CN112474524A - Wafer QDR groove for semiconductor - Google Patents
Wafer QDR groove for semiconductor Download PDFInfo
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- CN112474524A CN112474524A CN202011351740.1A CN202011351740A CN112474524A CN 112474524 A CN112474524 A CN 112474524A CN 202011351740 A CN202011351740 A CN 202011351740A CN 112474524 A CN112474524 A CN 112474524A
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- inner cavity
- shell
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
- B08B17/02—Preventing deposition of fouling or of dust
- B08B17/04—Preventing deposition of fouling or of dust by using removable coverings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/003—Cleaning involving contact with foam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a wafer QDR groove for a semiconductor, comprising: the device comprises a shell, a sealing mechanism, a cleaning mechanism, a water tank, a water pump, a nitrogen bubbling device and a controller; the inner cavity of the shell is divided into a left side and a right side by a partition plate; the sealing mechanism is arranged at the top end of the shell; the cleaning mechanism is arranged on the left side of the inner cavity of the shell; the water tank is arranged at the front end of the right side of the inner cavity of the shell; the water pump is arranged at the top end of the water tank, and a water inlet pipe of the water pump extends into the inner cavity of the water tank; the nitrogen bubbling device is arranged at the rear end of the right side of the inner cavity of the shell; the controller is installed at the top front side of the shell. This wafer QDR groove for semiconductor can realize that the wafer washes fast and discharges, improves wafer cleaning efficiency simultaneously, avoids the long-time contact of oxygen molecule or steam in wafer surface and the air to generate the oxide layer to can seal the device when not rinsing, prevent that outside dust from getting into inside attached to belt cleaning device, and then influence wafer washing and processingquality.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer QDR groove for a semiconductor.
Background
The semiconductor IC process is developed based on ion implantation, diffusion, epitaxial growth and photolithography, which are four basic processes invented after the 50 th century, and because the devices and wires in the integrated circuit are very fine, if the integrated circuit is contaminated by dust particles and metals, the functions of the circuits in the wafer are easily damaged, short circuit or open circuit is formed, the failure of the integrated circuit is caused and the formation of geometric characteristics is affected, therefore, in the manufacturing process, except for removing external pollution sources, wet cleaning or dry cleaning is required in the integrated circuit manufacturing steps such as high temperature diffusion and before ion implantation, etc., and dry and wet cleaning is to effectively use chemical solution or gas to remove the impurities of micro dust, metal ions and organic matters remained on the wafer without destroying the surface characteristics and electrical characteristics of the wafer, in addition, the manufacturing process is always carried out in a clean room under the participation of people, so that the pollution of various environments to the silicon wafer is inevitably generated, and the pollutants can be roughly divided into particles, organic matters, metal pollutants and oxides according to the generation condition of the pollutants;
in the prior art, a wafer cleaning device similar to that disclosed in the publication No. CN104658947B is adopted for wafer cleaning, and the device includes: a cleaning tank; the cleaning tank is provided with a containing cavity; a wafer support device; the wafer supporting device is arranged in the containing cavity and used for supporting a wafer; a spray head; the sprayer can be arranged towards the wafer to spray liquid or gas, but the surface of the wafer is exposed in the air and can contact oxygen molecules or water vapor in the air, an oxide layer can grow at normal temperature, the quality of cleaning the wafer is greatly influenced, particle impurities on the surface of the wafer are not favorably taken away by deionized water, and the device is directly exposed in the air and is easy to adhere to dust or particles in the air, so that the processing quality of the wafer is influenced.
Disclosure of Invention
The invention aims to provide a wafer QDR groove for a semiconductor, which at least solves the problems that the surface of a wafer in the prior art is exposed in the air and can contact oxygen molecules or water vapor in the air, an oxide layer can grow at normal temperature, the cleaning quality of the wafer is greatly influenced, particle impurities on the surface of the wafer are not favorably taken away by deionized water, and the device is directly exposed in the air and is easy to adhere to dust or particles in the air, so that the processing quality of the wafer is influenced.
In order to achieve the purpose, the invention provides the following technical scheme: a wafer QDR groove for semiconductor comprises:
the inner cavity of the shell is divided into a left side and a right side by a partition plate;
the sealing mechanism is arranged at the top end of the shell;
the cleaning mechanism is arranged on the left side of the inner cavity of the shell;
the water tank is arranged at the front end of the right side of the inner cavity of the shell;
the water pump is arranged at the top end of the water tank, and a water inlet pipe of the water pump extends into the inner cavity of the water tank (6);
the nitrogen bubbling device is arranged at the rear end of the right side of the inner cavity of the shell;
and the controller is arranged on the front side of the top end of the shell and is electrically connected with the water pump and the nitrogen bubbling device respectively.
Preferably, the sealing mechanism comprises; the sealing mechanism comprises a sealing mechanism shell, a mounting groove, a sealing plate, a chain wheel, a chain, a connecting rod, a limiting groove block, a movable sealing plate, a first motor, a first bevel gear and a second bevel gear; the sealing mechanism shell is arranged at the top end of the shell; the mounting groove is formed in the left side of the top end of the sealing mechanism shell, and the inner cavity of the mounting groove is communicated with the left side of the inner cavity of the shell; the number of the sealing plates is two, and the two sealing plates are respectively arranged on the front side and the rear side of the bottom end of the inner cavity of the mounting groove; the number of the chain wheels is two, and the two chain wheels are respectively connected to the front end and the rear end of the right side of the inner cavity of the sealing mechanism shell in a rotating mode through pin shafts; the front end and the rear end of the inner side of the chain are respectively meshed with the outer walls of the front chain wheel and the rear chain wheel; the number of the connecting rods is two, the two connecting rods are respectively arranged on the left side and the right side of the outer wall of the chain, the connecting rods are L-shaped, and the left ends of the connecting rods extend into the inner cavity of the mounting groove; the limiting groove block is arranged on the left side of the top end of the inner cavity of the sealing mechanism shell along the front-back direction, and the outer wall of the connecting rod is in adaptive insertion connection with the inner cavity of the limiting groove block; the number of the movable sealing plates is two, and the two movable sealing plates are respectively arranged on the left sides of the front connecting rod and the rear connecting rod; the first motor is arranged at the front end of the left side of the inner cavity of the sealing mechanism shell and is electrically connected with the controller; the first conical gear screw is connected to the output end of the first motor; the second bevel gear is connected to the lower end of the chain wheel positioned on the front side of the inner cavity of the sealing mechanism shell through a screw, and the second bevel gear is meshed with the first bevel gear.
Preferably, the cleaning mechanism comprises; the device comprises a spraying groove, a spraying assembly, a nozzle assembly, an overflow groove, a waste liquid collecting tank, a first electric telescopic rod, a sealing plate, a bottom plate, a flow homogenizing plate and a drain hole; the spraying groove is arranged in the center of the bottom end of the inner cavity of the mounting groove on the left side of the inner cavity of the shell; the number of the spraying assemblies is two, and the two spraying assemblies are respectively arranged at the top ends of the front side and the rear side of the inner cavity of the spraying groove; the number of the spray head assemblies is two, and the two spray head assemblies are respectively arranged at the bottom ends of the front side and the rear side of the inner cavity of the spray groove; the number of the overflow grooves is two, and the two overflow grooves are embedded into openings at the top ends of the front side and the rear side of an inner cavity of the spray groove respectively along the left and right directions; the waste liquid collecting tank is sleeved at the bottom end of the outer wall of the spraying groove, and the spraying groove is fixedly connected with the top end of the inner cavity of the waste liquid collecting tank through a support; the first electric telescopic rod is arranged at the center of the bottom end of the inner cavity of the waste liquid collecting tank along the vertical direction and is electrically connected with the controller; the sealing plate is arranged at the top end of the first electric telescopic rod; the bottom plate is arranged at an opening at the bottom end of the inner cavity of the spray groove; the flow equalizing plate is arranged at the bottom end of the inner cavity of the spraying groove and is positioned above the bottom plate; the drain hole is formed in the center of the top end of the bottom plate, and the inner cavity of the drain hole is matched with the sealing plate.
Preferably, the spray assembly comprises; the spraying assembly comprises a spraying assembly shell, a rotating shaft, a worm wheel, a second motor and a multi-thread worm; the spraying component shell is arranged at the top end of the inner wall of the spraying groove; the rotating shaft is rotatably connected to the right side of the spraying component shell through a bearing, an inner ring of the bearing is in interference fit with the outer wall of the rotating shaft, an outer ring of the bearing is fixedly connected with the inner wall of the spraying component shell, and the left side of the rotating shaft extends into an inner cavity of the spraying component shell; the worm wheel screw is connected to the left end of the rotating shaft; the second motor is arranged at the bottom end of the inner cavity of the spraying component shell and is electrically connected with the controller; the multi-thread worm is in threaded connection with the outer wall of the second motor, and the multi-thread worm is meshed with the worm wheel.
Preferably, the spray assembly further comprises; the device comprises a fixed seat, a DIW spray pipe and a rotary joint; the number of the fixed seats is two, and the two fixed seats are respectively arranged on the left side and the right side of the top end of the inner wall of the spraying groove; the DIW spray pipe is inserted into the inner sides of the left and right fixed seats along the left and right directions, and the left side of the DIW spray pipe is fixedly connected with the right end of the rotating shaft; the rotary joint is arranged on the right side of the inner cavity of the DIW spray pipe, one end of a guide pipe is screwed on the right side of the inner cavity of the rotary joint, and the other end of the guide pipe extends into the right side of the inner cavity of the shell and is screwed with a water outlet of the water pump.
Compared with the prior art, the invention has the beneficial effects that: the wafer QDR groove for semiconductor:
1. deionized water in the water tank is pumped into the DIW spray pipe along the guide pipe to form intercrossing spraying through the water pump, the multi-thread worm on the second motor drive corresponding position in two spray subassemblies in the front and back rotates clockwise or anticlockwise, the worm wheel is promoted to drive the rotating shaft to drive the DIW spray pipe to rotate clockwise or anticlockwise under the action of the rotating force of the multi-thread worm, the deionized water sprayed out of the interior of the DIW spray pipe is prevented from directly spraying and washing the surface of the wafer, and the deionized water in the inner cavity of the spray tank gradually rises to wash the wafer in the interior of.
2. Get into the spray tank in by the shower nozzle pipe through the inside pure nitrogen gas of nitrogen gas bubbling device, and then increase the wafer and vibrate in the deionized water stream of spray tank, improved the effect of washing, second electric telescopic handle shortens through self intermittent type nature extension and drives the connecting seat and drive the shower nozzle pipe at spray tank inner chamber below reciprocating motion all around, improves nitrogen gas bubbling effect
3. The first electric telescopic rod is shortened to drive the sealing plate to move downwards to stop sealing the drain hole, deionized water in the spraying groove penetrates through the flow equalizing plate and enters the waste liquid collecting tank from the drain hole to be discharged, the first motor drives the first bevel gear to rotate, the second bevel gear drives the front side chain wheel to rotate under the action of the first bevel gear, and then the chain drives the connecting rods on the left side and the right side to drive the moving sealing plates on corresponding positions to move inwards to seal the inner cavity of the mounting groove, so that external dust is prevented from entering the mounting groove;
therefore, the wafer can be rapidly washed and rapidly discharged, the wafer cleaning efficiency is improved, meanwhile, the oxide layer is prevented from being generated by long-time contact of oxygen molecules or water vapor in the surface of the wafer and air, the device can be sealed when the device is not cleaned, and external dust is prevented from entering the cleaning device to further influence the cleaning and processing quality of the wafer.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is an exploded view of the sealing mechanism of FIG. 1;
FIG. 4 is an exploded view of the cleaning mechanism of FIG. 1;
FIG. 5 is an exploded view of the spray assembly of FIG. 4;
fig. 6 is an exploded view of the showerhead assembly of fig. 4.
In the figure: 1. a shell, 2, a sealing mechanism, 21, a sealing mechanism shell, 22, a mounting groove, 23, a sealing plate, 24, a chain wheel, 25, a chain, 26, a connecting rod, 27, a limit groove block, 28, a movable sealing plate, 29, a first motor, 210, a first bevel gear, 211, a second bevel gear, 3, a cleaning mechanism, 31, a spraying groove, 32, an overflow groove, 33, a waste liquid collecting tank, 34, a first electric telescopic rod, 35, a sealing plate, 36, a bottom plate, 37, a flow homogenizing plate, 38, a drain hole, 4, a spraying component, 41, a spraying component shell, 42, a rotating shaft, 43, a worm wheel, 44, a second motor, 45, a multi-thread worm, 46, a fixed seat, 47, a DIW spraying pipe, 48, a rotating joint, 5, a nozzle component, 51, a mounting seat, 52, a second electric telescopic rod, 53, a connecting seat, 54, a nozzle pipe, 55, a limit groove block, 56, a inserted rod, 6. the device comprises a water tank, 7, a water pump, 8, a nitrogen bubbling device, 9 and a controller.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a wafer QDR groove for semiconductor comprises: the device comprises a shell 1, a sealing mechanism 2, a cleaning mechanism 3, a water tank 6, a water pump 7, a nitrogen bubbling device 8 and a controller 9; the inner cavity of the shell 1 is divided into a left side and a right side by a clapboard; the sealing mechanism 2 is arranged at the top end of the shell 1; the cleaning mechanism 3 is arranged on the left side of the inner cavity of the shell 1; the water tank 6 is arranged at the front end of the right side of the inner cavity of the shell 1, the inner wall of the water tank 6 is good in sealing performance, and a water inlet valve pipe extending out of the outer wall of the shell 1 is arranged on the front side of the water tank 6 and can inject deionized water into the water tank; the water pump 7 is arranged at the top end of the water tank 6, a water inlet pipe of the water pump 7 extends into an inner cavity of the water tank 6, the water pump 7 is directly purchased, installed and used from the market according to actual use requirements, and the water pump 7 can be controlled by the controller 9 to pump deionized water in the water tank 6 into the DIW spray pipe 47 along the guide pipe; the nitrogen bubbling device 8 is arranged at the rear end of the right side of the inner cavity of the shell 1, the specific use model of the nitrogen bubbling device 8 is directly purchased, installed and used from the market according to the actual use requirement, and the nitrogen bubbling device 8 can be controlled by the controller 9 to enable internal pure nitrogen to enter the nozzle pipe 54 along the guide pipe; the controller 9 is installed at the top front side of casing 1, and controller 9 respectively with water pump 7 and nitrogen gas bubbling device 8 electric connection, controller 9 specifically uses the model to directly purchase the installation and use from the market according to the actual use requirement.
Preferably, the sealing mechanism 2 further includes; the sealing mechanism comprises a sealing mechanism shell 21, a mounting groove 22, a sealing plate 23, a chain wheel 24, a chain 25, a connecting rod 26, a limiting groove block 27, a movable sealing plate 28, a first motor 29, a first bevel gear 210 and a second bevel gear 211; the sealing mechanism shell 21 is arranged at the top end of the shell 1; the mounting groove 22 is formed in the left side of the top end of the sealing mechanism shell 21, and the inner cavity of the mounting groove 22 is communicated with the left side of the inner cavity of the shell 1; the number of the sealing plates 23 is two, and the two sealing plates 23 are respectively arranged on the front side and the rear side of the bottom end of the inner cavity of the mounting groove 22; the number of the chain wheels 24 is two, and the two chain wheels 24 are respectively connected to the front end and the rear end of the right side of the inner cavity of the sealing mechanism shell 21 in a rotating mode through pin shafts; the front end and the rear end of the inner side of the chain 25 are respectively meshed with the outer walls of the front chain wheel 24 and the rear chain wheel 24, and the rear side chain wheel 24 plays a role in tensioning and limiting the chain 25; the number of the connecting rods 26 is two, the two connecting rods 26 are respectively arranged on the left side and the right side of the outer wall of the chain 25, the connecting rods 26 are L-shaped, and the left ends of the connecting rods 26 extend into the inner cavity of the mounting groove 22; the limiting groove block 27 is arranged on the left side of the top end of the inner cavity of the sealing mechanism shell 21 along the front-back direction, the outer wall of the connecting rod 26 is in adaptive insertion connection with the inner cavity of the limiting groove block 27, and the connecting rod 26 can move back and forth in the inner cavity of the limiting groove block 27; the number of the movable sealing plates 28 is two, and the two movable sealing plates 28 are respectively arranged on the left sides of the front connecting rod 26 and the rear connecting rod 26; the first motor 29 is arranged at the front end of the left side of the inner cavity of the sealing mechanism shell 21, the first motor 29 is electrically connected with the controller 9, the specific use model of the first motor 29 is directly purchased, installed and used from the market according to the actual use requirement, and the controller 9 can control the first motor 29 to drive the first bevel gear 210 to rotate anticlockwise or clockwise; the first bevel gear 210 is screwed at the output end of the first motor 29; the second bevel gear 211 is screwed on the lower end of the front side sprocket 24 in the cavity of the sealing mechanism housing 21, the second bevel gear 211 is meshed with the first bevel gear 210, and the second bevel gear 211 can drive the front side sprocket 24 to rotate clockwise or counterclockwise under the action of the first bevel gear 210.
Preferably, the washing mechanism 3 further includes; the device comprises a spraying groove 31, a spraying component 4, a nozzle component 5, an overflow groove 32, a waste liquid collecting pool 33, a first electric telescopic rod 34, a sealing plate 35, a bottom plate 36, a uniform flow plate 37 and a water discharging hole 38; the spraying groove 31 is arranged in the center of the bottom end of the inner cavity left mounting groove 22 of the shell 1; the number of the spraying assemblies 4 is two, and the two spraying assemblies 4 are respectively arranged at the top ends of the front side and the rear side of the inner cavity of the spraying groove 31; the number of the spray head assemblies 5 is two, and the two spray head assemblies 5 are respectively arranged at the bottom ends of the front side and the rear side of the inner cavity of the spray groove 31; the number of the overflow grooves 32 is two, and the two overflow grooves 32 are respectively embedded into openings at the front and rear top ends of the inner cavity of the spray groove 31 in the left-right direction; the waste liquid collecting tank 33 is sleeved at the bottom end of the outer wall of the spraying groove 31, and the spraying groove 31 is fixedly connected with the top end of the inner cavity of the waste liquid collecting tank 33 through a support; the first electric telescopic rod 34 is arranged at the center of the bottom end of the inner cavity of the waste liquid collecting tank 33 in the vertical direction, the first electric telescopic rod 34 is electrically connected with the controller 9, the specific use model of the first electric telescopic rod 34 is directly purchased, installed and used from the market according to the actual use requirement, the first electric telescopic rod 34 can be controlled by the controller 9 to drive the sealing plate 35 to move upwards or downwards through self elongation and shortening, and the first electric telescopic rod 34 is made of a waterproof material; the sealing plate 35 is arranged at the top end of the first electric telescopic rod 34; the bottom plate 36 is arranged at the opening at the bottom end of the inner cavity of the spray groove 31; the flow equalizing plate 37 is arranged at the bottom end of the inner cavity of the spraying groove 31 and is positioned above the bottom plate 36, the flow equalizing plate 37 plays a role of accelerating water drainage to prevent vortex from being generated in the water drainage process, and the flow velocity of the drainage water is increased to facilitate deionized water to take away particle impurities on the surface of the wafer; the water drainage hole 38 is arranged at the center of the top end of the bottom plate 36, the inner cavity of the water drainage hole 38 is matched with the sealing plate 35, and the sealing plate 35 can seal the inner cavity of the water drainage hole 38.
Preferably, the spraying assembly 4 further comprises; a spray assembly housing 41, a rotating shaft 42, a worm wheel 43, a second motor 44 and a multi-wire worm 45; the spraying component shell 41 is arranged at the top end of the inner wall of the spraying groove 31; the rotating shaft 42 is rotatably connected to the right side of the spraying assembly shell 41 through a bearing, the inner ring of the bearing is in interference fit with the outer wall of the rotating shaft 42, the outer ring of the bearing is fixedly connected with the inner wall of the spraying assembly shell 41, and the left side of the rotating shaft 42 extends into the inner cavity of the spraying assembly shell 41; the worm wheel 43 is in screw connection with the left end of the rotating shaft 42; the second motor 44 is arranged at the bottom end of the inner cavity of the spraying assembly shell 41, the second motor 44 is electrically connected with the controller 9, the specific usage model of the second motor 44 is directly purchased, installed and used from the market according to the actual usage requirement, and the second motors 44 in the front and the back spraying assemblies 4 can be controlled by the controller 9 to drive the multi-thread worm 45 at the corresponding positions to rotate clockwise or anticlockwise; the multi-wire worm 45 is screwed on the outer wall of the second motor 44, the multi-wire worm 45 is meshed with the worm wheel 43, and the worm wheel 43 can drive the rotating shaft 42 to rotate clockwise or anticlockwise under the action of the rotating force of the multi-wire worm 45.
Preferably, the spraying assembly 4 further comprises; a fixed seat 46, a DIW spray pipe 47 and a rotary joint 48; the number of the fixing seats 46 is two, and the two fixing seats 46 are respectively arranged on the left side and the right side of the top end of the inner wall of the spraying groove 31; the DIW spray pipe 47 is inserted into the inner sides of the left and right fixed seats 46 along the left and right directions, the left side of the DIW spray pipe 47 is fixedly connected with the right end of the rotating shaft 42, and workers adjust the flushing water pressure, water quantity, direction and angle of the DIW spray pipe 47 in advance to perform adjustment test and record, so that the best effect and the spraying range of flushing wafers with different sizes and quantities are achieved, all wafers and wafer boxes are covered by the DIW spray pipe, and dead angle zones caused by spraying and flushing are prevented; the rotary joint 48 is arranged on the right side of the inner cavity of the DIW spray pipe 47, one end of the guide pipe is screwed on the right side of the inner cavity of the rotary joint 48, the other end of the guide pipe extends into the right side of the inner cavity of the shell 1 and is screwed with the water outlet of the water pump 7, and the rotary joint 48 can prevent the DIW spray pipe 47 from driving the guide pipe to rotate in the rotating process.
Preferably, the showerhead assembly 5 further includes; the device comprises a mounting seat 51, a second electric telescopic rod 52, a connecting seat 53, a spray head pipe 54, a limiting slot block 55 and an inserting rod 56; the mounting seat 51 is embedded in an opening at the bottom end of the inner wall of the spray groove 31; the second electric telescopic rod 52 is arranged at the center of the outer side of the mounting seat 51, the second electric telescopic rod 52 is electrically connected with the controller 9, the inner side of the second electric telescopic rod 52 extends into the inner side of the mounting seat 51, the specific use model of the second electric telescopic rod 52 is directly purchased from the market and installed and used according to the actual use requirement, and the second electric telescopic rod 52 can be controlled by the controller 9 to drive the connecting seat 53 to reciprocate back and forth through intermittent extension and shortening of the second electric telescopic rod; the connecting base 53 is arranged on the inner side of the second electric telescopic rod 52; the nozzle pipe 54 is arranged on the inner side of the connecting seat 53 along the left-right direction, one end of a guide pipe is screwed on the right side of the nozzle pipe 54, the other end of the guide pipe extends into the right side of the inner cavity of the shell 1 and is screwed with the air outlet of the nitrogen bubbling device 8, and nitrogen in the nozzle pipe 54 overflows upwards to form bubbles so as to increase the flushing force of deionized water and have good self-cleaning effect on the tank body; the number of the limiting slot blocks 55 is two, the two limiting slot blocks 55 are embedded in the left side and the right side of the mounting seat 51 respectively, and the inner side and the outer side of each limiting slot block 55 extend out of the outer wall of the connecting seat 53 respectively; the number of the insertion rods 56 is two, the two insertion rods 56 are respectively inserted into the inner sides of the left and right limiting insertion groove blocks 55, the inner sides of the insertion rods 56 are fixedly connected with the outer sides of the connecting seats 53, and the insertion rods 56 can move inwards or outwards in the inner cavities of the limiting insertion groove blocks 55.
All the electrical components in the present application can be connected with an external adaptive power supply through a wire, and an adaptive external controller should be selected to connect according to specific actual use conditions to meet the control requirements of all the electrical components, and the specific connection mode and the control sequence thereof should be referred to in the following working principle that the electrical components are electrically connected in sequence, the detailed connection means thereof is a known technology in the art and is not described, and the following main description of the working principle and the process specifically works as follows.
Step 1: when the water tank cleaning machine is used, a worker injects deionized water into the water tank 6 in advance, the wafer passes through the mounting groove 22 by the external mechanical arm to enter the inner cavity of the spraying groove 31, the worker controls the controller 9 to start the water pump 7, the deionized water in the water tank 6 is pumped into the DIW spraying pipes 47 by the water pump 7 along the guide pipe, the front DIW spraying pipes 47 and the rear DIW spraying pipes 47 form mutual cross spraying, the user controls the controller 9 to start the second motors 44 in the front spraying assembly 4 and the rear spraying assembly 4 in sequence, the second motors 44 in the front spraying assembly 4 and the rear spraying assembly 4 drive the multi-thread worm 45 at the corresponding positions to rotate clockwise or anticlockwise, the worm wheel 43 is meshed with the multi-thread worm 45, the worm wheel 43 drives the rotating shaft 42 to rotate clockwise or anticlockwise under the rotating force of the multi-thread worm 45, and then under the limiting effect of the, the deionized water sprayed from the interior of the DIW spray pipe 47 is prevented from directly spraying and washing the surface of the wafer, and the surface of the wafer is prevented from being polluted by the generated particle sludge, so that the deionized water in the inner cavity of the spray tank 31 is gradually raised and then overflows from the overflow tank 32 to the inner cavity of the waste liquid collecting tank 33, thereby promoting the deionized water in the gaps and corners of the wafer in the spray tank 31 to be continuously updated, and improving the washing effect.
Step 2: when cleaning the wafer, staff control controller 9 starts nitrogen gas bubbling device 8, the inside pure nitrogen gas of nitrogen gas bubbling device 8 enters into to shower nozzle pipe 54 along the pipe, and get into in spray tank 31 by shower nozzle pipe 54, and then increase the wafer and vibrate in the deionized water stream in spray tank 31, the flushing effect has been improved, and reduce the oxygen content in the deionized water, avoid generating the oxide on the wafer surface, staff control controller 9 starts second electric telescopic handle 52 in two front and back shower nozzle subassemblies 5 in proper order, second electric telescopic handle 52 shortens through self intermittent type extension in order to drive connecting seat 53 reciprocating motion back and forth, and under the limiting displacement of inserted bar 56, make connecting seat 53 drive shower nozzle pipe 54 reciprocating motion back and forth below spray tank 31 inner chamber, improve nitrogen gas bubbling effect
And step 3: after the use, the operator controls the controller 9 to close the water pump 7 to stop injecting deionized water into the spray groove 31, controls the controller 9 to drive the first electric telescopic rod 34 to shorten to drive the sealing plate 35 to move downwards, further causes the sealing plate 35 to move out of the inner cavity of the drain hole 38 to stop sealing the same, causes the deionized water in the inner cavity of the spray groove 31 to pass through the uniform flow plate 37 and enter the waste liquid collecting tank 33 through the drain hole 38 to be discharged, causes the external mechanical arm to move the wafer out of the spray groove 31, controls the spray groove 9 to start the first motor 29, causes the first motor 29 to drive the first bevel gear 210 to rotate anticlockwise, further causes the second bevel gear 211 to drive the front side sprocket 24 to rotate clockwise under the action of the first bevel gear 210, further causes the chain 25 to drive the chain 25 to rotate clockwise under the tensioning limiting action of the rear side sprocket 24, the chains 25 drive the connecting rods 26 on the left and right sides to move inwards, and under the limiting action of the limiting groove blocks 27, the left and right connecting rods 26 drive the movable sealing plates 28 on the corresponding positions to move inwards to seal the inner cavity of the mounting groove 22, so that external dust is prevented from entering;
therefore, the wafer can be rapidly washed and rapidly discharged, the wafer cleaning efficiency is improved, meanwhile, the oxide layer is prevented from being generated by long-time contact of oxygen molecules or water vapor in the surface of the wafer and air, the device can be sealed when the device is not cleaned, and external dust is prevented from entering the cleaning device to further influence the cleaning and processing quality of the wafer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A wafer QDR groove for semiconductor is characterized by comprising:
the device comprises a shell (1), wherein the inner cavity of the shell (1) is divided into a left side and a right side by a partition plate;
the sealing mechanism (2) is arranged at the top end of the shell (1);
the cleaning mechanism (3) is arranged on the left side of the inner cavity of the shell (1);
the water tank (6) is arranged at the front end of the right side of the inner cavity of the shell (1);
the water pump (7) is arranged at the top end of the water tank (6), and a water inlet pipe of the water pump (7) extends into an inner cavity of the water tank (6);
the nitrogen bubbling device (8) is arranged at the rear end of the right side of the inner cavity of the shell (1);
the controller (9) is installed on the front side of the top end of the shell (1), and the controller (9) is electrically connected with the water pump (7) and the nitrogen bubbling device (8) respectively.
2. The wafer QDR cell for semiconductor of claim 1, wherein: the sealing mechanism (2) comprises;
a sealing mechanism housing (21) provided at the top end of the housing (1);
the mounting groove (22) is formed in the left side of the top end of the sealing mechanism shell (21), and the inner cavity of the mounting groove (22) is communicated with the left side of the inner cavity of the shell (1);
the number of the sealing plates (23) is two, and the two sealing plates (23) are respectively arranged on the front side and the rear side of the bottom end of the inner cavity of the mounting groove (22);
the number of the chain wheels (24) is two, and the two chain wheels (24) are respectively connected to the front end and the rear end of the right side of the inner cavity of the sealing mechanism shell (21) in a rotating mode through pin shafts;
the front end and the rear end of the inner side of the chain (25) are respectively meshed with the outer walls of the front chain wheel (24) and the rear chain wheel (24);
the number of the connecting rods (26) is two, the two connecting rods (26) are respectively arranged on the left side and the right side of the outer wall of the chain (25), the connecting rods (26) are L-shaped, and the left ends of the connecting rods (26) extend into the inner cavity of the mounting groove (22);
the limiting groove block (27) is arranged on the left side of the top end of the inner cavity of the sealing mechanism shell (21) in the front-back direction, and the outer wall of the connecting rod (26) is in adaptive insertion connection with the inner cavity of the limiting groove block (27);
the number of the movable sealing plates (28) is two, and the two movable sealing plates (28) are respectively arranged on the left sides of the front connecting rod (26) and the rear connecting rod (26);
the first motor (29) is arranged at the front end of the left side of the inner cavity of the sealing mechanism shell (21), and the first motor (29) is electrically connected with the controller (9);
the first conical gear (210) is connected to the output end of the first motor (29) through a screw;
and the second bevel gear (211) is screwed at the lower end of the chain wheel (24) positioned at the front side of the inner cavity of the sealing mechanism shell (21), and the second bevel gear (211) is meshed with the first bevel gear (210).
3. The wafer QDR cell for semiconductor of claim 1, wherein: the cleaning mechanism (3) comprises;
the spraying groove (31) is arranged in the center of the bottom end of the inner cavity left mounting groove (22) of the shell (1);
the number of the spraying assemblies (4) is two, and the two spraying assemblies (4) are respectively arranged at the top ends of the front side and the rear side of the inner cavity of the spraying groove (31);
the number of the spray head assemblies (5) is two, and the two spray head assemblies (5) are respectively arranged at the bottom ends of the front side and the rear side of the inner cavity of the spray groove (31);
the number of the overflow grooves (32) is two, and the two overflow grooves (32) are embedded into openings at the top ends of the front side and the rear side of an inner cavity of the spray groove (31) respectively along the left and right directions;
the waste liquid collecting tank (33) is sleeved at the bottom end of the outer wall of the spraying groove (31), and the spraying groove (31) is fixedly connected with the top end of the inner cavity of the waste liquid collecting tank (33) through a support;
the first electric telescopic rod (34) is arranged at the center of the bottom end of the inner cavity of the waste liquid collecting tank (33) in the vertical direction, and the first electric telescopic rod (34) is electrically connected with the controller (9);
the sealing plate (35) is arranged at the top end of the first electric telescopic rod (34);
the bottom plate (36) is arranged at an opening at the bottom end of the inner cavity of the spray groove (31);
the flow equalizing plate (37) is arranged at the bottom end of the inner cavity of the spraying groove (31) and is positioned above the bottom plate (36);
the drain hole (38) is formed in the center of the top end of the bottom plate (36), and the inner cavity of the drain hole (38) is matched with the sealing plate (35).
4. The QDR groove of claim 3, wherein: the spray assembly (4) comprises;
the spraying assembly shell (41) is installed at the top end of the inner wall of the spraying groove (31);
the rotating shaft (42) is rotatably connected to the right side of the spraying assembly shell (41) through a bearing, an inner ring of the bearing is in interference fit with the outer wall of the rotating shaft (42), an outer ring of the bearing is fixedly connected with the inner wall of the spraying assembly shell (41), and the left side of the rotating shaft (42) extends into an inner cavity of the spraying assembly shell (41);
a worm wheel (43) screwed to the left end of the rotating shaft (42);
the second motor (44) is arranged at the bottom end of the inner cavity of the spraying assembly shell (41), and the second motor (44) is electrically connected with the controller (9);
the multi-wire worm (45) is screwed on the outer wall of the second motor (44), and the multi-wire worm (45) is meshed with the worm wheel (43).
5. The QDR groove of claim 4, wherein: the spraying component (4) also comprises;
the number of the fixed seats (46) is two, and the two fixed seats (46) are respectively arranged on the left side and the right side of the top end of the inner wall of the spraying groove (31);
the DIW spray pipe (47) is inserted into the inner sides of the left and right fixed seats (46) along the left and right directions, and the left side of the DIW spray pipe (47) is fixedly connected with the right end of the rotating shaft (42);
the rotary joint (48) is arranged on the right side of the inner cavity of the DIW spray pipe (47), one end of a guide pipe is screwed on the right side of the inner cavity of the rotary joint (48), and the other end of the guide pipe extends into the right side of the inner cavity of the shell (1) and is screwed with a water outlet of the water pump (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011351740.1A CN112474524A (en) | 2020-11-26 | 2020-11-26 | Wafer QDR groove for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011351740.1A CN112474524A (en) | 2020-11-26 | 2020-11-26 | Wafer QDR groove for semiconductor |
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| Publication Number | Publication Date |
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| CN112474524A true CN112474524A (en) | 2021-03-12 |
Family
ID=74935613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011351740.1A Withdrawn CN112474524A (en) | 2020-11-26 | 2020-11-26 | Wafer QDR groove for semiconductor |
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| CN (1) | CN112474524A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113787044A (en) * | 2021-10-15 | 2021-12-14 | 科立盈智能装备科技(广州)有限公司 | Intelligent movement washs car |
| CN113857117A (en) * | 2021-09-01 | 2021-12-31 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and cleaning method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9109049D0 (en) * | 1990-04-30 | 1991-06-12 | Aigo Seiichiro | Apparatus for washing semiconductor materials |
| CN207430827U (en) * | 2017-09-15 | 2018-06-01 | 常州市一马机械有限公司 | A kind of seamless steel pipe rinse bath with fixed cleaning function |
| CN208288588U (en) * | 2017-11-24 | 2018-12-28 | 东莞市钡耳特自动化设备有限公司 | A kind of full-automatic hydrocarbon cleaning equipment |
| CN110047788A (en) * | 2019-06-03 | 2019-07-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning device and wafer cleaning system |
| CN211496136U (en) * | 2019-12-20 | 2020-09-15 | 南通市建设混凝土有限公司 | Environment-friendly closed dustless aggregate and powder spiral conveying device |
-
2020
- 2020-11-26 CN CN202011351740.1A patent/CN112474524A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9109049D0 (en) * | 1990-04-30 | 1991-06-12 | Aigo Seiichiro | Apparatus for washing semiconductor materials |
| CN207430827U (en) * | 2017-09-15 | 2018-06-01 | 常州市一马机械有限公司 | A kind of seamless steel pipe rinse bath with fixed cleaning function |
| CN208288588U (en) * | 2017-11-24 | 2018-12-28 | 东莞市钡耳特自动化设备有限公司 | A kind of full-automatic hydrocarbon cleaning equipment |
| CN110047788A (en) * | 2019-06-03 | 2019-07-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning device and wafer cleaning system |
| CN211496136U (en) * | 2019-12-20 | 2020-09-15 | 南通市建设混凝土有限公司 | Environment-friendly closed dustless aggregate and powder spiral conveying device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113857117A (en) * | 2021-09-01 | 2021-12-31 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and cleaning method |
| CN113787044A (en) * | 2021-10-15 | 2021-12-14 | 科立盈智能装备科技(广州)有限公司 | Intelligent movement washs car |
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Application publication date: 20210312 |