CN220691971U

CN220691971U - Rectifying plate for etching cleaning tank

Info

Publication number: CN220691971U
Application number: CN202322167232.3U
Authority: CN
Inventors: 钱诚; 李刚; 李涛
Original assignee: Wuxi Aelsystem Intelligent Equipment Co ltd
Current assignee: Wuxi Aelsystem Intelligent Equipment Co ltd
Priority date: 2023-08-11
Filing date: 2023-08-11
Publication date: 2024-03-29
Anticipated expiration: 2033-08-11

Abstract

The utility model relates to an etching is rectifying plate for washing tank, the intermediate block sets up in rectifying plate intermediate position for the wafer is no longer directly impacted by the washing liquid in the middle of, simultaneously, the last distribution of rectifying plate has first rectifying hole and second rectifying hole, the aperture in second rectifying hole can reduce greatly and lead to the dead zone problem that intermediate block bottom washing liquid formed because of the intermediate block sets up, make the washing liquid can pass through the second rectifying hole smoothly and reach the rectifying plate top along the intermediate block both sides, simultaneously the plate body top both sides have the inclined plane to play certain guide effect to the washing liquid, in the middle of the wafer with the washing liquid direction wafer, the washing degree of consistency of single wafer has been improved through above-mentioned setting.

Description

Rectifying plate for etching cleaning tank

Technical Field

The application belongs to the technical field of wafer manufacturing equipment, and particularly relates to a rectifying plate for an etching cleaning tank.

Background

In the wafer production process, a large number of cleaning operations are required, and a large number of wafers are usually placed in a cleaning tank together with a wafer basket (flower basket), so that the cleaning uniformity is the cleaning effect which needs to be considered. The cleaning uniformity has two dimensions, one is the cleanliness of the individual wafers across the surface, and the other is the uniformity between rows of different wafers.

After the existing etching cleaning tank cleans the wafer, the uniformity is not high, namely the distribution of residual particles on the wafer is not uniform.

Disclosure of Invention

The utility model aims to solve the technical problems that: in order to solve the defects in the prior art, the rectifying plate for the etching cleaning tank is provided for improving the cleaning uniformity.

The technical scheme adopted for solving the technical problems is as follows:

a rectifying plate for an etching cleaning tank, comprising:

the wafer basket comprises a plate body, wherein inclined planes are arranged on two sides of the top of the plate body, and limiting blocks are arranged on the plate body and used for limiting and fixing the wafer basket;

the middle block is arranged on the plate body, and a long strip block is arranged in the middle of the middle block and is used for jacking up a wafer in a wafer basket placed on the plate body;

the plate body is evenly provided with first rectifying holes, second rectifying holes are formed in two sides of the middle block of the plate body, and the aperture of each second rectifying hole is 2-5 times that of each first rectifying hole.

Preferably, in the rectifying plate for an etching cleaning tank of the present utility model, the second rectifying holes located on each side of the intermediate block are arranged in two rows.

Preferably, the rectification plate groove for the etching cleaning groove is provided with two rows of second rectification holes in a staggered mode.

Preferably, the rectifying plate for etching cleaning tank of the present utility model, the second rectifying hole is an inclined hole, and the bottom opening is closer to the middle block than the top opening.

Preferably, the rectifying plate for etching cleaning tank of the present utility model is divided into a row close to the long bar and a row far away from the long bar, wherein the number of the row close to the long bar is greater than the number of the row far away from the long bar.

Preferably, the rectifying plate for etching cleaning tank of the present utility model, the bottom opening of the second rectifying hole is larger than the top opening.

Preferably, the radius of the first rectifying hole of the rectifying plate for the etching cleaning tank is 1.5mm to 2.5mm.

Preferably, the rectifying plate for etching cleaning tank of the present utility model, each second rectifying hole is disposed in the middle of 4 first rectifying holes.

The beneficial effects of the utility model are as follows:

according to the rectifying plate for the etching cleaning tank, the middle block is arranged in the middle of the rectifying plate, so that the middle of the wafer is not directly impacted by cleaning liquid, meanwhile, the first rectifying hole and the second rectifying hole are distributed on the rectifying plate, the aperture of the second rectifying hole is large, the dead zone problem formed by the cleaning liquid at the bottom of the middle block due to the arrangement of the middle block can be reduced, the cleaning liquid can smoothly pass through the second rectifying hole and reach the upper part of the rectifying plate along the two sides of the middle block, meanwhile, the inclined planes on the two sides of the top of the plate body play a certain guiding role on the cleaning liquid, the cleaning liquid is guided to the middle of the wafer, and the cleaning uniformity of a single wafer is improved through the arrangement.

Drawings

The technical scheme of the application is further described below with reference to the accompanying drawings and examples.

FIG. 1 is a perspective view of a fairing of an embodiment of the present application;

FIG. 2 is a top view of a fairing of an embodiment of the present application;

FIG. 3 is a cross-sectional view of a fairing of an embodiment of the application;

FIG. 4 is a schematic diagram of the structure of an etching rinse tank in accordance with an embodiment of the present application;

FIG. 5 is a cross-sectional view of the front end of an etch cleaning tank according to an embodiment of the present application;

FIG. 6 is a cross-sectional view of the middle of an etch cleaning tank according to an embodiment of the present application;

FIG. 7 is a cross-sectional view of a circulation inlet tube according to an embodiment of the present application;

the reference numerals in the figures are:

1. a tank body;

2. a limiting block;

3. a rectifying plate;

4. a circulating water inlet pipe;

10. an inner overflow plate;

11. a reflux groove;

31. a plate body;

32. a middle block;

33. a sliver block;

34. a first rectifying hole;

and 35 a second rectifying hole.

Detailed Description

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application can be understood by those of ordinary skill in the art in a specific context.

The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.

Examples

The present embodiment provides a rectifying plate for an etching cleaning tank, as shown in fig. 1 and 2, including:

the wafer basket comprises a plate body 31, wherein inclined planes are arranged on two sides of the top of the plate body 31, a limiting block 2 is arranged on the plate body 31, and the limiting block 2 is used for limiting and fixing the wafer basket;

the middle block 32 is arranged on the plate body 31, and a long bar block 33 is arranged in the middle of the middle block 32, and the long bar block 33 is used for jacking up a wafer in a wafer basket placed on the plate body 31;

the plate body 31 is evenly provided with first rectifying holes 34, second rectifying holes 35 are formed in the plate body 31 and located on two sides of the middle block 32, and the aperture of each second rectifying hole 35 is 2-5 times that of each first rectifying hole 34.

The rectifying plate for the etching cleaning tank of this embodiment, the intermediate block sets up in rectifying plate intermediate position for the wafer is no longer directly impacted by the washing liquid in the middle of, simultaneously, the last distribution of rectifying plate has first rectifying hole and second rectifying hole, and the aperture of second rectifying hole can reduce the dead zone problem that leads to intermediate block bottom washing liquid to form because of the intermediate block sets up greatly, makes the washing liquid can pass through the second rectifying hole smoothly and reach the rectifying plate top along the intermediate block both sides, has the inclined plane to play certain guide effect to the washing liquid simultaneously, in the middle of with the washing liquid direction wafer, has improved the washing degree of consistency of single wafer through above-mentioned setting.

Further, the second rectifying holes 35 are provided in two rows on each side of the intermediate block 32.

Further, the two rows of second rectifying holes 35 are arranged in a staggered manner.

Further, the second rectifying hole 35 is an inclined hole, and the bottom opening is closer to the intermediate block 32 than the top opening.

Further, the second rectifying hole 35 is divided into a row close to the long bar 33 and a row far from the long bar 33, wherein the number of the row close to the long bar 33 is greater than the number of the row far from the long bar 33.

Further, the bottom opening of the second rectifying hole 35 is larger than the top opening.

Further, the radius of the first rectifying hole 34 is 1.5mm to 2.5mm.

Further, each of the second rectification holes 35 is provided in the middle of 4 first rectification holes 34. The rectifying effect is improved by mixing the big rectifying holes and the small rectifying holes.

The embodiment also provides an etching cleaning tank, as shown in fig. 3, including:

the cleaning device comprises a tank body 1, wherein the tank body 1 is provided with an upper opening and an inner overflow plate 10, the inner overflow plate 10 encloses a main tank, one side of the tank body 1 is provided with a reflux tank 11, an overflow channel formed between the inner overflow plate 10 and the outer wall is communicated with the reflux tank 11, the top of the tank body 1 is provided with a liquid inlet, and cleaning liquid is introduced into the main tank through the liquid inlet;

the rectifying plate 3 is arranged at the bottom of the tank body 1;

the circulating water inlet pipe 4 is arranged at the bottom of the rectifying plate 3, and the reflux groove 11 is communicated with the circulating water inlet pipe 4 through a pump;

the rectifying plate 3 is as described above.

In the etching cleaning tank with the rectifying plate of this embodiment, when starting, cleaning liquid is introduced into the main tank through the liquid inlet, the cleaning liquid in the main tank overflows into the overflow channel through the inner overflow plate 10 and flows into the reflux tank 11 (the periphery of the main tank is all overflow tanks, but three overflow tanks are converged into the front reflux tank 11) to be converged, the cleaning liquid in the reflux tank 11 is pumped into the circulating water inlet pipe 4 by a pump so as to enter the bottom of the main tank, and the cleaning liquid circulates between the main tank, the overflow channel, the reflux tank 11 and the circulating water inlet pipe 4.

The etching cleaning tank with the rectifying plate is characterized in that the middle block 32 is arranged at the middle position of the rectifying plate 3, so that the middle of the wafer is not directly impacted by cleaning liquid, meanwhile, the first rectifying holes 34 and the second rectifying holes 35 are distributed on the rectifying plate 3, the aperture of the second rectifying holes 35 can greatly reduce the dead zone problem formed by cleaning liquid at the bottom of the middle block 32 due to the arrangement of the middle block 32, the cleaning liquid can smoothly pass through the second rectifying holes 35 and reach the upper part of the rectifying plate 3 along the two sides of the middle block 32, and meanwhile, the inclined planes on the two sides of the top of the plate body 31 play a certain guiding role on the cleaning liquid, the cleaning liquid is guided to the middle of the wafer, and the cleaning uniformity of a single wafer is improved through the arrangement.

Further, the limiting blocks 2 are L-shaped, 4 limiting blocks 2 form a region for accommodating a wafer basket (flower basket), and at least one second rectifying hole 35 is formed on the outer side of each limiting block 2. It should be noted that the box in fig. 2 is two setting areas for carrying wafer baskets surrounded by two sets of limiting blocks 2. The second rectifying hole 35 is arranged outside the region, so that two wafers at the outermost side can be cleaned, and the cleaning uniformity of the whole wafer basket is improved.

Further, the heights of the two ends of the strip block 33 in each area carrying the wafer basket are lower than the middle, that is, the structure that the two sides of the middle phase are gradually reduced is formed, so that the height of the middle wafer is higher, wafers with different heights are formed, and the cleaning effect among different wafers is more uniform during cleaning. (typically, wafer cleaning on both sides of the wafer basket is good and wafer cleaning in the middle of the wafer basket is poor).

Further, the circulating water inlet pipe 4 comprises an inner pipe 41 and an outer pipe 42 sleeved outside the inner pipe 41, and openings are formed in the inner pipe 41 and the outer pipe 42.

Further, the inner tube 41 has a row of openings, two rows of openings are uniformly formed on the outer tube 42, and the central axes of the three rows of openings form an included angle of 60 degrees. The circulation water inlet pipe 4 with a two-layer pipe structure can play a role of first rectification, and the rectification plate 3 is a role of second rectification.

With the above-described preferred embodiments according to the present application as a teaching, the related workers can make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.

Claims

1. A rectifying plate for an etching cleaning tank, comprising:

the wafer basket comprises a plate body (31), wherein inclined planes are arranged on two sides of the top of the plate body (31), a limiting block (2) is arranged on the plate body (31), and the limiting block (2) is used for limiting and fixing the wafer basket;

the middle block (32) is arranged on the plate body (31), a long strip block (33) is arranged in the middle of the middle block (32), and the long strip block (33) is used for jacking up a wafer in a wafer basket placed on the plate body (31);

the plate body (31) is evenly provided with first rectifying holes (34), second rectifying holes (35) are formed in the two sides of the middle block (32) on the plate body (31), and the aperture of each second rectifying hole (35) is 2-5 times that of each first rectifying hole (34).

2. Rectifying plate for etching baths according to claim 1, characterized in that said second rectifying holes (35) are provided in two rows on each side of the intermediate block (32).

3. Rectifying plate for etching baths according to claim 1, characterized in that two rows of said second rectifying holes (35) are offset.

4. The rectifying plate for an etching rinse tank according to claim 1, characterized in that said second rectifying hole (35) is an inclined hole, the bottom opening being closer to the intermediate block (32) than the top opening.

5. A rectifying plate for etching cleaning tank according to claim 3, characterized in that the second rectifying hole (35) is divided into a row close to said elongated block (33) and a row distant from said elongated block (33), wherein the number of the row close to said elongated block (33) is greater than the number of the row distant from said elongated block (33).

6. The rectifying plate for an etching cleaning tank according to claim 5, characterized in that a bottom opening of said second rectifying hole (35) is larger than a top opening.

7. The rectifying plate for an etching rinse tank according to claim 1, characterized in that the radius of said first rectifying hole (34) is 1.5mm to 2.5mm.

8. The rectifying plate for an etching cleaning tank according to claim 1, characterized in that each second rectifying hole (35) is provided in the middle of 4 first rectifying holes (34).