CN219534476U - Efficient overflow device with stepped arrangement - Google Patents
Efficient overflow device with stepped arrangement Download PDFInfo
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- CN219534476U CN219534476U CN202320395268.4U CN202320395268U CN219534476U CN 219534476 U CN219534476 U CN 219534476U CN 202320395268 U CN202320395268 U CN 202320395268U CN 219534476 U CN219534476 U CN 219534476U
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Abstract
The utility model discloses a step arrangement high-efficiency overflow device, and relates to the technical field of manufacturing of semiconductor discrete devices (diodes). The device includes the one-level groove, second grade groove and tertiary groove that set gradually, and the one-level groove contains: a water inlet (comprising a water inlet low baffle and a water inlet high baffle) and a first low baffle; the secondary tank comprises: a first high baffle (not closed below the high baffle as an overflow water outlet) and a second low baffle; the tertiary tank comprises: second Gao Dangban (not closed below the high baffle as overflow outlet), third low baffle. The utility model is based on a multistage overflow cleaning mode, ensures the cleaning efficiency, increases the surface overflow port to accelerate the outflow of surface impurities, increases the central overflow port to accelerate the flow of middle water, obviously improves the overflow effect by layering impurities, effectively reduces the overflow cleaning time of the silicon wafer, reduces the production cost and improves the economic benefit of the product.
Description
Technical Field
The utility model relates to the technical field of manufacturing of semiconductor discrete devices (diodes), in particular to a novel step-distribution efficient overflow device.
Background
In the diode diffusion sheet or chip production process, the process from the wafer to the chip finished product needs to be performed for more than 10 cleaning processes. Overflow cleaning is the most indispensable procedure in the cleaning procedure, and by means of long-time overflow, metal impurities (metal ion contamination) on the surface of the wafer can be removed, so that the problems that the metal ions are introduced into the wafer in the subsequent diffusion sheet or chip production process, and the reliability of the product is poor, and even the yield is low are avoided.
The conventional process adopts a two-tank overflow mode, as shown in fig. 1. With the conventional single groove size of 400 x 400mm, 128 liters of water is required to be filled into one double groove, and when the water inlet resistivity is above 15 megaohms, the control time from 4-5 inch wafer meeting process requirement overflow to above 10 megaohms is 15 minutes, the water consumption is about 1200 liters per hour.
In addition, the traditional cleaning tank has a certain dead angle, the flow rate of overflow water at the edge of the tank is low, and the cleaning efficiency of residual liquid is low. In the mass production process, double-groove overflow is easy to become a bottleneck of a cleaning process, and the production efficiency of the diode is greatly influenced.
Disclosure of Invention
The utility model aims to solve the problems that when the silicon wafer is overflowed and washed, the silicon wafer occupies a water tank for a long time, the water consumption is huge, residual liquid on the surface of the silicon wafer is overflowed and washed cleanly, and the production efficiency is low and high, and further provides a step arrangement high-efficiency overflow device, which accelerates the surface water flow speed, improves the pure water utilization rate, reduces the overflow washing time and reduces the production cost.
The specific technical scheme adopted by the utility model is as follows:
the utility model provides a stepped arrangement high-efficiency overflow device which comprises a primary tank, a secondary tank and a tertiary tank which are sequentially communicated in the water flow direction, wherein the bottoms of the primary tank, the secondary tank and the tertiary tank are in a stepped structure from high to low;
a water inlet low baffle, a water inlet high baffle and a first low baffle are sequentially arranged in the primary tank at intervals along the water flow direction, and three plate surfaces are perpendicular to the water flow direction; the water inlet low baffle and the water inlet high baffle are arranged at the inlet of the primary tank, and the first low baffle is arranged at the outlet of the primary tank; the two ends of the water inlet low baffle and the first low baffle are respectively fixed on the two opposite side walls of the primary tank, the lower edge is fixed on the bottom surface of the primary tank, and the upper edge is lower than the top surface of the primary tank so that water can overflow and pass through; the two ends of the water inlet high baffle are respectively fixed on the two opposite side walls of the primary tank, the upper edge is not lower than the top surface of the primary tank, the lower edge is lower than the upper edge of the water inlet low baffle, and a channel for water flow to pass through is arranged between the lower edge of the water inlet low baffle and the bottom surface of the primary tank;
the inlet of the secondary tank is provided with a first high baffle, the outlet of the secondary tank is provided with a second low baffle, and the two plate surfaces are perpendicular to the water flow direction; the two ends of the first high baffle are respectively fixed on the two opposite side walls of the secondary tank, the upper edge is not lower than the top surface of the secondary tank, and the lower edge is lower than the upper edge of the first low baffle and a channel for water flow to pass through is arranged between the lower edge and the bottom surface of the secondary tank; two ends of the second low baffle are respectively fixed on two opposite side walls of the secondary tank, the lower edge of the second low baffle is fixed on the bottom surface of the secondary tank, and the upper edge of the second low baffle is lower than the top surface of the secondary tank so that water can overflow and pass through the second low baffle;
the inlet of the three-stage tank is provided with a second high baffle, the outlet of the three-stage tank is provided with a third low baffle, and the two plate surfaces are perpendicular to the water flow direction; two ends of the second high baffle are respectively fixed on two opposite side walls of the three-stage tank, the upper edge is not lower than the top surface of the three-stage tank, and the lower edge is lower than the upper edge of the second low baffle and a channel for water flow to pass through is arranged between the lower edge of the second high baffle and the bottom surface of the three-stage tank; the two ends of the third low baffle are respectively fixed on the two opposite side walls of the three-stage tank, the lower edge is fixed on the bottom surface of the three-stage tank, and the upper edge is lower than the top surface of the three-stage tank so that water can overflow.
Preferably, the height difference between the bottoms of the adjacent grooves is not less than 30mm.
Preferably, a water resistivity meter is installed in the primary tank.
Preferably, when the wafer with the size of 4-5 inches is cleaned, the upper edge of the first low baffle is higher than the lower edge of the water inlet high baffle by not less than 150mm.
Preferably, the plate surfaces of the first low baffle plate and the second low baffle plate are respectively provided with a first central overflow hole and a second central overflow hole in a penetrating way, wherein the first central overflow hole is lower than the lower edge of the first high baffle plate, and the second central overflow hole is lower than the lower edge of the second high baffle plate.
Preferably, the upper edges of the first low baffle, the second low baffle and the third low baffle are respectively provided with three first overflow ports, a second overflow port and a third overflow port for water overflow to pass through, the position of the first overflow port is lower than the upper edge of the first high baffle, the position of the second overflow port is lower than the upper edge of the second high baffle, and the position of the third overflow port is lower than the upper edge of the third high baffle.
Preferably, two first edge water outlet holes for discharging sewage are formed in the side wall of the secondary tank between the first low baffle and the first high baffle, and the positions of the first edge water outlet holes are slightly lower than the upper edge of the first low baffle.
Preferably, two second edge water outlet holes for discharging sewage are formed in the side wall of the three-stage groove between the second low baffle plate and the second high baffle plate, and the positions of the second edge water outlet holes are slightly lower than the upper edge of the second low baffle plate.
Preferably, the lower edge of the first high baffle is higher than the bottom of the first-stage tank, the lower edge of the second high baffle is higher than the bottom of the second-stage tank, and the lower edge of the third high baffle is in the same horizontal plane with the bottom of the third-stage tank.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model is based on a multistage overflow cleaning mode, ensures the cleaning efficiency, increases the surface overflow port to accelerate the outflow of surface impurities, increases the central overflow port to accelerate the flow of middle water, obviously improves the overflow effect by layering impurities, effectively reduces the overflow cleaning time of the silicon wafer, reduces the production cost and improves the economic benefit of the product.
Drawings
FIG. 1 is a schematic diagram of a conventional two-tank overflow launder;
FIG. 2 is a top view (a) and front view (b) of a stepped arrangement high efficiency overflow;
FIG. 3 is a schematic illustration of an overflow cleaning with a wafer-carrying basket placed in an overflow launder;
FIG. 4 is a schematic diagram showing the flow direction of water in the tank and on the wafer surface;
fig. 5 is a schematic structural view of the third low barrier G (a), the second low barrier E (b), and the first low barrier C (C);
the reference numerals in the drawings are: the water inlet high baffle B, the first low baffle C, the first high baffle D, the second low baffle E, the second Gao Dangban F, the third low baffle G, the third high baffle H, the first central overflow hole 1, the first overflow port 2, the first edge water outlet hole 3, the second central overflow hole 4, the second overflow port 5, the second edge water outlet hole 6 and the third overflow port 7.
Detailed Description
The utility model is further illustrated and described below with reference to the drawings and detailed description. The technical features of the embodiments of the utility model can be combined correspondingly on the premise of no mutual conflict.
As shown in FIG. 2, the utility model provides a stepped arrangement high-efficiency overflow device which mainly comprises a primary tank I, a secondary tank II and a tertiary tank III. The first-stage groove I, the second-stage groove II and the third-stage groove III are sequentially communicated in the water flow direction, the bottoms of the three grooves are of a stepped structure from high to low, and the depths of the bottoms of the three grooves gradually increase.
In practical use, in order to ensure overflow flow rate, the drop between adjacent groove bottoms is not less than 30mm. Therefore, the primary tank I is cleanest, and the water resistivity meter is arranged in the tank and is used for monitoring water quality in real time to ensure that the water is flushed cleanly. The tertiary tank III is dirty relative to the primary tank I. The wafer from the front fast discharging groove is firstly placed in the third-stage groove III, and then is placed in the second-stage groove II and the first-stage groove I in turn for washing, and due to the step design, the flow speed of overflow water can be ensured, so that the water flow can quickly flow across the surface of the wafer.
The specific structures of the primary tank I, the secondary tank II and the tertiary tank III will be described below.
The inlet of the primary tank I is sequentially provided with a water inlet low baffle A and a water inlet high baffle B at intervals along the water flow direction, and the surfaces of the water inlet low baffle A and the water inlet high baffle B are perpendicular to the water flow direction. The two ends of the water inlet low baffle A are respectively fixed on the two opposite side walls of the primary groove I, the lower edge is fixed on the groove bottom surface of the primary groove I, and the upper edge is lower than the top surface of the primary groove I so that water can overflow. The two ends of the water inlet high baffle B are respectively fixed on the two opposite side walls of the primary groove I, the upper edge is not lower than the top surface of the primary groove I, and the lower edge is lower than the upper edge of the water inlet low baffle A and a channel for water flow to pass through is arranged between the lower edge of the water inlet high baffle B and the bottom surface of the primary groove I.
When in actual use, after the water level is beyond the water inlet low baffle A, the water flow rate can be ensured to uniformly overflow the water inlet low baffle A, and then the water flow can be uniformly guided to the bottom of the primary tank I through the water inlet high baffle B, so that the effect of uniform bottom water inflow is achieved. The water inflow design can ensure uniform water flow velocity in the step overflow groove. The wafers in each stage of groove are arranged perpendicular to the baffle plate (as shown in figure 3), and under the design, water flow can uniformly and quickly pass through the surface of the wafers so as to ensure the cleaning effect.
The outlet of the primary tank I is provided with a first low baffle C, and the plate surface of the first low baffle C is perpendicular to the water flow direction. The two ends of the first low baffle C are respectively fixed on the two opposite side walls of the primary groove I, the lower edge is fixed on the groove bottom surface of the primary groove I, and the upper edge is lower than the top surface of the primary groove I so that water can overflow and pass through.
In actual use, the overflow water mainly flows out uniformly from the upper edge of the first low baffle C. The height of the upper edge of the first low baffle C is far higher than that of the lower edge of the water inlet high baffle B, and the height of the upper edge of the first low baffle C is generally adjustable according to the size of a silicon wafer, and in the case of the utility model, the height difference between the upper edge and the lower edge of the water inlet high baffle B is not smaller than 150mm for 4-5 inch wafers, so that the overflow water in the overflow tank flows uniformly according to the flow direction shown in figure 4. Of course, if used to clean larger sized wafers, the tanks may be scaled up.
In this embodiment, as shown in fig. 5 (C), two first central overflow holes 1 for water to pass through are formed on the plate surface of the first low baffle plate C, and the position of the first central overflow holes 1 is lower than the lower edge of the first high baffle plate D to ensure the overflow water flow rate. The upper edge of the first low baffle C is provided with three first overflow ports 2 for water overflow to pass through, and the position of the first overflow ports 2 is lower than the upper edge of the first high baffle D so as to ensure that impurities overflow.
In actual use, the primary tank I is filled with water due to the smaller aperture of the first central overflow hole 1. And then, the step-shaped drop is combined, the water is discharged from the first central overflow hole 1 and the first overflow hole 2, so that the flow rate of the water can be obviously increased, and the cleaning efficiency of the secondary tank II and the tertiary tank III is ensured.
The inlet of the second-stage groove II is provided with a first high baffle D, and the plate surface of the first high baffle D is perpendicular to the water flow direction. The two ends of the first high baffle D are respectively fixed on the two opposite side walls of the secondary tank II, the upper edge is not lower than the top surface of the secondary tank II, and the lower edge is lower than the upper edge of the first low baffle C and a channel for water flow to pass through is arranged between the lower edge of the first high baffle D and the bottom surface of the secondary tank II. The outlet of the second-stage tank II is provided with a second low baffle E, and the plate surface of the second low baffle E is vertical to the water flow direction. The two ends of the second low baffle E are respectively fixed on the two opposite side walls of the secondary tank II, the lower edge is fixed on the bottom surface of the secondary tank II, and the upper edge is lower than the top surface of the secondary tank II so that water can overflow.
In this embodiment, the lower edge of the first high baffle D is higher than the bottom of the primary tank I. The water flow passing through the first low baffle C can also ensure uniform overflow water flow rate after passing through the first high baffle D due to liquid level difference. A large amount of impurities are often present in the secondary tank ii between the first low baffle C and the first high baffle D, and therefore the side wall of the secondary tank ii between the first low baffle C and the first high baffle D is provided with the first edge water outlet hole 3. The arrangement position of the first edge water outlet hole 3 is slightly lower than the upper edge of the first low baffle C, so that overflow water with dirt (such as impurities like dirt oil stains) can quickly drain the dirt from the two sides of the overflow groove, and the overflow efficiency is improved.
In this embodiment, as shown in fig. 5 (b), two second central overflow holes 4 for water to pass through are formed on the plate surface of the second low baffle E, and the position of the second central overflow holes 4 is lower than the lower edge of the second high baffle F to ensure the overflow water flow rate. The upper edge of the second low baffle E is provided with three second overflow ports 5 for water overflow to pass through, and the position of the second overflow ports 5 is lower than the upper edge of the second high baffle F so as to ensure that impurities overflow.
The inlet of the third-stage tank III is provided with a second Gao Dangban F, and the plate surface of the second high baffle F is vertical to the water flow direction. The two ends of the second high baffle F are respectively fixed on the two opposite side walls of the three-stage groove III, the upper edge is not lower than the top surface of the three-stage groove III, and the lower edge is lower than the upper edge of the second low baffle E and a channel for water flow to pass through is arranged between the lower edge of the second high baffle F and the bottom surface of the three-stage groove III. As shown in fig. 5 (a), a third low baffle G is disposed at the outlet of the third tank iii, and the plate surface of the third low baffle G is perpendicular to the water flow direction. The two ends of the third low baffle G are respectively fixed on the two opposite side walls of the third-stage groove III, the lower edge is fixed on the bottom surface of the third-stage groove III, and the upper edge is lower than the top surface of the third-stage groove III so that water can overflow. In practical application, dirty water overflowed by three overflows is discharged after passing through the third low baffle G.
In this embodiment, the lower edge of the second high baffle F is higher than the bottom of the secondary tank II. The water flow passing through the second low baffle E can also ensure uniform overflow water flow rate after passing through the second Gao Dangban F due to the liquid level difference. A large amount of impurities are often present in the third-stage tank iii between the second low baffle E and the second high baffle F, and therefore the second edge water outlet 6 is opened on the side wall of the third-stage tank iii between the second low baffle E and the second high baffle F. The second edge water outlet hole 6 is arranged at a position slightly lower than the upper edge of the second low baffle E, so that the overflow water with dirt can quickly discharge the dirt from the overflow groove, and the overflow efficiency is improved.
The above embodiment is only a preferred embodiment of the present utility model, but it is not intended to limit the present utility model. Various changes and modifications may be made by one of ordinary skill in the pertinent art without departing from the spirit and scope of the present utility model. Therefore, all the technical schemes obtained by adopting the equivalent substitution or equivalent transformation are within the protection scope of the utility model.
Claims (9)
1. The efficient overflow device is characterized by comprising a first-stage groove (I), a second-stage groove (II) and a third-stage groove (III) which are sequentially communicated in the water flow direction, wherein the bottoms of the first-stage groove (I), the second-stage groove (II) and the third-stage groove (III) are in a stepped structure from high to low;
a water inlet low baffle (A), a water inlet high baffle (B) and a first low baffle (C) are sequentially arranged in the primary tank (I) at intervals along the water flow direction, and three plate surfaces are perpendicular to the water flow direction; the water inlet low baffle (A) and the water inlet high baffle (B) are arranged at the inlet of the primary tank (I), and the first low baffle (C) is arranged at the outlet of the primary tank (I); the two ends of the water inlet low baffle (A) and the two ends of the first low baffle (C) are respectively fixed on the two opposite side walls of the primary groove (I), the lower edge is fixed on the bottom surface of the primary groove (I), and the upper edge is lower than the top surface of the primary groove (I) so that water can overflow and pass through; the two ends of the water inlet Gao Dangban (B) are respectively fixed on the two opposite side walls of the primary groove (I), the upper edge is not lower than the top surface of the primary groove (I), and a channel for water flow to pass through is arranged between the lower edge lower than the upper edge of the water inlet low baffle (A) and the bottom surface of the primary groove (I);
the inlet of the secondary tank (II) is provided with a first high baffle (D), the outlet of the secondary tank is provided with a second low baffle (E), and the two plate surfaces are perpendicular to the water flow direction; the two ends of the first high baffle (D) are respectively fixed on the two opposite side walls of the secondary groove (II), the upper edge is not lower than the top surface of the secondary groove (II), and a channel for water flow to pass through is arranged between the lower edge lower than the upper edge of the first low baffle (C) and the bottom surface of the secondary groove (II); two ends of the second low baffle (E) are respectively fixed on two opposite side walls of the secondary groove (II), the lower edge of the second low baffle is fixed on the bottom surface of the secondary groove (II), and the upper edge of the second low baffle is lower than the top surface of the secondary groove (II) so that water can overflow and pass through;
the inlet of the three-stage tank (III) is provided with a second Gao Dangban (F), the outlet of the three-stage tank is sequentially provided with a third low baffle (G) and a third high baffle (H) at intervals along the water flow direction, and the three plate surfaces are perpendicular to the water flow direction; the two ends of the second Gao Dangban (F) are respectively fixed on the two opposite side walls of the three-stage groove (III), the upper edge is not lower than the top surface of the three-stage groove (III), the lower edge is lower than the upper edge of the second low baffle (E), and a channel for water flow to pass through is arranged between the lower edge and the bottom surface of the three-stage groove (III); two ends of the third low baffle (G) are respectively fixed on two opposite side walls of the three-stage groove (III), the lower edge is fixed on the bottom surface of the three-stage groove (III), and the upper edge is lower than the top surface of the three-stage groove (III) so that water can overflow and pass through; the two ends of the third high baffle (H) are respectively fixed on the two opposite side walls of the third tank (III), the upper edge is higher than the top surface of the third low baffle (G), and the lower edge is fixed on the bottom surface of the third tank (III).
2. The step-arrangement high-efficiency overflow device of claim 1, wherein the height difference between the bottoms of adjacent grooves is not less than 30mm.
3. The efficient step-arrangement overflow device according to claim 1, wherein a water resistivity meter is installed in the primary tank (i).
4. The step arrangement high efficiency overflow apparatus of claim 1, wherein the upper edge of the first lower baffle (C) is higher than the lower edge of the water inlet Gao Dangban (B) by not less than 150mm when cleaning a 4-5 inch wafer.
5. The efficient step-arrangement overflow device according to claim 1, wherein the first lower baffle (C) and the second lower baffle (E) are respectively provided with a first central overflow hole (1) and a second central overflow hole (4) for water to pass through, the first central overflow hole (1) is lower than the lower edge of the first upper baffle (D), and the second central overflow hole (4) is lower than the lower edge of the second Gao Dangban (F).
6. The efficient step-arrangement overflow device according to claim 1, wherein the upper edges of the first low baffle (C), the second low baffle (E) and the third low baffle (G) are respectively provided with three first overflow ports (2), second overflow ports (5) and third overflow ports (7) for water overflow to pass through, the position of the first overflow port (2) is lower than the upper edge of the first high baffle (D), the position of the second overflow port (5) is lower than the upper edge of the second Gao Dangban (F), and the position of the third overflow port (7) is lower than the upper edge of the third high baffle (H).
7. The efficient step-arrangement overflow device according to claim 1, wherein two first edge water outlets (3) for discharging sewage are formed in the side wall of the secondary tank (ii) between the first low baffle (C) and the first high baffle (D), and the position of the first edge water outlets (3) is lower than the upper edge of the first low baffle (C).
8. The efficient step-arrangement overflow device according to claim 1, wherein two second edge water outlet holes (6) for discharging sewage are formed in the side wall of the three-stage tank (iii) between the second low baffle (E) and the second Gao Dangban (F), and the position of the second edge water outlet holes (6) is lower than the upper edge of the second low baffle (E).
9. The efficient step-arrangement overflow device according to claim 1, wherein the lower edge of the first high baffle (D) is higher than the bottom of the first-stage tank (i), the lower edge of the second Gao Dangban (F) is higher than the bottom of the second-stage tank (ii), and the lower edge of the third high baffle (H) is at the same level as the bottom of the third-stage tank (iii).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320395268.4U CN219534476U (en) | 2023-03-06 | 2023-03-06 | Efficient overflow device with stepped arrangement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320395268.4U CN219534476U (en) | 2023-03-06 | 2023-03-06 | Efficient overflow device with stepped arrangement |
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| Publication Number | Publication Date |
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| CN219534476U true CN219534476U (en) | 2023-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202320395268.4U Active CN219534476U (en) | 2023-03-06 | 2023-03-06 | Efficient overflow device with stepped arrangement |
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| CN (1) | CN219534476U (en) |
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