CN117038514B - Etching cleaning tank with rectifying plate - Google Patents
Etching cleaning tank with rectifying plate Download PDFInfo
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- CN117038514B CN117038514B CN202311014444.6A CN202311014444A CN117038514B CN 117038514 B CN117038514 B CN 117038514B CN 202311014444 A CN202311014444 A CN 202311014444A CN 117038514 B CN117038514 B CN 117038514B
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- rectifying
- plate
- tank
- block
- hole
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- 238000004140 cleaning Methods 0.000 title claims abstract description 62
- 238000005530 etching Methods 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims description 40
- 238000010992 reflux Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The application relates to an etching cleaning tank with a rectifying plate, wherein a middle block is arranged in the middle of the rectifying plate, so that the middle of a wafer is not directly impacted by cleaning liquid, meanwhile, a first rectifying hole and a second rectifying hole are distributed on the rectifying plate, the aperture of the second rectifying hole is large, the problem of dead zone formed by the cleaning liquid at the bottom of the middle block due to the arrangement of the middle block can be reduced, the cleaning liquid can smoothly pass through the second rectifying hole and reach the upper part of the rectifying plate along the two sides of the middle block, and meanwhile, inclined planes are arranged on the two sides of the top of a plate body to have a certain guiding effect on the cleaning liquid, the cleaning liquid is guided to the middle of the wafer, and the cleaning uniformity of a single wafer is improved through the arrangement.
Description
Technical Field
The application belongs to the technical field of wafer manufacturing equipment, and particularly relates to an etching cleaning tank with a rectifying plate.
Background
In the wafer production process, a large number of cleaning operations are required, and a large number of wafers are usually placed in a cleaning tank together with a wafer basket (flower basket), so that the cleaning uniformity is the cleaning effect which needs to be considered. The cleaning uniformity has two dimensions, one is the cleanliness of the individual wafers across the surface, and the other is the uniformity between rows of different wafers.
After the existing etching cleaning tank cleans the wafer, the uniformity is not high, namely the distribution of residual particles on the wafer is not uniform.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to solve the defects in the prior art, the etching cleaning tank with the rectifying plate is provided for improving the cleaning uniformity.
The technical scheme adopted for solving the technical problems is as follows:
An etching rinse tank with a rectifying plate, comprising:
The tank body is provided with an upper opening and an inner overflow plate, the inner overflow plate encloses a main tank, one side of the tank body is provided with a reflux tank, an overflow channel formed between the inner overflow plate and the outer wall is communicated with the reflux tank, and the top of the tank body is provided with a liquid inlet through which cleaning liquid is introduced into the main tank;
The rectifying plate is arranged at the bottom of the tank body;
the circulating water inlet pipe is arranged at the bottom of the rectifying plate, and the reflux groove is communicated with the circulating water inlet pipe through a pump;
The rectifying plate includes:
the wafer basket comprises a plate body, wherein a limiting block is arranged on the plate body and used for limiting and fixing the wafer basket;
The middle block is arranged on the plate body, inclined planes are arranged on two sides of the top, a long strip block is arranged in the middle of the middle block, and the long strip block is used for jacking up a wafer in a wafer basket placed on the plate body;
The plate body is evenly provided with first rectifying holes, second rectifying holes are formed in two sides of the middle block of the plate body, and the aperture of each second rectifying hole is 2-5 times that of each first rectifying hole.
Preferably, in the etching cleaning tank with the rectifying plate, the second rectifying holes are arranged on each side of the middle block in two rows.
Preferably, in the etching cleaning tank with the rectifying plate, two rows of the second rectifying holes are arranged in a staggered mode.
Preferably, in the etching cleaning tank with the rectifying plate, the second rectifying hole is an inclined hole, and the bottom opening is closer to the middle block than the top opening.
Preferably, in the etching cleaning tank with the rectifying plate, the second rectifying hole is divided into a row close to the long strip block and a row far away from the long strip block, wherein the number of the row close to the long strip block is greater than the number of the row far away from the long strip block.
Preferably, the etching cleaning tank with the rectifying plate is characterized in that the bottom opening of the second rectifying hole is larger than the top opening.
Preferably, the etching cleaning tank with the rectifying plate has the radius of the first rectifying hole of 1.5mm to 2.5mm.
Preferably, the etching cleaning tank with the rectifying plate is L-shaped, 4 limiting blocks form a region for accommodating the wafer basket, and at least one second rectifying hole is formed on the outer side of each limiting block.
Preferably, the etching cleaning tank with the rectifying plate of the invention, each second rectifying hole is arranged in the middle of 4 first rectifying holes.
Preferably, the etching cleaning tank with the rectifying plate comprises an inner pipe and an outer pipe sleeved outside the inner pipe, and openings are formed in the inner pipe and the outer pipe.
The beneficial effects of the invention are as follows:
According to the etching cleaning tank with the rectifying plate, the middle block is arranged in the middle of the rectifying plate, so that the middle of the wafer is not directly impacted by cleaning liquid, meanwhile, the first rectifying hole and the second rectifying hole are distributed on the rectifying plate, the aperture of the second rectifying hole is large, the dead zone problem formed by the cleaning liquid at the bottom of the middle block due to the arrangement of the middle block can be reduced, the cleaning liquid can smoothly pass through the second rectifying hole and reach the upper part of the rectifying plate along the two sides of the middle block, meanwhile, the inclined planes on the two sides of the top of the plate body play a certain guiding role on the cleaning liquid, the cleaning liquid is guided to the middle of the wafer, and the cleaning uniformity of a single wafer is improved through the arrangement.
Drawings
The technical scheme of the application is further described below with reference to the accompanying drawings and examples.
FIG. 1 is a perspective view of a rectifying plate according to an embodiment of the present application;
FIG. 2 is a top view of a fairing of an embodiment of the application;
FIG. 3 is a cross-sectional view of a fairing of an embodiment of the application;
FIG. 4 is a schematic diagram of the structure of an etching rinse tank in accordance with an embodiment of the present application;
FIG. 5 is a cross-sectional view of the front end of an etch cleaning tank according to an embodiment of the present application;
FIG. 6 is a cross-sectional view of the middle of an etch cleaning tank according to an embodiment of the present application;
FIG. 7 is a cross-sectional view of a circulation inlet tube according to an embodiment of the application;
The reference numerals in the figures are:
1. A tank body;
2. a limiting block;
3. a rectifying plate;
4. a circulating water inlet pipe;
10. an inner overflow plate;
11. A reflux groove;
31. A plate body;
32. a middle block;
33. a sliver block;
34. A first rectifying hole;
35. and a second rectifying hole.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the scope of the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art in a specific case.
The technical scheme of the present application will be described in detail below with reference to the accompanying drawings in combination with embodiments.
Examples
The embodiment provides an etching cleaning tank with a rectifying plate, as shown in fig. 3, including:
the cleaning device comprises a tank body 1, wherein the tank body 1 is provided with an upper opening and an inner overflow plate 10, the inner overflow plate 10 encloses a main tank, one side of the tank body 1 is provided with a reflux tank 11, an overflow channel formed between the inner overflow plate 10 and the outer wall is communicated with the reflux tank 11, the top of the tank body 1 is provided with a liquid inlet, and cleaning liquid is introduced into the main tank through the liquid inlet;
the rectifying plate 3 is arranged at the bottom of the tank body 1;
The circulating water inlet pipe 4 is arranged at the bottom of the rectifying plate 3, and the reflux groove 11 is communicated with the circulating water inlet pipe 4 through a pump;
The rectifying plate 3 includes:
the wafer basket comprises a plate body 31, wherein a limiting block 2 is arranged on the plate body 31, and the limiting block 2 is used for limiting and fixing the wafer basket;
The middle block 32 is arranged on the plate body 31, inclined planes are arranged on two sides of the top, a long strip block 33 is arranged in the middle of the middle block 32, and the long strip block 33 is used for jacking up a wafer in a wafer basket (flower basket) placed on the plate body 31; the intermediate block 32 is made of PTFE material;
The plate body 31 is evenly provided with first rectifying holes 34, second rectifying holes 35 are formed in the plate body 31 and located on two sides of the middle block 32, and the aperture of each second rectifying hole 35 is 2-5 times that of each first rectifying hole 34.
In the etching cleaning tank with the rectifying plate of this embodiment, when starting, cleaning liquid is introduced into the main tank through the liquid inlet, the cleaning liquid in the main tank overflows into the overflow channel through the inner overflow plate 10 and flows into the reflux tank 11 (the periphery of the main tank is all overflow tanks, but three overflow tanks are converged into the front reflux tank 11) to be converged, the cleaning liquid in the reflux tank 11 is pumped into the circulating water inlet pipe 4 by a pump so as to enter the bottom of the main tank, and the cleaning liquid circulates between the main tank, the overflow channel, the reflux tank 11 and the circulating water inlet pipe 4.
The etching cleaning tank with the rectifying plate is characterized in that the middle block 32 is arranged at the middle position of the rectifying plate 3, so that the middle of the wafer is not directly impacted by cleaning liquid, meanwhile, the first rectifying holes 34 and the second rectifying holes 35 are distributed on the rectifying plate 3, the aperture of the second rectifying holes 35 can greatly reduce the dead zone problem formed by cleaning liquid at the bottom of the middle block 32 due to the arrangement of the middle block 32, the cleaning liquid can smoothly pass through the second rectifying holes 35 and reach the upper part of the rectifying plate 3 along the two sides of the middle block 32, and meanwhile, the inclined planes on the two sides of the top of the plate body 31 play a certain guiding role on the cleaning liquid, the cleaning liquid is guided to the middle of the wafer, and the cleaning uniformity of a single wafer is improved through the arrangement.
Further, the second rectifying holes 35 of the limiting block located at each side of the middle block 32 are arranged in two rows, and the second rectifying holes 35 are arranged in a staggered manner. The offset second rectifying holes 35 can improve the uniformity of the flow of the cleaning liquid.
Further, the second rectifying hole 35 is divided into a row close to the long bar 33 and a row far from the long bar 33, wherein the number of the row close to the long bar 33 is greater than the number of the row far from the long bar 33.
Further, the second rectifying hole 35 is an inclined hole, and the bottom opening is closer to the middle block 32 than the top opening, as shown in fig. 3. Thereby serving to guide the cleaning fluid at the bottom of the intermediate block 32.
Further, the bottom opening of the second rectifying hole 35 is larger than the top opening, and the bottom opening is large, and the top opening is small, so that the top flow rate of the second rectifying hole 35 can be slightly larger.
Further, the radius of the first rectifying hole 34 is 1.5mm to 2.5mm.
Further, the limiting blocks 2 are L-shaped, 4 limiting blocks 2 form a region for accommodating a wafer basket (flower basket), and at least one second rectifying hole 35 is formed on the outer side of each limiting block 2. It should be noted that the box in fig. 2 is two setting areas for carrying wafer baskets surrounded by two sets of limiting blocks 2. The second rectifying hole 35 is arranged outside the region, so that two wafers at the outermost side can be cleaned, and the cleaning uniformity of the whole wafer basket is improved.
Further, each second rectifying hole 35 is disposed in the middle of 4 first rectifying holes 34, and the size rectifying holes are mixed to improve the rectifying effect.
Further, the heights of the two ends of the strip block 33 in each area carrying the wafer basket are lower than the middle, that is, the structure that the two sides of the middle phase are gradually reduced is formed, so that the height of the middle wafer is higher, wafers with different heights are formed, and the cleaning effect among different wafers is more uniform during cleaning. (typically, wafer cleaning on both sides of the wafer basket is good and wafer cleaning in the middle of the wafer basket is poor).
Further, the circulating water inlet pipe 4 comprises an inner pipe 41 and an outer pipe 42 sleeved outside the inner pipe 41, and openings are formed in the inner pipe 41 and the outer pipe 42.
Further, the inner tube 41 has a row of openings, two rows of openings are uniformly formed on the outer tube 42, and the central axes of the three rows of openings form an included angle of 60 degrees. The circulation water inlet pipe 4 with a two-layer pipe structure can play a role of first rectification, and the rectification plate 3 is a role of second rectification.
With the above-described preferred embodiments according to the present application as a teaching, the worker skilled in the art could make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of claims.
Claims (5)
1. An etching rinse tank with a rectifying plate, comprising:
The cleaning device comprises a tank body (1), wherein the tank body (1) is provided with an upper opening and an inner overflow plate (10), a main tank is surrounded by the inner overflow plate (10), one side of the tank body (1) is provided with a reflux tank (11), an overflow channel formed between the inner overflow plate (10) and the outer wall is communicated with the reflux tank (11), and a liquid inlet is formed in the top of the tank body (1) and is used for leading cleaning liquid into the main tank through the liquid inlet;
the rectifying plate (3) is arranged at the bottom of the groove body (1);
The circulating water inlet pipe (4) is arranged at the bottom of the rectifying plate (3), and the reflux groove (11) is communicated with the circulating water inlet pipe (4) through a pump;
the rectifying plate (3) includes:
the wafer basket comprises a plate body (31), wherein a limiting block (2) is arranged on the plate body (31), and the limiting block (2) is used for limiting and fixing the wafer basket;
The middle block (32) is arranged on the plate body (31), inclined planes are arranged on two sides of the top, a long strip block (33) is arranged in the middle of the middle block (32), and the long strip block (33) is used for jacking up wafers in the wafer basket placed on the plate body (31);
The plate body (31) is evenly provided with first rectifying holes (34), second rectifying holes (35) are formed in the plate body (31) and located on two sides of the middle block (32), and the aperture of each second rectifying hole (35) is 2-5 times that of each first rectifying hole (34);
the second rectifying holes (35) positioned on each side of the middle block (32) are arranged in two rows;
the two rows of second rectifying holes (35) are arranged in a staggered mode;
the second rectifying hole (35) is an inclined hole, and the bottom opening is closer to the middle block (32) than the top opening;
The second rectifying hole (35) is divided into a row close to the long strip block (33) and a row far away from the long strip block (33), wherein the number of the row close to the long strip block (33) is more than the number of the row far away from the long strip block (33);
the bottom opening of the second rectifying hole (35) is larger than the top opening.
2. Etching rinse tank with rectifying plate according to claim 1, characterized in that the radius of the first rectifying hole (34) is 1.5mm to 2.5mm.
3. Etching rinse tank with rectifying plate according to claim 1, characterized in that the limiting block (2) is L-shaped, 4 limiting blocks (2) form a zone accommodating a carrying wafer basket, and at least one second rectifying hole (35) is provided outside the limiting block (2).
4. Etching rinse tank with rectifying plate according to claim 1, characterized in that each second rectifying hole (35) is arranged in the middle of 4 first rectifying holes (34).
5. The etching cleaning tank with the rectifying plate according to claim 1, characterized in that the circulating water inlet pipe (4) comprises an inner pipe (41) and an outer pipe (42) sleeved outside the inner pipe (41), and openings are formed in the inner pipe (41) and the outer pipe (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311014444.6A CN117038514B (en) | 2023-08-11 | 2023-08-11 | Etching cleaning tank with rectifying plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311014444.6A CN117038514B (en) | 2023-08-11 | 2023-08-11 | Etching cleaning tank with rectifying plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117038514A CN117038514A (en) | 2023-11-10 |
| CN117038514B true CN117038514B (en) | 2024-04-30 |
Family
ID=88633181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311014444.6A Active CN117038514B (en) | 2023-08-11 | 2023-08-11 | Etching cleaning tank with rectifying plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117038514B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196466A (en) * | 1992-10-27 | 1994-07-15 | Sony Corp | Wafer cleaning device |
| JPH06295896A (en) * | 1993-04-07 | 1994-10-21 | Tokyo Electron Ltd | Cleaning equipment |
| JP2001291693A (en) * | 2000-04-11 | 2001-10-19 | Ferrotec Gsq Corp | Cleaning pipe structure for cleaning device in semiconductor manufacturing apparatus |
| CN110541161A (en) * | 2018-05-28 | 2019-12-06 | 三菱电机株式会社 | semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
| CN111112215A (en) * | 2019-12-31 | 2020-05-08 | 中威新能源(成都)有限公司 | Method for cleaning silicon wafer by using alkaline solution containing ozone |
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
| CN218274527U (en) * | 2022-08-02 | 2023-01-10 | 乂易半导体科技(无锡)有限公司 | Wet etching cleaning device capable of improving uniformity after etching |
| CN219476634U (en) * | 2023-04-07 | 2023-08-04 | 江苏启微半导体设备有限公司 | Wafer cleaning device |
-
2023
- 2023-08-11 CN CN202311014444.6A patent/CN117038514B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196466A (en) * | 1992-10-27 | 1994-07-15 | Sony Corp | Wafer cleaning device |
| JPH06295896A (en) * | 1993-04-07 | 1994-10-21 | Tokyo Electron Ltd | Cleaning equipment |
| JP2001291693A (en) * | 2000-04-11 | 2001-10-19 | Ferrotec Gsq Corp | Cleaning pipe structure for cleaning device in semiconductor manufacturing apparatus |
| CN110541161A (en) * | 2018-05-28 | 2019-12-06 | 三菱电机株式会社 | semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
| CN111112215A (en) * | 2019-12-31 | 2020-05-08 | 中威新能源(成都)有限公司 | Method for cleaning silicon wafer by using alkaline solution containing ozone |
| CN111889443A (en) * | 2020-06-28 | 2020-11-06 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
| CN218274527U (en) * | 2022-08-02 | 2023-01-10 | 乂易半导体科技(无锡)有限公司 | Wet etching cleaning device capable of improving uniformity after etching |
| CN219476634U (en) * | 2023-04-07 | 2023-08-04 | 江苏启微半导体设备有限公司 | Wafer cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117038514A (en) | 2023-11-10 |
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