CN201711310U - Multi-functional silicon-wafer bubbling cleaning water tank - Google Patents

Multi-functional silicon-wafer bubbling cleaning water tank Download PDF

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Publication number
CN201711310U
CN201711310U CN 201020261778 CN201020261778U CN201711310U CN 201711310 U CN201711310 U CN 201711310U CN 201020261778 CN201020261778 CN 201020261778 CN 201020261778 U CN201020261778 U CN 201020261778U CN 201711310 U CN201711310 U CN 201711310U
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CN
China
Prior art keywords
water tank
tank
water
plastic plate
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201020261778
Other languages
Chinese (zh)
Inventor
索思卓
库黎明
边永智
闫志瑞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
You Yan Semi Materials Co., Ltd.
Original Assignee
Beijing General Research Institute for Non Ferrous Metals
Grinm Semiconductor Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing General Research Institute for Non Ferrous Metals, Grinm Semiconductor Materials Co Ltd filed Critical Beijing General Research Institute for Non Ferrous Metals
Priority to CN 201020261778 priority Critical patent/CN201711310U/en
Application granted granted Critical
Publication of CN201711310U publication Critical patent/CN201711310U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a multi-functional silicon-wafer bubbling cleaning water tank, which comprises a storage water tank and a plurality of bubbling water tanks. A pure-water inlet is arranged at the storage water tank; water leakage grooves are arranged on side walls of the water tank; the bottom of the water tank is an inclined plane with a water inlet part being high and a water outlet part being low; a water outlet is directly arranged at the bottom of the water outlet part to directly discharge water; a horizontal plastic plate is arranged in the water tank; a small hole is arranged on the plastic plate; a compressed air pipeline is arranged under the plastic plate; and a plurality of holes are arranged on the pipeline wall. The water tank can be temporally used for storing to-be-processed silicon-wafer and can primarily clean silica slags adhered to the silicon wafer, meanwhile, the later processing and cleaning are convenient, and the water tank has simple structure and low cost and is convenient in operation.

Description

Multi-functional silicon chip bubbling cleaning sink
Technical field
The utility model relates to a kind of silicon chip but also multi-functional tank that can cleaning silicon chip not only can deposited.Main cleaning object is the silicon chip that has a lot of silica flours to stick after the operations such as section and abrasive disc.
Background technology
Silicon chip is a kind of as semi-conducting material, and by industry-by-industry that the whole world is widely applied to, the silicon chip process technology is also ripe gradually.Silicon materials process technology step mainly contains crystal pulling, section, abrasive disc, corrosion, polishing etc.Section, abrasive disc partly are the major parts of silicon chip loss, and the loss mode is mainly sliver, scratch.Behind section or abrasive disc, silicon chip surface is stained with a large amount of silica flours, owing to processing problems, may have part silicon chip inside and crack again.The conventional clean method of handling silicon chip surface rinses out the silica flour of surface adhesion again for the silicon chip after will processing inserts the gaily decorated basket one by one with high pressure pure water hydraulic giant, then the silicon chip gaily decorated basket is put into supersonic wave cleaning machine, cleans.Require silicon chip surface moistening always during this time, dry tack free can produce colored sheet, and silicon chip is scrapped.In large-scale production, facts have proved that traditional way has three kinds of drawbacks: 1. the water under high pressure incident pressure is excessive, with the silicon chip avulsion, perhaps cracks; 2. when high pressure pure water hydraulic giant washes, can stay the flushing dead angle, bring a large amount of dirts into ultrasonic cleaning tank, the cleaning fluid in the pollution groove, cast deposits in a large number at bottom land and cell wall dead angle, influences cleaning performance by the gross; 3. there is the silicon chip of crackle can be cracked in the ultrasonic wave cleaning process, and influences other silicon chip cleaning performances.Under this condition, the way that needs a kind of pre-cleaning method to replace traditional high pressure pure water to wash both saved water, and needed easy and simple to handlely again, and cleaning performance more will be got well.
Summary of the invention
The purpose of this utility model provides a kind of multi-functional silicon chip bubbling cleaning sink, and this tank can temporarily be deposited silicon chip to be processed, can tentatively wash the impurity such as white residue that silicon chip sticks simultaneously, make things convenient for post-production to clean, and sink structure is simple, and is easy and simple to handle, cheap.
In order to realize above-mentioned purpose, the utility model adopts following technical scheme:
This multi-functional bubble type cleaning sink, it comprises: deposit tank, a plurality of bubbling tank, deposit tank and be provided with the pure water water inlet, the sidewall of tank all has leak-off chute, bottom of gullet is the inclined-plane, water inlet place height, drainage position is low, and the drainage position bottom all is provided with a discharge outlet from the direct draining in bottom, in tank, be equipped with horizontal plastic plate, aperture is arranged on the plastic plate, be equipped with compressed air piping below the plastic plate, have a plurality of holes on the duct wall.
Principle of the present utility model is: utilize the vibrations of liquid fluidity and bubble bump silicon chip generation, reach the purpose on cleaning silicon wafer surface, again in conjunction with water cleannes factor, design has a plurality of tanks from high to low, can recycle water, has saved water resource.
The horizontal plastic plate distance of leak-off chute and tank is greater than silicon chip gaily decorated basket height.To guarantee that the water trough inner water can flood the gaily decorated basket.
Whole device skin-material is a tetrafluoro.
The scope of the angle α of bottom of gullet inclined-plane and horizontal plane is at 0 degree<α<60 degree.
Description of drawings
Fig. 1: the schematic top plan view of a kind of structure of the present utility model.
Fig. 2: the schematic diagram of a kind of structure of the present utility model.
Fig. 3: plastic bottom board structural representation.
Fig. 4: compressed air piping paving mode schematic diagram.
Fig. 5: compressed air piping and base plate concern schematic diagram in groove
The specific embodiment
Among Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, mainly by depositing tank 1 and bubbling tank 2 two parts, 7 is the pure water water inlet to this cleaning sink, and bubbling tank quantity is made by oneself because of the cleaning demand.The bottom of gullet of depositing tank, a plurality of bubbling tanks is the inclined-plane, water inlet place height, drainage position is low, its objective is to be convenient to contamination precipitation, be convenient to simultaneously daily cleaning again, each bottom of gullet is provided with roomy discharge outlet 8, and the side has leak-off chute 3, is equipped with horizontal plastic plate 4 in tank, aperture 5 is arranged on the plastic plate, be equipped with compression pipe 12 below the plastic plate, have a plurality of holes 10 on the duct wall, its aperture is decided by the cleaning demand.The leak-off chute of filling with behind the tank by the side 3 flows in the bubbling groove (2) successively, is flowed out by discharge outlet 6 at last.
In the process, by base apertures 9 pipeline 12 of packing into, after the compressed air 11 that feeds is emerged from pipe hole 10, bubble is via the plastic bottom plate hole 5 vibrations silicon chips that rise, and silicon chip surface silica flour white residue etc. is come off, and impurity is by bottom plate hole 5, be deposited on below the base plate, prevent to pollute scuffing upper strata silicon chip.
Generally speaking, the steam vent 10 in the bubbling groove is bigger, and the steam vent 10 in the storage tank is less, when gushing on the bubble in the bubbling groove, can see that water rolls in tank.Surface adhesion silica flour, the silicon chip of impurity such as white residue are at first put into minimum bubbling groove, upwards enter the water quality zone of relative cleaning successively.The time and the bubbling intensity of cleaning are determined by process requirements.
After process finishing, the discharge outlet 8 of each trench bottom can be opened during the cleaning tank, bottom plastic plate 4 also can take out, convenient flushing.Reaching current is like this flowed to the low rinse bath of cleanliness factor by the cleanliness factor height.After water in the bubbling tank of current end flows out, flow out, flow into discharge outlet by leak-off chute.

Claims (4)

1. multi-functional bubble type cleaning sink, it is characterized in that: it comprises: deposit tank, a plurality of bubbling tank, deposit tank and be provided with the pure water water inlet, the sidewall of tank all has leak-off chute, bottom of gullet is the inclined-plane, water inlet place height, drainage position is low, and the drainage position bottom all is provided with a discharge outlet from the direct draining in bottom, in tank, be equipped with horizontal plastic plate, aperture is arranged on the plastic plate, be equipped with compressed air piping below the plastic plate, have a plurality of holes on the duct wall.
2. a kind of multi-functional bubble type cleaning sink according to claim 1 is characterized in that: the horizontal plastic plate distance of leak-off chute and tank is greater than silicon chip gaily decorated basket height.
3. a kind of multi-functional bubble type cleaning sink according to claim 1 and 2, it is characterized in that: whole device skin-material is a tetrafluoro.
4. a kind of multi-functional bubble type cleaning sink according to claim 1 and 2 is characterized in that: the scope of the angle α of bottom of gullet inclined-plane and horizontal plane is at 0 degree<α<60 degree.
CN 201020261778 2010-07-12 2010-07-12 Multi-functional silicon-wafer bubbling cleaning water tank Expired - Lifetime CN201711310U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201020261778 CN201711310U (en) 2010-07-12 2010-07-12 Multi-functional silicon-wafer bubbling cleaning water tank

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201020261778 CN201711310U (en) 2010-07-12 2010-07-12 Multi-functional silicon-wafer bubbling cleaning water tank

Publications (1)

Publication Number Publication Date
CN201711310U true CN201711310U (en) 2011-01-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201020261778 Expired - Lifetime CN201711310U (en) 2010-07-12 2010-07-12 Multi-functional silicon-wafer bubbling cleaning water tank

Country Status (1)

Country Link
CN (1) CN201711310U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102430542A (en) * 2011-12-29 2012-05-02 北京泰拓精密清洗设备有限公司 Multi-station bubbling cleaning machine
CN103008281A (en) * 2011-09-20 2013-04-03 宜兴市环洲微电子有限公司 Cleaning tank used for cleaning semiconductor wafers
CN104979235A (en) * 2014-04-10 2015-10-14 沈阳芯源微电子设备有限公司 Wafer soaking device
CN105127139A (en) * 2015-07-27 2015-12-09 句容骏成电子有限公司 Device for cleaning surfaces of LCD products
CN106269690A (en) * 2016-08-31 2017-01-04 湘潭大众整流器制造有限公司 A kind of positive plate cleaning case
CN106334688A (en) * 2016-08-29 2017-01-18 桂林福达全州高强度螺栓有限公司 Air bubble cleaning device for product surface treatment
CN106583053A (en) * 2016-12-21 2017-04-26 晶科能源有限公司 Silicon material floatation and cleaning method
WO2024051135A1 (en) * 2022-09-05 2024-03-14 上海中欣晶圆半导体科技有限公司 Method for improving silicon-wafer cleaning effect

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103008281A (en) * 2011-09-20 2013-04-03 宜兴市环洲微电子有限公司 Cleaning tank used for cleaning semiconductor wafers
CN102430542A (en) * 2011-12-29 2012-05-02 北京泰拓精密清洗设备有限公司 Multi-station bubbling cleaning machine
CN102430542B (en) * 2011-12-29 2013-09-11 北京泰拓精密清洗设备有限公司 Multi-station bubbling cleaning machine
CN104979235A (en) * 2014-04-10 2015-10-14 沈阳芯源微电子设备有限公司 Wafer soaking device
CN104979235B (en) * 2014-04-10 2017-07-07 沈阳芯源微电子设备有限公司 Wafer infuser device
CN105127139A (en) * 2015-07-27 2015-12-09 句容骏成电子有限公司 Device for cleaning surfaces of LCD products
CN106334688A (en) * 2016-08-29 2017-01-18 桂林福达全州高强度螺栓有限公司 Air bubble cleaning device for product surface treatment
CN106269690A (en) * 2016-08-31 2017-01-04 湘潭大众整流器制造有限公司 A kind of positive plate cleaning case
CN106269690B (en) * 2016-08-31 2019-07-26 湘潭大众整流器制造有限公司 A kind of anode plate cleaning case
CN106583053A (en) * 2016-12-21 2017-04-26 晶科能源有限公司 Silicon material floatation and cleaning method
WO2024051135A1 (en) * 2022-09-05 2024-03-14 上海中欣晶圆半导体科技有限公司 Method for improving silicon-wafer cleaning effect

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ASS Succession or assignment of patent right

Free format text: FORMER OWNER: GRINM SEMICONDUCTOR MATERIALS CO., LTD.

Effective date: 20120210

Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD.

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Effective date: 20120210

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20120210

Address after: 100088, 2, Xinjie street, Beijing

Patentee after: GRINM Semiconductor Materials Co., Ltd.

Address before: 100088, 2, Xinjie street, Beijing

Co-patentee before: GRINM Semiconductor Materials Co., Ltd.

Patentee before: General Research Institute for Nonferrous Metals

C56 Change in the name or address of the patentee

Owner name: GRINM ADVANCED MATERIALS CO., LTD.

Free format text: FORMER NAME: GRINM SEMICONDUCTOR MATERIALS CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 100088, 2, Xinjie street, Beijing

Patentee after: YOUYAN NEW MATERIAL CO., LTD.

Address before: 100088, 2, Xinjie street, Beijing

Patentee before: GRINM Semiconductor Materials Co., Ltd.

ASS Succession or assignment of patent right

Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD.

Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD.

Effective date: 20150611

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20150611

Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road

Patentee after: You Yan Semi Materials Co., Ltd.

Address before: 100088, 2, Xinjie street, Beijing

Patentee before: YOUYAN NEW MATERIAL CO., LTD.

CX01 Expiry of patent term

Granted publication date: 20110119

CX01 Expiry of patent term