CN219597490U - Silicon carbide wafer washs card stopper device - Google Patents

Abstract

The utility model discloses a silicon carbide wafer cleaning blocking device, which comprises: cleaning a clamping plug base, a clamping plug supporting beam, a clamping plug front connecting piece and a clamping plug rear connecting piece; the clamping plug supporting beam is used for supporting a wafer, the cleaning clamping plug base and the plurality of clamping plug supporting beams are respectively connected between the front clamping plug connecting piece and the rear clamping plug connecting piece, and the cleaning clamping plug base is located below the clamping plug supporting beam. According to the scheme, the contact area between the wafer and the blocking plug is reduced, more wafers are exposed in the groove body, the cleaning is more complete, the residual rate of liquid medicine is reduced, the improvement on the beam can prevent the water drops at the groove from being remained in the drying process, and the generation of water mark defects is reduced; the tool is improved, so that raw materials can be saved, and the wafer cleaning yield is greatly improved by reducing the contact area between the wafer and the clamping plug.

Description

Silicon carbide wafer washs card stopper device

Technical Field

The utility model relates to the technical field of wafers, in particular to a silicon carbide wafer cleaning blocking device.

Background

Silicon carbide wafers are being cleaned more often than on-wafer cleaning. For groove type cleaning, in order to ensure the cleaning yield, the tool design in the cleaning process is particularly important.

At present, the silicon carbide wafer is blocked by PFA (PFA wafer Cassette) in the cleaning process, which is also called cleaning flower basket, teflon cassette, teflon Long Jingzhou cassette, acid-resistant, alkali-resistant and corrosion-resistant (strong acid, strong fluoric acid and strong alkali). The structure on two sides of the device is designed to be relatively closed, the contact area between the wafer and the clamping groove body is large, the QDR flushing has concealment, and the liquid medicine is not easy to be flushed cleanly; in addition, the water drops remain in the blocking groove in the IPA drying process, so that dirt or water mark residue defects are generated on two sides of the wafer, and the cleaning yield is reduced.

Disclosure of Invention

In view of the above, the utility model provides a silicon carbide wafer cleaning blocking device, which reduces the contact area between a wafer and a blocking plug, more exposes the wafer in a groove body, more fully cleans the wafer, reduces the residual rate of liquid medicine, and improves the beam position so as to prevent water drops at the groove from being remained in the drying process and reduce the generation of water mark defects. The tool is improved, so that raw materials can be saved, and the wafer cleaning yield is greatly improved by reducing the contact area between the wafer and the clamping plug.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

a silicon carbide wafer cleaning chuck device comprising: cleaning a clamping plug base, a clamping plug supporting beam, a clamping plug front connecting piece and a clamping plug rear connecting piece;

the clamping plug supporting beam is used for supporting a wafer, the cleaning clamping plug base and the plurality of clamping plug supporting beams are respectively connected between the front clamping plug connecting piece and the rear clamping plug connecting piece, and the cleaning clamping plug base is located below the clamping plug supporting beam.

Preferably, the blocking support beam includes: the upper beam, the middle beam and the lower beam are sequentially arranged from high to low.

Preferably, the upper beam is 20-30mm away from the middle beam, the middle beam is 25-35mm away from the lower beam, and the lower beam is 8-15mm away from the cleaning plug base.

Preferably, the method further comprises: a plurality of comb teeth which are arranged at intervals along the length direction of the clamping plug supporting beam;

the comb teeth include: the upper comb teeth are arranged on the upper cross beam, the middle comb teeth are arranged on the middle cross beam, and the lower comb teeth are arranged on the lower cross beam;

the upper comb teeth, the middle comb teeth and the lower comb teeth are in one-to-one correspondence.

Preferably, the upper beam and the middle beam are respectively positioned at two sides of the lower beam in the horizontal direction;

the upper comb teeth and the middle comb teeth are arranged in opposite directions and face upwards and form an included angle of 30 degrees with the horizontal direction.

Preferably, the number of the lower cross beams is multiple, and at least two lower comb teeth of the lower cross beams are arranged in opposite directions and face upwards and form an included angle of 60 degrees with the horizontal direction.

Preferably, the comb teeth are conical comb teeth.

Preferably, the method further comprises: a stuck handle;

the clamping plug handle is connected between the front clamping plug connecting piece and the rear clamping plug connecting piece and is positioned above the clamping plug supporting cross beam.

Preferably, the cross section of the connecting piece before the blocking is H-shaped, and the cross section of the connecting piece after the blocking is U-shaped.

According to the technical scheme, the silicon carbide wafer cleaning blocking device reduces the contact area between the wafer and the blocking, more wafers are exposed in the groove body, cleaning is more complete, the residual rate of liquid medicine is reduced, and the improvement on the cross beam can prevent water drops at the groove from being remained in the drying process and reduce water mark defects. The tool is improved, so that raw materials can be saved, and the wafer cleaning yield is greatly improved by reducing the contact area between the wafer and the clamping plug.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a front view structure of a silicon carbide wafer cleaning chuck device according to an embodiment of the present utility model;

fig. 2 is a schematic top view of a cleaning chuck device for silicon carbide wafers according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of a left-hand structure of a cleaning chuck device for silicon carbide wafers according to an embodiment of the present utility model;

wherein, 1-cleaning the plug base; 2-a stuck handle;

3-1 upper cross beam, 3-2 middle cross beam, and lower 3-3 cross beam;

4-comb teeth, 41-upper comb teeth, 42-middle comb teeth and 43-lower comb teeth;

5-a pre-jam connection; and 6, a post-blocking connecting piece.

FIG. 4 is a schematic diagram of a conventional chuck after cleaning a wafer;

fig. 5 is a schematic diagram of the situation after the wafer is cleaned by the chuck according to the present embodiment.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The silicon carbide wafer cleaning blocking device provided by the embodiment of the utility model comprises: cleaning the clamping plug base 1, the clamping plug supporting cross beam, the clamping plug front connecting piece 5 and the clamping plug rear connecting piece 6, and the structure can be shown by referring to fig. 1, 2 and 3;

the clamping plug supporting cross beam is used for supporting a wafer, the cleaning clamping plug base 1 and the plurality of clamping plug supporting cross beams are respectively connected between the clamping plug front connecting piece 5 and the clamping plug rear connecting piece 6, and the cleaning clamping plug base 1 is located below the clamping plug supporting cross beam.

According to the technical scheme, the silicon carbide wafer cleaning blocking device provided by the utility model has the advantages that the structure for supporting the wafer adopts a beam form, so that the two sides of the wafer are in a relatively open state; compared with the prior art that the structures on two sides are relatively closed, the two-side shielding objects of the cleaning clamp plug are cut off, the contact area of the wafer and the clamp plug groove body is reduced, the wafer and the liquid medicine can be contacted more fully, the pollution problem on two sides is reduced, and the cleaning effect is better.

Further, the jam support beam includes: the upper beam 3-1, the middle beam 3-2 and the lower beam 3-3 are sequentially arranged from high to low to realize the support of different positions of the wafer, and the structure can be shown by referring to fig. 3.

Preferably, the height of the upper cross beam 3-1 is 20-30mm away from the height of the middle cross beam 3-2, the height of the middle cross beam 3-2 is 25-35mm away from the height of the lower cross beam 3-3, and the height of the lower cross beam 3-3 is 8-15mm away from the height of the cleaning plug base 1, so that the opening degree of two sides of a wafer is ensured, and the wafer is adapted to the existing specification.

The utility model provides a silicon carbide wafer cleaning blocking device, which further comprises: a plurality of comb teeth 4 which are arranged at intervals along the length direction of the clamping support beam and used for separating wafers and preventing lamination, and the structure of the comb teeth can be shown by referring to figure 2;

the comb teeth 4 include: upper comb teeth 41 provided on upper beam 3-1, middle comb teeth 42 provided on middle beam 3-2, and lower comb teeth 43 provided on lower beam 3-3;

the upper comb teeth 41, the middle comb teeth 42 and the lower comb teeth 43 are in one-to-one correspondence, specifically, the upper comb teeth 41, the middle comb teeth 42 and the lower comb teeth 43 are located on the same plane, so as to form a plurality of pairs of comb teeth combination, and the structure can be shown with reference to fig. 2 and 3.

Specifically, the upper beam 3-1 and the middle beam 3-2 are respectively positioned at two sides of the lower beam 3-3 in the horizontal direction so as to provide reliable transverse support for the wafer;

the upper comb teeth 41 and the middle comb teeth 42 are arranged opposite to each other, and face upwards and form an included angle of 30 degrees with the horizontal direction, and the structure can be shown by referring to fig. 2, wherein one side of the outermost comb teeth 4 is the upper comb teeth 41, and the other side is the middle comb teeth 42.

Further, the number of the lower cross beams 3-3 is plural, and the lower comb teeth 43 of at least two lower cross beams 3-3 are disposed opposite to each other and face upward and form an included angle of 60 degrees with the horizontal direction, and the structure thereof can be shown with reference to fig. 2 and 3, so as to provide reliable vertical support for the wafer.

Preferably, the comb teeth 4 are conical comb teeth, so that water drop residue can be avoided in the IPA drying process, and water mark generation is reduced.

The utility model provides a silicon carbide wafer cleaning blocking device, which further comprises: a stuck handle 2, the structure of which can be seen with reference to figures 1 and 2;

wherein, the stopper handle 2 is connected between the stopper front connecting piece 5 and the stopper rear connecting piece 6, and the stopper handle 2 is located the top of stopper supporting beam. Personnel are arranged on two sides of the top end of the clamping plug to take and put the clamping plug handle 2, so that hands are prevented from touching the clamping plug.

Specifically, the cross section of the front clamping plug connector 5 is H-shaped, as shown in fig. 1, and two cleaning clamping plug bases 1 are respectively positioned at the bottoms of two H-shaped lower supporting legs of the front clamping plug connector 5; the cross section of the connecting piece 6 after the blocking is U-shaped.

The present solution is further described below in connection with specific embodiments:

the outside of the silicon carbide wafer cleaning clamping plug is in a relatively open state at two sides, shielding is cut off at two sides, three beam supports are reserved, and the front and rear surfaces are designed to be H surfaces; personnel taking and placing clamping plug handles are arranged on two sides of the top end of the clamping plug to prevent hands from touching the clamping plug; the bottom end support of the clamping plug is relatively thick and is connected with the front H surface, the rear H surface and the U surface.

The wafer cleaning plug is internally provided with 26 conical comb teeth on each beam for separating wafers and preventing lamination. The comb teeth in the lower beam are 60-degree upward, 11mm away from the base, the comb teeth in the middle beam are 30-degree upward, 30mm away from the lower beam and 25mm away from the upper beam.

The device is simple to set and is suitable for various groove type cleaning processes;

the shielding objects at the two sides of the cleaning clamp plug are cut off, so that the wafer can be fully contacted with the liquid medicine, the problem of dirt at the two sides is reduced, and the cleaning effect is better;

by using conical comb teeth to isolate the wafer, water drop residue can be avoided in the IPA drying process, and water mark generation is reduced.

The wafer cleaning conditions before and after the optimization are shown in fig. 4 and 5.

In summary, the utility model discloses a silicon carbide wafer cleaning blocking device, which reduces the contact area between a wafer and a blocking plug, more wafers are exposed in a groove body, cleaning is more complete, the residual rate of liquid medicine is reduced, and the improvement on a beam can prevent water drops at a groove from being remained in the drying process and reduce water mark defects. The tool is improved, so that raw materials can be saved, and the wafer cleaning yield is greatly improved by reducing the contact area between the wafer and the clamping plug.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (7)

1. A silicon carbide wafer cleaning chuck device, comprising: cleaning a clamping plug base (1), a clamping plug supporting beam, a clamping plug front connecting piece (5) and a clamping plug rear connecting piece (6);

the clamping plug supporting cross beam is used for supporting a wafer, the cleaning clamping plug base (1) and the plurality of clamping plug supporting cross beams are respectively connected between the clamping plug front connecting piece (5) and the clamping plug rear connecting piece (6), and the cleaning clamping plug base (1) is positioned below the clamping plug supporting cross beam;

the jamming support beam comprises: the upper cross beam (3-1), the middle cross beam (3-2) and the lower cross beam (3-3) are sequentially arranged from high to low;

the silicon carbide wafer cleaning blocking device further comprises: a plurality of comb teeth (4) which are arranged at intervals along the length direction of the clamping plug supporting cross beam;

the comb teeth (4) include: upper comb teeth (41) arranged on the upper cross beam (3-1), middle comb teeth (42) arranged on the middle cross beam (3-2) and lower comb teeth (43) arranged on the lower cross beam (3-3);

the upper comb teeth (41), the middle comb teeth (42) and the lower comb teeth (43) are in one-to-one correspondence.

2. Silicon carbide wafer cleaning jam device according to claim 1, characterized in that the upper beam (3-1) is 20-30mm high from the middle beam (3-2), the middle beam (3-2) is 25-35mm high from the lower beam (3-3), the lower beam (3-3) is 8-15mm high from the cleaning jam base (1).

3. The silicon carbide wafer cleaning jam device according to claim 1, wherein the upper beam (3-1) and the intermediate beam (3-2) are located on both sides of the lower beam (3-3) in the horizontal direction, respectively;

the upper comb teeth (41) and the middle comb teeth (42) are arranged in opposite directions and face upwards and form an included angle of 30 degrees with the horizontal direction.

4. A silicon carbide wafer cleaning jam device according to claim 3, wherein the number of the lower cross beams (3-3) is plural, and the lower comb teeth (43) of at least two of the lower cross beams (3-3) are arranged in opposite directions and face upward and form an angle of 60 degrees with the horizontal direction.

5. Silicon carbide wafer cleaning jam according to claim 1, characterized in that the comb teeth (4) are conical comb teeth.

6. The silicon carbide wafer cleaning chuck device as set forth in claim 1, further comprising: a stuck handle (2);

the clamping handle (2) is connected between the front clamping connecting piece (5) and the rear clamping connecting piece (6), and the clamping handle (2) is located above the clamping supporting cross beam.

7. The silicon carbide wafer cleaning chuck device according to claim 1, wherein the cross section of the front chuck connector (5) is H-shaped and the cross section of the rear chuck connector (6) is U-shaped.