CN204289404U - A kind of silicon wafer cleaning tank - Google Patents
A kind of silicon wafer cleaning tank Download PDFInfo
- Publication number
- CN204289404U CN204289404U CN201420703272.3U CN201420703272U CN204289404U CN 204289404 U CN204289404 U CN 204289404U CN 201420703272 U CN201420703272 U CN 201420703272U CN 204289404 U CN204289404 U CN 204289404U
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- rinse bath
- silicon chip
- wafer cleaning
- overfall
- cleaning tank
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Abstract
The utility model discloses a kind of silicon wafer cleaning tank, relate to Wafer Cleaning technical field, rinse bath is rectangular shape, water inlet and overfall is provided with on the top of rinse bath, the height of described overfall is lower than the height of water inlet, the trough floor of described rinse bath is the steel plate that can shake, and the outside bottom surface of described steel plate is connected with ultrasonic transducer.This device utilizes the impurity of vibration of ultrasonic wave to silicon chip surface to clean, and effectively can remove the materials such as the mortar of silicon chip surface attachment, and can observe the cleaning situation of silicon chip surface intuitively, simple and quick.
Description
Technical field
The utility model relates to Wafer Cleaning technical field.
Background technology
Solar energy is maximum free of contamination renewable resource, inexhaustible, nexhaustible, is one of emphasis of mankind's using energy source from now on.Since last century end, along with the whole world is to the sharp increase of energy resource consumption, the threat of traditional energy exhaustion, and polysilicon, monocrystalline silicon generation technology development, solar photovoltaic industry is in the ascendant.
Along with the development of solar level monocrystalline silicon piece, the requirement of client to Si wafer quality is more and more harsh, and silicon chip surface cleanliness factor directly affects the conversion efficiency of silicon chip, so client is to silicon chip surface quality requirement all the more strict.In addition along with the adjustment of cutting technique, the mortar used in cutting constantly reclaims use, and cause mortar comparatively strong in silicon chip surface attachment, cleaning is difficulty comparatively, causes oxidation sheet frequently to produce, carries out improving and improving with regard to this situation spy to current cleaning equipment.
For solving the problem, now before silicon chip enters cleaning line, with the addition of a silicon wafer cleaning tank, in advance silicon chip being cleaned.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of silicon wafer cleaning tank, and this device utilizes the impurity of vibration of ultrasonic wave to silicon chip surface to clean, and effectively can remove the materials such as the mortar of silicon chip surface attachment, simple and quick.
The technical scheme taked for the utility model that solves the problem is: a kind of silicon wafer cleaning tank, described rinse bath is rectangular shape, water inlet and overfall is provided with on the top of rinse bath, the height of described overfall is lower than the height of water inlet, the trough floor of described rinse bath is the steel plate that can shake, and the outside bottom surface of described steel plate is connected with ultrasonic transducer.
Preferably, the bottom land of described rinse bath is also provided with discharge outlet.
Preferably, the groove width of described rinse bath 1.2 meters, long 1.8 meters, in groove, the degree of depth is 20 centimetres, and preferably, the distance of described overfall distance groove top mouth is 2 centimetres.
The beneficial effect adopting technique scheme to produce is: Wafer Cleaning line is directly perceived not when cleaning silicon chip, can not observe the cleaning situation of silicon chip, and cleaning performance is not very desirable, so before silicon chip enters into cleaning line, with the addition of a rinse bath, the in-built full water of rinse bath, and be the water of flowing, constantly carry out into water and water outlet by water inlet and overfall, make the water circulation in rinse bath, silicon chip is placed in the plastics gaily decorated basket, then the hand-held plastics gaily decorated basket puts it in the trough floor of rinse bath, open the ultrasonic transducer be connected with bottom land, produce ultrasonic wave, water in groove shakes under the vibrations of steel plate thereupon, Ultrasonic Cleaning can effectively remove the impurity such as the mortar of silicon chip surface, and directly cleaning situation is observed by human eye, more directly perceived, so this device cleaning performance is good, simple to operation, very practical.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Fig. 1 structural representation of the present utility model.
Wherein, 1, rinse bath, 2, water inlet, 3, overfall, 4, steel plate, 5, ultrasonic transducer, 6, discharge outlet.
Embodiment
As shown in Figure 1: a kind of silicon wafer cleaning tank, rinse bath 1 is rectangular shape, water inlet 2 and overfall 3 is provided with on the top of rinse bath 1, the height of described overfall 3 is lower than the height of water inlet 2, the trough floor of described rinse bath 1 is the steel plate 4 that can shake, and the outside bottom surface of described steel plate 4 is connected with ultrasonic transducer 5.The bottom land of described rinse bath 1 is also provided with discharge outlet 6.The groove width of described rinse bath 1 1.2 meters, long 1.8 meters, in groove, the degree of depth is 20 centimetres, and described overfall 3 is 2 centimetres apart from the distance of groove top mouth.
What first this cleaning device utilized is that ultrasonic wave cleans, and utilizes ultrasonic transducer 5 to produce ultrasonic wave, is made the water resonance in groove by steel plate 4, is opposite to the plastics gaily decorated basket and the silicon chip surface be immersed in water cleans, and cleaning performance is remarkable.
Wafer Cleaning line is directly perceived not when cleaning silicon chip, can not observe the cleaning situation of silicon chip, and cleaning performance is not very desirable, so before silicon chip enters into cleaning line, with the addition of a rinse bath 1, the in-built full water of rinse bath 1, and be the water of flowing, constantly carry out into water and water outlet by water inlet 2 and overfall 3, make the water circulation in rinse bath 1, silicon chip is placed in the plastics gaily decorated basket, then the hand-held plastics gaily decorated basket puts it in the trough floor of rinse bath 1, open the ultrasonic transducer 5 be connected with bottom land, produce ultrasonic wave, water in groove shakes under the vibrations of steel plate 4 thereupon, Ultrasonic Cleaning can effectively remove the impurity such as the mortar of silicon chip surface, and directly cleaning situation is observed by human eye, more directly perceived, so this device cleaning performance is good, simple to operation, very practical.
In sum: this device utilizes the impurity of vibration of ultrasonic wave to silicon chip surface to clean, the materials such as the mortar of silicon chip surface attachment effectively can be removed, simple and quick.
Claims (3)
1. a silicon wafer cleaning tank, it is characterized in that: described rinse bath (1) is rectangular shape, water inlet (2) and overfall (3) is provided with on the top of rinse bath (1), the height of described overfall (3) is lower than the height of water inlet (2), the trough floor of described rinse bath (1) is the steel plate (4) that can shake, and the outside bottom surface of described steel plate (4) is connected with ultrasonic transducer (5).
2. a kind of silicon wafer cleaning tank according to claim 1, is characterized in that: the bottom land of described rinse bath (1) is also provided with discharge outlet (6), and the quantity of described ultrasonic transducer (5) is 3.
3. a kind of silicon wafer cleaning tank according to claim 2, is characterized in that: the groove width of described rinse bath (1) 1.2 meters, and long 1.8 meters, in groove, the degree of depth is 20 centimetres, and the distance of described overfall (3) distance groove top mouth is 2 centimetres.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420703272.3U CN204289404U (en) | 2014-11-21 | 2014-11-21 | A kind of silicon wafer cleaning tank |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420703272.3U CN204289404U (en) | 2014-11-21 | 2014-11-21 | A kind of silicon wafer cleaning tank |
Publications (1)
Publication Number | Publication Date |
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CN204289404U true CN204289404U (en) | 2015-04-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420703272.3U Expired - Fee Related CN204289404U (en) | 2014-11-21 | 2014-11-21 | A kind of silicon wafer cleaning tank |
Country Status (1)
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CN (1) | CN204289404U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108766866A (en) * | 2018-05-25 | 2018-11-06 | 南京八度阳光太阳能科技有限公司 | A kind of fluff making device used for solar batteries |
CN109092779A (en) * | 2018-07-26 | 2018-12-28 | 武汉华星光电技术有限公司 | Eyeglass soaking box |
CN109158373A (en) * | 2018-11-09 | 2019-01-08 | 江苏德润光电科技有限公司 | A kind of polysilicon chip Intelligent cleaning device |
-
2014
- 2014-11-21 CN CN201420703272.3U patent/CN204289404U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108766866A (en) * | 2018-05-25 | 2018-11-06 | 南京八度阳光太阳能科技有限公司 | A kind of fluff making device used for solar batteries |
CN109092779A (en) * | 2018-07-26 | 2018-12-28 | 武汉华星光电技术有限公司 | Eyeglass soaking box |
WO2020019719A1 (en) * | 2018-07-26 | 2020-01-30 | 武汉华星光电技术有限公司 | Lens soaking container |
CN109158373A (en) * | 2018-11-09 | 2019-01-08 | 江苏德润光电科技有限公司 | A kind of polysilicon chip Intelligent cleaning device |
CN109158373B (en) * | 2018-11-09 | 2023-10-10 | 江苏德润光电科技有限公司 | Intelligent belt cleaning device of polycrystalline silicon piece |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20181121 |
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CF01 | Termination of patent right due to non-payment of annual fee |