CN202427679U - Ultrasonic cleaning machine for silicon wafers - Google Patents
Ultrasonic cleaning machine for silicon wafers Download PDFInfo
- Publication number
- CN202427679U CN202427679U CN2011205733301U CN201120573330U CN202427679U CN 202427679 U CN202427679 U CN 202427679U CN 2011205733301 U CN2011205733301 U CN 2011205733301U CN 201120573330 U CN201120573330 U CN 201120573330U CN 202427679 U CN202427679 U CN 202427679U
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- Prior art keywords
- ultrasonic
- silicon wafers
- tank
- ultrasonic tank
- cleaning machine
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- Expired - Fee Related
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Abstract
The utility model discloses an ultrasonic cleaning machine for silicon wafers. The ultrasonic cleaning machine for the silicon wafers comprises an ultrasonic tank and is characterized in that a drainage valve is arranged on one side of the ultrasonic tank, a support used for holding the silicon wafers is lapped at an opening of the ultrasonic tank, ultrasonic vibrators are arranged at the bottom of the ultrasonic tank, a circulating water pipeline is arranged on the ultrasonic tank, and a nozzle is arranged on the circulating water pipeline by the aid of a filtering device and a water suction pump. The ultrasonic cleaning machine for the silicon wafers is simple in structure and convenient to operate, effects for cleaning the silicon wafers is are better while water resources can be saved since ultrasonic cleaning is adopted.
Description
Technical field
The utility model relates to a kind of silicon wafer cleaner, particularly ultrasonic silicon wafer cleaner.
Background technology
Silicon chip can be attended by a large amount of residues and metal impurities when producing, when cleaning, quite bother, and cleaning performance is bad.Number of patent application is to disclose a kind of ultrasonic cleaning monocrystalline silicon piece device among the ZL200720192576.8; Comprise rinse bath, the cell wall of rinse bath is provided with water inlet and delivery port, and the trench bottom below is provided with ultrasonic oscillator; It is characterized in that: be provided with in the rinse bath groove one shelve monocrystalline silicon piece framework; The framework diapire is the paliform quartz pushrod, and the plane that quartz pushrod forms is lower than the ionized water horizontal plane, and whole framework is supported on rinse bath by feet.The cleaning device of this structure, complex structure has been wasted great lot of water resources during cleaning.
The utility model content
The purpose of the utility model is to provide a kind of simple in structure for the deficiency that solves above-mentioned prior art, and is easy to operate, good and the ultrasonic silicon wafer cleaner that can the conserve water resource of cleaning performance.
To achieve these goals; The ultrasonic silicon wafer cleaner that the utility model designed, it comprises ultrasonic tank, it is characterized in that being provided with water discharging valve in a side of ultrasonic tank; The notch place of ultrasonic tank is overlapped with the support that is used to place silicon chip, and the bottom of ultrasonic tank is provided with ultrasonic oscillator; Also be provided with circulating water line on the ultrasonic tank, be connected with shower nozzle through filter and suction pump on the circulating water line.
On support, be connected with collecting net, be used to collect the silicon chip that possibly come off when cleaning through connecting rod.
The ultrasonic silicon wafer cleaner that the utility model obtains, simple in structure, easy to operate, adopt ultrasonic cleaning, make the better effects if of cleaning silicon chip, and can the conserve water resource.
Description of drawings
Fig. 1 is an embodiment overall structure sketch map.
Among the figure: ultrasonic tank 1, water discharging valve 2, support 3, connecting rod 31, ultrasonic oscillator 4, circulating water line 5,, filter 51, suction pump 52, shower nozzle 6, collecting net 7, Water filling valve 8.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Embodiment:
As shown in Figure 1; The ultrasonic silicon wafer cleaner that present embodiment provides; It comprises ultrasonic tank 1, is provided with water discharging valve 2 in a side of ultrasonic tank 1, and the notch place of ultrasonic tank 1 is overlapped with the support 3 that is used to place silicon chip; On support 3, be connected with collecting net 7 through connecting rod 31, the bottom of ultrasonic tank 1 is provided with ultrasonic oscillator 4; Also be provided with circulating water line 5 on the ultrasonic tank 1, be connected with shower nozzle 6 through filter 51 and suction pump 52 on the circulating water line 5.When the water level of ultrasonic tank 1 is not enough, open the Water filling valve 8 of ultrasonic tank 1 top, when water level is too high, opening water discharge valve 2.When the water in the ultrasonic tank 1 is limpid gradually, open suction pump 52, clear water is sprayed through shower nozzle 6 through filter 51 backs, shower nozzle 6 is squeezed into clear water in the ultrasonic tank 1 by manually-operated control water (flow) direction and position again, reaches the effect of wash cycles.The ultrasonic wave that takes place through ultrasonic oscillator 4 cleans residue on the silicon chip and metal impurities.
Claims (2)
1. ultrasonic silicon wafer cleaner, it comprises ultrasonic tank (1), it is characterized in that being provided with water discharging valve (2) in a side of ultrasonic tank (1), and the notch place of ultrasonic tank (1) is overlapped with the support (3) that is used to place silicon chip, and the bottom of ultrasonic tank (1) is provided with ultrasonic oscillator (4); Also be provided with circulating water line (5) on the ultrasonic tank (1), circulating water line (5) is gone up and is connected with shower nozzle (6) through filter (51) and suction pump (52).
2. ultrasonic silicon wafer cleaner according to claim 1 is characterized in that upward being connected with collecting net (7) through connecting rod (31) at support (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205733301U CN202427679U (en) | 2011-12-31 | 2011-12-31 | Ultrasonic cleaning machine for silicon wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205733301U CN202427679U (en) | 2011-12-31 | 2011-12-31 | Ultrasonic cleaning machine for silicon wafers |
Publications (1)
Publication Number | Publication Date |
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CN202427679U true CN202427679U (en) | 2012-09-12 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011205733301U Expired - Fee Related CN202427679U (en) | 2011-12-31 | 2011-12-31 | Ultrasonic cleaning machine for silicon wafers |
Country Status (1)
Country | Link |
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CN (1) | CN202427679U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102873056A (en) * | 2012-10-12 | 2013-01-16 | 瓮福(集团)有限责任公司 | Cleaning device of sprayers for phosphoric acid and control method thereof |
CN103000897A (en) * | 2012-12-12 | 2013-03-27 | 大力电工襄阳股份有限公司 | Method and device for removing fragments in electrode material |
CN104289471A (en) * | 2014-09-30 | 2015-01-21 | 张家港市圣美隆羊绒制品有限公司 | Impeller type ultrasonic cleaner for textile spindles |
CN104289470A (en) * | 2014-09-30 | 2015-01-21 | 张家港市圣美隆羊绒制品有限公司 | Sweeper type ultrasonic cleaner for spinning spindle |
CN106733895A (en) * | 2015-11-20 | 2017-05-31 | 无锡南方声学工程有限公司 | A kind of supersonic wave cleaning machine inner support structure |
CN106733900A (en) * | 2015-11-20 | 2017-05-31 | 无锡南方声学工程有限公司 | A kind of ultrasonic vibration box structure of belt supporting frame |
-
2011
- 2011-12-31 CN CN2011205733301U patent/CN202427679U/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102873056A (en) * | 2012-10-12 | 2013-01-16 | 瓮福(集团)有限责任公司 | Cleaning device of sprayers for phosphoric acid and control method thereof |
CN103000897A (en) * | 2012-12-12 | 2013-03-27 | 大力电工襄阳股份有限公司 | Method and device for removing fragments in electrode material |
CN103000897B (en) * | 2012-12-12 | 2015-06-03 | 大力电工襄阳股份有限公司 | Method and device for removing fragments in electrode material |
CN104289471A (en) * | 2014-09-30 | 2015-01-21 | 张家港市圣美隆羊绒制品有限公司 | Impeller type ultrasonic cleaner for textile spindles |
CN104289470A (en) * | 2014-09-30 | 2015-01-21 | 张家港市圣美隆羊绒制品有限公司 | Sweeper type ultrasonic cleaner for spinning spindle |
CN106733895A (en) * | 2015-11-20 | 2017-05-31 | 无锡南方声学工程有限公司 | A kind of supersonic wave cleaning machine inner support structure |
CN106733900A (en) * | 2015-11-20 | 2017-05-31 | 无锡南方声学工程有限公司 | A kind of ultrasonic vibration box structure of belt supporting frame |
CN106733900B (en) * | 2015-11-20 | 2019-11-29 | 无锡南方声学工程有限公司 | A kind of ultrasonic vibration box structure of belt supporting frame |
CN106733895B (en) * | 2015-11-20 | 2020-03-24 | 无锡南方声学工程有限公司 | Inner support structure of ultrasonic cleaning machine |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120912 Termination date: 20141231 |
|
EXPY | Termination of patent right or utility model |