CN114289355A - Film forming system and film forming method for reducing adsorption of particles on surface of wafer - Google Patents
Film forming system and film forming method for reducing adsorption of particles on surface of wafer Download PDFInfo
- Publication number
- CN114289355A CN114289355A CN202111376165.5A CN202111376165A CN114289355A CN 114289355 A CN114289355 A CN 114289355A CN 202111376165 A CN202111376165 A CN 202111376165A CN 114289355 A CN114289355 A CN 114289355A
- Authority
- CN
- China
- Prior art keywords
- wafer
- fixedly connected
- cleaning
- conductive
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a film forming system and a film forming method for reducing the adsorption of particles on the surface of a wafer, and relates to the technical field of wafer film forming The springs are matched with each other, so that the bottom end of the cleaning brush body is fully attached to the wafer and the wafer box.
Description
Technical Field
The invention relates to the technical field of wafer film forming, in particular to a film forming system and a film forming method for reducing particle adsorption on the surface of a wafer.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, is called a wafer because the wafer is circular in shape, and needs a film forming system for removing particles on the surface of the wafer and then performing a film forming operation to complete the treatment of the surface of the wafer in order to reduce the adsorption of the particles on the surface of the wafer before film formation.
In the existing wafer film forming process, most of the existing wafer film forming processes can not clean the wafer by a method of simultaneously physically and chemically combining the wafer, and can not timely eliminate generated static electricity when the wafer is physically brushed, and in addition, air impurities in the inner end of the system can not be timely removed, cleaning liquid on the wafer is dried, and then the finished product quality of the wafer is influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a film forming system and a film forming method for reducing the adsorption of particles on the surface of a wafer, and solves the problems that the wafer cannot be cleaned by a physical and chemical combined method, static electricity cannot be eliminated in time when the wafer is physically cleaned, air impurities cannot be eliminated in time, the quality of a finished wafer product is influenced, and the like.
In order to achieve the purpose, the invention is realized by the following technical scheme: a film forming system for reducing the adsorption of particles on the surface of a wafer comprises a cleaning box, wherein the lower end of the cleaning box is fixedly connected with a discharge hopper, the bottom end of the discharge hopper is connected with a first recovery box fixedly connected with the cleaning box towards the outer lower end in a sliding manner, the upper end of the outer side of the cleaning box is fixedly connected with a liquid storage tank, the inner end of the liquid storage tank is connected with a stirring rod assembly, one end, close to the outer side of the liquid storage tank, of the stirring rod assembly is connected with a first belt pulley assembly, the bottom end of the liquid storage tank is fixedly connected with a discharge pipe, the inner bottom end of the cleaning box is fixedly connected with a filter plate, the discharge pipe is fixedly connected with a manual valve close to the lower end of the liquid storage tank, the middle end of the discharge pipe is fixedly connected with a liquid pump fixedly connected with the cleaning box, the lower end of the discharge pipe is fixedly connected with a driving mechanism connected with the cleaning box, and two sides of the driving mechanism are both connected with bevel gear assemblies connected with the outer end of the cleaning box, one end of the side surface of the bevel gear component is connected with the lower end of the first belt pulley component, the other end of the side surface of the bevel gear component is connected with a second belt pulley component, the upper end of the second belt pulley component is connected with a gear component connected with the liquid storage tank, the upper side of the gear component, which is close to the inner end of the liquid storage tank, is connected with the stirring rod component, and the bottom end of the bevel gear component is connected with a cleaning brush connected with the cleaning box;
the cleaning brush is composed of a rotating rod, a buffer piece, a cleaning brush body and a conductive assembly, wherein the rotating rod is connected with a bevel gear assembly, the conductive assembly is connected with the outer end of the cleaning box, the inner end of the rotating rod is connected with the buffer piece, the bottom end of the rotating rod is connected with the cleaning brush body, the cleaning brush body is connected with the buffer piece, the top end of the rotating rod is connected with the conductive assembly, and the conductive assembly is connected with the buffer piece;
the cleaning brush comprises a cleaning brush body, a buffer part, a rotating rod, a spring and a conductive rod, wherein the bottom end of the cleaning brush body is connected with the bottom end of the telescopic rod;
the top end of the liquid storage tank is fixedly connected with a first backflow pipe, the side face of the cleaning box is fixedly connected with a drying shell, the bottom end of the drying shell is fixedly connected with a first heating plate, and the upper end of the outer side of the drying shell is connected with an adjusting mechanism.
Preferably, the ring flange subassembly comprises ring flange body, rubber buffer, conducting block, the ring flange body is connected with bull stick, brush hair, bolster respectively, ring flange body edge is close to the screw upper end and is connected with the rubber buffer, ring flange body inner is connected with the conducting block, conducting block lower extreme and conductive wire electric connection, the conducting block upper end is connected with the bolster.
Preferably, the conducting assembly is composed of a conducting column, a connecting piece and a grounding line, the top end of the rotating rod is fixedly connected with the conducting column, the conducting column is connected with the top end of the buffer piece, and the connecting piece is respectively connected with the cleaning box, the conducting column and the grounding line.
Preferably, the connecting piece comprises a slide bar, a conductive bead, a buffer wire and a conductive ring, the conductive ring is fixedly connected with the cleaning box, the conductive ring is electrically connected with the grounding wire, the conductive ring is slidably connected with the slide bar, the bottom end of the slide bar is rotatably connected with the conductive bead, the surface of the slide bar is fixedly connected with the buffer wire, the upper end of the buffer wire is fixedly connected with the conductive ring, and the conductive bead is slidably connected with the conductive column.
Preferably, both sides of the inner end of the drying shell are slidably connected with a partition plate, the drying shell is fixedly connected with a processing shell away from the cleaning box, the inner bottom end of the processing shell is fixedly connected with a second heating plate, the outer side of the processing shell is fixedly connected with an air cylinder with an extension end slidably connected with the partition plate, the outer upper end of the processing shell is fixedly connected with an air storage tank assembly, the bottom end of the air storage tank assembly is fixedly connected with an air pump assembly, the bottom end of the air pump assembly is fixedly connected with a conduit fixedly connected with the inner upper end of the processing shell, the processing shell is fixedly connected with a nitrogen tank close to the air storage tank assembly, the bottom end of the nitrogen tank is fixedly connected with a gas compressor fixedly connected with the processing shell, the bottom end of the gas compressor is fixedly connected with a second three-way electromagnetic valve, the bottom air outlet of the second three-way electromagnetic valve is fixedly connected with an injection pipe fixedly connected with the processing shell, the positive fixedly connected with apron of liquid storage pot, the positive rotation of clean case is connected with first rotor plate, it openly rotates and is connected with the second rotor plate to handle the shell, second three-way solenoid valve side opening end fixedly connected with second back flow, the cylinder extends the side end fixedly connected with and has the thing dish, handle shell outside lower extreme fixedly connected with and first hot plate and second hot plate electric connection's controller.
Preferably, the driving mechanism is composed of a first three-way electromagnetic valve, a casing and an impeller, the first three-way electromagnetic valve is respectively and fixedly connected with the discharge pipe, the casing and the first backflow pipe, the inner end of the casing is rotatably connected with the impeller, the impeller is connected with the bevel gear assembly, and the bottom end of the casing is fixedly connected with a spray plate fixedly connected with the upper end in the cleaning box.
Preferably, adjustment mechanism comprises second collection box, vacuum pump, check valve subassembly, connecting pipe, second collection box, check valve subassembly, connecting pipe all with stoving shell fixed connection, second collection box one side upper end and connecting pipe fixed connection, the connecting pipe is connected with vacuum pump, check valve subassembly respectively.
Preferably, stoving shell, first commentaries on classics board, second commentaries on classics board openly all are equipped with embedded toughened glass's observation groove, first commentaries on classics board, second commentaries on classics board edge all overlap and are equipped with the leak protection packing ring, the injection pipe is close to and is located under the pipe to handle the shell inner opening part, the baffle starts through corresponding pneumatic means, the baffle lower extreme is equipped with the circular slot with cylinder extension end sliding connection and embedded wear-resisting packing ring, it keeps away from the stopper that cylinder end fixedly connected with diameter is greater than the circular slot to carry the thing dish.
The invention also discloses a film forming method of the film forming system for reducing the adsorption of the particles on the surface of the wafer, which comprises the following steps:
step one, a user opens the first rotating plate, and after a wafer box with wafers is placed on the object carrying disc and fixed, the position of the object carrying disc is adjusted through the air cylinder, so that the wafer is attached to the brush hairs, the first rotating plate is closed, the manual valve is opened, the liquid pump is started, the liquid pump pumps the cleaning liquid from the cleaning liquid in the liquid storage tank through the discharge pipe, the cleaning liquid is sprayed into the cleaning box through the first three-way electromagnetic valve, the machine shell and the spraying plate, so that the surface of the wafer box and the surface of the wafer are wetted with the cleaning liquid, meanwhile, the impeller at the inner end of the casing rotates along with the flowing of the cleaning liquid, the impeller drives the bevel gear component to operate, the lower end of the bevel gear component drives the cleaning brush to wipe the wafer box and the wafer by matching with the cleaning liquid, the redundant cleaning liquid and the impurity mixture are discharged into the first recovery box through the filter plate and the discharge hopper, in the process, starting a vacuum pump, and pumping the air in the drying shell and the air in the processing shell into a second recovery box through a connecting pipe by the vacuum pump;
step two, in the process that the cleaning brush cleans the wafer and the wafer box, the rotating rod, the telescopic rod and the spring are matched with each other, so that the bottom end of the cleaning brush body is fully attached to the wafer and the wafer box, the wafer and the wafer box are fully cleaned, incomplete cleaning caused by uneven contact is avoided, the surface of the wafer is further polluted, static electricity generated during brush cleaning can be transmitted to the end of the conductive column through the conductive block and the conductive rod by the conductive wire, the static electricity at the end of the conductive column is conducted to the ground through the grounding wire by the connecting piece, the static electricity removing effect is further completed, the sliding rod, the conductive beads, the buffer wire and the conductive ring at the inner end of the connecting piece are matched with each other in the process, the static electricity generated at the bottom of the rotating cleaning brush body can be led out without obstacles, and damage to the wafer before film forming caused by difficulty in static electricity removal of the rotating cleaning brush is eliminated, and the quality of finished products is further influenced;
step three, the two sides of the bevel gear component respectively drive a first belt pulley component and a second belt pulley component to operate, the first belt pulley component drives one stirring rod in the stirring rod components to rotate, the second belt pulley component drives the other stirring rod in the stirring rod components to reversely rotate through a gear component, the two stirring rod components are matched with each other to fully stir the cleaning solution in the liquid storage tank so as to ensure uniform concentration of the cleaning solution and avoid influencing chemical cleaning on the surface of the wafer due to uneven concentration of the cleaning solution;
step four, after cleaning, the manual valve is closed, the first three-way electromagnetic valve is reversed, so that the residual cleaning solution flows back into the liquid storage tank through the first return pipe, waste is reduced, then the liquid pump is closed, the clapboard is opened, the cylinder is started, the cylinder drives the wafer and the wafer box to enter the drying shell through the carrying disc, the plug at the left end of the loading tray blocks the circular groove at the left end of the partition plate by observing the toughened glass at the outer end of the drying shell, the controller is started, the controller supplies power to the first heating plate, the first heating plate releases heat, heating the drying shell to promote the evaporation of the cleaning liquid on the wafer box and the wafer, introducing the evaporated cleaning liquid into a second recycling tank through a connecting pipe, drying, starting an air pumping pump assembly, injecting carrier gas, oxygen and silane at the inner end of the gas storage tank assembly into the processing shell by the air pumping pump assembly, and purging particles in the processing shell to prevent subsequent particles from being attached to the wafer;
and step five, after drying, opening the partition plate, starting the air cylinder to enable the carrying disc to drive the wafer box and the wafer to enter the processing shell, enabling the plug at the left end of the carrying disc to plug the circular groove at the right end of the partition plate, starting the controller, supplying power to the second heating plate, supplying heat to the inside of the processing shell by the second heating plate, enabling the wafer to fully react with oxygen, silane and carrying gas, further enabling the surface of the wafer to generate a silicon dioxide film, after the reaction is finished, stopping supplying heat to the second heating plate, opening the second rotating plate, taking the wafer box and the wafer out of the carrying disc, and reducing the particle adsorption degree of the surface of the silicon dioxide film on the surface of the wafer.
Preferably, in the fifth step, after the wafer and the wafer box are placed at the proper positions, the second rotating plate is closed, the second three-way electromagnetic valve and the gas compressor are started, the second three-way electromagnetic valve is reversed, the gas compressor extracts nitrogen in the nitrogen tank, and the inner end of the guide pipe is blown to avoid the blockage of the inner end of the guide pipe.
Advantageous effects
The invention provides a film forming system and a film forming method for reducing particle adsorption on the surface of a wafer. Compared with the prior art, the method has the following beneficial effects:
(1) this reduce adsorbed film forming system of wafer surface granule and filming method, through set up actuating mechanism in the device, the cleaning solution is through first three-way solenoid valve, a housing, spray the board, spout into in the clean incasement, make spool box and wafer surface wet the cleaning solution, meanwhile, the impeller of casing inner rotates along with the cleaning solution flows, the impeller drives the function of bevel gear subassembly, bevel gear subassembly end drives the cleaning brush and cleans spool box and wafer to the cooperation cleaning solution, the availability factor of drawing liquid pump can be increased to this kind of mode, reduce extravagantly, realize physics and the dual cleanness of chemistry to the wafer, increase cleaning efficiency.
(2) This reduce adsorbed film forming system of wafer surface granule and filming method, through set up adjustment mechanism in the device, start the vacuum pump, the vacuum pump passes through the connecting pipe will dry the shell and handle in the air suction second collection box in the shell, avoid wafer stoving in-process and the gaseous impurity in the shell of drying to react, influence follow-up filming operation, and in the evaporation process, the vacuum pump can cooperate relevant subassembly to retrieve cleaning solution steam.
(3) According to the film forming system and the film forming method for reducing the adsorption of the particles on the surface of the wafer, the buffer piece is arranged in the cleaning brush, and the rotating rod, the telescopic rod and the spring are matched with each other, so that the bottom end of the cleaning brush body is fully attached to the wafer and the wafer box, the cleaning is fully achieved, and the problem that the cleaning is incomplete due to uneven contact and the surface of the wafer is dirty is avoided.
(4) According to the film forming system and the film forming method for reducing the particle adsorption on the surface of the wafer, the conductive component is arranged at the inner end of the cleaning brush, the conductive wire can transmit static electricity generated during brush cleaning to the conductive column end through the conductive block and the conductive rod, and the connecting piece conducts the static electricity at the conductive column end to the ground through the grounding wire, so that the static electricity removing effect is completed.
(5) According to the film forming system and the film forming method for reducing the adsorption of the particles on the surface of the wafer, the flange plate assembly is arranged at the lower end of the cleaning brush, the flange plate body is convenient to detach, and then a user can replace bristles, the phenomenon that the bristles cannot be replaced for a long time and fall off seriously and cannot clean the wafer is avoided, the rubber plug can be used in the cleaning process, the protection screw is not corroded, and the service life of an instrument is prolonged.
Drawings
FIG. 1 is a structural cross-sectional view of the present invention;
FIG. 2 is a front view of the structure of the present invention;
FIG. 3 is a cross-sectional view of the construction of the inner end cleaning brush of the present invention;
FIG. 4 is a cross-sectional view of the construction of the inner end bumper of the present invention;
FIG. 5 is a partial cross-sectional view of the inner end cleaning brush body of the present invention;
FIG. 6 is a structural cross-sectional view of the inner end flange assembly of the present invention;
FIG. 7 is a cross-sectional view of the construction of an inner end conductive assembly of the present invention;
FIG. 8 is a structural cross-sectional view of the inner end connector of the present invention;
FIG. 9 is a structural cross-sectional view of the inner end drive mechanism of the present invention;
FIG. 10 is an enlarged view of a portion of the invention at A in FIG. 1;
fig. 11 is an enlarged view of the inner end adjustment mechanism of the present invention.
In the figure: 1. a cleaning tank; 2. a discharge hopper; 3. a first recovery tank; 4. a liquid storage tank; 5. a stirring rod assembly; 6. a first pulley assembly; 7. a discharge pipe; 8. a liquid pump; 9. a drive mechanism; 91. a first three-way solenoid valve; 92. a housing; 93. an impeller; 10. a bevel gear assembly; 11. a cleaning brush; 111. a rotating rod; 112. a buffer member; 1121. a telescopic rod; 1122. a spring; 1123. a conductive rod; 113. a cleaning brush body; 1131. a flange assembly; 11311. the flange plate body; 11312. a rubber plug; 11313. a conductive block; 1132. brushing; 1133. a conductive filament; 114. a conductive component; 1141. a conductive post; 1142. a connecting member; 11421. a slide bar; 11422. conductive beads; 11423. buffering wires; 11424. conducting rings; 1143. a ground line; 12. a second pulley assembly; 13. a gear assembly; 14. a first return pipe; 15. drying the shell; 16. a first heating plate; 17. an adjustment mechanism; 171. a second recovery tank; 172. a vacuum pump; 173. a check valve assembly; 174. a connecting pipe; 18. a partition plate; 19. treating the shell; 20. a second heating plate; 21. a cylinder; 22. a gas tank assembly; 23. a conduit; 24. an air extraction pump assembly; 25. a nitrogen tank; 26. a gas compressor; 27. a second three-way solenoid valve; 28. an injection pipe; 29. a cover plate; 30. a first rotating plate; 31. a second rotating plate; 32. a second return pipe; 33. a carrying plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a reduce absorptive film forming system of wafer surface granule, including clean case 1, clean 1 lower extreme fixedly connected with of case goes out hopper 2, go out 2 bottom sliding connection of hopper and clean 1 first collection box 3 toward outside lower extreme fixed connection of case, clean 1 outside upper end fixedly connected with liquid storage pot 4 of case, 4 medial extremity of liquid storage pot is connected with puddler subassembly 5, puddler subassembly 5 is close to 4 outside one end of liquid storage pot and is connected with first belt pulley subassembly 6, 4 bottom fixedly connected with discharging pipe 7 of liquid storage pot, 1 bottom fixedly connected with filter plate in clean case, discharging pipe 7 is close to 4 lower extreme fixedly connected with manual valves of liquid storage pot, the impurity in the cleaning solution can be filtered to the filter plate, reduce the purification step of follow-up recovery cleaning solution, the flow of manual valve user's control cleaning solution of being convenient for. The middle end of the discharge pipe 7 is fixedly connected with a liquid pump 8 fixedly connected with the cleaning box 1, the lower end of the discharge pipe 7 is fixedly connected with a driving mechanism 9 connected with the cleaning box 1, and two sides of the driving mechanism 9 are both connected with bevel gear components 10 connected with the outer end of the cleaning box 1.
The driving mechanism 9 is composed of a first three-way electromagnetic valve 91, a casing 92 and an impeller 93, the first three-way electromagnetic valve 91 is respectively fixedly connected with the discharge pipe 7, the casing 92 and a first return pipe 14, the inner end of the casing 92 is rotatably connected with the impeller 93, the impeller 93 is connected with a bevel gear component 10, the bottom end of the casing 92 is fixedly connected with a spray plate fixedly connected with the inner upper end of the cleaning box 1, cleaning liquid is sprayed into the cleaning box 1 through the first three-way electromagnetic valve 91, the casing 92 and the spray plate, so that the wafer box and the surface of the wafer are wetted with the cleaning liquid, meanwhile, the impeller 93 at the inner end of the casing 92 rotates along with the flowing of the cleaning liquid, the impeller 93 drives the bevel gear component 10 to operate, the lower end of the bevel gear component 10 drives the cleaning brush 11 to clean the wafer box and the wafer by matching cleaning liquid, the mode can increase the use efficiency of the liquid pump 8, reduce waste, and realize double cleaning of the wafer by physics and chemistry, the cleaning efficiency is increased.
The cleaning brush 11 is composed of a rotating rod 111, a buffer member 112, a cleaning brush body 113 and a conductive assembly 114, wherein the rotating rod 111 is connected with the bevel gear assembly 10, the conductive assembly 114 is connected with the outer end of the cleaning box 1, the inner end of the rotating rod 111 is connected with the buffer member 112, the bottom end of the rotating rod 111 is connected with the cleaning brush body 113, the cleaning brush body 113 is connected with the buffer member 112, the top end of the rotating rod 111 is connected with the conductive assembly 114, and the conductive assembly 114 is connected with the buffer member 112. The buffer member 112 is composed of a telescopic rod 1121, a spring 1122, and a conductive rod 1123, the bottom end of the telescopic rod 1121 is connected to the cleaning brush body 113, the upper end of the telescopic rod 1121 is slidably connected to the rotating rod 111, the top end of the telescopic rod 1121 is fixedly connected to the spring 1122, the top end of the spring 1122 is fixedly connected to the inner end of the rotating rod 111, the conductive rod 1123 is slidably connected to the rotating rod 111 and the telescopic rod 1121, the bottom end of the conductive rod 1123 is connected to the cleaning brush body 113, the top end of the conductive rod 1123 is connected to the conductive assembly 114, the rotating rod 111, the telescopic rod 1121, and the spring 1122 are matched with each other, so that the bottom end of the cleaning brush body 113 is fully attached to the wafer and the wafer box, the wafer is fully cleaned, incomplete cleaning caused by uneven contact is avoided, and therefore, the surface of the wafer is dirty, the static electricity generated when the brush bristles 1132 are cleaned can be transmitted to the end of the conductive post 1141 through the conductive block 11313 and the conductive rod 1123, the connecting member 1142 guides the static electricity at the end of the conductive post 1141 to the ground wire 1143, thereby completing the static electricity removing function.
The cleaning brush body 113 is composed of a flange plate assembly 1131, bristles 1132 and conductive wires 1133, the upper end of the flange plate assembly 1131 is connected with the rotating rod 111 and the buffer member 112 respectively, and the lower end of the flange plate assembly is connected with the bristles 1132 and the conductive wires 1133 respectively. Flange plate subassembly 1131 comprises ring flange body 11311, rubber buffer 11312, conducting block 11313, ring flange body 11311 respectively with bull stick 111, brush hair 1132, bolster 112 is connected, ring flange body 11311 edge is close to the screw upper end and is connected with rubber buffer 11312, ring flange body 11311 inner end is connected with conducting block 11313, conducting block 11313 lower extreme and conducting wire 1133 electric connection, conducting block 11313 upper end is connected with bolster 112, ring flange body 11311 convenient to detach, and then the convenient to use person changes brush hair 1132, and rubber buffer 11312 can be in the cleaning process, the protection screw does not corrode, the extension apparatus life, conducting block 11313 cooperation conducting wire 1133 is with brush hair 1132 because of the static leading-in relevant position of clean production.
The conductive assembly 114 comprises a conductive post 1141, a connecting member 1142, and a ground wire 1143, the top end of the rotating rod 111 is fixedly connected to the conductive post 1141, the conductive post 1141 is connected to the top end of the buffer member 112, and the connecting member 1142 is respectively connected to the cleaning box 1, the conductive post 1141, and the ground wire 1143. The connecting member 1142 is composed of a sliding rod 11421, a conductive bead 11422, a buffer wire 11423 and a conductive ring 11424, the conductive ring 11424 is fixedly connected with the cleaning box 1, the conductive ring 11424 is electrically connected with a grounding wire 1143, the conductive ring 11424 is slidably connected with the sliding rod 11421, the bottom end of the sliding rod 11421 is rotatably connected with the conductive bead 11422, the surface of the sliding rod 11421 is fixedly connected with the buffer wire 11423, the upper end of the buffer wire 11423 is fixedly connected with the conductive ring 11424, the conductive bead 11422 is slidably connected with the conductive post 1141, the sliding rod 11421, the conductive bead 11422, the buffer wire 11423 and the conductive ring 11424 at the inner end of the connecting member 1142 are matched with each other in the process, so that static electricity generated at the bottom of the rotating cleaning brush body 113 can be led out without obstacles, damage to the rotating cleaning brush 11 before film forming of the wafer due to difficulty in removing the static electricity is eliminated, and the quality of the finished product is further influenced.
The two sides of the inner end of the drying shell 15 are slidably connected with a partition plate 18, the end of the drying shell 15 far away from the cleaning box 1 is fixedly connected with a processing shell 19, the inner bottom end of the processing shell 19 is fixedly connected with a second heating plate 20, the outer side of the processing shell 19 far away from the drying shell 15 is fixedly connected with an air cylinder 21 with an extending end slidably connected with the partition plate 18, the upper end of the outer side of the processing shell 19 is fixedly connected with an air storage tank assembly 22, the bottom end of the air storage tank assembly 22 is fixedly connected with an air suction pump assembly 24, the bottom end of the air suction pump assembly 24 is fixedly connected with a guide pipe 23 fixedly connected with the inner upper end of the processing shell 19, the end of the processing shell 19 close to the air storage tank assembly 22 is fixedly connected with a nitrogen tank 25, the bottom end of the nitrogen tank 25 is fixedly connected with a gas compressor 26 fixedly connected with the processing shell 19, the bottom end of the gas compressor 26 is fixedly connected with a second three-way electromagnetic valve 27, and the gas outlet at the bottom end of the second three-way electromagnetic valve 27 is fixedly connected with an injection pipe 28 fixedly connected with the processing shell 19, the front of the liquid storage tank 4 is fixedly connected with a cover plate 29, the front of the cleaning box 1 is rotatably connected with a first rotating plate 30, the front of the processing shell 19 is rotatably connected with a second rotating plate 31, the side opening end of the second three-way electromagnetic valve 27 is fixedly connected with a second return pipe 32, the tail end of the extending side of the cylinder 21 is fixedly connected with a loading disc 33, and the lower end of the outer side of the processing shell 19 is fixedly connected with a controller which is electrically connected with the first heating plate 16 and the second heating plate 20.
The front surfaces of the drying shell 15, the first rotating plate 30 and the second rotating plate 31 are all provided with observation grooves embedded with toughened glass, the toughened glass is convenient for a user to observe the motion conditions of a wafer box, a wafer and a carrying disc 33 in the film forming process, and properly adjusted, the edges of the first rotating plate 30 and the second rotating plate 31 are respectively sleeved with a leakage-proof gasket which can play a good role in leakage prevention, potential safety hazards are caused by gas leakage in the film forming process, the injection pipe 28 is positioned right below the guide pipe 23 near the opening at the inner end of the processing shell 19, after the film forming is finished, the guide pipe 23 can be purged through the injection pipe 28, and then avoid pipe 23 to block up, baffle 18 is started through corresponding pneumatic means, and the baffle 18 lower extreme is equipped with the circular slot with cylinder 21 extension end sliding connection and embedded wear-resisting packing ring, and the stopper that the diameter is greater than the circular slot is kept away from cylinder 21 end fixedly connected with to carry thing dish 33, and this setting can make baffle 18 have good gas tightness.
The invention also discloses a film forming method of the film forming system for reducing the adsorption of the particles on the surface of the wafer, which comprises the following steps:
firstly, a user opens a first rotating plate 30, a wafer box containing wafers is placed on an object carrying disc 33 and fixed well, the position of the object carrying disc 33 is adjusted through an air cylinder 21, the wafers are attached to bristles 1132, the first rotating plate 30 is closed, a manual valve is opened, a liquid pump 8 is started, the liquid pump 8 pumps cleaning liquid out of a liquid storage tank 4 through a discharge pipe 7, the cleaning liquid is sprayed into a cleaning tank 1 through a first three-way electromagnetic valve 91, a machine shell 92 and a spraying plate, the wafer box and the surfaces of the wafers are wetted with the cleaning liquid, meanwhile, an impeller 93 at the inner end of the machine shell 92 rotates along with the flowing of the cleaning liquid, the impeller 93 drives a bevel gear component 10 to operate, the lower end of the bevel gear component 10 drives a cleaning brush 11 to wipe the wafer box and the wafers in cooperation with the cleaning liquid, redundant cleaning liquid and impurity mixture are discharged into a first recovery tank 3 through the filter plate and a discharge hopper 2, in the process, the vacuum pump 172 is started, the vacuum pump 172 draws air in the drying cabinet 15 and the treating cabinet 19 into the second recovery tank 171 through the connection pipe 174;
step two, in the process of cleaning the wafer and the wafer box by the cleaning brush 11, the rotating rod 111, the telescopic rod 1121, the spring 1122 cooperate with each other, so that the bottom end of the cleaning brush body 113 is fully attached to the wafer and the wafer box to fully clean the wafer and the wafer box, and incomplete cleaning caused by uneven contact is avoided, thereby causing the surface of the wafer to be dirty, the conductive wire 1133 can transmit the static electricity generated by the cleaning of the brush 1132 to the end of the conductive post 1141 through the conductive block 11313 and the conductive rod 1123, the connecting member 1142 can guide the static electricity at the end of the conductive post 1141 to the ground through the grounding wire 1143, thereby completing the static electricity removing function, and the sliding bar 11421, the conductive bead 11422, the buffer wire 11423 and the conductive ring 11424 at the inner end of the connecting member 1142 are matched with each other in the process, static electricity generated at the bottom of the rotating cleaning brush body 113 can be led out without obstacles, and damage to the rotating cleaning brush 11 before film forming of a wafer caused by difficulty in static electricity removal is eliminated, so that the quality of a finished product is influenced;
step three, the two sides of the bevel gear component 10 respectively drive the first belt pulley component 6 and the second belt pulley component 12 to operate, the first belt pulley component 6 drives one stirring rod in the stirring rod component 5 to rotate, the second belt pulley component 12 drives the other stirring rod in the stirring rod component 5 to reversely rotate through the gear component 13, the two stirring rod components 5 are matched with each other to fully stir the cleaning solution in the liquid storage tank 4, so that the concentration uniformity of the cleaning solution is ensured, and the chemical cleaning on the surface of the wafer is prevented from being influenced by the non-uniform concentration of the cleaning solution;
step four, after the cleaning is finished, the manual valve is closed, the first three-way electromagnetic valve 91 is reversed, so that the residual cleaning solution flows back into the liquid storage tank 4 through the first return pipe 14, the waste is reduced, the liquid pump 8 is closed, the partition plate 18 is opened, the air cylinder 21 is started, the air cylinder 21 drives the wafer and the wafer box to enter the drying shell 15 through the object carrying disc 33, the plug at the left end of the object carrying disc 33 blocks the circular groove at the left end of the partition plate 18 through the observation of toughened glass at the outer end of the drying shell 15, the controller is started, the controller supplies power to the first heating plate 16, the first heating plate 16 releases heat, the interior of the drying shell 15 is heated, the evaporation of the cleaning solution on the wafer box and the wafer is promoted, the evaporated cleaning solution enters the second recovery tank 171 through the connecting pipe 174, the air pumping assembly 24 is started in the drying process, the air pumping assembly 24 injects the carrier gas, the oxygen and the silane at the inner end of the gas storage tank assembly 22 into the processing shell 19, purging the particles in the processing shell 19 to prevent subsequent particles from attaching to the wafer;
step five, after the drying is finished, the partition plate 18 is opened, the cylinder 21 is started, the object carrying disc 33 drives the wafer box and the wafers to enter the processing shell 19, the plug at the left end of the object carrying disc 33 blocks the circular groove at the right end of the partition plate 18, the controller is started, the controller supplies power to the second heating plate 20, the second heating plate 20 supplies heat to the processing shell 19, the wafers are fully reacted with oxygen, silane and carrier gas, and further the silicon dioxide film is generated on the surfaces of the wafers, after the reaction is finished, the heat supply to the second heating plate 20 is stopped, the second rotating plate 31 is opened, the wafer box and the wafers are taken out from the object carrying disc 33, the silicon dioxide film on the surfaces of the wafers can reduce the particle adsorption degree of the surfaces, after the wafers and the wafer box are placed at proper positions, the second rotating plate 31 is closed, the second three-way electromagnetic valve 27 and the gas compressor 26 are started, the second three-way electromagnetic valve 27 is reversed, the gas compressor 26 extracts the nitrogen in the nitrogen tank 25, the inner end of the conduit 23 is blown to avoid clogging of the inner end.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A film forming system for reducing particle adsorption on the surface of a wafer comprises a cleaning box (1), and is characterized in that: the lower end of the cleaning box (1) is fixedly connected with a discharge hopper (2), the bottom end of the discharge hopper (2) is slidably connected with a first recovery box (3) fixedly connected with the cleaning box (1) towards the outer lower end, the outer upper end of the cleaning box (1) is fixedly connected with a liquid storage tank (4), the inner side end of the liquid storage tank (4) is connected with a stirring rod assembly (5), one end, close to the outer side of the liquid storage tank (4), of the stirring rod assembly (5) is connected with a first belt pulley assembly (6), the bottom end of the liquid storage tank (4) is fixedly connected with a discharge pipe (7), the inner bottom end of the cleaning box (1) is fixedly connected with a filter plate, the discharge pipe (7) is close to the lower end of the liquid storage tank (4) and is fixedly connected with a manual valve, the middle end of the discharge pipe (7) is fixedly connected with a liquid pump (8) fixedly connected with the cleaning box (1), and the lower end of the discharge pipe (7) is fixedly connected with a driving mechanism (9) connected with the cleaning box (1), both sides of the driving mechanism (9) are connected with bevel gear assemblies (10) connected with the outer end of the cleaning box (1), one end of the side face of each bevel gear assembly (10) is connected with the lower end of the first belt pulley assembly (6), the other end of the side face of each bevel gear assembly (10) is connected with the second belt pulley assembly (12), the upper end of each second belt pulley assembly (12) is connected with a gear assembly (13) connected with the liquid storage tank (4), the inner end, close to the liquid storage tank (4), of the upper side of each gear assembly (13) is connected with the stirring rod assembly (5), and the bottom end of each bevel gear assembly (10) is connected with a cleaning brush (11) connected with the cleaning box (1);
the cleaning brush (11) is composed of a rotating rod (111), a buffer piece (112), a cleaning brush body (113) and a conductive assembly (114), the rotating rod (111) is connected with the bevel gear assembly (10), the conductive assembly (114) is connected with the outer end of the cleaning box (1), the inner end of the rotating rod (111) is connected with the buffer piece (112), the bottom end of the rotating rod (111) is connected with the cleaning brush body (113), the cleaning brush body (113) is connected with the buffer piece (112), the top end of the rotating rod (111) is connected with the conductive assembly (114), and the conductive assembly (114) is connected with the buffer piece (112);
the cleaning brush is characterized in that the buffer member (112) is composed of an expansion link (1121), a spring (1122) and a conductive rod (1123), the bottom end of the expansion link (1121) is connected with the cleaning brush body (113), the upper end of the expansion link (1121) is in sliding connection with the rotating rod (111), the top end of the expansion link (1121) is fixedly connected with the spring (1122), the top end of the spring (1122) is fixedly connected with the inner end of the rotating rod (111), the conductive rod (1123) is in sliding connection with the rotating rod (111) and the expansion link (1121) respectively, the bottom end of the conductive rod (1123) is connected with the cleaning brush body (113), the top end of the conductive rod (1123) is connected with the conductive component (114), the cleaning brush body (113) is composed of a flange plate component (1131), bristles (1132) and conductive wires (1133), the upper end of the flange plate component (1131) is connected with the rotating rod (111) and the buffer member (112) respectively, and the lower end of the flange plate component is connected with the bristles (1132) respectively, A conductive filament (1133) connection;
liquid storage pot (4) top fixedly connected with first return pipe (14), clean case (1) side fixedly connected with stoving shell (15), stoving shell (15) inner bottom fixedly connected with first hot plate (16), stoving shell (15) outside upper end is connected with adjustment mechanism (17).
2. A film-forming system for reducing particle adsorption on a wafer surface according to claim 1, wherein: flange plate subassembly (1131) comprises ring flange body (11311), rubber buffer (11312), conducting block (11313), ring flange body (11311) is connected with bull stick (111), brush hair (1132), bolster (112) respectively, ring flange body (11311) edge is close to the screw upper end and is connected with rubber buffer (11312), ring flange body (11311) inner end is connected with conducting block (11313), conducting block (11313) lower extreme and conducting wire (1133) electric connection, conducting block (11313) upper end is connected with bolster (112).
3. A film-forming system for reducing particle adsorption on a wafer surface according to claim 1, wherein: the conductive assembly (114) is composed of a conductive column (1141), a connecting piece (1142) and a grounding line (1143), the top end of the rotating rod (111) is fixedly connected with the conductive column (1141), the conductive column (1141) is connected with the top end of the buffer piece (112), and the connecting piece (1142) is respectively connected with the cleaning box (1), the conductive column (1141) and the grounding line (1143).
4. A film forming system for reducing particle adsorption on a wafer surface according to claim 3, wherein: connecting piece (1142) comprise slide bar (11421), conductive ball (11422), buffer wire (11423), conducting ring (11424), conducting ring (11424) and cleaning box (1) fixed connection, conducting ring (11424) and earth connection (1143) electric connection, conducting ring (11424) and slide bar (11421) sliding connection, slide bar (11421) bottom and conductive ball (11422) rotate to be connected, slide bar (11421) surface and buffer wire (11423) fixed connection, buffer wire (11423) upper end and conducting ring (11424) fixed connection, conductive ball (11422) and conductive post (1141) sliding connection.
5. A film-forming system for reducing particle adsorption on a wafer surface according to claim 1, wherein: the inner end of the drying shell (15) is slidably connected with a partition plate (18), the drying shell (15) is far away from a cleaning box (1) and fixedly connected with a processing shell (19), the inner end of the processing shell (19) is fixedly connected with a second heating plate (20), the outer side of the processing shell (19) is far away from a cylinder (21) of which the extending end is slidably connected with the partition plate (18), the outer upper end of the processing shell (19) is fixedly connected with a gas storage tank assembly (22), the bottom end of the gas storage tank assembly (22) is fixedly connected with a gas pumping pump assembly (24), the bottom end of the gas pumping pump assembly (24) is fixedly connected with a guide pipe (23) fixedly connected with the inner upper end of the processing shell (19), the processing shell (19) is close to the gas storage tank assembly (22) and fixedly connected with a nitrogen tank (25), the bottom end of the nitrogen tank (25) is fixedly connected with a gas compressor (26) fixedly connected with the processing shell (19), gas compressor (26) bottom fixedly connected with second three way solenoid valve (27), second three way solenoid valve (27) bottom gas outlet fixedly connected with and handle shell (19) fixed connection's injection pipe (28), liquid storage pot (4) openly fixedly connected with apron (29), clean case (1) openly rotates and is connected with first commentaries on classics board (30), it openly rotates and is connected with second commentaries on classics board (31) to handle shell (19), second three way solenoid valve (27) side opening end fixedly connected with second back flow (32), cylinder (21) extension side end fixed connection has thing dish (33), handle shell (19) outside lower extreme fixedly connected with and first hot plate (16) and second hot plate (20) electric connection's controller.
6. A film-forming system for reducing particle adsorption on a wafer surface according to claim 1, wherein: the driving mechanism (9) is composed of a first three-way electromagnetic valve (91), a casing (92) and an impeller (93), the first three-way electromagnetic valve (91) is fixedly connected with the discharge pipe (7), the casing (92) and the first return pipe (14) respectively, the inner end of the casing (92) is rotatably connected with the impeller (93), the impeller (93) is connected with the bevel gear assembly (10), and the bottom end of the casing (92) is fixedly connected with a spray plate fixedly connected with the inner upper end of the cleaning box (1).
7. A film-forming system for reducing particle adsorption on a wafer surface according to claim 1, wherein: adjustment mechanism (17) comprise second collection box (171), vacuum pump (172), check valve subassembly (173), connecting pipe (174), second collection box (171), check valve subassembly (173), connecting pipe (174) all with stoving shell (15) fixed connection, second collection box (171) one side upper end and connecting pipe (174) fixed connection, connecting pipe (174) are connected with vacuum pump (172), check valve subassembly (173) respectively.
8. The system of claim 5, wherein the wafer comprises: drying shell (15), first commentaries on classics board (30), second commentaries on classics board (31) openly all are equipped with embedded toughened glass's observation groove, first commentaries on classics board (30), second commentaries on classics board (31) edge all overlap and are equipped with the leak protection packing ring, injection pipe (28) are close to and are handled shell (19) inner opening part and are located under pipe (23), baffle (18) start through corresponding pneumatic means, baffle (18) lower extreme is equipped with the circular slot with cylinder (21) extension end sliding connection and embedded wear-resisting packing ring, it keeps away from cylinder (21) end fixedly connected with diameter and is greater than the stopper of circular slot to carry thing dish (33).
9. A film forming method for reducing particle adsorption on the surface of a wafer is characterized in that: the method specifically comprises the following steps:
step one, a user opens a first rotating plate (30), after a wafer box with wafers is placed on an object carrying disc (33) and fixed, the position of the object carrying disc (33) is adjusted through an air cylinder (21), the wafers are attached to bristles (1132), the first rotating plate (30) is closed, a manual valve is opened, an infusion pump (8) is started, the infusion pump (8) pumps cleaning liquid from a liquid storage tank (4) through a discharge pipe (7), the cleaning liquid is sprayed into a cleaning box (1) through a first three-way electromagnetic valve (91), a machine shell (92) and a spraying plate, the wafer box and the surfaces of the wafers are wetted with the cleaning liquid, meanwhile, an impeller (93) at the inner end of the machine shell (92) rotates along with the flowing of the cleaning liquid, the impeller (93) drives a bevel gear component (10) to operate, and the lower end of the bevel gear component (10) drives a cleaning brush (11) to wipe the wafer box and the wafers together with the cleaning liquid, redundant cleaning solution and impurity mixture are discharged into the first recovery tank (3) through the filter plate and the discharge hopper (2), in the process, a vacuum pump (172) is started, and the vacuum pump (172) pumps air in the drying shell (15) and the processing shell (19) into the second recovery tank (171) through a connecting pipe (174);
step two, in the process that the cleaning brush (11) cleans the wafer and the wafer box, the rotating rod (111), the telescopic rod (1121) and the spring (1122) are matched with each other, so that the bottom end of the cleaning brush body (113) is fully attached to the wafer and the wafer box, the wafer and the wafer box are fully cleaned, incomplete cleaning caused by uneven contact is avoided, the surface of the wafer is polluted, static electricity generated when the brush bristles (1132) are cleaned can be transmitted to the end of the conductive post (1141) through the conductive block (11313) and the conductive rod (1123) by the conductive wire (1133), the static electricity at the end of the conductive post (1141) is conducted to the ground through the grounding wire (1143) by the connecting piece (1142), the static electricity removing effect is completed, the sliding rod (11421), the conductive ball (11422), the buffer wire (11423) and the conductive ring (11424) at the inner end of the connecting piece (1142) are matched with each other in the process, and the static electricity generated at the bottom of the rotating cleaning brush body (113) can be led out without obstacles, the damage of the rotary cleaning brush (11) before the film forming of the wafer caused by difficult static electricity removal is eliminated, and the quality of the finished product is further influenced;
step three, the two sides of the bevel gear component (10) respectively drive the first belt pulley component (6) and the second belt pulley component (12) to operate, the first belt pulley component (6) drives one stirring rod in the stirring rod component (5) to rotate, the second belt pulley component (12) drives the other stirring rod in the stirring rod component (5) to reversely rotate through the gear component (13), the two stirring rod components (5) are matched with each other, the cleaning solution in the liquid storage tank (4) is fully stirred, so that the uniform concentration of the cleaning solution is ensured, and the chemical cleaning on the surface of the wafer due to the uneven concentration of the cleaning solution is avoided;
step four, after cleaning, the manual valve is closed, the first three-way electromagnetic valve (91) is reversed to enable the residual cleaning solution to flow back into the liquid storage tank (4) through the first return pipe (14), waste is reduced, then the liquid pump (8) is closed, the partition plate (18) is opened, the air cylinder (21) is started, the air cylinder (21) drives the wafer and the wafer box to enter the drying shell (15) through the object carrying disc (33), the round groove at the left end of the partition plate (18) is blocked by a plug at the left end of the object carrying disc (33) through observation of toughened glass at the outer end of the drying shell (15), the controller is started, the controller supplies power to the first heating plate (16), the first heating plate (16) releases heat to heat the inside of the drying shell (15) to promote evaporation of the wafer box and the wafer cleaning solution, the evaporated cleaning solution enters the second recovery tank (171) through the connecting pipe (174), air extraction is carried out in the drying process, and the pump assembly (24) is started, the air pumping pump assembly (24) injects carrier gas, oxygen and silane at the inner end of the gas storage tank assembly (22) into the processing shell (19) to purge particles in the processing shell (19) so as to prevent subsequent particles from being attached to the wafer;
and step five, after drying, opening the partition plate (18), starting the air cylinder (21), enabling the object carrying plate (33) to drive the wafer box and the wafers to enter the processing shell (19), enabling the plug at the left end of the object carrying plate (33) to block the circular groove at the right end of the partition plate (18), starting the controller, supplying power to the second heating plate (20) by the controller, supplying heat into the processing shell (19) by the second heating plate (20), enabling the wafers to fully react with oxygen, silane and carrier gas, and further enabling the silicon dioxide film to be generated on the surfaces of the wafers, stopping supplying heat to the second heating plate (20) after the reaction is finished, opening the second rotating plate (31), taking the wafer box and the wafer out of the object carrying plate (33), and reducing the particle adsorption degree on the surfaces of the silicon dioxide film on the surfaces of the wafers.
10. A film-forming method for reducing adsorption of particles on a surface of a wafer according to claim 9, wherein: in the fifth step, after the wafer and the wafer box are placed at proper positions, the second rotating plate (31) is closed, the second three-way electromagnetic valve (27) and the gas compressor (26) are started, the second three-way electromagnetic valve (27) is reversed, the gas compressor (26) extracts nitrogen in the nitrogen tank (25), and the inner end of the guide pipe (23) is blown to avoid the blockage of the inner end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111376165.5A CN114289355B (en) | 2021-11-19 | 2021-11-19 | Film forming system and film forming method for reducing adsorption of particles on surface of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111376165.5A CN114289355B (en) | 2021-11-19 | 2021-11-19 | Film forming system and film forming method for reducing adsorption of particles on surface of wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114289355A true CN114289355A (en) | 2022-04-08 |
| CN114289355B CN114289355B (en) | 2023-02-03 |
Family
ID=80966116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111376165.5A Active CN114289355B (en) | 2021-11-19 | 2021-11-19 | Film forming system and film forming method for reducing adsorption of particles on surface of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114289355B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
| US20050251936A1 (en) * | 2004-05-14 | 2005-11-17 | International Business Machines Corporation | Apparatus and method for cleaning electronic articles |
| CN101665918A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Film forming method and film forming apparatus |
| CN204747023U (en) * | 2015-06-24 | 2015-11-11 | 湘能华磊光电股份有限公司 | LED wafer automatic cleaning machine |
| CN110838457A (en) * | 2018-08-15 | 2020-02-25 | 台湾积体电路制造股份有限公司 | Wafer cleaning equipment and wafer cleaning method |
| CN111383965A (en) * | 2020-03-04 | 2020-07-07 | 天霖(张家港)电子科技有限公司 | Rotary type washing and drying device |
| CN212468959U (en) * | 2019-12-31 | 2021-02-05 | 常州声泰龙电子音响有限公司 | Cleaning device for loudspeaker dust cover |
| CN212494080U (en) * | 2020-03-27 | 2021-02-09 | 深圳市赛平精密技术有限公司 | Wafer cleaning machine |
| CN112838030A (en) * | 2020-12-30 | 2021-05-25 | 江苏亚电科技有限公司 | Cleaning device for wafer |
-
2021
- 2021-11-19 CN CN202111376165.5A patent/CN114289355B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
| US20050251936A1 (en) * | 2004-05-14 | 2005-11-17 | International Business Machines Corporation | Apparatus and method for cleaning electronic articles |
| CN101665918A (en) * | 2008-09-05 | 2010-03-10 | 东京毅力科创株式会社 | Film forming method and film forming apparatus |
| CN204747023U (en) * | 2015-06-24 | 2015-11-11 | 湘能华磊光电股份有限公司 | LED wafer automatic cleaning machine |
| CN110838457A (en) * | 2018-08-15 | 2020-02-25 | 台湾积体电路制造股份有限公司 | Wafer cleaning equipment and wafer cleaning method |
| CN212468959U (en) * | 2019-12-31 | 2021-02-05 | 常州声泰龙电子音响有限公司 | Cleaning device for loudspeaker dust cover |
| CN111383965A (en) * | 2020-03-04 | 2020-07-07 | 天霖(张家港)电子科技有限公司 | Rotary type washing and drying device |
| CN212494080U (en) * | 2020-03-27 | 2021-02-09 | 深圳市赛平精密技术有限公司 | Wafer cleaning machine |
| CN112838030A (en) * | 2020-12-30 | 2021-05-25 | 江苏亚电科技有限公司 | Cleaning device for wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114289355B (en) | 2023-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3186168U (en) | Electric cleaning and cleaning device | |
| CN206794196U (en) | A kind of clean dirt machine of mobile phone metal-back | |
| CN206535812U (en) | The offline cleaning machines of PCBA | |
| CN206316067U (en) | A kind of tealeaves cleaning machine | |
| CN111715629A (en) | Cleaning and drying integrated device for copper pipe joint of automobile air conditioner | |
| CN101306422A (en) | Steel ball cleaning drying device | |
| CN217665027U (en) | Multifunctional cleaning device | |
| CN114289355B (en) | Film forming system and film forming method for reducing adsorption of particles on surface of wafer | |
| CN212190320U (en) | Glass developing machine with cleaning function | |
| CN217791266U (en) | A capsule machine for garrulous crusty pancake | |
| CN208894708U (en) | A kind of guide wheel cleaning device adjusted with flow | |
| CN214767627U (en) | Novel dual disinfection washs case cleaning machine | |
| CN210657518U (en) | Spraying-sucking spinning ring dripless cleaning hand scratcher of textile fabric cleaning machine | |
| CN210497536U (en) | Washing device for cellulose acetate propionate production and processing | |
| CN210162064U (en) | Cleaning device | |
| CN201111448Y (en) | Steel ball cleaning drying device | |
| CN209566891U (en) | Autonomous car washer | |
| CN113751381A (en) | Copper strip cleaning and cutting integrated equipment and cleaning method thereof | |
| CN220781522U (en) | Washing and drying device for grinding zirconium beads | |
| CN215424492U (en) | Cleaning device of shoe sole cleaning machine | |
| CN216347680U (en) | Oil tank cleaning and drying device | |
| CN214865582U (en) | Wire rod belt cleaning device | |
| CN219636228U (en) | Self-cleaning discharger | |
| CN217432406U (en) | Automatic spray cleaning machine | |
| CN220295324U (en) | Belt cleaning device is used in valve hand wheel production |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |