CN110047788A - Wafer cleaning device and wafer cleaning system - Google Patents
Wafer cleaning device and wafer cleaning system Download PDFInfo
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- CN110047788A CN110047788A CN201910476413.XA CN201910476413A CN110047788A CN 110047788 A CN110047788 A CN 110047788A CN 201910476413 A CN201910476413 A CN 201910476413A CN 110047788 A CN110047788 A CN 110047788A
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- drainage hole
- water
- overflow launder
- wafer cleaning
- groove
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to the wafer cleaning technical fields of semiconductor crystal wafer processing, more particularly, to a kind of wafer cleaning device and wafer cleaning system.Wafer cleaning device includes overflow launder and sealing mechanism, and fresh ultrapure water can be constantly injected into overflow launder by the water injection hole of isopipe root；Wafer is placed in overflow launder and is cleaned, and the stained object washed down goes out overflow launder with ultrapure water overflow；The first drainage hole is offered on the bottom wall of overflow launder, is provided with sealing mechanism on the first drainage hole, can be realized by sealing mechanism and the first drainage hole is switched on and off；When the water quality of the ultrapure water in overflow launder meets cleaning requirement, closing is sealed to the first drainage hole by sealing mechanism, wafer is cleaned in overflow launder；After the water quality of ultrapure water is unqualified, the first drainage hole is opened, the ultrapure water in overflow launder can be quickly discharged by the first drainage hole, to quickly complete the replacement of ultrapure water inside overflow launder.
Description
Technical field
The present invention relates to the wafer cleaning technical fields of semiconductor crystal wafer processing, more particularly, to a kind of wafer cleaning device
And wafer cleaning system.
Background technique
With the development of semi-conductor industry, the critical size of device technology technology constantly reduces, and silicon wafer is less than work in entrance
It must be clean before skill, it is therefore desirable to by the cleaning step being repeated as many times, current typical wet chemical cleans technique master
Have RCA cleaning process technology, ozone clean technology and IMEC cleaning process technology, wherein every kind of technology need using
Multiple-medicinal-liquid needs to carry out ultrapure water cleaning process step between different processing steps, for what is generated in cleaning process flow
Particulate matter and liquor residue.Because being needed in entire technology using multiple ultrapure water cleaning step, ultrapure water usage amount is huge
Greatly, it rapidly discharge the ultrapure water waste water in rinse bath, and the waste water of the wafer cleaning device of the prior art
Rate of discharge is slow, influences the cleaning efficiency of wafer.
Summary of the invention
The purpose of the present invention is to provide a kind of wafer cleaning device and wafer cleaning systems, brilliant in the prior art to solve
The low technical problem of discharge of wastewater rate in circle cleaning device.
The present invention provides a kind of wafer cleaning devices, including overflow launder and sealing mechanism；On the bottom wall of the overflow launder
The first drainage hole is offered, the sealing mechanism is provided on first drainage hole, the sealing mechanism can be opened or be closed
Break first drainage hole.
It further, further include water-saving groove；The water-saving groove is located at the lower section of the overflow launder, and the water-saving groove can be held
It fetches from the overflowing liquid of the overflow launder and the relief liquor from first drainage hole；Along first on the bottom wall of the water-saving groove
The both ends in direction offer the second drainage hole and third drainage hole respectively；Second drainage hole is connected with ultrapure water recovery device
Logical, the third drainage hole carries out discharge of wastewater for ultrapure water；
It is correspondingly provided with the sealing mechanism on second drainage hole and the third drainage hole, for described the
Two drainage holes and the third drainage hole are switched on or off.
Further, the sealing mechanism includes top pressure closure and cylinder；One end of the top pressure closure is sealed end, institute
It states sealed end to be adapted with corresponding drainage hole, closure can be sealed to corresponding drainage hole；The top pressure closure
The other end be connected with the movable end of the cylinder, the cylinder can drive the top pressure closure to corresponding drainage hole
It is blocked or is opened.
Further, seal boss, the seal boss and corresponding draining are provided on the end face of the sealed end
Hole is adapted and can extend into corresponding drainage hole；The side wall of the seal boss prolong its circumferential direction offer sealing it is recessed
Slot is provided with sealing ring in the sealed groove.
Further, the bottom wall of the water-saving groove has certain tilt angle along the first direction, makes described water-saving
The bottom wall of slot is higher than close to one end of second drainage hole close to one end of the third drainage hole.
Further, overflow port is offered at the top of the groove body of the overflow launder；The quantity of the overflow port is one or more
A, when the quantity of the overflow port is multiple, multiple overflow ports are circumferentially-spaced at the top of the groove body of the overflow launder
Setting.
It further, further include spraying mechanism；The spraying mechanism includes water inlet line and nozzle；The water inlet line is logical
Fixed support plate is crossed to be fixedly connected on the side wall of the overflow launder, the nozzle be set on the water inlet line and with it is described
Water inlet line is connected, and the ejection end of the nozzle is towards inside the overflow launder.
Further, even flow plate is additionally provided in the overflow launder, the even flow plate is located at the isopipe root；It is described
Offered along its thickness direction through the uniform flow hole of the even flow plate plate face on even flow plate, the quantity in the uniform flow hole be it is multiple,
Multiple uniform flow holes are spaced apart on the even flow plate；Gas circulation groove is also provided in the even flow plate, it is described even
Air inlet is provided in flowing plate, the air inlet is connected with the gas circulation groove；Bubbling is also provided on the even flow plate
Hole, the gas circulation groove are connected by the bubble holes with the overflow launder；The quantity of the bubble holes be it is multiple, it is multiple
The bubble holes are arranged at intervals on the gas circulation groove.
It further, further include water resistance rate detection system；The water resistance rate detection system includes three-way connection and water quality electricity
Resistance rate sensor；Offer apopore on the side wall of the groove body of the overflow launder, the first interface of the three-way connection with it is described
Apopore is connected, and the water quality resistivity sensor is connected with the second interface of the three-way connection, the second interface
It is two interfaces being oppositely arranged with the first interface；The third interface of the three-way connection is the water resistance rate detection system
Water outlet, and the water outlet be lower than the overflow port.
The present invention also provides a kind of wafer cleaning systems, including wafer cleaning device described in any of the above embodiments.
Compared with prior art, the invention has the benefit that
Wafer cleaning device provided by the invention includes overflow launder and sealing mechanism；Wherein, overflow launder is that upper end is open
The bottom of groove, overflow launder is provided with water injection hole, ultrapure water can be filled into overflow launder by water injection hole, and continue to overflow
The fresh ultrapure water of injection in slot；Wafer to be cleaned is placed in overflow launder and is cleaned using ultrapure water to it, is removed
The stained object of wafer surface, the stained object washed from wafer can swim in top and with ultrapure water at the top of overflow launder
Open end overflow.The first drainage hole is offered on the bottom wall of overflow launder, sealing mechanism is provided on the first drainage hole, by close
Sealing mechanism, which can be realized, is switched on and off the first drainage hole, the ultrapure water energy when the first drainage hole is opened, in overflow launder
Enough rapidly emitted by the first drainage hole；When wafer is placed in cleaned in overflow launder when, at this time in overflow launder
The water quality of ultrapure water meets cleaning requirement, and the first drainage hole is the state being off, and sealing mechanism carries out the first drainage hole
Sealing, the stained object washed down from wafer can be overflowed from the open end at the top of overflow launder with ultrapure water；Work as overflow
Object content is high due to staining for ultrapure water in slot, ultrapure when water quality does not meet the cleaning requirement to wafer and in overflow launder
It when water becomes waste water, needs to replace the ultrapure water in overflow launder, be opened by sealing mechanism to the close of the first drainage hole
Envelope, enables the ultrapure water in overflow launder to be rapidly discharged from the first drainage hole of isopipe root, to quickly complete
Replacement to overflow launder inside ultrapure water improves working efficiency.
The present invention also provides a kind of wafer cleaning systems, and including the wafer cleaning device, thus the wafer is clear
Washing system also has the beneficial effect of wafer cleaning device.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram under the first visual angle of wafer cleaning device provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram under the second visual angle of wafer cleaning device provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram under wafer cleaning device third provided in an embodiment of the present invention visual angle；
Fig. 4 is the structural schematic diagram under the first visual angle of overflow launder provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram under the second visual angle of overflow launder provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram under overflow launder third provided in an embodiment of the present invention visual angle；
Fig. 7 is the structural schematic diagram under the first visual angle of sealing mechanism provided in an embodiment of the present invention.
Appended drawing reference:
1- overflow launder, the first drainage hole of 11-, 12- overflow port, 2- sealing mechanism, 21- top pressure closure, 22- cylinder, 23- are close
Envelope boss, 24- sealing ring, 3- water-saving groove, the second drainage hole of 31-, 32- third drainage hole, 4- spraying mechanism, 41- water inlet line,
42- nozzle, 43- fixed support plate, 5- even flow plate, 51- uniform flow hole, 52- gas circulation groove, 53- bubble holes, 54- air inlet, 6-
Water resistance rate detection system, 61- three-way connection, 62- water quality resistivity sensor, 63- water outlet, a- first direction.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.
The component for the embodiment of the present invention for usually describing and showing in attached drawing here can be with a variety of different configurations
To arrange and design.Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below and is wanted
The scope of the present invention of protection is sought, but is merely representative of selected embodiment of the invention.
Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Wafer cleaning device and wafer cleaning according to the application some embodiments are described referring to Fig. 1 to Fig. 7
System.
This application provides a kind of wafer cleaning devices, as shown in Fig. 1 to Fig. 3 and Fig. 6, including overflow launder 1 and sealer
Structure 2；The first drainage hole 11 is offered on the bottom wall of overflow launder 1, and sealing mechanism 2, sealing mechanism 2 are provided on the first drainage hole 11
The first drainage hole 11 can be switched on or off.
Wafer cleaning device provided by the present application includes overflow launder 1 and sealing mechanism 2；Wherein, overflow launder 1 is that upper end is open
Groove, the bottom of overflow launder 1 is provided with water injection hole, ultrapure water can be filled into overflow launder 1 by water injection hole, and continue to
The fresh ultrapure water of injection in overflow launder 1；Wafer to be cleaned is placed in overflow launder 1 and is carried out clearly using ultrapure water to it
Wash, remove the stained object of wafer surface, the stained object washed from wafer can swim in top and with ultrapure water from overflow
It overflows the open end at 1 top of chute.
The first drainage hole 11 is offered on the bottom wall of overflow launder 1, is provided with sealing mechanism 2 on the first drainage hole 11, is passed through
Sealing mechanism 2 can be realized being switched on and off to the first drainage hole 11, when the first drainage hole 11 is opened, in overflow launder 1
Ultrapure water can rapidly be emitted by the first drainage hole 11；When wafer is placed in cleaned in overflow launder 1 when, at this time
The water quality of ultrapure water in overflow launder 1 meets cleaning requirement, and the first drainage hole 11 is the state being off, and sealing mechanism 2 is right
First drainage hole 11 is sealed, and the stained object washed down from wafer can be from the open end at the top of overflow launder 1 with ultrapure
Water overflows；When the ultrapure water in overflow launder 1 is high due to staining object content, water quality does not meet the cleaning requirement to wafer
When and overflow launder 1 in ultrapure water when becoming waste water, need to replace the ultrapure water in overflow launder 1, pass through sealing mechanism
2 open the sealing to the first drainage hole 11, enable first drainage hole 11 of the ultrapure water in overflow launder 1 from 1 bottom of overflow launder
It is rapidly discharged, to quickly complete the replacement to 1 inside ultrapure water of overflow launder, improves working efficiency.
Preferably, the quantity of the first drainage hole 11 is multiple, and multiple first drainage holes 11 are arranged at intervals at the bottom of overflow launder 1
On wall, and it is provided with a sealing mechanism 2 on multiple first drainage holes 11, it is opened or is closed by sealing mechanism 2
It is disconnected；Preferably, the quantity of the first drainage hole 11 is two.
In one embodiment of the application, it is preferable that as shown in Figure 1 to Figure 3, wafer cleaning device further includes water-saving groove
3；Water-saving groove 3 is located at the lower section of overflow launder 1, and water-saving groove 3 can accept the overflowing liquid from overflow launder 1 and come from the first drainage hole
11 relief liquor；The second drainage hole 31 and third drainage hole are offered respectively along the both ends of first direction a on the bottom wall of water-saving groove 3
32；Second drainage hole 31 is connected with ultrapure water recovery device, and third drainage hole 32 carries out discharge of wastewater for ultrapure water；Second
It is correspondingly provided with sealing mechanism 2 on drainage hole 31 and third drainage hole 32, for the second drainage hole 31 and third drainage hole
32 are switched on or off.
In this embodiment, wafer cleaning device further includes water-saving groove 3, and overflow launder 1 is set up in water-saving groove 3 by bracket
Top, during being cleaned by overflow launder 1 to wafer, the stained object that washes down can be with ultrapure water from overflow launder 1
Open top end overflows and flows into water-saving groove 3, is collected and stores in water-saving groove 3；Simultaneously when in overflow launder 1
Ultrapure water water quality it is undesirable when, the waste water in overflow launder 1 can be rapidly discharged by section by the first drainage hole 11
In sink 3.
The bottom wall of water-saving groove 3 offers the second drainage hole 31 and third drainage hole 32 along the both ends of first direction a respectively；Its
In the second drainage hole 31 be connected with ultrapure water recovery device, when the ultrapure water collected in water-saving groove 3 is still conformed to wafer
When cleaning standard, the ultrapure water in water-saving groove 3 can be transported in ultrapure water recovery device by the second drainage hole 31, with right
The secondary use of ultrapure water saves water；When the water quality of ultrapure water in water-saving groove 3 is undesirable, pass through third drainage hole
32 go out the discharge of wastewater in water-saving groove 3.
It is also correspondingly provided with sealing mechanism 2 on second drainage hole 31 and third drainage hole 32, by sealing mechanism 2 to
Two drainage holes 31 and third drainage hole 32 are switched on or off；When the water quality of the ultrapure water in water-saving groove 3 meets the requirements and needs
When being recycled to it, the sealing mechanism 2 on the second drainage hole 31 can be opened, the second drainage hole 31 is opened, passes through
Second drainage hole 31 is connected by pipeline with ultrapure water recovery device, the ultrapure water in water-saving groove 3 is rapidly emitted into ultrapure
In water recovery device, recycling and reusing is carried out；When the ultrapure water water quality in water-saving groove 3 is unqualified, third drainage hole 32 is opened
On sealing mechanism 2, emit waste water in water-saving groove 3 rapidly by third drainage hole 32.
In one embodiment of the application, it is preferable that as shown in fig. 7, sealing mechanism 2 includes top pressure closure 21 and cylinder
22；One end of top pressure closure 21 is sealed end, and sealed end is adapted with corresponding drainage hole, can be to corresponding drainage hole
It is sealed closure；The other end of top pressure closure 21 is connected with the movable end of cylinder 22, and cylinder 22 can drive top pressure closure
21 pairs of corresponding drainage holes are blocked or are opened.
In this embodiment, sealing mechanism 2 includes top pressure closure 21 and cylinder 22, and wherein one end of top pressure closure 21 is close
Sealing end, sealed end can be adapted with corresponding drainage hole and be sealed closure to it；The other end of top pressure closure 21 with
The movable end of cylinder 22 is connected, and top pressure closure 21 can be driven to do back and forth along the length direction of 22 telescopic rod of cylinder by the qigong
Movement, is sealed closure or unlatching to corresponding drainage hole.
Specifically, cylinder 22 is installed on the corresponding position of overflow launder 1 or water-saving groove 3 by an erection support, when need
When blocking to drainage hole, the movable end of cylinder 22 drives top pressure closure 21 to be moved to the direction close to drainage hole until right
Corresponding drainage hole is sealed closure, when needing to open corresponding drainage hole, is driven by the movable end of cylinder 22 close
21 phase of capping cover is moved far from the direction of drainage hole, to open corresponding drainage hole.
It should be noted that cylinder 22 includes waterproof shell, can guarantee when cylinder 22 and ultrapure water contact, ultrapure water
The inside of cylinder 22 will not be entered and influence the normal operation of cylinder 22.
In one embodiment of the application, it is preferable that as shown in fig. 7, being provided with seal boss on the end face of sealed end
23, seal boss 23 is adapted with corresponding drainage hole and can extend into corresponding drainage hole；Seal boss 23
Side wall prolongs its circumferential direction and offers sealed groove, and sealing ring 24 is provided in sealed groove.
In this embodiment, the end face uplink of the sealed end of top pressure closure 21 is provided with seal boss 23, seal boss
23 can be adapted with the size of corresponding drainage hole, and seal boss 23 can extend into corresponding drainage hole, sealing
Prolong its circumferential direction on the side wall of boss 23 and offer sealed groove, sealing ring 24 is placed in sealed groove, when 2 pairs of phases of sealing mechanism
When corresponding drainage hole is sealed closure, top pressure closure 21 is under the driving of 22 movable end of cylinder, on the end face of sealed end
Seal boss 23 can extend into corresponding drainage hole, and the side wall of corresponding drainage hole and seal boss 23 being capable of clamping positions
In sealing ring 24 between the two, to guarantee top pressure closure 21 to the sealing performance of corresponding drainage hole.
In one embodiment of the application, it is preferable that as depicted in figs. 1 and 2, the bottom wall of water-saving groove 3 is along first direction a
With certain tilt angle, it is higher than the bottom wall of water-saving groove 3 close to third drainage hole 32 close to one end of the second drainage hole 31
One end.
In this embodiment, both ends of the bottom wall of water-saving groove 3 on first direction a are provided with the second drainage hole 31 and third
Drainage hole 32, while the bottom wall of water receiving tank has certain tilt angle along first direction a, makes to be provided with the second drainage hole 31
One end is higher than the one end for being provided with third drainage hole 32；Ultrapure water from overflow launder 1 in water-saving groove 3 can carry stained object, flaw
Dirt can be deposited on the slot bottom of water-saving groove 3, and since the slot bottom of water-saving groove 3 is higher than close to the close to one end of the second drainage hole 31
One end of three drainage holes 32, can make most stained object that can be deposited on the side of third drainage hole 32, thus when passing through the
When ultrapure water in water-saving groove 3 is emitted into ultrapure water recovery device by two drainage holes 31, it can be reduced to a certain extent
The content of the stained object of middle carrying；Simultaneously when the discharge of wastewater in water-saving groove 3 is gone out by third drainage hole 32, also can
Most stained object is emitted therewith.
In one embodiment of the application, it is preferable that as shown in Figure 1 and Figure 4, offered at the top of the groove body of overflow launder 1
Overflow port 12；The quantity of overflow port 12 is one or more, and when the quantity of overflow port 12 is multiple, multiple overflow ports 12 are along excessive
Being provided at circumferentially spaced at the top of the groove body of chute 1.
In this embodiment, multiple overflow ports 12 are offered at the top of the groove body of overflow launder 1, the quantity of overflow port 12 is one
A or multiple, the ultrapure water in overflow launder 1 can pass through 12 overflow of overflow port into water-saving groove 3 with the stained object washed down
It is interior；When the quantity of overflow port 12 is multiple, multiple being provided at circumferentially spaced at the top of the groove body of overflow launder 1 of overflow port 12；It is excellent
Selection of land, overflow hole can be arc-shaped or rectangular；Thus by opening up overflow port 12 at the top of the groove body of overflow launder 1,
The area of overflow port 12 is increased, 1 pollution discharge capability of overflow launder can be effectively improved.
In one embodiment of the application, it is preferable that as shown in Figure 1 and Figure 4, wafer cleaning device further includes spray thrower
Structure 4；Spraying mechanism 4 includes water inlet line 41 and nozzle 42；Water inlet line 41 is fixedly connected on overflow by fixed support plate 43
On the side wall of slot 1, nozzle is set on water inlet line 41 and is connected with water inlet line 41, and the ejection end direction of nozzle 42 is overflow
Inside chute 1.
In this embodiment, wafer cleaning device further includes spraying mechanism 4, and spraying mechanism 4 includes water inlet line 41 and spray
Mouth 42；Water inlet line 41 is set up on the side wall with overflow launder 1 by the way that fixed support plate 43 is fixed, and one end of water inlet line 41 is external
The other end of ultrapure water feed pipe, water inlet line 41 is blocked, and nozzle 42, one end of nozzle 42 are provided on water inlet line 41
It is connected with water inlet line 41, the ejection end of nozzle 42 can be ejected towards the inside of overflow launder 1 from the ejection end of nozzle 42
Conical water column, conical water column can directly wash away wafer surface, crystal column surface effectively can be stained object
It rinses well.
Preferably, the quantity of nozzle 42 is multiple, and multiple nozzles 42 are arranged at intervals on water inlet line 41, not only increases spray
The contact area of water column and wafer that mouth 42 ejects, can rinse wafer well, while can be simultaneously to multiple
Wafer is rinsed.
Preferably, the quantity of spraying mechanism 4 is two, and two spraying mechanisms 4 are relatively arranged on 1 first direction a of overflow launder
Both ends, increase the contact area of water column and wafer that nozzle 42 ejects, so as to more effectively rush wafer
Wash clean.
In one embodiment of the application, it is preferable that as shown in figure 5, being additionally provided with even flow plate 5, uniform flow in overflow launder 1
Plate 5 is located at 1 bottom of overflow launder；It is offered along its thickness direction through the uniform flow hole 51 of 5 plate face of even flow plate, uniform flow on even flow plate 5
The quantity in hole 51 be it is multiple, multiple uniform flow holes 51 are spaced apart on even flow plate 5；Gas circulation groove 52 is also provided in even flow plate 5,
Air inlet 54 is provided on even flow plate 5, air inlet 54 is connected with gas circulation groove 52；Bubble holes are also provided on even flow plate 5
53, gas circulation groove 52 is connected by bubble holes 53 with overflow launder 1；The quantity of bubble holes 53 is multiple, multiple bubble holes 53
It is arranged at intervals on gas circulation groove 52.
In this embodiment, 1 inside bottom of overflow launder also passes through support frame and is provided with even flow plate 5, even flow plate 5 and overflow launder
Also there are certain gaps between 1 bottom wall；It is offered on even flow plate 5 through the uniform flow hole 51 of even flow plate 5, the number in uniform flow hole 51
Amount is multiple, and multiple uniform flow holes 51 are distributed on even flow plate 5；The bottom of overflow launder 1 is provided with water injection hole, passes through water filling
Hole can persistently inject ultrapure water into overflow launder 1, can carry out uniform flow to the ultrapure water that bottom is injected by even flow plate 5, make to surpass
Pure water equably fills entire overflow launder 1.
It is also provided with gas circulation groove 52 inside even flow plate 5, air inlet 54, air inlet 54 and gas are provided on even flow plate 5
One end of body circulation groove 52 is connected, can be as pouring nitrogen inside gas circulation groove 52 by air inlet 54；On even flow plate 5 also
Bubble holes 53 are offered, will be connected to inside gas circulation groove 52 and overflow launder 1 by bubble holes 53；The quantity of bubble holes 53
To be multiple, multiple bubble holes 53 are arranged at intervals on gas circulation groove 52, and the nitrogen in gas circulation groove 52 is from bubble holes 53
Discharge makes to form bubble in overflow launder 1, is purged by nitrogen bubbling to by the stained object on former piece surface, thus effectively
Improve the cleannes of wafer.
In one embodiment of the application, it is preferable that as shown in Figure 1 and Figure 5, wafer cleaning device further includes water resistance rate
Detection system 6；Water resistance rate detection system 6 includes three-way connection 61 and water quality resistivity sensor 62；The side of the groove body of overflow launder 1
Apopore is offered on wall, the first interface of three-way connection 61 is connected with apopore, water quality resistivity sensor 62 and threeway
The second interface of connector 61 is connected, and second interface and first interface are two interfaces being oppositely arranged；The of three-way connection 61
Three interfaces are the water outlet 63 of water resistance rate detection system 6, and water outlet 63 is lower than overflow port 12.
In this embodiment, wafer cleaning device further includes water resistance rate detection system 6；Water resistance rate detection system 6 includes three
Pass joint 61 and water quality resistivity sensor 62；Offer apopore on the side wall of the groove body of overflow launder 1, the of three-way connection 61
One interface is connected with apopore, and the ultrapure water in overflow launder 1 can be entered in three-way connection 61 by first interface；Threeway
An end interface opposite with first interface is second interface in connector 61, and water quality resistivity sensor 62 is connected with second interface
It is logical, and the water quality for capableing of ultrapure water in three-way connector is detected；In three-way connection 61 with first interface and second interface
The interface of perpendicular one end is third interface, and third interface is the water outlet 63 of water resistance rate detection system 6, and third interface is spacious
Mouthful, and open end is upward, which is lower than the overflow port 12 of overflow launder 1, to enter three-way connection 61 from first interface
Interior ultrapure water can be spilled over to throttling channel from third interface, guarantee that the ultrapure water in three-way connection 61 is running water, water quality can
Remain identical as the water quality condition in overflow launder 1, to can accurately detect by water quality resistivity sensor 62
The practical water quality situation of ultrapure water in overflow launder 1.
Present invention also provides a kind of silicon chip cleaning system, the wafer cleaning device including any of the above-described embodiment.
In this embodiment, silicon chip cleaning system includes wafer cleaning device, therefore silicon chip cleaning system has wafer clear
Whole beneficial effects of cleaning device, this is no longer going to repeat them.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of wafer cleaning device, which is characterized in that including overflow launder and sealing mechanism；
The first drainage hole is offered on the bottom wall of the overflow launder, and the sealing mechanism, institute are provided on first drainage hole
First drainage hole can be switched on or off by stating sealing mechanism.
2. wafer cleaning device according to claim 1, which is characterized in that further include water-saving groove；
The water-saving groove is located at the lower section of the overflow launder, the water-saving groove can accept overflowing liquid from the overflow launder and
Relief liquor from first drainage hole；
The second drainage hole and third drainage hole are offered respectively along the both ends of first direction on the bottom wall of the water-saving groove；Described
Two drainage holes are connected with ultrapure water recovery device, and the third drainage hole carries out discharge of wastewater for ultrapure water；
It is correspondingly provided with the sealing mechanism on second drainage hole and the third drainage hole, for the second row
Water hole and the third drainage hole are switched on or off.
3. wafer cleaning device according to claim 2, which is characterized in that the sealing mechanism includes that top pressure closure is gentle
Cylinder；
One end of the top pressure closure is sealed end, and the sealed end is adapted with corresponding drainage hole, can be to corresponding
Drainage hole be sealed closure；
The other end of the top pressure closure is connected with the movable end of the cylinder, and the cylinder can drive the top pressure closure
Corresponding drainage hole is blocked or opened.
4. wafer cleaning device according to claim 3, which is characterized in that be provided with sealing on the end face of the sealed end
Boss, the seal boss are adapted with corresponding drainage hole and can extend into corresponding drainage hole；The sealing
The side wall of boss prolongs its circumferential direction and offers sealed groove, is provided with sealing ring in the sealed groove.
5. wafer cleaning device according to claim 2, which is characterized in that the bottom wall of the water-saving groove is along the first party
To being higher than the bottom wall of the water-saving groove close to described the close to one end of second drainage hole
One end of three drainage holes.
6. wafer cleaning device according to claim 1, which is characterized in that offered at the top of the groove body of the overflow launder excessive
Head piece；
The quantity of the overflow port is one or more, when the quantity of the overflow port is multiple, multiple overflow port edges
Being provided at circumferentially spaced at the top of the groove body of the overflow launder.
7. wafer cleaning device according to claim 1, which is characterized in that further include spraying mechanism；
The spraying mechanism includes water inlet line and nozzle；The water inlet line is fixedly connected on described overflow by fixed support plate
On the side wall of chute, the nozzle is set on the water inlet line and is connected with the water inlet line, and the nozzle
Ejection end is towards inside the overflow launder.
8. wafer cleaning device according to claim 1, which is characterized in that it is additionally provided with even flow plate in the overflow launder,
The even flow plate is located at the isopipe root；
It is offered along its thickness direction through the uniform flow hole of the even flow plate plate face, the quantity in the uniform flow hole on the even flow plate
To be multiple, multiple uniform flow holes are spaced apart on the even flow plate；
Be also provided with gas circulation groove in the even flow plate, be provided with air inlet on the even flow plate, the air inlet with it is described
Gas circulation groove is connected；Bubble holes are also provided on the even flow plate, the gas circulation groove passes through the bubble holes and institute
Overflow launder is stated to be connected；The quantity of the bubble holes be it is multiple, multiple bubble holes are arranged at intervals at the gas circulation groove
On.
9. wafer cleaning device according to claim 2, which is characterized in that further include water resistance rate detection system；The water
Resistance rate detection system includes three-way connection and water quality resistivity sensor；
Apopore, the first interface of the three-way connection and the apopore phase are offered on the side wall of the groove body of the overflow launder
Connection, the water quality resistivity sensor is connected with the second interface of the three-way connection, the second interface and described the
One interface is two interfaces being oppositely arranged；The third interface of the three-way connection is the water outlet of the water resistance rate detection system
Mouthful, and the water outlet is lower than the overflow port.
10. a kind of wafer cleaning system, which is characterized in that including wafer cleaning device of any of claims 1-9.
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| CN201910476413.XA CN110047788B (en) | 2019-06-03 | 2019-06-03 | Wafer cleaning device and wafer cleaning system |
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