CN205289078U - Wafer -cleaning device - Google Patents

Wafer -cleaning device Download PDF

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Publication number
CN205289078U
CN205289078U CN201521143834.4U CN201521143834U CN205289078U CN 205289078 U CN205289078 U CN 205289078U CN 201521143834 U CN201521143834 U CN 201521143834U CN 205289078 U CN205289078 U CN 205289078U
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CN
China
Prior art keywords
silicon chip
shower
cleaning device
rinse bath
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201521143834.4U
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Chinese (zh)
Inventor
房利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin All Kinds Of Things In Nature Gold One Hundred Microtronics AS
Original Assignee
Tianjin All Kinds Of Things In Nature Gold One Hundred Microtronics AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Tianjin All Kinds Of Things In Nature Gold One Hundred Microtronics AS filed Critical Tianjin All Kinds Of Things In Nature Gold One Hundred Microtronics AS
Priority to CN201521143834.4U priority Critical patent/CN205289078U/en
Application granted granted Critical
Publication of CN205289078U publication Critical patent/CN205289078U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a wafer -cleaning device, including washing tank, shower, washing basket, washing tank lateral wall no. 1, washing tank lateral wall no. 2, silicon chip backing plate, wherein washing tank lateral wall no. 1 is equipped with the shower respectively with washing tank lateral wall no. 2, the one end of shower is sealed, and the other end links to each other with the delivery pipe, be equipped with the nozzle on the shower, the bottom of washing tank is equipped with the silicon chip backing plate, be equipped with the tooth's socket on the washing basket, insert the silicon chip in the tooth's socket of washing basket. A wafer -cleaning device can effective residual acid, alkali or organic solvent who washs the silicon chip surface adsorption, let the silicon chip can obtain thorough washing, avoided that the silicon chip surface is local washs unclean phenomenon, improved the cleanliness factor of silicon chip, the the device matting is simple, has practiced thrift the water consumption.

Description

A kind of silicon chip cleaning device
Technical field
This utility model belongs to silicon chip cleaning device field, especially relates to a kind of silicon chip cleaning device.
Background technology
Along with the integrated level of the development of large scale integrated circuit, integrated circuit improve constantly, live width constantly reduces, integrated circuit to the cleanliness factor of silicon chip surface, surface chemical state, oxide thickness requirement also more and more higher. Semiconductor device produce in silicon chip must through strict cleaning, even if otherwise micropollution also results in component failure. The purpose cleaned is in that to remove surface contamination impurity, including inorganic matter and Organic substance. These impurity have with state of atom or ionic condition, have in the form of a film or particle form be present in silicon chip surface. Organic pollution includes oils and fats or the fiber that photoresist, organic solvent residual thing, synthetic wax contact device with people, instrument, vessel bring. Inorganic pollution includes heavy metal gold, copper, ferrum, chromium etc., has a strong impact on minority carrier lifetime and surface conductance; Alkali metal and sodium etc. can cause serious drain. Particle contamination includes white residue, dust, antibacterial, microorganism, organic colloid fiber etc. can cause various defect. The quantity of the component failure caused owing to Wafer Cleaning is improper at present has exceeded the half of total losses in integrated circuit. Expect high-quality silicon chip, it is necessary to improve Conventional cleaning methods, make silicon chip have very clean surface. But to reach this target, the improvement to Wafer Cleaning equipment is a very big challenge. The mode of the current many employings of silicon chip decontamination method multiple rinse bath ladder washing, not only operation is numerous and diverse and also pollutant of silicon chip surface after washing can residual packing at silicon chip surface, cause local not wash clean clearly.
Summary of the invention
In view of this, this utility model is directed to a kind of a kind of silicon chip cleaning device, and to solve, Wafer Cleaning operation is numerous and diverse, sordid problem is cleaned in silicon chip local.
For reaching above-mentioned purpose, the technical solution of the utility model is achieved in that
A kind of silicon chip cleaning device, including rinse bath, shower, cleaning basket, rinse bath sidewall one, rinse bath sidewall two, silicon chip backing plate, wherein said rinse bath sidewall one is respectively equipped with shower with rinse bath sidewall two, one end of described shower is closed, the other end is connected with feed pipe, and described shower is provided with nozzle, and the bottom of described rinse bath is provided with silicon chip backing plate, described cleaning basket is provided with teeth groove, inserts silicon chip in the teeth groove of described cleaning basket.
Further, the quantity of the silicon chip inserted in described teeth groove is 10��25.
Further, the placement direction of described silicon chip is parallel with nozzle direction.
Further, the spacing of described nozzle is 5��15cm.
Further, the internal diameter of described shower is 12��15mm.
Further, the quantity of the silicon chip inserted in described teeth groove is 13.
Relative to prior art, a kind of silicon chip cleaning device described in the utility model has the advantage that
(1) a kind of silicon chip cleaning device described in the utility model can effectively wash the residual acid of silicon chip surface absorption, alkali or organic solvent, silicon chip can be cleaned thoroughly, avoid silicon chip surface local and clean sordid phenomenon, improve the cleanliness factor of silicon chip;
(2) a kind of silicon chip cleaning device described in the utility model is applicable to various sizes of silicon chip, has wide range of applications, can be prevented effectively from silicon chip and break and collapse limit phenomenon, improves the yield rate that silicon chip produces;
(3) a kind of silicon chip cleaning device described in the utility model shortens the time that silicon chip is further corroded, it is prevented that silicon chip surface is oxidized, and this device matting is simple, has saved water consumption.
Accompanying drawing explanation
The accompanying drawing of the part constituting this utility model is further appreciated by of the present utility model for providing, and schematic description and description of the present utility model is used for explaining this utility model, is not intended that improper restriction of the present utility model. In the accompanying drawings:
Fig. 1 is the structural representation of the rinse bath described in this utility model embodiment;
Fig. 2 is the structural representation cleaning basket described in this utility model embodiment;
Fig. 3 is the structural representation placing the silicon chip cleaning device cleaning basket and silicon chip described in this utility model embodiment
Description of reference numerals:
1-rinse bath; 2-shower; 3-nozzle; 4-silicon chip backing plate; 5-cleans basket; 6-rinse bath sidewall one; 7-rinse bath sidewall two; 8-silicon chip; 9-teeth groove.
Detailed description of the invention
It should be noted that when not conflicting, the embodiment in this utility model and the feature in embodiment can be mutually combined.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model. additionally, term " first ", " second " etc. are only for descriptive purposes, and it is not intended that indicate or imply relative importance or the implicit quantity indicating indicated technical characteristic. thus, the feature defining " first ", " second " etc. can express or implicitly include one or more these features. in description of the present utility model, except as otherwise noted, " multiple " are meant that two or more.
In description of the present utility model, it is necessary to explanation, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, for instance, it is possible to it is fixing connection, it is also possible to be removably connect, or connect integratedly; Can be mechanically connected, it is also possible to be electrical connection; Can be joined directly together, it is also possible to be indirectly connected to by intermediary, it is possible to be the connection of two element internals. For the ordinary skill in the art, it is possible to understand above-mentioned term concrete meaning in this utility model by concrete condition.
Describe this utility model below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
Embodiment 1
A kind of silicon chip cleaning device, including rinse bath 1, shower 2, clean basket 5, rinse bath sidewall 1, rinse bath sidewall 27, silicon chip backing plate 4, wherein said rinse bath sidewall 1 is respectively equipped with shower 2 with rinse bath sidewall 27, one end of described shower 2 is closed, the other end is connected with feed pipe, described shower 2 is provided with nozzle 3, the spacing of nozzle 3 is 8cm, the internal diameter of shower 2 is 13mm, the bottom of described rinse bath 1 is provided with silicon chip backing plate 4, described cleaning basket is provided with teeth groove 9, 13 silicon chips 8 are put in cleaning basket 5, the placement direction of described silicon chip 8 is parallel with nozzle 3 direction, keep rinse bath 1 interior edema overflow clean before cleaning, the cleaning basket 5 being then placed in carrying silicon wafers 8 cleans up.
The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all within spirit of the present utility model and principle, any amendment of making, equivalent replacement, improvement etc., should be included within protection domain of the present utility model.

Claims (6)

1. a silicon chip cleaning device, it is characterized in that: include rinse bath (1), shower (2), clean basket (5), rinse bath sidewall one (6), rinse bath sidewall two (7), silicon chip backing plate (4), wherein said rinse bath sidewall one (6) is respectively equipped with shower (2) with rinse bath sidewall two (7), one end of described shower (2) is closed, the other end is connected with feed pipe, described shower (2) is provided with nozzle (3), the bottom of described rinse bath (1) is provided with silicon chip backing plate (4), cleaning basket (5) it is provided with in described rinse bath (1), described cleaning basket (5) is provided with teeth groove (9), the teeth groove (9) of described cleaning basket (5) inserts silicon chip (8).
2. a kind of silicon chip cleaning device according to claim 1, it is characterised in that: the quantity of the silicon chip (8) inserted in described teeth groove (9) is 10��25.
3. a kind of silicon chip cleaning device according to claim 1, it is characterised in that: the placement direction of described silicon chip (8) is parallel with nozzle direction.
4. a kind of silicon chip cleaning device according to claim 1, it is characterised in that: the spacing of described nozzle (3) is 5��15cm.
5. a kind of silicon chip cleaning device according to claim 1, it is characterised in that: the internal diameter of described shower (2) is 12��15mm.
6. a kind of silicon chip cleaning device according to claim 1, it is characterised in that: the quantity of the silicon chip (8) inserted in described teeth groove (9) is 13.
CN201521143834.4U 2015-12-31 2015-12-31 Wafer -cleaning device Expired - Fee Related CN205289078U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521143834.4U CN205289078U (en) 2015-12-31 2015-12-31 Wafer -cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521143834.4U CN205289078U (en) 2015-12-31 2015-12-31 Wafer -cleaning device

Publications (1)

Publication Number Publication Date
CN205289078U true CN205289078U (en) 2016-06-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201521143834.4U Expired - Fee Related CN205289078U (en) 2015-12-31 2015-12-31 Wafer -cleaning device

Country Status (1)

Country Link
CN (1) CN205289078U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112808639A (en) * 2020-12-30 2021-05-18 湖南三安半导体有限责任公司 Cleaning device
CN112916500A (en) * 2021-01-25 2021-06-08 上海磬采电力科技开发有限公司 Wafer cleaning device and wafer cleaning method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112808639A (en) * 2020-12-30 2021-05-18 湖南三安半导体有限责任公司 Cleaning device
CN112916500A (en) * 2021-01-25 2021-06-08 上海磬采电力科技开发有限公司 Wafer cleaning device and wafer cleaning method

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160608

Termination date: 20191231

CF01 Termination of patent right due to non-payment of annual fee