CN218274527U - Wet etching cleaning device capable of improving uniformity after etching - Google Patents
Wet etching cleaning device capable of improving uniformity after etching Download PDFInfo
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- CN218274527U CN218274527U CN202222023897.2U CN202222023897U CN218274527U CN 218274527 U CN218274527 U CN 218274527U CN 202222023897 U CN202222023897 U CN 202222023897U CN 218274527 U CN218274527 U CN 218274527U
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Abstract
The utility model provides a wet etching cleaning device capable of improving the uniformity after etching, which relates to the technical field of semiconductor manufacturing equipment and comprises an outer groove and an inner groove arranged inside the outer groove, wherein a liquid inlet pipe is arranged in the inner groove, a flow equalizing plate is horizontally arranged above the liquid inlet pipe in the inner groove, a plurality of flow equalizing holes are densely distributed on the flow equalizing plate, the groove wall of the inner groove is provided with an overflow port, and the inner groove is communicated with the outer groove through the overflow port; the utility model discloses a rivers that the flow homogenizing plate made the feed liquor pipe get into can evenly flow through the wafer, and the cooperation is by supreme down, and the velocity of flow is by the rivers mode that subtracts, can effectively get rid of the sculpture liquid of wafer the latter half on the one hand, and on the other hand flow homogenizing plate flow homogenizing effect is showing, can effectively improve rivers to the washing homogeneity of wafer to improve the homogeneity behind the wafer sculpture, the difficult vortex that takes place of fluid simultaneously can effectively reduce the wafer surface and be infected with the granule dust, and clean effect is showing.
Description
Technical Field
The utility model relates to a semiconductor manufacturing equipment technical field, concretely relates to wet process sculpture belt cleaning device that homogeneity behind can improving the sculpture.
Background
With the development of semiconductor manufacturing process, the critical dimension is reduced, the requirements of wet etching on uniformity between wafers and within wafers are higher and higher, especially after high-concentration hydrofluoric acid etching and ammonium fluoride etching, when a wafer moves from a chemical tank to an overflow tank, a large amount of chemicals still remain on the surface of the wafer and continue to react with the surface of the wafer, and because the wafer is vertically arranged in the tank during etching, the etching amount of the lower part of the wafer is larger than that of the upper part of the wafer.
Fig. 5 shows a simplified structural diagram of a conventional wet etching cleaning device, which includes an inner tank and an outer tank, when cleaning the etched wafer, the wafer is vertically placed in the inner tank, water flows into the inner tank through a liquid inlet pipe at the bottom of the inner tank, and overflows to the outer tank after flowing through the wafer, and in this process, the flow velocity uniformity of the fluid in the tank is poor, the flow direction of the fluid is not clear enough, and a plurality of small vortexes can be formed in the flow field, so that the surface of the hydrophobic wafer after processing is more easily contaminated with particle dust, which is specifically represented as:
1. the uniformity of etching is poor, which is expressed in that the uniformity of the upper and lower parts in the wafer is poor, and the uneven flow of the fluid causes the deviation of the etching amount when different wafers or different parts of the same wafer cannot clean chemicals timely.
2. The cleanliness is poor, and bubbles formed by turbulent flow are particularly shown, so that the surface of a water repellent wafer is more easily stained with particle dust.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wet etching cleaning device which can improve the uniformity after etching, so as to solve the technical problems that the prior wet etching cleaning device is adopted to clean the etched wafer in the prior art, and the etching uniformity and cleanliness are poor; the utility model provides a plurality of technical effects which can be generated by the optimized technical scheme in a plurality of technical schemes; see below for details.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a pair of can improve wet process sculpture belt cleaning device of homogeneity behind sculpture, including the water jacket with set up in the inside groove of water jacket, wherein: the inside inslot is provided with the feed liquor pipe, the inside inslot is located the top level of feed liquor pipe is provided with the flow homogenizing plate, it has a plurality of flow homogenizing holes to gather on the flow homogenizing plate, the cell wall top side of inside groove is provided with the overflow mouth, the inside groove passes through the overflow mouth with the water jacket is linked together.
Preferably, the number of the flow equalizing plates is one, and the flow equalizing plates divide the inner cavity of the inner groove into a wafer accommodating cavity positioned on the upper side and a liquid inlet cavity positioned on the lower side; the liquid inlet pipe is arranged in the liquid inlet cavity; the wafer accommodating cavity is communicated with the outer groove through the overflow port.
Preferably, a liquid inlet is arranged on the liquid inlet pipe.
Preferably, the liquid inlet pipe comprises a liquid inlet main pipe and a plurality of horizontally arranged liquid inlet branch pipes, wherein: all the liquid inlet branch pipes are connected with the liquid inlet header pipe, and all the liquid inlet branch pipes are arranged in parallel; the liquid inlet is arranged on the liquid inlet branch pipe.
Preferably, a plurality of liquid inlets are uniformly arranged on the top side pipe wall of each liquid inlet branch pipe along the axial direction.
Preferably, the bottom wall of the inner tank is provided with a first liquid discharge port in communication with the inner tank.
Preferably, the bottom wall of the outer tank is provided with a second liquid outlet communicated with the outer tank.
Preferably, a groove is formed in the top side of the wall of the inner groove, the inner groove is communicated with the outer groove through the groove, and the groove forms the overflow port.
Preferably, the number of the overflow ports is set to be a plurality, and all the overflow ports are sequentially and uniformly arranged along the top edge of the wall of the inner groove.
The utility model provides a pair of wet etching belt cleaning device that can improve homogeneity after sculpture has following beneficial effect at least:
the wet etching cleaning device capable of improving the uniformity after etching comprises an outer groove and an inner groove formed in the outer groove, in the actual use process, a wafer is vertically placed in the inner groove, and water flows to the outer groove after cleaning the wafer.
The utility model discloses a wafer cleaning device, including the inside groove, be provided with the feed liquor pipe in the inside groove, be located in the inside groove the top level of feed liquor pipe is provided with the flow homogenizing plate, the last densely distributed of flow homogenizing plate has a plurality of even discharge orifices, the cell wall top side of inside groove is provided with the overflow mouth, the inside groove passes through the overflow mouth with the outer tank is linked together, during the use, rivers pass through the feed liquor pipe and get into to the inside groove in, rivers are by lower supreme flow, at first through the flow homogenizing plate, later flow through the wafer, finally by overflow mouth overflow to the outer inslot, at this in-process, rivers flow from bottom to supreme on the one hand, the velocity of flow is steadilyd decrease, can effectively get rid of the etching liquid of wafer the latter half, on the other hand flow homogenizing plate flow homogenizing effect is showing, can effectively improve rivers to the washing homogeneity of wafer after effectively improving the wafer sculpture, flow homogenizing plate is simultaneously, and the flow direction is stable, is difficult for taking place the vortex, can effectively reduce the wafer surface of hydrophobicity and be infected with granule dust, has better cleanliness factor.
The utility model discloses an including the inslot be provided with the uniform flow board, the rivers that make feed liquor pipe get into can the wafer of evenly flowing through, cooperation rivers are by lower supreme, and the flow mode that the velocity of flow subtracts gradually not only can show the washing homogeneity that improves rivers to the wafer, and it is even to guarantee the sculpture, can effectively clear up the sculpture liquid of wafer the latter half moreover, and clean effect is showing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a schematic structural view of another view angle of the present invention;
FIG. 3 is a schematic top view of the inner tank uniform flow plate of the present invention;
FIG. 4 is a schematic top view of the liquid inlet pipe in the inner tank of the present invention;
fig. 5 is a schematic structural diagram of a conventional wet etching cleaning apparatus.
Reference numerals
1. An outer tank; 11. a second drain port; 2. an inner tank; 21. an overflow port; 22. a wafer accommodating cavity; 23. a liquid inlet cavity; 24. a first drain port; 3. a liquid inlet pipe; 31. a liquid inlet; 32. a liquid inlet header pipe; 33. a liquid inlet branch pipe; 4. a flow homogenizing plate; 41. flow homogenizing holes; 5. and (5) a wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1:
the utility model provides a can improve wet etching belt cleaning device of homogeneity behind sculpture, it is shown with reference to fig. 1-3, can improve wet etching belt cleaning device of homogeneity behind sculpture includes the oversheath 1 and sets up in the inside groove 2 of oversheath 1.
A liquid inlet pipe 3 is arranged in the inner groove 2, and the liquid inlet pipe 3 is arranged at the position of the inner groove 2 close to the bottom wall.
A flow equalizing plate 4 is horizontally arranged in the inner groove 2 above the liquid inlet pipe 3, a plurality of flow equalizing holes 41 are densely distributed on the flow equalizing plate 4, an overflow opening 21 is arranged at the top side of the groove wall of the inner groove 2, and the inner groove 2 is communicated with the outer groove 1 through the overflow opening 21.
When the wafer-shaped flow equalizing device is used, the wafer 5 is vertically placed in the inner groove 2 and is positioned on the upper side of the flow equalizing plate 4, water flow provided by the liquid inlet pipe 3 enters the inner groove 2 and flows to the wafer 5 through the flow equalizing holes 41 on the flow equalizing plate 4, and then the water flow flows into the outer groove 1 through the overflow port 21.
In the above process, the water flow in the inner tank 2 flows from bottom to top, the direction of the fluid is the same, and the flow velocity is gradually reduced, and the water flow passing through the uniform flow holes 41 flows uniformly.
So, the etching liquid of wafer 5 the latter half can effectively be got rid of to rivers on the one hand, and the even flow effect of on the other hand even flow plate 4 is showing, can effectively improve rivers to the washing homogeneity of wafer 5 to show the homogeneity that improves wafer 5 after etching, the fluid flow direction is stable simultaneously, is difficult for taking place the vortex, can effectively reduce 5 surfaces of wafer of hydrophobicity and be infected with granule dust, and clean effect is showing.
The utility model discloses be in the overflow state at the in-process of in-service use always.
Example 2:
example 2 is based on example 1:
as shown in fig. 2, the number of the flow equalizing plates 4 is set to one, and the flow equalizing plates 4 divide the inner cavity of the inner tank 2 into a wafer accommodating chamber 22 located at the upper side and a liquid inlet chamber 23 located at the lower side.
The liquid inlet pipe 3 is arranged in the liquid inlet cavity 23, and water flow provided by the liquid inlet pipe 3 can directly enter the liquid inlet cavity 23.
The wafer accommodating cavity 22 is used for accommodating the wafer 5, and the wafer accommodating cavity 22 is communicated with the outer tank 1 through the overflow port 21.
As an alternative embodiment, as shown in fig. 1 and fig. 2, the liquid inlet pipe 3 is provided with a plurality of liquid inlets 31, the number of the liquid inlets 31 is set to be plural, water flows into the liquid inlet cavity 23 through the plurality of liquid inlets 31, and the plurality of liquid inlets 31 facilitate the diffusion of the entered water flows.
As an alternative embodiment, as shown in fig. 4, the inlet pipe 3 includes an inlet header pipe 32 and a plurality of horizontally arranged inlet branch pipes 33.
All the liquid inlet branch pipes 33 are connected with the liquid inlet header pipe 32, the water inlet end of the liquid inlet header pipe 32 is arranged on the outer side of the outer tank 1 and is connected with a water source of deionized water, all the liquid inlet branch pipes 33 are arranged in parallel, and the liquid inlet 31 is arranged on the liquid inlet branch pipes 33.
The plurality of inlet branch pipes 33 with the liquid inlets 31 are mutually matched, so that the water flow flowing into the liquid inlet cavity 23 is more uniform.
Alternatively, as shown in fig. 4, the number of the inlet branch pipes 33 is set to two.
As an alternative embodiment, as shown in fig. 4, a plurality of liquid inlets 31 are uniformly arranged on the top side pipe wall of each liquid inlet branch pipe 33 along the axial direction.
The uniform distribution of the liquid inlet 31 further improves the flow uniformity of the fluid.
As an alternative embodiment, as shown in fig. 1 and 4, the bottom wall of the inner tank 2 is provided with a first drain port 24 in communication with the inner tank 2, and the first drain port 24 is in communication to facilitate the drainage of the liquid in the inner tank 2.
As an alternative embodiment, as shown in fig. 1 and 4, a second liquid discharge port 11 is provided in the bottom wall of the outer tank 1 and in communication with the outer tank 1, and the second liquid discharge port 11 is in communication with the outer tank 1 to facilitate the discharge of the liquid in the outer tank 1.
As an alternative embodiment, as shown in fig. 1, the top side of the walls of the inner tank 2 is provided with a groove through which the inner tank 2 communicates with the outer tank 1, said groove forming an overflow opening 21.
The overflow port 21 is positioned at the top of the wall of the inner tank 2, and the overflow effect is remarkable.
As an alternative embodiment, as shown in fig. 1, the number of the overflow ports 21 is set to be plural, and all the overflow ports 21 are sequentially and uniformly arranged along the top edge of the groove wall of the inner groove 2, so as to improve the water flow conductivity.
Adopt the utility model discloses the method step of high sculpture homogeneity is as follows:
step (I), manufacturing the wet etching cleaning device capable of improving the uniformity after etching;
step (II), after the hydrofluoric acid or the ammonium fluoride is processed, the wafer to be processed is clamped by a conveying arm and is placed in the inner groove 2;
and (III) the wet etching cleaning device capable of improving the uniformity after etching is always in an overflow state, liquid flows through the liquid inlet pipe 3, flows into the liquid inlet cavity 23 from the liquid inlet 31, uniformly reaches the wafer accommodating cavity 22 through the flow equalizing plate 4, and then flows into the outer tank 1 from the overflow port 21, and in the process, the time of the whole overflow cleaning process is set according to a machine menu.
And (IV) after the wafer to be processed is cleaned, entering a chemical tank of next processing equipment or drying the wafer to be processed, and ending the process.
In the above steps, the wafer to be processed may be a substrate, a patterned wafer with a surface stacked by different films, a wafer with a flat surface, a wafer with a grooved pattern on a surface, or the like.
The hydrofluoric acid or the ammonium fluoride is suitable for wafers with various concentrations and water repellent surfaces after being treated by other chemicals.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "top", "bottom", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. The utility model provides a can improve wet etching belt cleaning device of homogeneity behind sculpture which characterized in that, including the water jacket with set up in the inside groove of water jacket, wherein:
the inside groove is internally provided with a liquid inlet pipe, the inside groove is internally provided with a flow equalizing plate horizontally arranged above the liquid inlet pipe, a plurality of flow equalizing holes are densely distributed on the flow equalizing plate, the groove wall of the inside groove is provided with an overflow port, and the inside groove is communicated with the outer groove through the overflow port.
2. The wet etching cleaning device capable of improving the uniformity after etching as claimed in claim 1, wherein the number of the flow equalizing plates is set to one, and the flow equalizing plates divide the inner cavity of the inner tank into a wafer accommodating cavity at the upper side and a liquid inlet cavity at the lower side;
the liquid inlet pipe is arranged in the liquid inlet cavity;
the wafer accommodating cavity is communicated with the outer groove through the overflow port.
3. The wet etching cleaning device capable of improving the uniformity after etching as claimed in claim 2, wherein the liquid inlet pipe is provided with a liquid inlet.
4. The wet etching cleaning device capable of improving uniformity after etching according to claim 3, wherein the liquid inlet pipe comprises a liquid inlet header pipe and a plurality of horizontally arranged liquid inlet branch pipes, wherein:
all the liquid inlet branch pipes are connected with the liquid inlet header pipe, and all the liquid inlet branch pipes are arranged in parallel;
the liquid inlet is arranged on the liquid inlet branch pipe.
5. The wet etching cleaning device capable of improving the uniformity after etching as claimed in claim 4, wherein a plurality of liquid inlets are uniformly arranged on the top side pipe wall of each liquid inlet branch pipe along the axial direction.
6. The wet etching cleaning device capable of improving uniformity after etching as claimed in claim 1, wherein the bottom wall of the inner tank is provided with a first drain port in communication with the inner tank.
7. The wet etching cleaning device capable of improving the uniformity after etching according to claim 1, wherein a second liquid outlet is arranged on the bottom wall of the outer groove and communicated with the outer groove.
8. The wet etching cleaning device for improving post-etching uniformity as recited in claim 1, wherein a top side of a wall of the inner tank is provided with a groove, the inner tank is communicated with the outer tank through the groove, and the groove forms the overflow port.
9. The wet etching cleaning device according to claim 8, wherein the number of the overflow ports is set to be plural, and all the overflow ports are sequentially and uniformly arranged along the top edge of the inner groove wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222023897.2U CN218274527U (en) | 2022-08-02 | 2022-08-02 | Wet etching cleaning device capable of improving uniformity after etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222023897.2U CN218274527U (en) | 2022-08-02 | 2022-08-02 | Wet etching cleaning device capable of improving uniformity after etching |
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| Publication Number | Publication Date |
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| CN218274527U true CN218274527U (en) | 2023-01-10 |
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| CN202222023897.2U Active CN218274527U (en) | 2022-08-02 | 2022-08-02 | Wet etching cleaning device capable of improving uniformity after etching |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038514A (en) * | 2023-08-11 | 2023-11-10 | 无锡亚电智能装备有限公司 | Etching cleaning tank with rectifying plate |
| CN117239013A (en) * | 2023-11-15 | 2023-12-15 | 江苏皓兮新能源技术开发有限公司 | Reaction tank system for improving wet etching uniformity of solar photovoltaic cells |
-
2022
- 2022-08-02 CN CN202222023897.2U patent/CN218274527U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038514A (en) * | 2023-08-11 | 2023-11-10 | 无锡亚电智能装备有限公司 | Etching cleaning tank with rectifying plate |
| CN117038514B (en) * | 2023-08-11 | 2024-04-30 | 无锡亚电智能装备有限公司 | Etching cleaning tank with rectifying plate |
| CN117239013A (en) * | 2023-11-15 | 2023-12-15 | 江苏皓兮新能源技术开发有限公司 | Reaction tank system for improving wet etching uniformity of solar photovoltaic cells |
| CN117239013B (en) * | 2023-11-15 | 2024-02-27 | 江苏皓兮新能源技术开发有限公司 | Reaction tank system for improving wet etching uniformity of solar photovoltaic cells |
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