CN204564661U - Bonding gold wire ultrasonic bubble cleaning device - Google Patents
Bonding gold wire ultrasonic bubble cleaning device Download PDFInfo
- Publication number
- CN204564661U CN204564661U CN201520205177.5U CN201520205177U CN204564661U CN 204564661 U CN204564661 U CN 204564661U CN 201520205177 U CN201520205177 U CN 201520205177U CN 204564661 U CN204564661 U CN 204564661U
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- China
- Prior art keywords
- foam
- mold slots
- water inlet
- cleaning device
- supersonic generator
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- Expired - Fee Related
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Abstract
The utility model relates to a kind of bonding gold wire ultrasonic bubble cleaning device, comprise water leg, mold slots, supersonic generator, circulating pump, cyclic water tank, foam transmitting tube, foam maker, foam control valve, filter, water inlet pipe, return pipe, in described water leg, be provided with mold slots, supersonic generator.The beneficial effects of the utility model are, can clean the outer surface of para-linkage spun gold, have high-quality, the distinguishing feature such as laborsaving, efficient and pollution-free.Easy to use, structure is simple, automatically cleans, and cleaning speed is fast, cleaning is more thorough, can reach completely clean object, can not cause damage by para-linkage spun gold.
Description
Technical field:
The utility model relates to a kind of cleaning device, especially a kind of bonding gold wire ultrasonic bubble cleaning device.
Background technology:
Ultrasonic Cleaning is the cavitation effect utilizing ultrasonic wave in liquid medium, the object surfaces externally and internally of liquid medium place of arrival is cleaned, there is high-quality, the distinguishing feature such as laborsaving, efficient and pollution-free, in west, advanced industrial country is widely applied, achieves very large economic benefit.China also starts progressively to promote the use of this new technology.In currently available technology, bonding gold supersonic wave cleaning machine is single line ultrasonic cleaning technology, and the speed passed through in cleaning device due to need of production bonding gold wire is very fast, and that therefore cleans is thorough not, does not reach completely clean object.
Summary of the invention:
In order to overcome the deficiencies in the prior art, the utility model object be to provide a kind of easy to use, structure is simple, cleaning performance better bonding gold wire ultrasonic bubble cleaning device.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of bonding gold wire ultrasonic bubble cleaning device, comprise water leg, mold slots, supersonic generator, circulating pump, cyclic water tank, foam transmitting tube, foam maker, foam control valve, filter, water inlet pipe, return pipe, in described water leg, be provided with mold slots, supersonic generator, be provided with discharge outlet in described water leg bottom surface.Be provided with foam maker in described mold slots, the side of mold slots is provided with water inlet, is provided with upper cover on its top, and described discharge outlet is connected with return pipe, and water inlet is connected with water inlet pipe, and return pipe, water inlet pipe are connected with cyclic water tank.Water inlet pipe is provided with circulating pump, return pipe is provided with filter.Be provided with foam emission port in the side of described supersonic generator, described foam emission port is connected with foam maker by foam transmitting tube, is provided with foam control valve in the side of described supersonic generator.
The length of described mold slots and the wide length that is less than water leg and wide, mold slots tall and big in the height of water leg, is provided with entrance hole and wire hole in the both sides of mold slots, is provided with rubber tube at entrance hole and wire hole, reduce the damage that metal wallboard para-linkage spun gold causes.
The both sides of described mold slots are provided with gap, when the water in mold slots is higher than gap, just flow out from gap.
The beneficial effects of the utility model are, can clean the outer surface of para-linkage spun gold, have high-quality, the distinguishing feature such as laborsaving, efficient and pollution-free.Easy to use, structure is simple, automatically cleans, and cleaning speed is fast, cleaning is more thorough, can reach completely clean object, can not cause damage by para-linkage spun gold.
Accompanying drawing illustrates:
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of the utility model upper cover.
In figure: 1 water leg, 2 mold slots, 3 supersonic generators, 4 circulating pumps, 5 cyclic water tanks, 6 foam transmitting tubes, 7 foam control valves, 8 foam makers, 9 filters, 10 water inlet pipes, 11 return pipes, 12 entrance holes, 13 wire holes, 14 gaps, 15 upper covers.
Detailed description of the invention:
As shown in Figure 1-2, a kind of bonding gold wire ultrasonic bubble cleaning device, comprise water leg (1), mold slots (2), supersonic generator (3), circulating pump (4), cyclic water tank (5), foam transmitting tube (6), foam maker (8), foam control valve (7), filter (9), water inlet pipe (10), return pipe (11), in described water leg (1), be provided with mold slots (2), supersonic generator (3), be provided with discharge outlet in described water leg (1) bottom surface.The length of described mold slots (2) and the wide length that is less than water leg (1) and wide, mold slots (2) tall and big in the height of water leg (1), entrance hole (12) and wire hole (13) is provided with in the both sides of mold slots (2), be provided with rubber tube at entrance hole (12) and wire hole (13), reduce the damage that metal wallboard para-linkage spun gold causes.The both sides of mold slots (2) are provided with gap (14), when the water in mold slots (2) is higher than gap (14), just flow out from gap (14).Foam maker (8) is provided with in mold slots (2), the side of mold slots (2) is provided with water inlet, is provided with upper cover (15) on its top, described discharge outlet is connected with return pipe (11), water inlet is connected with water inlet pipe (10), and return pipe (11), water inlet pipe (10) are connected with cyclic water tank (5).Water inlet pipe (10) is provided with circulating pump (4), return pipe (11) is provided with filter (9).Be provided with foam emission port and foam control valve (7) in the side of described supersonic generator (3), foam emission port is connected with foam maker (8) by foam transmitting tube (6).
Operation principle: when para-linkage line cleans, water in cyclic water tank (5) is drawn in mold box by circulating pump (4), simultaneously, supersonic generator (3) produces ultrasonic wave, ultrasonic wave entered foam emission port, foam transmitting tube (6) enters foam maker (8), foam maker (8) produces a large amount of bubble, and para-linkage line cleans.Clean and drop to dirt and flow in water leg (1), then flow to filter (9) through discharge outlet and return pipe (11) and filter.Current after filtering return cyclic water tank (5), circulate and so forth, and constantly para-linkage line cleans.
Claims (3)
1. a bonding gold wire ultrasonic bubble cleaning device, it is characterized in that: comprise water leg, mold slots, supersonic generator, circulating pump, cyclic water tank, foam transmitting tube, foam maker, foam control valve, filter, water inlet pipe, return pipe, in described water leg, be provided with mold slots, supersonic generator, be provided with discharge outlet in described water leg bottom surface; Be provided with foam maker in described mold slots, the side of mold slots is provided with water inlet, is provided with upper cover on its top, and described discharge outlet is connected with return pipe, and water inlet is connected with water inlet pipe, and return pipe, water inlet pipe are connected with cyclic water tank; Water inlet pipe is provided with circulating pump, return pipe is provided with filter; Be provided with foam emission port and foam control valve in the side of described supersonic generator, described foam emission port is connected with foam maker by foam transmitting tube.
2. bonding gold wire ultrasonic bubble cleaning device according to claim 1, it is characterized in that: the length of described mold slots and the wide length that is less than water leg and wide, mold slots tall and big in the height of water leg, be provided with entrance hole and wire hole in the both sides of mold slots, be provided with rubber tube at entrance hole and wire hole.
3. bonding gold wire ultrasonic bubble cleaning device according to claim 1, is characterized in that: the both sides of described mold slots are provided with gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520205177.5U CN204564661U (en) | 2015-04-01 | 2015-04-01 | Bonding gold wire ultrasonic bubble cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520205177.5U CN204564661U (en) | 2015-04-01 | 2015-04-01 | Bonding gold wire ultrasonic bubble cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204564661U true CN204564661U (en) | 2015-08-19 |
Family
ID=53857354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520205177.5U Expired - Fee Related CN204564661U (en) | 2015-04-01 | 2015-04-01 | Bonding gold wire ultrasonic bubble cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204564661U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107052081A (en) * | 2017-06-07 | 2017-08-18 | 郑州千兆美电子新材料科技有限公司 | A kind of online bubble explosion cleaning device of bonding wire |
| CN109570134A (en) * | 2018-11-28 | 2019-04-05 | 重庆市润金新材料科技有限公司 | A kind of bonding gold wire cleaning device |
-
2015
- 2015-04-01 CN CN201520205177.5U patent/CN204564661U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107052081A (en) * | 2017-06-07 | 2017-08-18 | 郑州千兆美电子新材料科技有限公司 | A kind of online bubble explosion cleaning device of bonding wire |
| CN109570134A (en) * | 2018-11-28 | 2019-04-05 | 重庆市润金新材料科技有限公司 | A kind of bonding gold wire cleaning device |
| CN109570134B (en) * | 2018-11-28 | 2020-08-14 | 重庆市润金新材料科技有限公司 | Bonding gold wire belt cleaning device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 277500 west side of Yikang Road, Tengzhou Economic Development Zone, Shandong Patentee after: Tengzhou Chenhui electronic group Limited by Share Ltd Address before: 277500 west side of Yikang Road, Tengzhou Economic Development Zone, Shandong Patentee before: TENGZHOU CHENHUI ELECTRONICS GROUP LIMITED |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20170401 |