-19 | 2022-04-08 | 杭州中欣晶圆半导体股份有限公司 | Film forming system and film forming method for reducing adsorption of particles on surface of wafer |
| CN114289355B (en) * | 2021-11-19 | 2023-02-03 | 杭州中欣晶圆半导体股份有限公司 | Film forming system and film forming method for reducing adsorption of particles on surface of wafer |
| CN115732313A (en) * | 2022-01-30 | 2023-03-03 | 江苏亚电科技有限公司 | Cleaning method of horizontal wafer cleaning device |
| CN115732313B (en) * | 2022-01-30 | 2024-04-05 | 江苏亚电科技股份有限公司 | Cleaning method of wafer horizontal cleaning device |
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Application publication date: 20200707 |
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