CN115261944B - Scanning type pre-wetting system and pre-wetting method for wafer - Google Patents
Scanning type pre-wetting system and pre-wetting method for wafer Download PDFInfo
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- CN115261944B CN115261944B CN202211177800.1A CN202211177800A CN115261944B CN 115261944 B CN115261944 B CN 115261944B CN 202211177800 A CN202211177800 A CN 202211177800A CN 115261944 B CN115261944 B CN 115261944B
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- 238000009736 wetting Methods 0.000 title claims abstract description 211
- 239000007788 liquid Substances 0.000 claims abstract description 86
- 238000005507 spraying Methods 0.000 claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims description 130
- 239000007921 spray Substances 0.000 claims description 71
- 238000009434 installation Methods 0.000 claims description 12
- 238000010992 reflux Methods 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000009960 carding Methods 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009713 electroplating Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003116 impacting effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
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Abstract
The invention discloses a scanning type pre-wetting system and a pre-wetting method for a wafer, wherein the pre-wetting system comprises a wetting groove, a wafer carrier and a wetting unit, wherein the wetting groove is formed with a wetting cavity, and the wetting cavity is formed with a plug-in port and a liquid discharge port; the wetting unit comprises a spraying seat, a plurality of spraying heads, a driving part and a liquid supply part, wherein each spraying head is provided with a first channel and a second channel, wetting liquid sprayed out of the first channel forms a fan-shaped wetting area after being intercepted and dredged by the second channel, every two adjacent fan-shaped wetting areas are partially overlapped, and the plurality of fan-shaped wetting areas form a scanning reference area. According to the invention, the scanning reference area which is formed by partially overlapping the fan-shaped wetting areas and extends in the radial direction of the vertically arranged wafer is used for realizing scanning type spraying pre-wetting by taking the wafer as the reference in the linear reciprocating motion, so that the pre-wetting effect of the wafer is effectively improved; meanwhile, the resistance barrier of the wetting gap on the surface of the wafer can be effectively broken through, and the surface of the wafer is fully wetted.
Description
Technical Field
The invention belongs to the technical field of wafer pre-wetting, and particularly relates to a scanning type pre-wetting system of a wafer, and a pre-wetting method of the wafer.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. The silicon crystal bar is ground, polished and sliced to form a silicon wafer. Further, a conductive metal layer is plated on the wafer, and the conductive metal layer is processed to form a conductive circuit.
At present, due to the processing requirements of the wafer surface, some features such as through holes and holes, for example TSV trenches, exist on the wafer surface, and these features are prone to form wet gaps (dry spots), that is, during the electroplating process, due to the surface tension of the electroplating solution, gas bubbles are easily formed at the solid-liquid interface between the electroplating solution and the wafer surface, and the electroplating solution cannot fully fill these wet gaps, thereby causing the coated metal of the wafer to pinch off, and further leaving gaps at the bottom of the features of the wafer to cause defects, such as the circuit lines to be blocked. Therefore, before electroplating a wafer, a pre-treatment for wetting the surface of the wafer is usually required to improve the electroplating quality of the wafer.
The existing wafer pre-wetting method generally comprises the steps of horizontally placing a wafer and keeping the wafer rotating, and arranging a spray head above the wafer to spray a wetting liquid on the wafer, however, in the actual pre-wetting process, due to the influence of centrifugal force, the wetting liquid sprayed to the surface of the wafer is easy to get rid of and fall off, the retention time of the wetting liquid on the surface of the wafer cannot be ensured, and due to the influence of air pressure in a wetting gap, the wetting liquid is difficult to effectively break through a resistance barrier and immerse into the wetting gap, so that the wetting is insufficient, the pre-wetting effect of the wafer is poor, and the subsequent electroplating is influenced.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects of the prior art and provide a brand-new scanning type pre-wetting system for wafers.
Meanwhile, the invention also relates to a wafer pre-wetting method.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a scanning type pre-wetting system for wafers comprises a wetting groove, a wafer carrier and a wetting unit, wherein the wetting groove is formed with a wetting cavity, and the wetting cavity is formed with an insertion opening and a liquid discharge opening; the wetting unit comprises a spraying seat, a plurality of spraying heads which are linearly distributed on the spraying seat, a driving part and a liquid supply part, wherein the driving part is used for driving the spraying seat to do linear reciprocating motion along the direction which is intersected with the arrangement direction of the plurality of spraying heads, each spraying head is provided with a first channel and a second channel, a fan-shaped wetting area which takes a water outlet of the first channel as the center of a circle is formed after wetting liquid sprayed out of the first channel is intercepted and dredged by the second channel, every two adjacent fan-shaped wetting areas are partially overlapped, the plurality of fan-shaped wetting areas form a scanning reference area, when in pre-wetting, the wafer carrier is inserted into the wetting cavity from the insertion opening, the central line of the wafer is horizontally arranged, the scanning reference area extends along the radial direction of the wafer, and the pre-wetting area formed in the reciprocating motion covers the surface to be wetted of the wafer.
Preferably, the wetting fluid flow direction in the first channel intersects the wetting fluid flow direction in the second channel.
Preferably, the shower head includes the installation department of dismouting on spraying the seat, sprays the body, wherein sprays the upper end of body and emits the installation department, and first passageway is located and sprays the body and just extend from top to bottom, and the second passageway is located and sprays the upper end that the body emits the installation department. The arrangement is convenient for installation and implementation.
Specifically, the first passageway comprises a pressurizing section having an inner diameter that becomes gradually smaller along the direction of the flow of the wetting fluid in the first passageway, and an output section communicating the pressurizing section with the second passageway. The arrangement is realized, and the ejection pressure of the wetting liquid is effectively improved through the arrangement of the pressurizing section, so that the wetting liquid can break through the resistance barrier at the gap on the surface of the wafer more easily.
Preferably, the second channel is recessed inwardly from a side of the spray body and intersects the output section to form a combing zone.
Specifically, the carding zone comprises a first surface, a second surface and a third surface, wherein the first surface is horizontally arranged, the second surface extends upwards from the inner side of the first surface, the third surface extends upwards from the upper end of the second surface in an inclined mode, and an included angle formed by the first surface and the third surface ranges from 10 degrees to 35 degrees. By the arrangement, when the wetting liquid is sprayed, the influence of the self gravity on the wetting liquid drop can be reduced, the wetting liquid drop is uniformly sprayed to the surface to be wetted of the wafer, and the spray area of the wetting liquid is maximized.
Further, the output section is cylindrical and located outside the second face, or/and the output section is tangential to the second face.
Preferably, the plurality of spray heads are divided into a plurality of spray groups, wherein the plurality of spray groups are distributed at intervals along the movement direction of the spray seat, and the scanning reference areas formed by the spray groups are intersected or parallel. By the arrangement, the working stroke of the spraying seat can be shortened on the premise that the surface to be wetted of the whole wafer is pre-wetted, so that the pre-wetting efficiency is effectively improved.
Specifically, the number of the spraying groups is two, and the two spraying groups are respectively arranged at the top and the bottom of the spraying seat, wherein the distance between the two spraying groups is greater than or equal to 0.5 time of the diameter of the wafer. By the arrangement, the distance of unidirectional movement of the spraying seat does not exceed the radius of the wafer every time, and the covering of the surface to be wetted of the whole wafer can be realized.
Furthermore, a plurality of spray headers in the two spray groups are arranged in an up-down one-to-one alignment manner.
Preferably, the wetting tank comprises a first tank panel and a second tank panel which are positioned on two sides, a bottom die which is positioned at the bottom and end dies which are positioned at two ends of the bottom die, wherein the first tank panel and the second tank panel, the bottom die and the end dies form a wetting cavity, the liquid outlet is formed on the bottom die and is communicated with the outside, the end dies are correspondingly provided with guide wheel assemblies, and the wafer carrier is attached to the wheel surfaces of the guide wheel assemblies from two opposite sides and is inserted into the wetting tank in a vertically moving mode. The wafer carrier is guaranteed to be stable in taking and placing, and damage to equipment caused by shaking and impacting the wetting groove is avoided.
Preferably, the pre-wetting system further comprises a wetting liquid circulating unit, wherein the wetting liquid circulating unit comprises a reflux tank communicated with the liquid outlet, and a reflux pipeline used for communicating the reflux tank with the liquid supply component, the reflux tank is internally provided with a deflector, and the refluxed wetting liquid flows to the reflux pipeline along the deflector. The arrangement is convenient for recovering and reusing the wetting liquid, and the cost is saved.
Preferably, the spray seat and the plurality of spray heads form a wetting group, and the wetting groups are two and are symmetrically arranged about the wetting cavity; the wafer carrier is provided with a first loading area and a second loading area; the liquid supply part comprises a first liquid supply pipeline and a second liquid supply pipeline which are respectively communicated with a plurality of spray heads in the two wetting groups, when the two wafers are pre-wetted, the two wafers are respectively loaded in the first loading area and the second loading area and are inserted into the same wetting cavity, and the two wetting groups synchronously pre-wet the surfaces to be wetted of the two wafers.
Another technical solution of the present invention is a method for pre-wetting a wafer, which uses the scanning pre-wetting system and includes the following steps:
s1, a wafer is horizontally arranged from a central line and is installed on a wafer carrier, and the wafer is vertically inserted into a wetting cavity from an insertion port, so that a surface to be wetted of the wafer faces a spray header, and a scanning reference area formed by a plurality of spray headers extends along the radial direction of the wafer;
and S2, supplying wetting liquid to each spray header, intercepting and dredging the wetting liquid sprayed out of the first channel through the second channel to form a fan-shaped wetting area with the water outlet of the first channel as the center of a circle, keeping partial coincidence of the fan-shaped wetting areas formed by two adjacent spray headers forming the scanning reference area, and simultaneously, repeatedly wetting the whole to-be-wetted surface of the wafer in a scanning manner by the wetting liquid sprayed out of the scanning reference area in the linear reciprocating motion of the spray base.
Due to the implementation of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the invention, the scanning reference area which is formed by partially overlapping the fan-shaped wetting areas and extends in the radial direction of the vertically arranged wafer is used for realizing scanning type spraying pre-wetting by taking the wafer as the reference in the linear reciprocating motion, and overlapping wetting liquid drops are sprayed to the surface of the wafer, so that the residence time of the wetting liquid on the surface of the wafer is ensured, and the pre-wetting effect of the wafer is effectively improved; meanwhile, the resistance barrier of the wafer surface wetting gap can be effectively broken through, and the wafer surface is fully wetted so as to meet the requirements of the electroplating process.
Drawings
FIG. 1 is a schematic view of the wafer and wafer carrier assembly of the present invention;
FIG. 2 is a schematic diagram of a scanning pre-wetting system for wafers according to the present invention;
FIG. 3 is a schematic diagram of a scanning pre-wetting system for wafers according to the present invention (hiding the same side panel of the wetting tank and the reflow tank);
FIG. 4 is an enlarged view of the structure at A in FIG. 3;
FIG. 5 is a schematic perspective view of the showerhead;
FIG. 6 is a schematic view of the structure of FIG. 5 viewed from the direction B;
FIG. 7 is a schematic sectional view taken along line C-C in FIG. 6;
wherein: y, a wafer;
1. a moistening tank; 11. a first slot panel; 12. a second slot panel; 13. bottom die; 14. end die; q1, a wetting chamber; k1, inserting the opening; k2, a liquid discharge port; d. a guide wheel; q2, a sliding cavity;
2. a wafer carrier;
3. a wetting unit; 30. a spray seat; k3, connecting ports; 31. a shower head; 311. an installation part; 312. spraying the body; t1, a first channel; t10, a pressurization section; t11, an output section; t2, a second channel; m1, a first face; m2, a second face; m3, a third surface; 32. a drive member; 320. a linear motor; 33. a liquid supply part; 331. a first liquid supply line; 332. a second liquid supply line; 333. an auxiliary booster pump;
4. a dampener solution circulation unit; 40. a reflux tank; b. a baffle; 41. a return line.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
As shown in fig. 1 to 7, the scanning pre-wetting system for wafer of the present embodiment includes a wetting tank 1, a wafer carrier 2, a wetting unit 3, and a wetting liquid circulating unit 4.
In this example, the wetting tank 1 extends vertically, and the wetting tank 1 includes a first tank panel 11 and a second tank panel 12 located at two sides, a bottom mold 13 located at the bottom, and end molds 14 located at two ends of the bottom mold 13, wherein the first tank panel 11 and the second tank panel 12, the bottom mold 13, and the end molds 14 form a wetting chamber q1, the top of the wetting tank 1 is open and forms a plug-in opening k1, a drain opening k2 communicating with the outside is formed on the bottom mold 13, the wafer carrier 2 can pass through the plug-in opening k1 from top to bottom and be positioned in the wetting chamber q1 under the operation of the robot during each pre-wetting, and the excess wetting liquid after the pre-wetting flows downward through the drain opening k2. By the arrangement, when the wafer is wetted at each time, redundant wetting liquid can be guaranteed to be discharged out of the wetting cavity in time, and residues are avoided.
Meanwhile, in order to further facilitate the wafer carrier 2 to enter and exit the wetting chamber q1, guide wheel assemblies are correspondingly arranged on the inner walls of the end dies 14 at two sides, and the wafer carrier 2 is attached to the wheel surfaces of the guide wheel assemblies from two opposite sides and is inserted into the wetting groove 1 in a vertically moving manner. The wafer carrier is guaranteed to be stable in taking and placing, and damage to equipment caused by shaking and impacting the wetting groove is avoided.
Specifically, the guide wheel assembly comprises a plurality of guide wheels d which are distributed at intervals from top to bottom, and when the wafer carrier 2 is inserted, the guide wheels d on the two sides roll along the corresponding side edges of the wafer carrier 2.
In this example, the wafer carrier 2 has a first loading area and a second loading area located on the front and rear sides, and the two wafers Y are loaded in the first loading area and the second loading area respectively vertically and horizontally from the center line.
In this embodiment, the wetting unit 3 includes a spray base 30, a plurality of spray heads 31 linearly distributed on the spray base 30, a driving part 32 for driving the spray base 30 to linearly reciprocate along a direction intersecting with the arrangement direction of the plurality of spray heads 31, and a liquid supply part 33, wherein each spray head 31 has a first channel t1 and a second channel t2, the wetting liquid sprayed from the first channel t1 is intercepted and guided by the second channel t2 to form a fan-shaped wetting area with the water outlet of the first channel t1 as a center, every two adjacent fan-shaped wetting areas are partially overlapped, the plurality of fan-shaped wetting areas form a scanning reference area, when pre-wetting, the wafer carrier 2 is inserted into the wetting cavity q1 from the insertion port k1, the center line of the wafer Y is horizontally arranged, the scanning reference area extends along the radial direction of the wafer Y, and the pre-wetting area formed during the reciprocating motion covers the surface to be wetted of the wafer Y. In this embodiment, deionized water is used as the wetting liquid.
Specifically, the spray seat 30 and the plurality of spray heads 31 form a wetting group, two wetting groups are symmetrically arranged about the wetting cavity q1, when in pre-wetting, two wafers Y are respectively loaded in the first loading area and the second loading area on the wafer carrier 2 and are inserted into the same wetting cavity q1, and the two wetting groups synchronously pre-wet the surfaces to be wetted of the two wafers Y.
Next, taking one of the wetting groups as an example for description, the structure of the other wetting group is also clear.
In this example, two connection ports k3 communicating with the liquid supply part 33 are provided on opposite sides of the bottom of the shower base 30, and a passage communicating the connection ports k3 with each shower head 31 is further formed inside the shower base 30. The moving direction of the shower base 30 is perpendicular to the arrangement direction of the plurality of shower heads 31.
In this embodiment, the plurality of shower heads 31 are divided into two shower groups and are respectively disposed at the top and the bottom of the shower base 30, wherein the scanning reference regions formed by the two shower groups are parallel to each other, the plurality of shower heads 31 in the two shower groups are aligned one above the other, and the distance between the two shower groups is equal to 0.5 times of the Y diameter of the wafer. The arrangement is that the distance of unidirectional movement of the spraying seat is the radius of the wafer at each time, so that the covering of the surface to be wetted of the whole wafer can be realized, the working stroke of the spraying seat can be shortened, and the efficiency of prewetting is effectively improved.
Specifically, each shower head 31 includes an installation portion 311 and a shower body 312, which are assembled and disassembled on the shower base 30, wherein the upper end portion of the shower body 312 protrudes out of the installation portion 311, the first passage t1 is located in the shower body 312 and extends up and down, the second passage t2 is located at the upper end portion of the shower body 312 protruding out of the installation portion 311, and the flowing direction of the wetting liquid in the first passage t1 is intersected with the flowing direction of the wetting liquid in the second passage t 2. Thus, the installation and implementation are convenient.
The first passage t1 comprises a pressurizing section t10 and an output section t11, wherein the inner diameter of the pressurizing section t10 becomes gradually smaller along the flow direction of the wetting fluid in the first passage t1, and the output section t11 communicates the pressurizing section t10 with the second passage t 2. The arrangement is that the pressurizing section is arranged, so that the spraying pressure of the wetting liquid is effectively improved, and the wetting liquid can break through the resistance barrier at the gap on the surface of the wafer more easily.
The second channel t2 is recessed inward from the side of the shower body 312 and intersects with the output section t11 to form a combing region. The carding zone comprises a first surface m1 arranged horizontally, a second surface m2 extending upwards from the inner side of the first surface m1, and a third surface m3 extending obliquely upwards from the upper end of the second surface m2, wherein the included angle between the first surface m1 and the third surface m3 is 20 degrees. By the arrangement, when the wetting liquid is sprayed, the influence of the gravity of the wetting liquid drop on the wetting liquid drop can be reduced, the wetting liquid drop is uniformly sprayed to the surface to be wetted of the wafer, and the spraying area of the wetting liquid is maximized.
Further, the output section t11 is cylindrical and located outside the second plane m2, and the output section t11 is tangent to the second plane m 2.
In order to realize the synchronous up-and-down movement of the spray seats 30 in the two wetting groups, the two wetting groups share one group of driving parts 32, wherein two sliding cavities q2 extending up and down are further formed on the wetting groove 1 and positioned at two opposite sides of the wetting cavity q 1; the driving part 32 comprises two linear motors 320 correspondingly arranged at the tops of the two sliding cavities q2, wherein the telescopic shaft of each linear motor 320 is inserted into the sliding cavity q2 from top to bottom and is fixedly connected with the corresponding side of each spray seat 30, and the spray seats 30 are driven to move up and down through the telescopic motion of the telescopic shafts.
The liquid supply part 33 comprises a first liquid supply pipeline 331 and a second liquid supply pipeline 332 which are respectively communicated with the plurality of spray headers 31 in the two wetting groups, and an auxiliary booster pump 333 arranged on the first liquid supply pipeline 331, wherein the first liquid supply pipeline 331 and the second liquid supply pipeline 332 are respectively connected to a connecting port k3 at the bottom of the spray base 30 through pipelines.
The wetting liquid circulating unit 4 includes a return tank 40 communicating with the liquid discharge port k2, a return line 41 communicating the return tank 40 with the liquid supply unit 33, and a return pump (not shown but not shown) provided in the return line 41, wherein the return tank 40 has a baffle b disposed obliquely therein, and the returned wetting liquid flows along the baffle b toward the return line 41. The arrangement is convenient for recovering and reusing the wetting liquid, and the cost is saved.
Therefore, the pre-wetting step for the wafer surface of the present embodiment is as follows:
s1, horizontally arranging a wafer Y from a central line, installing the wafer Y on a wafer carrier 2, and vertically inserting the wafer Y into a wetting cavity q1 from an insertion port k1, so that a surface to be wetted of the wafer Y faces a spray head 31, and a scanning reference area formed by a plurality of spray heads 31 extends along the radial direction of the wafer Y;
and S2, supplying wetting liquid to each spray header 31, intercepting and dredging the wetting liquid sprayed out of the first channel t1 through the second channel t2 to form a fan-shaped wetting area with the water outlet of the first channel t1 as the center of a circle, keeping the fan-shaped wetting areas formed by two adjacent spray headers 31 forming the scanning reference area partially overlapped, and simultaneously, in the linear reciprocating motion of the spray base 30, repeatedly wetting the whole surface to be wetted of the wafer Y in a scanning manner by the wetting liquid sprayed out of the scanning reference area.
In summary, the present embodiment has the following advantages:
1. the scanning type spraying pre-wetting taking the wafer as the reference is realized in the linear reciprocating motion through the scanning reference area which is formed by partially overlapping the fan-shaped wetting areas and extends in the radial direction of the vertically arranged wafer, the overlapped wetting liquid drops are sprayed to the surface of the wafer, the residence time of the wetting liquid on the surface of the wafer is ensured, and the pre-wetting effect of the wafer is effectively improved;
2. the resistance barrier of a wetting gap on the surface of the wafer can be effectively broken through, the surface of the wafer is fully wetted, and the requirements of an electroplating process are met;
3. the distance of unidirectional movement of the spray seat is the radius of the wafer every time, so that the whole wafer surface to be wetted can be covered, the working stroke of the spray seat can be shortened, and the pre-wetting efficiency is effectively improved;
4. when the wetting liquid is sprayed, the influence of the self gravity on the wetting liquid drops can be reduced, the wetting liquid drops are ensured to be uniformly sprayed to the surface to be wetted of the wafer, and the maximum spraying area of the wetting liquid is realized;
5. by arranging the wetting fluid circulating unit, the wetting fluid is convenient to recover and reuse, and the cost is saved.
The present invention has been described in detail in order to enable those skilled in the art to understand the invention and to practice it, and it is not intended to limit the scope of the invention, and all equivalent changes and modifications made according to the spirit of the present invention should be covered by the present invention.
Claims (10)
1. A scanning type pre-wetting system of a wafer is characterized in that: the wafer wetting device comprises a wetting groove, a wafer carrier and a wetting unit, wherein the wetting groove is formed with a wetting cavity, and the wetting cavity is formed with an insertion opening and a liquid discharge opening; the wetting unit comprises a spray seat, a plurality of spray heads which are linearly distributed on the spray seat, a driving part for driving the spray seat to linearly reciprocate along the direction intersecting with the arrangement direction of the plurality of spray heads, and a liquid supply part, wherein each spray head is provided with a first channel and a second channel, wetting liquid sprayed out of the first channel is intercepted and dredged by the second channel to form a fan-shaped wetting area with the water outlet of the first channel as the center of a circle, every two adjacent fan-shaped wetting areas are partially overlapped, a plurality of fan-shaped wetting areas form a scanning reference area, when in pre-wetting, the wafer carrier is inserted into the wetting cavity from the insertion opening, the central line of the wafer is horizontally arranged, the scanning reference area extends along the radial direction of the wafer, and the pre-wetting area formed in the reciprocating motion covers the surface to be wetted of the wafer;
the spray head comprises an installation part and a spray body which are detachably arranged on the spray seat, wherein the upper end part of the spray body protrudes out of the installation part, the first channel is positioned in the spray body and extends up and down, and the second channel is positioned at the upper end part of the spray body which protrudes out of the installation part;
said first passageway comprising a pumping section having an inner diameter tapering in the direction of flow of said wetting fluid within said first passageway and an output section communicating said pumping section with said second passageway;
the second channel is inwards sunken from the side part of the spraying body and is intersected with the output section to form a carding area, the carding area comprises a first surface, a second surface and a third surface, the first surface is horizontally arranged, the second surface extends upwards from the inner side of the first surface, the third surface extends upwards from the upper end of the second surface in an inclined mode, and the included angle between the first surface and the third surface ranges from 10 degrees to 35 degrees.
2. The system of claim 1, wherein: the direction of wetting fluid flow in said first channel intersects the direction of wetting fluid flow in said second channel.
3. A scanning pre-wetting system for wafers as claimed in claim 1, wherein: the output section is cylindrical and located outside the second face, or/and the output section is tangential to the second face.
4. Scanning pre-wetting system of a wafer according to any of claims 1 to 3, characterized in that: the plurality of spray heads are divided into a plurality of spray groups, wherein the plurality of spray groups are distributed at intervals along the movement direction of the spray seat, and scanning reference areas formed by the spray groups are intersected or parallel.
5. The system of claim 4, wherein: the two spraying groups are respectively arranged at the top and the bottom of the spraying seat, and the distance between the two spraying groups is greater than or equal to 0.5 time of the diameter of the wafer.
6. The system of claim 5, wherein: and a plurality of spray headers in the two spray groups are arranged in an up-down one-to-one alignment manner.
7. A scanning pre-wetting system for wafers as claimed in claim 1, wherein: wetting groove is including the first groove panel and the second groove panel that are located both sides, the die block that is located the bottom, be located the end mould at die block both ends, wherein first groove panel and second groove panel, die block, end mould constitute the moist chamber, the leakage fluid dram forms on the die block and with outside intercommunication, it is equipped with the guide pulley subassembly to correspond on the end mould, the wafer is in from opposite sides laminating on the wheel face of guide pulley subassembly and with cartridge with reciprocating in the moist groove.
8. The system of claim 7, wherein: the pre-wetting system further comprises a wetting liquid circulating unit, wherein the wetting liquid circulating unit comprises a reflux groove communicated with the liquid outlet and a reflux pipeline used for communicating the reflux groove with the liquid supply part, a guide plate is arranged in the reflux groove, and the wetting liquid flowing back flows to the reflux pipeline along the guide plate.
9. A scanning pre-wetting system for wafers as claimed in claim 7, wherein: the spray seat and the plurality of spray heads form a wetting group, and two wetting groups are symmetrically arranged relative to the wetting cavity; the wafer carrier is provided with a first loading area and a second loading area; the liquid supply part comprises a first liquid supply pipeline and a second liquid supply pipeline which are respectively communicated with the plurality of spray headers in the two wetting groups, when the two wafers are pre-wetted, the two wafers are respectively loaded in the first loading area and the second loading area and are inserted into the same wetting cavity, and the two wetting groups synchronously pre-wet the surfaces to be wetted of the two wafers.
10. A pre-wetting method of a wafer is characterized in that: employing a scanning pre-wetting system according to any of claims 1 to 9 and comprising the steps of:
s1, horizontally arranging a wafer from a central line, installing the wafer on a wafer carrier, and vertically inserting the wafer into a wetting cavity from an insertion port, so that a surface to be wetted of the wafer faces a spray header, and a scanning reference area formed by a plurality of spray headers extends along the radial direction of the wafer;
and S2, supplying wetting liquid to each spray header, forming a fan-shaped wetting area by intercepting and dredging the wetting liquid sprayed from the first channel by using the water outlet of the first channel as the circle center, keeping partial coincidence of the fan-shaped wetting areas formed by two adjacent spray headers forming the scanning reference area, and simultaneously wetting the whole surface to be wetted of the wafer repeatedly in a scanning manner by using the wetting liquid sprayed from the scanning reference area in the linear reciprocating motion of the spray base.
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| CN202211177800.1A CN115261944B (en) | 2022-09-27 | 2022-09-27 | Scanning type pre-wetting system and pre-wetting method for wafer |
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| CN202211177800.1A CN115261944B (en) | 2022-09-27 | 2022-09-27 | Scanning type pre-wetting system and pre-wetting method for wafer |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW483040B (en) * | 2001-05-30 | 2002-04-11 | Taiwan Semiconductor Mfg | Pre-wetting process system of chip for electroplating metal and its method |
| TW201036712A (en) * | 2009-02-10 | 2010-10-16 | Nexx Systems Inc | Wetting a workpiece surface in a fluid-processing system |
| CN103305886A (en) * | 2012-03-13 | 2013-09-18 | 诺发系统公司 | Methods and apparatus for wetting pretreatment for through resist metal plating |
| CN105529282A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备（上海）有限公司 | Semiconductor pre-wetting device and semiconductor pre-wetting method |
| CN108570701A (en) * | 2018-07-03 | 2018-09-25 | 华进半导体封装先导技术研发中心有限公司 | A kind of plating damping device |
| CN109427579A (en) * | 2017-08-31 | 2019-03-05 | 长鑫存储技术有限公司 | Method for preparing high depth-width ratio structure and structure |
| CN109671650A (en) * | 2018-12-04 | 2019-04-23 | 芯恩（青岛）集成电路有限公司 | A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer |
| CN211463585U (en) * | 2019-12-11 | 2020-09-11 | 重庆拓达建设（集团）有限公司 | Bricklaying wetting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102492797B1 (en) * | 2017-11-16 | 2023-01-30 | 삼성전자주식회사 | Substrate treating apparatus having a showerhead |
-
2022
- 2022-09-27 CN CN202211177800.1A patent/CN115261944B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW483040B (en) * | 2001-05-30 | 2002-04-11 | Taiwan Semiconductor Mfg | Pre-wetting process system of chip for electroplating metal and its method |
| TW201036712A (en) * | 2009-02-10 | 2010-10-16 | Nexx Systems Inc | Wetting a workpiece surface in a fluid-processing system |
| CN103305886A (en) * | 2012-03-13 | 2013-09-18 | 诺发系统公司 | Methods and apparatus for wetting pretreatment for through resist metal plating |
| CN105529282A (en) * | 2014-09-29 | 2016-04-27 | 盛美半导体设备（上海）有限公司 | Semiconductor pre-wetting device and semiconductor pre-wetting method |
| CN109427579A (en) * | 2017-08-31 | 2019-03-05 | 长鑫存储技术有限公司 | Method for preparing high depth-width ratio structure and structure |
| CN108570701A (en) * | 2018-07-03 | 2018-09-25 | 华进半导体封装先导技术研发中心有限公司 | A kind of plating damping device |
| CN109671650A (en) * | 2018-12-04 | 2019-04-23 | 芯恩（青岛）集成电路有限公司 | A kind of circulating liquid formula suction nozzle, and its method for removing particle in wafer |
| CN211463585U (en) * | 2019-12-11 | 2020-09-11 | 重庆拓达建设（集团）有限公司 | Bricklaying wetting device |
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| CN115261944A (en) | 2022-11-01 |
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