CN218251886U

CN218251886U - Megasonic groove body for cleaning wafer

Info

Publication number: CN218251886U
Application number: CN202222575723.7U
Authority: CN
Inventors: 钟红海; 施先众; 郑耀敦; 赵复岗
Original assignee: Guangdong Fanlin Equipment Technology Co ltd
Current assignee: Guangdong Fanlin Equipment Technology Co ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-01-10
Anticipated expiration: 2032-09-28

Abstract

The utility model discloses a megasonic tank body for cleaning wafers, which comprises a megasonic vibrating plate, a megasonic outer tank, a megasonic inner tank, a liquid inlet pipe and a liquid outlet pipe; the megasonic outer groove is arranged on the megasonic vibration plate, the megasonic inner groove is arranged in the megasonic outer groove, and the liquid inlet pipe and the liquid outlet pipe sequentially penetrate through the walls of the megasonic outer groove and the walls of the megasonic inner groove and extend into the megasonic inner groove; the bottom surface of the megasonic tank has a certain inclination with respect to the horizontal plane. The utility model provides a bottom surface that is used for rinsing megasonic groove of megasonic cell body of wafer has certain gradient, and the bubble that produces in the cleaning process of being convenient for rises along the inclined plane, has reduced the gathering of bubble, has reduced the loss of megasonic energy, has improved the cleaning efficiency. The inner groove and the outer groove of the megasonic tank body are fixedly connected in a rib and groove mode, so that the megasonic tank is more convenient to disassemble and assemble and reduces maintenance cost compared with a traditional screw positioning mode.

Description

Megasonic groove body for cleaning wafer

Technical Field

The utility model belongs to the technical field of the wafer belt cleaning device, concretely relates to megasonic groove body for rinsing wafer.

Background

The ultrasonic cleaning process utilizes the direct and indirect action of the cavitation action, the acceleration action and the direct current action of the ultrasonic waves in the liquid on the liquid and dirt to disperse, emulsify and peel off the dirt layer so as to achieve the cleaning purpose. However, cavitation generated by ultrasonic cleaning causes thousands of atmospheric pressures generated by the bubbles during blasting to cause large vibration velocity and acceleration of particles, and also causes frequent and violent impact on the dirt on the surface of the cleaning piece, and also causes violent impact on the wafer, and in severe cases, the wafer is damaged. Megasonic cleaning is required because of the increasing demands placed on semiconductor wafer cleaning, which is not met by ultrasonic cleaning. The megasonic cleaning does not generate strong cavitation effect, and can avoid damage to the surface of the wafer and pollutant residue in the cleaning process. The megasonic cleaning efficiency is high, the time is short, the concentration of the used cleaning agent is low, and the consumption of chemical reagents is low, so that the damage to the environment is low. However, bubbles are generated during megasonic cleaning, and the more bubbles are accumulated, the more energy loss of megasonic is caused. In addition, the megasonic inner groove and the megasonic outer groove are fixed by screws, so that the disassembly is troublesome, and the installation and the maintenance of the groove body are inconvenient.

SUMMERY OF THE UTILITY MODEL

A primary object of the present application is to provide a megasonic tank for cleaning wafers that reduces bubble accumulation during megasonic cleaning.

In order to achieve the above object, the present invention provides the following technical solutions:

a megasonic tank body for cleaning wafers comprises a megasonic vibration plate, a megasonic outer tank, a megasonic inner tank, a liquid inlet pipe and a liquid outlet pipe; the megasonic outer groove is arranged on the megasonic vibration plate, the megasonic inner groove is arranged in the megasonic outer groove, and the liquid inlet pipe and the liquid outlet pipe sequentially penetrate through the walls of the megasonic outer groove and the walls of the megasonic inner groove and extend into the megasonic inner groove; the bottom surface of the megasonic tank has a certain inclination with respect to the horizontal plane.

Use this application during a megasonic tank body for rinsing the wafer, add the washing liquid in to megasonic inside groove through the feed liquor pipe, megasonic vibration board produces the high frequency pressure wave, utilizes megasonic vibration board to produce the effect of scrubbing of high frequency pressure wave and washs the wafer. The bubbles generated in the cleaning process are stressed by the high-frequency pressure wave in the cleaning process, and the bottom plate of the megasonic groove inclines, so the bubbles are easy to rise along the inclined surface after being stressed, the accumulation of the bubbles is further reduced, and in addition, the cleaning liquid in the inner part is easy to drain by the inclination of the bottom surface.

As a preferred embodiment, the megasonic tank for cleaning wafers is provided with ribs on the upper part, the ribs are arranged on the outer surface of the megasonic tank, and the number of the ribs is at least 4;

a fixed plate is arranged on the wall of the megasonic outer tank, the top end of the fixed plate extends out of the top surface of the megasonic outer tank, and the top end of the fixed plate is recessed downwards to form a groove;

the convex edges and the grooves correspond one to realize the connection of the megasonic inner groove and the megasonic outer groove.

The utility model discloses the megasonic inside groove that adopts is square, is provided with the bead in its four corners department, because of the top extension of fixed plate the top surface of megasonic outer tank, the top surface of megasonic inside groove just is located on the megasonic outer tank like this, the dismantlement of the megasonic inside groove of being convenient for.

In the megasonic tank for cleaning wafers, as a preferred embodiment, the distance between the bottom surface of the megasonic inner tank and the bottom surface of the megasonic outer tank is 40-60mm.

As a preferable embodiment, the distance between the liquid inlet of the megasonic tank and the bottom surface of the megasonic tank is 35-40mm, and the liquid inlet pipe penetrates through the liquid inlet of the megasonic tank and extends to 2/3-4/5 of the length of the megasonic tank along the length direction of the megasonic tank.

Thus, the liquid inlet of the megasonic tank is more uniform.

The megasonic tank for cleaning wafers as a preferred embodiment further comprises an overflow groove, wherein the overflow groove is arranged around the wall of the megasonic tank, and the height of the upper surface of the overflow groove is 30-35mm lower than that of the upper surface of the megasonic tank.

Because the cleaning liquid in the megasonic inner groove is difficult to avoid overflowing outwards in the cleaning process, the overflow groove is arranged around the groove wall of the megasonic inner groove, and the cleaning liquid can be prevented from overflowing into the megasonic outer groove.

As a preferred embodiment, the overflow groove is provided with an overflow port, one end of the overflow pipe is communicated with the overflow port, and the other end of the overflow pipe passes through the megasonic outer tank and extends out of the tank wall of the megasonic outer tank.

As a preferred embodiment, the included angle between the bottom surface of the megasonic tank and the horizontal plane is 2 ° to 10 °.

The megasonic tank for cleaning the wafer is an optimized embodiment, a support frame is placed in the megasonic inner tank and is positioned above the liquid inlet pipe, the support frame is arranged in parallel to the horizontal plane, a plurality of through holes are uniformly formed in the support frame, and the edge of the support frame is detachably connected with the inner wall of the megasonic inner tank. The edge of the support frame can be detachably connected with the megasonic inner groove through screws.

The arrangement of the supporting frame facilitates the wafer basket of flowers to be stably placed in the megasonic inner groove. The through holes are arranged so that cleaning liquid can flow into the area above the support frame to clean the wafer.

The utility model has the advantages that: the utility model provides a bottom surface that is used for rinsing megasonic groove of megasonic cell body of wafer has certain gradient, and the bubble that produces in the cleaning process of being convenient for rises along the inclined plane, has reduced the gathering of bubble, has reduced the loss of megasonic energy, has improved the cleaning efficiency.

This application a mode that is used for wasing the megasonic groove body of wafer adopts bead and recess between inside groove and the water jacket carries out fixed connection, for traditional screw location's mode, more convenient dismantlement and installation have reduced the maintenance cost.

Drawings

Fig. 1 is a schematic structural view of a megasonic tank for cleaning wafers according to the present disclosure;

in the figure: 1. a megasonic outer tank; 2. a megasonic inner tank; 3. a liquid inlet pipe; 4. a liquid discharge pipe; 5. a rib; 6. a fixing plate; 7. an overflow trough; 8. a support frame; 9. an overflow pipe; 10. a wafer flower basket.

Detailed Description

In order to make the technical solutions of the embodiments of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to examples, and it is obvious that the described embodiments are only examples of a part of the present application, and not all examples. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

A megasonic tank body for cleaning a wafer comprises a megasonic vibration plate, a megasonic outer tank 1, a megasonic inner tank 2, a liquid inlet pipe 3 and a liquid outlet pipe 4; the megasonic outer tank 1 is arranged on the megasonic vibration plate, the megasonic inner tank 2 is arranged in the megasonic outer tank 1, and the liquid inlet pipe 3 and the liquid outlet pipe 4 sequentially penetrate through the walls of the megasonic outer tank 1 and the walls of the megasonic inner tank 2 and extend into the megasonic inner tank 2; the bottom surface of the megasonic tank 2 has a certain inclination with respect to the horizontal plane.

When using this application during the megasonic groove body, utilize megasonic vibrating plate to produce the scrubbing effect cleaning wafer of high frequency pressure wave. The bubbles generated in the cleaning process are stressed by the high-frequency pressure wave in the cleaning process, and the bottom plate of the megasonic groove 2 inclines, so the bubbles are easy to rise along the inclined surface after being stressed, and the accumulation of the bubbles is further reduced. The inclination is generally designed to be 2 to 10 degrees between the bottom surface of the megasonic tank 2 and the horizontal plane, which helps the generated bubbles to go upward and avoid accumulation of bubbles. Because the bottom surface of the megasonic internal groove 2 has a certain inclination, in order to facilitate the stable placement of the wafer basket of flowers 10, a support frame 8 is placed in the megasonic internal groove 2, the support frame 8 is positioned above the liquid inlet pipe 3, the support frame 8 is arranged parallel to the horizontal plane, a plurality of through holes are uniformly arranged on the support frame 8, the edge of the support frame 8 is detachably connected with the inner wall of the megasonic internal groove 2, and when the wafer basket of flowers 10 is placed on the support frame 8.

In order to conveniently inject the cleaning liquid and ensure that the cleaning liquid of the megasonic inner groove 2 is uniformly injected, the distance between the liquid inlet of the megasonic inner groove 2 and the bottom surface of the megasonic inner groove 2 is 35-40mm, and the liquid inlet pipe 3 penetrates through the liquid inlet of the megasonic inner groove 2 and extends to 2/3-4/5 of the length of the megasonic inner groove 2 along the length direction of the megasonic inner groove 2.

The megasonic groove 2 and the outer groove of the megasonic groove body for cleaning the wafer are fixedly connected through the groove and the convex edge 5. The upper part of the megasonic inner groove 2 is provided with ribs 5, the ribs 5 are arranged on the outer surface of the megasonic inner groove 2, the number of the ribs 5 is at least 4, the shape of the megasonic inner groove 2 described in the embodiment is a square, and the ribs 5 are respectively arranged at four corners. A fixing plate 6 is arranged on the wall of the megasonic outer tank 1, the top end of the fixing plate 6 extends out of the top surface of the megasonic outer tank 1, and the top end of the fixing plate 6 is recessed downwards to form a groove; the convex ribs 5 correspond to the grooves one by one to realize the connection of the megasonic inner groove 2 and the megasonic outer groove 1. Thus, the top surface of the megasonic inner tank 2 is positioned above the outer tank for easy disassembly, and the distance between the bottom surface of the megasonic inner tank 2 and the bottom surface of the megasonic outer tank 1 can be 40mm, 50mm or 60mm.

In order to prevent the cleaning liquid from overflowing in the cleaning process, an overflow groove 7 is arranged around the groove wall of the megasonic groove 2, and the height of the upper surface of the overflow groove 7 can be 30-35mm lower than that of the upper surface of the megasonic groove 2; an overflow port is formed in the overflow groove 7, one end of the overflow pipe 9 is communicated with the overflow port, and the other end of the overflow pipe 9 penetrates through the megasonic outer groove 1 and extends out of the groove wall of the megasonic outer groove 1.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and additions can be made without departing from the method of the present invention, and these improvements and additions should also be regarded as the protection scope of the present invention.

Claims

1. A megasonic tank body for cleaning wafers is characterized by comprising a megasonic vibrating plate, a megasonic outer tank, a megasonic inner tank, a liquid inlet pipe and a liquid outlet pipe; the megasonic outer tank is arranged on the megasonic vibration plate, the megasonic inner tank is arranged in the megasonic outer tank, and the liquid inlet pipe and the liquid outlet pipe sequentially penetrate through the walls of the megasonic outer tank and the walls of the megasonic inner tank and extend into the megasonic inner tank;

the bottom surface of the megasonic tank has a certain inclination with respect to the horizontal plane.

2. The megasonic tank for cleaning wafers as claimed in claim 1, wherein the upper part of the megasonic inner tank is provided with ribs which are arranged on the outer surface of the megasonic inner tank, and the number of the ribs is at least 4;

3. A megasonic tank for cleaning wafers as claimed in claim 2, wherein the distance between the bottom surface of the megasonic inner tank and the bottom surface of the megasonic outer tank is 40-60mm.

4. The megasonic tank for cleaning wafers as claimed in claim 1, wherein the distance between the liquid inlet of the megasonic tank and the bottom surface of the megasonic tank is 35-40mm, and the liquid inlet pipe passes through the liquid inlet of the megasonic tank and extends to 2/3-4/5 of the length of the megasonic tank along the length direction of the megasonic tank.

5. The megasonic tank of claim 1, further comprising an overflow launder disposed around the walls of the megasonic tank, the height of the upper surface of the overflow launder being 30-35mm lower than the height of the upper surface of the megasonic tank.

6. The megasonic tank for cleaning wafers as claimed in claim 5, wherein the overflow groove is provided with an overflow port, one end of the overflow pipe is communicated with the overflow port, and the other end of the overflow pipe passes through the megasonic outer tank and extends out of the tank wall of the megasonic outer tank.

7. The megasonic tank for cleaning wafers of claim 1 wherein the angle between the bottom surface of the megasonic tank and the horizontal plane is 2 ° -10 °.

8. The megasonic tank for cleaning wafers as claimed in claim 1, wherein a support frame is placed in the megasonic tank, the support frame is located above the liquid inlet pipe, the support frame is arranged parallel to a horizontal plane, a plurality of through holes are uniformly formed in the support frame, and the edge of the support frame is detachably connected with the inner wall of the megasonic tank.