JP3960457B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
According to the present invention, a plurality of substrates to be processed are supported in parallel to each other by a substrate support section in an overflow processing tank having a predetermined shape, and in this state, a plurality of processing fluids are supplied into the overflow processing tank by a fluid supply section. The present invention relates to a substrate processing apparatus for processing a single substrate.
[0002]
[Prior art]
Conventionally, a processing liquid supply pipe is provided at the bottom of an overflow processing tank to supply a processing liquid, the processing liquid is rectified by a rectifying plate and guided upward, and the surface of a plurality of substrates standing in parallel is provided. As a substrate processing apparatus for processing, one having a configuration described in JP-A-6-208984 and one described in JP-A-7-161678 have been proposed.
[0003]
In the substrate processing apparatus described in Japanese Patent Laid-Open No. 6-208984, the bottom of the processing tank is bulged upward directly below the central axis of the plurality of substrates, and both ends with the bulging portion as the center. A configuration is adopted in which a pair of processing liquid supply pipes for discharging the processing liquid horizontally or obliquely upward is provided in the section.
[0004]
In the substrate processing apparatus described in Japanese Patent Laid-Open No. 7-161678, the bottom of the processing tank is recessed directly below the central axis of the plurality of substrates, and both end portions are centered on the recessed portion. In addition, a pair of processing liquid supply pipes that discharge the processing liquid horizontally or obliquely downward is provided, and a plate member that changes the flow direction upward by colliding the discharged processing liquid is provided corresponding to the recessed portion. The configuration is adopted.
[0005]
And even if it employ | adopts the substrate processing apparatus of any structure, the flow velocity in the part with the largest fluid resistance, ie, the part corresponding to the center part of a board | substrate, is maximized, and the whole surface of a board | substrate is processed substantially uniformly. Seems to be able to.
[0006]
[Problems to be solved by the invention]
However, when the substrate processing apparatus having the above-described configuration is adopted, a pair of processing liquid supply pipes is necessary, which causes a disadvantage that not only the configuration is complicated but also the size is increased.
[0007]
In addition, there is a disadvantage that the flow velocity in the portion corresponding to the central portion of the substrate may not be sufficiently increased. That is,
When the substrate processing apparatus described in JP-A-6-208984 is employed,
The process liquids discharged from the pair of process liquid supply pipes collide with each other to try to obtain a strong upward flow corresponding to the central portion of the substrate, but the upward flow obtained by the collision is strongly lateral. Since it also has components, the processing liquid flows laterally while rising, and in the state where the distance between the substrates is reduced, a sufficient flow of the processing liquid is formed at the center of the substrate row. As a result, it becomes almost impossible to uniformly treat the entire surface of the substrate.
[0008]
When the substrate processing apparatus described in JP-A-7-161678 is employed,
The processing liquid discharged from the pair of processing liquid supply pipes collides with the plate material, and attempts to obtain a strong upward flow corresponding to the central portion of the substrate, but the upward flow obtained by the collision is strong lateral Therefore, the processing liquid flows laterally while rising, and in the state where the distance between the substrates is reduced, a sufficient flow of the processing liquid is formed at the center of the substrate row. As a result, it becomes almost impossible to uniformly treat the entire surface of the substrate.
[0009]
Further, in the substrate processing apparatus having the above-described configuration, it is possible to supply only one type of processing liquid to the processing tank and perform substrate processing, and sequentially supply a plurality of types of processing liquids to the processing tank. It is also possible to process the substrate.
[0010]
In the case where the substrate is processed by sequentially supplying a plurality of types of processing liquids to the processing tank, for example, when the second processing liquid is supplied after the first type of processing liquid is supplied, the processing liquid is supplied. Since the first type of processing liquid must be completely discharged from the pipe and the corresponding piping, not only the time required for cleaning these processing liquid supply pipe and the corresponding piping is increased, but also the cleaning liquid is required. There is an inconvenience that the amount becomes extremely large.
[0011]
OBJECT OF THE INVENTION
The present invention has been made in view of the above-described problems, and can simplify the configuration, reduce the size, and sufficiently increase the flow velocity in the portion corresponding to the central portion of the substrate. The first object is to provide a processing apparatus, and when processing a substrate by sequentially supplying a plurality of types of processing liquids to a processing tank, the time required for cleaning can be shortened and the required amount of cleaning liquid can be reduced. It is a second object to provide a substrate processing apparatus that can be reduced.
[0012]
[Means for Solving the Problems]
A substrate processing apparatus according to a first aspect of the present invention supplies an overflow processing tank having a predetermined shape, a substrate support for supporting a plurality of processing target substrates in parallel in the overflow processing tank, and a processing fluid in the overflow processing tank. Including a fluid supply,
As the fluid supply part, in the vicinity of the bottom of the overflow processing tank, the processing fluid is disposed so as to face the center of the processing target substrate and extend in the alignment direction of the processing target substrates and to discharge the processing fluid downward. A long first tube body having a discharge port is adopted, and a protrusion protruding outward to surround a predetermined range including the processing fluid discharge port of the long first tube body as the bottom of the overflow treatment tank What has space is adopted, and the inside of the processing tank of the protruding space is set to be narrow.
[0013]
The substrate processing apparatus according to claim 2, further comprising a long second tubular body having a processing fluid discharge port for discharging the processing fluid downward at positions symmetrical to each other with respect to the long first tubular body. It is what you have.
[0014]
According to a third aspect of the present invention, there is provided an overflow processing tank having a predetermined shape, a substrate support for supporting a plurality of processing target substrates in parallel in the overflow processing tank, and supplying a processing fluid into the overflow processing tank. Including a fluid supply,
The fluid supply unit is disposed in the vicinity of the bottom of the overflow processing tank so as to face the center of the processing target substrate and extend in the direction in which the processing target substrates are arranged, and to discharge the processing fluid downward. A pair of flow rate adjusting plates that are long first tubes having discharge ports and guide the processing fluid discharged from the first tubes upward while guiding the fluid to the center. And a pair of flow rate adjusting plates are arranged symmetrically across the first tube body Is.
[0015]
The substrate processing apparatus according to claim 4 employs the pair of rectifying plates provided so as to extend obliquely upward from the bottom surface of the overflow processing tank at a target position relative to each other with respect to the first tubular body. is there.
[0016]
The substrate processing apparatus according to claim 5 has a processing fluid discharge port that discharges the processing fluid downward at a predetermined position that is symmetrical to each other with respect to the long first tubular body and outside the rectifying plate. A second tubular body having a scale is further provided.
[0017]
7. The substrate processing apparatus according to claim 6, wherein the pair of rectifying plates employs an outer surface shape that guides the processing fluid discharged from the second pipe body upward while guiding it to the central portion of the overflow processing tank. It is.
[0018]
According to a seventh aspect of the present invention, there is provided a substrate processing apparatus in which a processing fluid discharge pipe is provided at a predetermined position at the bottom of the overflow processing tank so as to correspond to each space defined by the pair of rectifying plates.
[0019]
The substrate processing apparatus according to claim 8, wherein a processing fluid discharge pipe is provided at a predetermined position on the bottom of the overflow processing tank so as to correspond only to a space surrounded by the pair of rectifying plates, and processing is performed at a predetermined position below each rectifying plate. A flow permissible opening that allows the flow of the working fluid is formed.
[0020]
[Action]
In the substrate processing apparatus according to claim 1, in a state where a plurality of substrates to be processed are supported in parallel with each other by a substrate support in an overflow processing tank having a predetermined shape, a processing fluid is provided in the overflow processing tank by the fluid supply unit. When processing multiple substrates by supplying
As the fluid supply section, in the vicinity of the bottom of the overflow processing tank, the liquid supply section is disposed so as to face the center of the processing target substrate and extend in the alignment direction of the processing target substrates, and to discharge the processing fluid downward. The long first tube body having the fluid discharge port is surrounded by a predetermined range including the processing fluid discharge port of the long first tube body with respect to the protruding space provided at the bottom of the overflow processing tank. Since the inside of the processing space of the protruding space is set to be narrow, the processing fluid discharged from the first tube is once held in the protruding space, and then overflowed through the narrow portion. Due to the discharge into the tank, the flow velocity at the portion corresponding to the central portion of the substrate can be sufficiently increased, and as a result, the entire surface of the substrate can be processed almost uniformly. In addition, since only one first tubular body is required, the configuration can be simplified and the size can be reduced.
[0021]
3. The substrate processing apparatus according to claim 2, wherein a long second tube having a processing fluid discharge port for discharging a processing fluid downward at positions symmetrical to each other with respect to the long first tube. Therefore, when processing a substrate by sequentially supplying a plurality of types of processing fluids to the overflow processing tank, different processing fluids may be supplied by the first tubular body and the second tubular body. In this way, the time required for cleaning can be shortened, and the required amount of cleaning fluid can be reduced.
[0022]
In the substrate processing apparatus according to claim 3, in a state where a plurality of substrates to be processed are supported in parallel to each other by the substrate support portion in the overflow processing tank having a predetermined shape, the processing fluid is supplied into the overflow processing tank by the fluid supply unit. When processing multiple substrates by supplying
As the fluid supply section, in the vicinity of the bottom of the overflow processing tank, the liquid supply section is disposed so as to face the center of the processing target substrate and extend in the alignment direction of the processing target substrates, and to discharge the processing fluid downward. A pair of rectifying plates for guiding the processing fluid ejected from the first tubular body upward while guiding the processing fluid ejected from the first tubular body to the long first tubular body having the fluid ejection port. And a pair of flow rate adjusting plates are arranged symmetrically across the first tube body Therefore, the flow velocity in the portion corresponding to the central portion of the substrate can be sufficiently increased, and as a result, the entire surface of the substrate can be processed almost uniformly. In addition, since only one first tubular body is required, the configuration can be simplified and the size can be reduced.
[0023]
If it is the substrate processing apparatus of Claim 4, what was provided so that it may extend diagonally upward from the bottom face of an overflow processing tank in the mutually target position on the basis of the 1st pipe as a pair of rectifying plates may be adopted. Therefore, the same effect as in the third aspect can be achieved without increasing the size of the overflow treatment tank.
[0024]
The substrate processing apparatus according to claim 5, wherein a processing fluid discharge port that discharges the processing fluid downward is provided at a predetermined position that is symmetrical to each other with respect to the long first tubular body and outside the rectifying plate. When the substrate is processed by sequentially supplying a plurality of types of processing fluids to the overflow processing tank, the first tube and the second tube are provided. Thus, different processing fluids can be supplied to each other, and in this way, the time required for cleaning can be shortened and the required amount of cleaning fluid can be reduced.
[0025]
The substrate processing apparatus according to claim 6, wherein the pair of rectifying plates have an outer surface shape that guides the processing fluid discharged from the second pipe body upward while guiding the fluid to the center of the overflow processing tank. Therefore, the flow velocity of the processing fluid discharged from the second tubular body at the portion corresponding to the central portion of the substrate can be sufficiently increased, and as a result, the entire surface of the substrate can be processed almost uniformly. In addition, the same effect as that of the fifth aspect can be achieved.
[0026]
In the substrate processing apparatus according to claim 7, since a processing fluid discharge pipe is provided at a predetermined position at the bottom of the overflow processing tank so as to correspond to each space defined by the pair of rectifying plates, an overflow occurs after processing. In addition to achieving the discharge of the residual fluid from the treatment tank, the same action as in any one of claims 3 to 6 can be achieved.
[0027]
In the substrate processing apparatus according to claim 8, a processing fluid discharge pipe is provided at a predetermined position at the bottom of the overflow processing tank so as to correspond only to the space surrounded by the pair of rectifying plates, and a predetermined position at the bottom of each rectifying plate. Since the flow permissible opening that allows the flow of the processing fluid is formed, the number of the processing fluid discharge pipes can be reduced to one, and the same effect as any one of claims 3 to 6 is achieved. Can be achieved.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a substrate processing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings.
[0029]
FIG. 1 is a longitudinal sectional view schematically showing one embodiment of a substrate processing apparatus of the present invention.
[0030]
The substrate processing apparatus includes an overflow processing tank 1, a round pipe-shaped first processing liquid supply pipe 2 provided at the bottom of the overflow processing tank 1, and a rectifying plate provided slightly above the first processing liquid supply pipe 2. 4, a plurality of processing target substrates 5 (for example, semiconductor wafers) supported in a state of being erected in parallel above the rectifying plate 4, and a drain pipe 6 for extracting the processing liquid from the overflow processing tank 1. And have.
[0031]
The overflow processing tank 1 has a shape in which a lower portion thereof is narrowed with a vertical plane including a central axis of the plurality of processing target substrates 5 as a reference, and an upper portion is formed narrowly in a central portion of the bottom wall. And the protrusion space 1a surrounding the discharge outlet of the 1st process liquid supply pipe 2 is formed. The protruding space 1a may have a trapezoidal cross section as shown in FIG. 1, but may have other shapes such as a substantially circular cross section (see FIG. 2). Any material that can be discharged upward while being concentrated in the center may be used. The width of the narrow portion is set so that the flow rate of the processing liquid toward the central axis of the plurality of processing target substrates 5 becomes a predetermined flow rate.
[0032]
The first processing liquid supply pipe 2 is provided at the center of the bottom of the processing tank 1 so as to be positioned in a vertical plane including the central axis of the plurality of processing target substrates 5, and discharges the processing liquid obliquely downward. The position of the discharge port is set as much as possible.
[0033]
The rectifying plate 4 is a plate material having a large number of through holes that allow the treatment liquid to pass therethrough.
[0034]
And the process liquid from a process liquid tank (not shown) is supplied to the 1st process liquid supply pipe 2 through piping (not shown) which interposed the pump, the filter, and the valve.
[0035]
The operation of the substrate processing apparatus having the above configuration is as follows.
[0036]
The processing liquid discharged from the first processing liquid supply pipe 2 is guided obliquely outward and downward in the protruding space 1a, and discharged upward from the narrow width portion. Then, the amount of the processing liquid in the overflow processing tank 1 gradually increases, and finally overflows from the overflow processing tank 1.
[0037]
In this state, the plurality of processing target substrates 5 accommodated in the overflow processing tank 1 are immersed in the processing liquid, and the processing liquid is continuously discharged upward from the narrow portion of the protruding space 1a. to continue.
[0038]
Therefore, as indicated by an upward arrow in FIG. 1, the flow velocity corresponding to the central portion of the substrate to be processed 5 is the largest and can be approximated to an ideal flow velocity distribution. A sufficient amount of processing liquid can be supplied to the central portion of the substrate 5 so that the surface of the processing target substrate 5 can be processed almost uniformly (for example, a cleaning process is performed).
[0039]
Further, since only one first treatment liquid supply pipe 2 needs to be provided, the configuration can be simplified and the size can be reduced.
[0040]
Furthermore, the substrate processing apparatus having the configuration shown in FIG. 1 is suitable for substrate processing in which only one type of processing liquid is supplied, but is applied to substrate processing in which two types of processing liquids are sequentially supplied. You can also. However, in the latter case, when the processing liquid is switched, the inside of the first processing liquid supply pipe 2 and the piping must be cleaned, so that the time required for cleaning becomes long and the required amount of cleaning liquid increases. Therefore, in this case, by adopting the substrate processing apparatus having the configuration shown in FIG. 3, it is possible to prevent the occurrence of inconvenience that the time required for cleaning becomes longer and the required amount of cleaning liquid increases.
[0041]
The substrate processing apparatus shown in FIG. 3 is different from the substrate processing apparatus shown in FIG. 1 in that the substrate processing apparatus is provided at a predetermined position near the end of the processing tank 1 so as to extend in parallel with the central axis of the plurality of processing target substrates 5. In addition, the second processing liquid supply pipe 3 in which the position of the discharge port is set to discharge the processing liquid obliquely downward is only provided. Of course, as shown in FIG. 4, a processing liquid tank (not shown) for supplying the corresponding processing liquid and a pipe 2a with a valve 2b interposed are provided corresponding to the first processing liquid supply pipe 2. In addition, a processing liquid tank (not shown) for supplying the corresponding processing liquid and a pipe 3 a with a valve 3 b interposed are provided corresponding to the second processing liquid supply pipe 3. A pipe 6 a with a valve 6 b interposed is provided corresponding to the drain pipe 6.
[0042]
When the substrate processing apparatus having this configuration is employed, the first processing liquid is supplied through the first processing liquid supply pipe 2, and then the second processing liquid is supplied through the second processing liquid supply pipe 3. The target substrate 5 can be processed. In addition, after starting the process of the process target board | substrate 5 with a 2nd process liquid, the valve | bulb 6b is opened a little and the 1st process liquid is discharged | emitted little by little through the drain pipe 6 and the piping 6a. The influence of the first processing liquid leaking from the supply pipe 2 can be eliminated.
[0043]
Therefore, when the processing liquid to be supplied to the overflow processing tank 1 is switched, it is only necessary to switch the supply system, so that the time required for cleaning can be shortened and the required amount of cleaning liquid can be reduced. Also in this case, simplification and downsizing of the configuration can be achieved as compared with the case where a plurality of processing liquid supply pipes are provided corresponding to each processing liquid. In this case, it is preferable to set the inner diameter of the first processing liquid supply pipe 2 to be equal to or smaller than the inner diameter of the second processing liquid supply pipe 3 in order to reduce the difference between the supply speeds of both processing liquids.
[0044]
Of course, in the substrate processing apparatus having the configuration shown in FIG. 3, the same processing liquid can be supplied through the first processing liquid supply pipe 2 and the second processing liquid supply pipe 3. In this case, it is not possible to shorten the time required for cleaning and reduce the required amount of cleaning liquid. However, as indicated by the upward arrow in FIG. Since it can be further approximated by an ideal flow velocity distribution, a sufficient amount of processing liquid is supplied to the central portion of the processing target substrate 5 even though the fluid resistance is large, so that the surface of the processing target substrate 5 is made almost uniform. Can be processed. In this case, it is preferable to set the inner diameter of the first processing liquid supply pipe 2 to be equal to or larger than the inner diameter of the second processing liquid supply pipe 3.
[0045]
FIG. 5 is a longitudinal sectional view schematically showing still another embodiment of the substrate processing apparatus of the present invention.
[0046]
The substrate processing apparatus is symmetric with respect to the overflow processing tank 1, the round pipe-shaped first processing liquid supply pipe 2 provided in the center of the bottom of the overflow processing tank 1, and the first processing liquid supply pipe 2. In this way, a round pipe-shaped second processing liquid supply pipe 3 provided at the bottom of the overflow processing tank 1, and a rectifying plate 4 provided slightly above the first processing liquid supply pipe 2 and the second processing liquid supply pipe 3. A plurality of processing target substrates 5 (for example, semiconductor wafers) supported in a state of being erected in parallel above the rectifying plate 4, and a drain pipe 6 for extracting processing liquid from the overflow processing tank 1 In addition to surrounding the discharge port of the first processing liquid supply pipe 2, the processing fluid discharged from the first processing liquid supply pipe 2 is guided upward while being guided to the center and discharged from the second processing liquid supply pipe 3. While guiding the processing fluid to the center And a pair of flow rate adjusting plate 7 for guiding a.
[0047]
FIG. 6 is a side view showing the configuration of each flow rate adjusting plate 7.
[0048]
The flow rate adjusting plate 7 may have, for example, a rectangular fluid flow allowance portion 7a at a predetermined interval at the lower portion {see FIG. 6 (a)}, but the long fluid flow allowance portion 7b is provided. It may be one {see (c) in FIG. 6}, and may further have a circular fluid flow allowing portion 7c at a predetermined interval {see (b) in FIG. 6}.
[0049]
When this embodiment is adopted, a processing liquid (for example, hydrofluoric acid) is supplied from the first processing liquid supply pipe 2, so that a pair of flow rate adjusting plates 7 indicate an upward arrow in FIG. 5. In addition, the flow velocity in the central portion can be maximized, and a sufficient amount of processing liquid is supplied to the central portion of the substrate to be processed 5 in spite of the large fluid resistance, so that the surface of the substrate to be processed 5 is almost the same. It can be processed uniformly.
[0050]
Then, after the processing of the substrate 5 is finished, the supply of the processing liquid from the first processing liquid supply pipe 2 is stopped and the processing liquid is discharged through the drain pipe 6. In this case, since the fluid flow allowing portion is provided below the flow rate adjusting plate 7, the processing liquid in the space outside the flow rate adjusting plate 7 moves to the space surrounded by the flow rate adjusting plate 7, and the drain It is reliably discharged through the tube 6.
[0051]
Thereafter, by supplying a different processing liquid (for example, pure water) from the second processing liquid supply pipe 3, a pair of flow rate adjusting plates 7 causes the flow rate at the center portion as shown by an upward arrow in FIG. The surface of the processing target substrate 5 can be processed almost uniformly by supplying a sufficient amount of processing liquid to the central portion of the processing target substrate 5 even though the fluid resistance is large. it can.
[0052]
Then, after the processing of the substrate 5 is completed, the supply of the processing liquid from the second processing liquid supply pipe 3 is stopped and the processing liquid is discharged through the drain pipe 6.
[0053]
FIG. 7 is a longitudinal sectional view showing still another embodiment of the substrate processing apparatus of the present invention.
[0054]
The substrate processing apparatus is different from the substrate processing apparatus of FIG. 5 in that a pair of flow rate adjusting plates 7 that do not have a fluid flow allowing portion is adopted and is partitioned by the pair of flow rate adjusting plates 7. The only difference is that the drain pipe 6 is provided corresponding to each of the three spaces.
[0055]
When the substrate processing apparatus having this configuration is adopted, the configuration becomes complicated and the cost is increased due to the large number of drain pipes 6, but the substrate processing is performed in the same manner as the substrate processing apparatus of FIG. It can be carried out.
[0056]
When the processing liquid is supplied using the substrate processing apparatus of FIG. 5 or FIG. 7 and the flow rate (l / min) of the processing liquid is increased to monitor the flow state of the processing liquid, in FIG. ), The flow of the processing liquid is in a steady state in the range of the flow rate up to 40 (l / min), so that uniform processing of the substrate surface can be achieved and the required time can be shortened. . On the other hand, when the flow of the processing liquid was similarly monitored in the substrate processing apparatus not provided with the flow rate adjusting plate, the flow rate was about 30 (l / min) as shown in FIGS. ), The flow of the treatment liquid is in a steady state in the range up to about 25 (l / min), and the flow of the treatment liquid is in an unsteady state in the range beyond these, so only by suppressing the flow rate. Uniform treatment of the substrate surface can be achieved, and the required time becomes long.
[0057]
8A and 8B show the case where the processing liquid is supplied from the first processing liquid supply pipe 2, and FIGS. 8C and 8D show the case where the processing liquid is supplied from the second processing liquid supply pipe 3. Each case is shown.
[0058]
Therefore, the upper limit of the flow rate that can ensure a steady state can be increased by providing the flow rate adjusting plate.
[0059]
The flow rate adjusting plate 7 has a constant thickness from the lower end to the upper end as shown in FIG. 9 (a), and the lower end to the upper end as shown in FIG. 9 (b). As shown in FIG. 9C, the thickness is gradually decreased from the lower end portion toward the upper end portion. The effect can be achieved.
[0060]
5, 7, and 9, the flow rate adjusting plate in which both the inner surface and the outer surface are formed to be flat is adopted, but the inner surface is formed in a convex shape as shown in FIG. 10 (a). 10 (b), the inner surface is formed in a concave shape, the outer surface is formed in a concave shape as shown in FIG. 11 (a), and the outer surface is formed as shown in FIG. 11 (b). Can be formed in a convex shape. Of course, these arbitrary shapes can be combined.
[0061]
Furthermore, at the boundary portion between the flow rate adjusting plate 7 and the bottom surface of the overflow treatment tank 1, welding can be performed with the bottom surface and the inner surface and outer surface of the flow rate adjusting plate smoothly attached with R as shown in FIG. Preferably, the flow of the treatment liquid can be made smooth.
[0062]
【The invention's effect】
According to the first aspect of the present invention, the flow velocity in the portion corresponding to the central portion of the substrate can be sufficiently increased, and therefore, the entire surface of the substrate can be processed substantially uniformly. Since only the book is required, the configuration can be simplified, and there is a specific effect that the size can be reduced.
[0063]
According to the second aspect of the present invention, when processing a substrate by sequentially supplying a plurality of types of processing fluids to the overflow processing tank, different processing fluids are supplied by the first tube and the second tube. In this way, it is possible to shorten the time required for cleaning, and to produce a specific effect that the required amount of cleaning fluid can be reduced.
[0064]
According to the invention of claim 3, the flow velocity in the portion corresponding to the central portion of the substrate can be sufficiently increased, and as a result, the entire surface of the substrate can be processed almost uniformly. Since only the book is required, the configuration can be simplified, and there is a specific effect that the size can be reduced.
[0065]
The invention of claim 4 has the same effect as that of claim 3 without increasing the size of the overflow treatment tank.
[0066]
According to the fifth aspect of the present invention, when a plurality of types of processing fluids are sequentially supplied to the overflow processing tank to perform substrate processing, different processing fluids are supplied by the first tube and the second tube. In this way, it is possible to shorten the time required for cleaning, and to produce a specific effect that the required amount of cleaning fluid can be reduced.
[0067]
According to the sixth aspect of the present invention, the flow velocity of the processing fluid discharged from the second tubular body at the portion corresponding to the central portion of the substrate can be sufficiently increased, and as a result, the entire surface of the substrate can be processed almost uniformly. In addition, the same effects as in the fifth aspect can be obtained.
[0068]
The invention of claim 7 can achieve the discharge of the residual fluid from the overflow treatment tank after the treatment, and has the same effect as any of claims 3 to 6.
[0069]
According to the eighth aspect of the present invention, the number of processing fluid discharge pipes can be reduced to one, and the same effect as any one of the third to sixth aspects is achieved.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view schematically showing one embodiment of a substrate processing apparatus of the present invention.
FIG. 2 is a longitudinal sectional view showing another configuration example of the protruding space.
FIG. 3 is a longitudinal sectional view schematically showing another embodiment of the substrate processing apparatus of the present invention.
4 is a piping system diagram showing piping for the substrate processing apparatus of FIG. 3;
FIG. 5 is a longitudinal sectional view schematically showing still another embodiment of the substrate processing apparatus of the present invention.
FIG. 6 is a side view of a flow rate adjusting plate.
FIG. 7 is a longitudinal sectional view schematically showing still another embodiment of the substrate processing apparatus of the present invention.
FIG. 8 is a diagram showing a result of monitoring the state of the flow of the treatment liquid by increasing the flow rate (l / min) of the treatment liquid.
FIG. 9 is a front view showing an example of the configuration of a flow rate adjusting plate.
FIG. 10 is a diagram illustrating an example of an inner surface of a flow rate adjusting plate.
FIG. 11 is a diagram illustrating an example of an outer surface of a flow rate adjusting plate.
FIG. 12 is a longitudinal sectional view showing an example of a joining structure between the flow rate adjusting plate and the bottom surface of the overflow treatment tank.
[Explanation of symbols]
1 Overflow tank 1a Protruding space
2 First treatment liquid supply pipe 3 Second treatment liquid supply pipe
5 Substrate to be treated 6 Drain pipe
7 Flow rate adjustment plate

Claims (8)

An overflow treatment tank (1) having a predetermined shape, a substrate support part for supporting a plurality of treatment target substrates (5) in parallel in the overflow treatment tank, and a fluid supply part for supplying a treatment fluid into the overflow treatment tank (2) a substrate processing apparatus comprising:
The fluid supply unit (2) is disposed in the vicinity of the bottom of the overflow processing tank (1) so as to face the center of the processing target substrate (5) and extend in the alignment direction of the processing target substrates (5). The long first tube (2) having a processing fluid discharge port for discharging the processing fluid downward, and the bottom of the overflow processing tank (1) is the long first tube (2). And a projecting space (1a) projecting outward to surround a predetermined range including the processing fluid discharge port, and the projecting space (1a) is set to have a narrow width inside the processing tank. A substrate processing apparatus. A long second tubular body (3) having a processing fluid discharge port for discharging a processing fluid downward at a position symmetrical to each other with respect to the long first tubular body (2). The substrate processing apparatus according to claim 1. An overflow treatment tank (1) having a predetermined shape, a substrate support part for supporting a plurality of treatment target substrates (5) in parallel in the overflow treatment tank, and a fluid supply part for supplying a treatment fluid into the overflow treatment tank (2) a substrate processing apparatus comprising:
The fluid supply unit (2) is disposed in the vicinity of the bottom of the overflow processing tank (1) so as to face the center of the processing target substrate (5) and extend in the alignment direction of the processing target substrates (5). , A long first tube (2) having a processing fluid discharge port for discharging the processing fluid downward, while guiding the processing fluid discharged from the first tube (2) to the central portion A substrate processing apparatus comprising a pair of flow rate adjusting plates (7) guided upward, wherein the pair of flow rate adjusting plates (7) are arranged symmetrically with the first tube (2) interposed therebetween. . The pair of flow rate adjusting plates (7) are provided so as to extend obliquely upward from the bottom surface of the overflow processing tank (1) at positions that are mutually targeted with respect to the first pipe body (2). The substrate processing apparatus as described. A long-length processing fluid discharge port that discharges the processing fluid downward at a predetermined position that is symmetrical with respect to the long first tubular body (2) and outside the flow rate adjusting plate (7). The substrate processing apparatus according to claim 3 or 4, further comprising a second tubular body (3). The pair of flow rate adjusting plates (7) has an outer surface shape that guides the processing fluid discharged from the second tubular body (3) upward while guiding it to the center of the overflow processing tank (1). Item 6. The substrate processing apparatus according to Item 5. The processing fluid discharge pipe (6) is provided at a predetermined position at the bottom of the overflow processing tank (1) so as to correspond to each space defined by the pair of flow rate adjusting plates (7). The substrate processing apparatus according to any one of the above. A processing fluid discharge pipe (6) is provided at a predetermined position on the bottom of the overflow processing tank (1) so as to correspond only to the space surrounded by the pair of flow rate adjusting plates (7). The substrate processing apparatus according to any one of claims 3 to 6, wherein flow allowable openings (7a), (7b), and (7c) that allow the flow of the processing fluid to flow are formed in a lower predetermined position.

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