CN104979235A - Wafer soaking device - Google Patents
Wafer soaking device Download PDFInfo
- Publication number
- CN104979235A CN104979235A CN201410143157.XA CN201410143157A CN104979235A CN 104979235 A CN104979235 A CN 104979235A CN 201410143157 A CN201410143157 A CN 201410143157A CN 104979235 A CN104979235 A CN 104979235A
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- wafer
- reservoir
- electric actuator
- film magazine
- infuser device
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- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of wafer wet processing in the semiconductor industry and specifically relates to a wafer soaking device which meets wafer soaking requirements. A liquid storage tank and an electric actuator are arranged on a bottom board; a wafer box is arranged in the liquid storage tank; one end of a lifting connection rod is connected with the output end of the electric actuator, and the other end is inserted into the liquid storage tank and is hinged with the wafer box; the tank groove of the upper portion of the liquid storage tank is provided with a wafer feeding window for allowing a mechanical arm to feed the wafers into the wafer box; the electric actuator drives the lifting connection rod to drive the wafer box to go up and down, so that the wafer box is allowed to rise to the height corresponding to the wafer feeding window to facilitate to fetch and release the wafers, or the wafer box is allowed to decline and be immersed into chemical liquid for soaking the wafers; the inner upper and lower two sides of the wafer feeding window are respectively provided with an air blowpipe arranged on the liquid storage tank; the air blowpipes are communicated with an air source; and each air blowpipe is uniformly provided with a plurality of air mouths. The wafer soaking device realizes uniformity of soaking time of each signal wafer and waiting time after the wafer is taken out, and realizes higher requirements for wafer soaking in the wet processing process.
Description
Technical field
The invention belongs to semicon industry wafer wet process field, specifically a kind of wafer infuser device meeting wafer immersion demand.
Background technology
At present, wafer wet treatment process in semicon industry is often needed to use chemical liquids to carry out immersion treatment to wafer.And current wafer immersion way, be generally adopt whole box wafer to put into chemical liquid bath to soak, after arriving the scheduled time, whole box takes out the PROCESS FOR TREATMENT of carrying out next step more simultaneously; But there will be the situation that each wafer processes successively when next step PROCESS FOR TREATMENT, the time so just causing the wait of whole box wafer every a slice is all different, may affect the quality of final chip.So the homogeneity how realizing each wafer soak time is an inevitable problem.
Summary of the invention
Single-wafer soak time and the homogeneity problem of stand-by period after taking out during in order to solve wafer immersion treatment, main purpose of the present invention is to provide a kind of timesharing to pass sheet, meet wafer infuser device wafer being soaked to requirements at the higher level.
Another object of the present invention is to provide a kind of wafer infuser device improving treatment effeciency and uniformity.
The object of the invention is to be achieved through the following technical solutions:
The present invention includes film magazine, reservoir, base plate, electric actuator, lifting linking member, biography sheet window, gas blow pipe and valve, wherein reservoir and electric actuator are arranged on base plate respectively, film magazine is positioned at reservoir, one end of described lifting linking member is connected with the output of electric actuator, and it is interior, hinged with described film magazine that the other end inserts reservoir; Bottom in described reservoir fills soaks the chemical liquids of wafer, the cell wall on top has the biography sheet window sent into by wafer for manipulator in film magazine; Described electric actuator drives lifting linking member to drive film magazine lifting, makes film magazine rise to the height corresponding with described biography sheet window and gets/put wafer, or film magazine is declined be immersed in below chemical liquids to soak wafer; The both sides up and down of described biography sheet window inner side are respectively equipped with the gas blow pipe be arranged on reservoir, this gas blow pipe is connected with source of the gas, every root gas blow pipe is evenly equipped with multiple valve respectively, and described valve is got in the process of wafer at described manipulator and is blown to the surface of wafer.
Wherein: one end of described lifting linking member is connected with the output of electric actuator by connecting plate, this connecting plate is provided with tilt cylinders, the output of described tilt cylinders is connected with one end of tilt linkage, the other end insertion reservoir of described tilt linkage is interior, hinged with described film magazine, and described tilt cylinders drives tilt linkage to drive film magazine to tilt backwards; The bottom filling chemical liquids in described reservoir is provided with supersonic generator; Described electric actuator is fixed on base plate by support, and the output of electric actuator is connected with mounting panel, and one end and the mounting panel of described connecting plate are affixed, and the other end is connected with one end of described lifting linking member; Described tilt cylinders, between lifting linking member one end and mounting panel, drives lifting with connecting plate and mounting panel by electric actuator; Described tilt linkage parallels with lifting linking member;
Valve on described upper and lower two gas blow pipes is all obliquely installed, and each valve be positioned on the gas blow pipe of described biography sheet window inside front is downward-sloping, and each valve be positioned on the gas blow pipe below described biography sheet window inner side is inclined upwardly;
Described reservoir is provided with lift cylinder away from the top of electric actuator side, and the output of this lift cylinder is connected with the baffle plate passing sheet window described in switch; The lower external face that described reservoir fills chemical liquids posts heating plate; The end face of described reservoir has exhaust outlet, and the bottom surface and base plate of reservoir have leakage fluid dram; Inside or the outside of described reservoir are provided with liquid level sensor, be arranged on described reservoir and fill on the internal groove side wall of chemical liquids bottom when this liquid level sensor is positioned at reservoir inside; When described liquid level sensor is positioned at reservoir outside, be arranged on liquid level cross over pipe, the bottom of UNICOM in reservoir and the top of reservoir respectively, two ends of described liquid level cross over pipe; The cell wall on described reservoir top has maintenance window.
Advantage of the present invention and good effect are:
1. the present invention passes the mode of sheet by timesharing, drives lifting linking member to drive film magazine lifting by electric actuator, the homogeneity of stand-by period after achieving monolithic soak time and taking out; While taking-up wafer, the valve on gas blow pipe is blown respectively to the upper and lower surface of wafer, removes the moisture film of wafer surface, achieves in wet treatment process the requirements at the higher level that wafer soaks.
2. film magazine can be tilted backwards set angle, to ensure that wafer can not skid off film magazine when film magazine immerses in chemical liquids by the present invention; And film magazine can vibration by a small margin below chemical liquid level under the state of hypsokinesis, to accelerate treatment effeciency and uniformity.
3. the present invention is provided with at biography sheet window place the baffle plate controlled by lift cylinder, when wafer soaks, ensures that reservoir is a closed cavity; Wafer is immersed in closed cavity, can reduce chemical liquids volatilization and the impact on environment in limits ground very much.
4. the outer surface of reservoir bottom of the present invention has pasted heating plate, chemical liquids in liquid storage groove can be heated, to reduce process treatment time.
5. reservoir of the present invention establishes exhaust outlet and leakage fluid dram respectively, achieve the discharge of chemical liquids and the discharge of gas.
6. reservoir of the present invention inner or outer setting liquid level sensor, can monitor the change of chemical liquids liquid level in reservoir constantly.
7. the present invention has offered maintenance window on the cell wall of reservoir, is convenient to observe wafer and soaks situation.
8. structure of the present invention is simple, and be swift in response, easy for installation, cost is low.
Accompanying drawing explanation
Fig. 1 is external overall structural representation of the present invention;
Fig. 2 is internal structure schematic diagram of the present invention;
Fig. 3 is the structural representation of gas blow pipe of the present invention and valve;
Wherein: 1 is wafer, 2 is film magazine, and 3 is reservoir, and 4 is base plate, 5 is support, and 6 is electric actuator, and 7 is supersonic generator, and 8 is maintenance window, 9 is tilt linkage, and 10 is tilt cylinders, and 11 is lifting linking member, and 12 for passing sheet window, 13 is heating plate, and 14 is baffle plate, and 15 is lift cylinder, and 16 is mounting panel, 17 is connecting plate, and 18 is exhaust outlet, and 19 is leakage fluid dram, and 20 is gas blow pipe, 21 is valve, and 22 is liquid level sensor, and 23 is liquid level cross over pipe.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1 and Figure 2, the present invention includes film magazine 2, reservoir 3, base plate 4, support 5, electric actuator 6, supersonic generator 7, tilt linkage 9, tilt cylinders 10, lifting linking member 11, pass sheet window 12, heating plate 13, baffle plate 14, lift cylinder 15, mounting panel 16, connecting plate 17, gas blow pipe 20 and valve 21, wherein reservoir 3 is fixed on base plate 4, for closed cavity, the top of reservoir 3 is cuboid or square, and bottom is barrel-shaped; Electric actuator 6 is fixed on base plate 4 by support 5, and is positioned at the side of reservoir 3.Film magazine 2 is positioned at reservoir 3, can load more wafers 1 in film magazine 2; The output of electric actuator 6 and one end of mounting panel 16 are connected, and one end of lifting linking member 11 is affixed with the other end of mounting panel 16 by connecting plate 17, and the other end of lifting side rod 11 inserts in reservoir 3, with described film magazine 2 and passes through rod hinge connection; The tilt cylinders 10 connecting plate 17 being also connected with tilt cylinders 10(the present embodiment can be replaced by linear electric motors), on the connecting plate 17 of this tilt cylinders 10 between lifting linking member 11 one end and mounting panel 16 other end, lifting is driven by electric actuator 6 with connecting plate 17 and mounting panel 16, the output of tilt cylinders 10 is connected with one end of tilt linkage 9, the other end of tilt linkage 9 inserts in reservoir 3, with described film magazine 2 and passes through rod hinge connection, parallels between lifting linking member 11 and tilt linkage 9.The bottom filling chemical liquids in reservoir 3 is provided with supersonic generator 7, and chemical liquids can be made to vibrate by a small margin.
The cell wall on reservoir 3 top has and passes sheet window 12 and maintenance window 8, the present embodiment is in the middle of four sides of the reservoir 3 of cuboid or square, wherein have away from the one side of electric actuator 6 and send in film magazine 2 by wafer 1 for manipulator or from film magazine 2, take out the biography sheet window 12 of wafer 1, the one side towards electric actuator 6 offers maintenance window 8.The both sides up and down passed inside sheet window 12 are respectively equipped with the gas blow pipe 20 be fixed on reservoir 3 internal groove side wall, and every root gas blow pipe 20 is all connected with source of the gas; Every root gas blow pipe 20 is evenly equipped with multiple valve 21 respectively, and described valve 21 is got at manipulator in the process of wafer 1 and is blown to the surface of wafer 1.Valve 21 on upper and lower two gas blow pipes 20 is all obliquely installed, and each valve 21 be positioned on the gas blow pipe 20 passing sheet window 12 inside front is downward-sloping, and each valve 21 be positioned on the gas blow pipe 20 passing sheet window 12 side-lower is inclined upwardly; The each valve 21 of the present embodiment all tilts 45 °, blows in the process that wafer 1 is taken out by manipulator respectively to the upper and lower surface of wafer 1.
Offer at reservoir 3 top passing sheet window 12 one side and be provided with lift cylinder 15, the output of this lift cylinder 15 is connected with the baffle plate 14 that switch passes sheet window 12.Bottom in reservoir 3 fills the chemical liquids of soaking wafer 1, posts heating plate 13 at the outer surface of bottom; The end face of reservoir 3 has exhaust outlet 18, and the bottom surface of reservoir 3 and base plate 4 have leakage fluid dram 19, achieves the discharge of chemical liquids and the discharge of gas.Electric actuator 6 drives lifting linking member 11 to drive film magazine 2 to be elevated, make film magazine 2 rise to the height corresponding with passing sheet window 12 and get/put wafer 1, or film magazine 2 is declined be immersed in below chemical liquids and soak wafer 1, tilt cylinders 10 drives tilt linkage 9 to drive film magazine 2 to tilt backwards.
In the inside of reservoir 3 or outside, liquid level sensor 22 is installed, is arranged on reservoir 3 when this liquid level sensor 22 is positioned at reservoir 3 inside and fills on the internal groove side wall of chemical liquids bottom; Liquid level sensor 22 be positioned at reservoir 3 outside time, be arranged on liquid level cross over pipe 23, the two ends of this liquid level cross over pipe 23 respectively UNICOM in the top of the bottom of reservoir 3 and reservoir 3; The liquid level sensor 22 of the present embodiment is positioned at the outside of reservoir 3, can monitor the liquid level of chemical liquids in reservoir 3.
Operation principle of the present invention is:
When carrying out PROCESS FOR TREATMENT, the chemical liquids in reservoir 3 can be heated by heating plate 13; When wafer 1 fetched and delivered by needs, electric actuator 6 drives lifting linking member 11 to drive film magazine 2 to rise to the position corresponding with passing sheet window 12, and tilt cylinders 10 and tilt linkage 9 are along with together rising; Then, tilt cylinders 10 rises, and drives tilt linkage 9 to make film magazine 2 maintenance level; Lift cylinder 15 drives baffle plate 14 to rise, and after biography sheet window 12 is opened, manipulator can carry out the action of fetching and delivering wafer 1.After wafer 1 has been placed, lift cylinder 15 has driven baffle plate 14 to decline, and blocks and passes sheet window 12; Tilt cylinders 10 is retracted, and make film magazine 2 tilt backwards the angle of setting, then lifting linking member 11 slowly declines under the drive of electric actuator 6, until film magazine 2 and wafer 1 are immersed in below liquid level.After soak time is specified in arrival, contrary action is taked to take out wafer.
Wafer 1 constantly can be sent in film magazine 2, until film magazine 2 is piled by the time interval of presetting by manipulator; Film magazine 2 can vibration by a small margin below chemical liquid level under the state of hypsokinesis, to accelerate treatment effeciency and uniformity.The present invention can soak more wafers simultaneously, and the soak time of each wafer can be specified, after any a slice wafer 1 soak time arrives the fixed time, this wafer 1 will be taken out by manipulator, valve 21 in the process of taking out on upper and lower gas blow pipe 20 starts to blow, the moisture film of wafer 1 upper and lower surface is removed, achieves the requirements at the higher level to wafer immersion in wet treatment process, compensate for the limitation of immersion way while of whole box wafer.
Claims (10)
1. a wafer infuser device, it is characterized in that: comprise film magazine (2), reservoir (3), base plate (4), electric actuator (6), lifting linking member (11), pass sheet window (12), gas blow pipe (20) and valve (21), wherein reservoir (3) and electric actuator (6) are arranged on base plate (4) respectively, film magazine (2) is positioned at reservoir (3), one end of described lifting linking member (11) is connected with the output of electric actuator (6), and it is interior, hinged with described film magazine (2) that the other end inserts reservoir (3); Bottom in described reservoir (3) fills the chemical liquids of soaking wafer (1), the cell wall on top has the biography sheet window (12) in wafer (1) feeding film magazine (2) for manipulator; Described electric actuator (6) drives lifting linking member (11) to drive film magazine (2) lifting, make film magazine (2) rise to the height corresponding with described biography sheet window (12) and get/put wafer (1), or film magazine (2) is declined be immersed in below chemical liquids and soak wafer (1); The both sides up and down of described biography sheet window (12) inner side are respectively equipped with the gas blow pipe (20) be arranged on reservoir (3), this gas blow pipe (20) is connected with source of the gas, every root gas blow pipe (20) is evenly equipped with multiple valve (21) respectively, and described valve (21) is got at described manipulator in the process of wafer (1) and is blown to the surface of wafer (1).
2. by wafer infuser device according to claim 1, it is characterized in that: one end of described lifting linking member (11) is connected with the output of electric actuator (6) by connecting plate (17), this connecting plate (17) is provided with tilt cylinders (10), the output of described tilt cylinders (10) is connected with one end of tilt linkage (9), other end insertion reservoir (3) of described tilt linkage (9) is interior, hinged with described film magazine (2), and described tilt cylinders (10) drives tilt linkage (9) to drive film magazine (2) to tilt backwards; The bottom filling chemical liquids in described reservoir (3) is provided with supersonic generator (7).
3. by wafer infuser device according to claim 2, it is characterized in that: described electric actuator (6) is fixed on base plate (4) by support (5), the output of electric actuator (6) is connected with mounting panel (16), one end and the mounting panel (16) of described connecting plate (17) are affixed, and the other end is connected with the one end of described lifting linking member (11).
4. by wafer infuser device according to claim 3, it is characterized in that: described tilt cylinders (10) is positioned between lifting linking member (11) one end and mounting panel (16), drive lifting with connecting plate (17) and mounting panel (16) by electric actuator (6); Described tilt linkage (9) parallels with lifting linking member (11).
5. by the wafer infuser device described in claim 1 or 2, it is characterized in that: the valve (21) on described upper and lower two gas blow pipes (20) is all obliquely installed, the each valve (21) be positioned on the gas blow pipe (20) of described biography sheet window (12) inside front is downward-sloping, and each valve (21) be positioned on the gas blow pipe (20) of described biography sheet window (12) side-lower is inclined upwardly.
6. by the wafer infuser device described in claim 1 or 2, it is characterized in that: described reservoir (3) is provided with lift cylinder (15) away from the top of electric actuator (6) side, the output of this lift cylinder (15) is connected with the baffle plate (14) passing sheet window (12) described in switch.
7., by the wafer infuser device described in claim 1 or 2, it is characterized in that: the lower external face that described reservoir (3) fills chemical liquids posts heating plate (13).
8., by the wafer infuser device described in claim 1 or 2, it is characterized in that: the end face of described reservoir (3) has exhaust outlet (18), the bottom surface of reservoir (3) and base plate (4) have leakage fluid dram (19).
9. by the wafer infuser device described in claim 1 or 2, it is characterized in that: the inside of described reservoir (3) or outside are provided with liquid level sensor (22), be arranged on described reservoir (3) when this liquid level sensor (22) is positioned at reservoir (3) inside and fill on the internal groove side wall of chemical liquids bottom; Described liquid level sensor (22) be positioned at reservoir (3) outside time, be arranged on liquid level cross over pipe (23), the two ends of described liquid level cross over pipe (23) respectively UNICOM in the top of the bottom of reservoir (3) and reservoir (3).
10., by the wafer infuser device described in claim 1 or 2, it is characterized in that: the cell wall on described reservoir (3) top has maintenance window (8).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410143157.XA CN104979235B (en) | 2014-04-10 | 2014-04-10 | Wafer infuser device |
| TW103122202A TWI544541B (en) | 2014-04-10 | 2014-06-27 | Wafer immersion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410143157.XA CN104979235B (en) | 2014-04-10 | 2014-04-10 | Wafer infuser device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104979235A true CN104979235A (en) | 2015-10-14 |
| CN104979235B CN104979235B (en) | 2017-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410143157.XA Active CN104979235B (en) | 2014-04-10 | 2014-04-10 | Wafer infuser device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104979235B (en) |
| TW (1) | TWI544541B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107346753A (en) * | 2016-05-06 | 2017-11-14 | 亿力鑫系统科技股份有限公司 | soaking device |
| CN110560411A (en) * | 2019-09-30 | 2019-12-13 | 清远市进田企业有限公司 | circuit board washs recovery unit |
| CN111863654A (en) * | 2019-04-26 | 2020-10-30 | 昆山基侑电子科技有限公司 | Wafer soaking tank |
| CN112509950A (en) * | 2020-12-21 | 2021-03-16 | 马之彬 | Semiconductor soaking device convenient for backflow of liquid medicine |
| CN112750737A (en) * | 2021-01-06 | 2021-05-04 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate soaking mechanism and substrate soaking device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000174088A (en) * | 1998-12-04 | 2000-06-23 | Super Silicon Kenkyusho:Kk | Wafer loader |
| US6551487B1 (en) * | 2001-05-31 | 2003-04-22 | Novellus Systems, Inc. | Methods and apparatus for controlled-angle wafer immersion |
| CN201711310U (en) * | 2010-07-12 | 2011-01-19 | 北京有色金属研究总院 | Multi-functional silicon-wafer bubbling cleaning water tank |
| CN102492947A (en) * | 2011-12-15 | 2012-06-13 | 天津中环领先材料技术有限公司 | Low-roughness silicon wafer alkali corrosion process |
| CN202487547U (en) * | 2012-03-27 | 2012-10-10 | 江西赛维Ldk太阳能高科技有限公司 | Wet silicon wafer automatic separation device |
-
2014
- 2014-04-10 CN CN201410143157.XA patent/CN104979235B/en active Active
- 2014-06-27 TW TW103122202A patent/TWI544541B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000174088A (en) * | 1998-12-04 | 2000-06-23 | Super Silicon Kenkyusho:Kk | Wafer loader |
| US6551487B1 (en) * | 2001-05-31 | 2003-04-22 | Novellus Systems, Inc. | Methods and apparatus for controlled-angle wafer immersion |
| CN201711310U (en) * | 2010-07-12 | 2011-01-19 | 北京有色金属研究总院 | Multi-functional silicon-wafer bubbling cleaning water tank |
| CN102492947A (en) * | 2011-12-15 | 2012-06-13 | 天津中环领先材料技术有限公司 | Low-roughness silicon wafer alkali corrosion process |
| CN202487547U (en) * | 2012-03-27 | 2012-10-10 | 江西赛维Ldk太阳能高科技有限公司 | Wet silicon wafer automatic separation device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107346753A (en) * | 2016-05-06 | 2017-11-14 | 亿力鑫系统科技股份有限公司 | soaking device |
| CN111863654A (en) * | 2019-04-26 | 2020-10-30 | 昆山基侑电子科技有限公司 | Wafer soaking tank |
| CN111863654B (en) * | 2019-04-26 | 2023-07-25 | 昆山基侑电子科技有限公司 | Wafer soaking tank |
| CN110560411A (en) * | 2019-09-30 | 2019-12-13 | 清远市进田企业有限公司 | circuit board washs recovery unit |
| CN112509950A (en) * | 2020-12-21 | 2021-03-16 | 马之彬 | Semiconductor soaking device convenient for backflow of liquid medicine |
| CN112509950B (en) * | 2020-12-21 | 2022-12-09 | 盐城高测新能源科技有限公司 | Semiconductor soaking device convenient for backflow of liquid medicine |
| CN112750737A (en) * | 2021-01-06 | 2021-05-04 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Substrate soaking mechanism and substrate soaking device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI544541B (en) | 2016-08-01 |
| CN104979235B (en) | 2017-07-07 |
| TW201539568A (en) | 2015-10-16 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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