CN114405072A - Spraying system suitable for chemical etching is used - Google Patents
Spraying system suitable for chemical etching is used Download PDFInfo
- Publication number
- CN114405072A CN114405072A CN202111674381.8A CN202111674381A CN114405072A CN 114405072 A CN114405072 A CN 114405072A CN 202111674381 A CN202111674381 A CN 202111674381A CN 114405072 A CN114405072 A CN 114405072A
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- CN
- China
- Prior art keywords
- liquid outlet
- shell
- bearing platform
- chemical etching
- buffer chamber
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/02—Foam dispersion or prevention
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a spraying system suitable for chemical etching, which relates to the technical field of semiconductors and comprises a wafer bearing platform, a cleaning cavity, a lifting mechanism and a cleaning spray head, wherein the wafer bearing platform is arranged in the cleaning cavity, the lifting mechanism is arranged at the lower end of the wafer bearing platform, the cleaning spray head is arranged on the upper side of the wafer bearing platform and comprises a shell, a first liquid conveying pipe, a second liquid conveying pipe and a buffer chamber, the buffer chamber is arranged in the shell, a gap is formed between the buffer chamber and the inner wall of the shell, a liquid inlet hole is formed in the side wall of the buffer chamber, a liquid outlet is formed in the lower end of the shell, the lower end of the buffer chamber is communicated with the liquid outlet, and the first liquid conveying pipe and the second liquid conveying pipe penetrate through the shell and are positioned in the gap. According to the invention, multiple times of mixing of multiple chemical agents can be realized, the chemical agents can be fully mixed, bubbles in the mixed liquid can be automatically filtered, and the cleaning efficiency is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a spraying system suitable for chemical etching.
Background
In integrated circuit manufacturing, high temperature chemicals are often used to clean and etch the wafer surface. At present, the mainstream wet cleaning and etching uses single-cavity operation, during the operation, the wafer rotates at a high speed, chemical agents are sprayed to the front side of the wafer, and inert gas or high-purity water is sprayed to the back side of the wafer to protect the wafer.
Because the membranous layer structure on wafer surface is more complicated, consequently, need multiple chemical agent to mix the washing at abluent in-process, then direct mix chemical agent and produce a large amount of bubbles easily and influence cleaning efficiency, and multiple chemical agent mixes inadequately and also can lead to cleaning efficiency low.
Disclosure of Invention
The present invention is directed to a spray system suitable for chemical etching, which solves the above-mentioned problems.
The technical scheme adopted by the invention is as follows:
the utility model provides a spraying system suitable for chemical etching is used, includes wafer load-bearing platform, washs cavity, elevating system and washing shower nozzle, it is equipped with to wash in the cavity wafer load-bearing platform, wafer load-bearing platform's lower extreme is equipped with elevating system, wafer load-bearing platform's upside is equipped with wash the shower nozzle, it includes shell, first transfer line, second transfer line and surge chamber to wash the shower nozzle, the inside of shell is equipped with the surge chamber with be equipped with the clearance between the shell inner wall, be equipped with the feed liquor hole on the lateral wall of surge chamber, the lower extreme of shell is equipped with the liquid outlet, the lower extreme of surge chamber with the liquid outlet intercommunication, first transfer line with the second transfer line passes the shell is located in the clearance.
Preferably, the lower end of the buffer chamber is provided with a liquid outlet joint, and the liquid outlet joint is communicated with the liquid outlet.
Preferably, the diameter of an opening at the upper end of the liquid outlet joint is larger than that of an opening at the lower end of the liquid outlet joint, and the inner peripheral wall of the liquid outlet joint is obliquely arranged from top to bottom in the direction close to the axis of the liquid outlet joint.
Preferably, a sealing plate is arranged at the upper end of the liquid outlet joint, an inclined flow guide hole is formed in the outer edge of the sealing plate, and the inclined direction of the flow guide hole is the same as the inclined direction of the inner wall of the liquid outlet joint.
Preferably, the outer edge of the upper end of the buffer chamber is provided with a flange, the inner peripheral wall of the shell is provided with a groove, and the flange is arranged in the groove.
Preferably, the heating device further comprises a heating sleeve, and the heating sleeve is arranged on the outer side of the shell.
The technical scheme has the following advantages or beneficial effects:
according to the invention, multiple times of mixing of multiple chemical agents can be realized, the chemical agents can be fully mixed, bubbles in the mixed liquid can be automatically filtered, and the cleaning efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a spray system suitable for chemical etching in accordance with the present invention;
fig. 2 is a schematic structural view of a cleaning head according to the present invention.
In the figure: 1. a wafer carrying platform; 11. a nitrogen nozzle; 12. a heating module; 2. cleaning the chamber; 21. a layer cavity; 3. a lifting mechanism; 4. cleaning the spray head; 41. a housing; 42. a first infusion tube; 43. a second infusion tube; 44. a buffer chamber; 45. a liquid inlet hole; 46. a liquid outlet joint; 47. a liquid outlet; 48. a sealing plate; 49. a flow guide hole; 410. a flange; 411. heating a jacket; 5. and (5) a wafer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
FIG. 1 is a schematic diagram of a spray system suitable for chemical etching in accordance with the present invention; fig. 2 is a schematic structural diagram of a cleaning showerhead in the present invention, please refer to fig. 1 to 2, which illustrate a preferred embodiment, showing a spraying system suitable for chemical etching, comprising a wafer carrying platform 1, a cleaning chamber 2, a lifting mechanism 3 and a cleaning showerhead 4, wherein the wafer carrying platform 1 is arranged in the cleaning chamber 2, the lifting mechanism 3 is arranged at the lower end of the wafer carrying platform 1, the cleaning showerhead 4 is arranged at the upper side of the wafer carrying platform 1, the cleaning showerhead 4 comprises a housing 41, the infusion device comprises a first infusion tube 42, a second infusion tube 43 and a buffer chamber 44, wherein the buffer chamber 44 is arranged in the shell 41, a gap is formed between the buffer chamber 44 and the inner wall of the shell 41, a liquid inlet hole 45 is formed in the side wall of the buffer chamber 44, a liquid outlet 47 is formed in the lower end of the shell 41, the lower end of the buffer chamber 44 is communicated with the liquid outlet 47, and the first infusion tube 42 and the second infusion tube 43 penetrate through the shell 41 and are located in the gap. In this embodiment, as shown in fig. 1, the cleaning chamber 2 is divided into two layer cavities 21 disposed up and down, and the lifting mechanism 3 can drive the wafer supporting platform 1 to drive the wafer 5 to move up and down in the cleaning chamber 2, and when different cleaning solutions are used for cleaning, different layer cavities 21 can be replaced, for example, when the wafer 5 is cleaned by using a mixed chemical solution, the layer cavity 21 of the first layer can be used, and when the chemical solution on the surface of the wafer 5 is removed by using ultrapure water, the layer cavity 21 of the second layer can be used. The wafer 5 and the wafer bearing platform 1 are in non-contact, and a nitrogen nozzle 11 is arranged on the part, opposite to the middle part of the wafer 5, of the wafer bearing platform 1 and used for upwards jacking the wafer 5. A circle of heating modules 12 are arranged on the wafer bearing platform 1 and opposite to the edge part of the wafer 5, and are used for heating the edge area of the wafer 5, so that chemical liquid medicine in the edge area of the wafer 5 can be in a heating state, and the reaction rate is improved.
As shown in fig. 2, the first infusion tube 42 and the second infusion tube 43 are used for conveying different types of chemical liquid medicines, the two types of chemical liquid medicines generate a certain amount of bubbles after the first mixing reaction between the shell 41 and the buffer chamber 44, the bubbles float on the surface of the mixed liquid, then the liquid level of the mixed liquid rises to the position of the liquid inlet hole 45, the mixed liquid enters the buffer chamber 44 through the liquid inlet hole 45, then the liquid level of the mixed liquid continuously rises and exceeds the height of the liquid inlet hole 45, so that the bubbles cannot enter the buffer chamber 44 through the liquid inlet hole 45, and the bubbles can be effectively removed. The mixed liquid enters the buffer chamber 44 through the liquid inlet hole 45 and is mixed for the second time in the buffer chamber 44, so that the two chemical liquid medicines can be fully mixed, the reaction efficiency can be improved, and the cleaning efficiency can be improved.
Further, as a preferred embodiment, the lower end of the buffer chamber 44 is provided with a liquid outlet joint 46, and the liquid outlet joint 46 is communicated with a liquid outlet 47. In this embodiment, the mixed liquid in the buffer chamber 44 enters the liquid outlet 47 through the liquid outlet joint 46, and is finally sprayed to the surface of the wafer 5 through the liquid outlet 47.
Further, as a preferred embodiment, the diameter of the upper end opening of the liquid outlet joint 46 is larger than the diameter of the lower end opening of the liquid outlet joint 46, and the inner peripheral wall of the liquid outlet joint 46 is inclined from top to bottom toward the axial direction close to the liquid outlet joint 46.
Further, as a preferred embodiment, a sealing plate 48 is disposed at the upper end of the liquid outlet joint 46, an inclined guiding hole 49 is disposed at the outer edge of the sealing plate 48, and the inclined direction of the guiding hole 49 is the same as the inclined direction of the inner wall of the liquid outlet joint 46. In this embodiment, as shown in fig. 2, the sealing plate 48 is used to seal the liquid outlet joint 46, so as to prevent the mixed liquid from directly entering the liquid outlet 47. Wherein, the upper end opening diameter of water conservancy diversion hole 49 is less than lower extreme opening diameter, plays the effect of buffering the mixed liquid velocity of flow, avoids mixed liquid velocity of flow too fast to lead to the bubble to appear, and as shown in fig. 2, the lower extreme opening of water conservancy diversion hole 49 points to going out the interior perisporium of liquid joint 46, and mixed liquid flows downwards along the inner wall that goes out liquid joint 46 and is discharged by liquid outlet 47, can effectually avoid mixed liquid velocity of flow too big phenomenon emergence that produces the bubble.
Further, as a preferred embodiment, a flange 410 is disposed on the outer edge of the upper end of the buffer chamber 44, a groove is disposed on the inner peripheral wall of the housing 41, and the flange 410 is disposed in the groove.
Further, as a preferred embodiment, a heating jacket 411 is further included, and the heating jacket 411 is disposed outside the housing 41. In this embodiment, the heating jacket 411 is used for heating the housing 41, so that the first mixing of the chemical liquid medicine can be realized by heating, and the mixing efficiency can be improved conveniently.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a spraying system suitable for chemical etching is used, a serial communication port, including wafer load-bearing platform, washing cavity, elevating system and washing shower nozzle, it is equipped with to wash the cavity wafer load-bearing platform, wafer load-bearing platform's lower extreme is equipped with elevating system, wafer load-bearing platform's upside is equipped with the washing shower nozzle, the washing shower nozzle includes shell, first transfer line, second transfer line and surge chamber, the inside of shell is equipped with the surge chamber with be equipped with the clearance between the shell inner wall, be equipped with the feed liquor hole on the lateral wall of surge chamber, the lower extreme of shell is equipped with the liquid outlet, the lower extreme of surge chamber with the liquid outlet intercommunication, first transfer line with the second transfer line passes the shell and is located in the clearance.
2. The spray system suitable for chemical etching of claim 1 wherein the lower end of said buffer chamber is provided with a liquid outlet connection, said liquid outlet connection being in communication with said liquid outlet.
3. The spray system of claim 2, wherein the diameter of the upper opening of the liquid outlet connector is larger than the diameter of the lower opening of the liquid outlet connector, and the inner peripheral wall of the liquid outlet connector is inclined from top to bottom in the direction close to the axis of the liquid outlet connector.
4. The spray system suitable for chemical etching as claimed in claim 3, wherein a sealing plate is provided at an upper end of the liquid outlet joint, an inclined guide hole is provided at an outer edge of the sealing plate, and an inclined direction of the guide hole is the same as an inclined direction of an inner wall of the liquid outlet joint.
5. The chemical etching spray system of claim 1, wherein the buffer chamber has a flange at an upper outer edge thereof, and a groove is formed in an inner peripheral wall of the housing, and the flange is disposed in the groove.
6. The spray system adapted for chemical etching as recited in claim 1, further comprising a heating jacket disposed on an exterior side of said housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111674381.8A CN114405072A (en) | 2021-12-31 | 2021-12-31 | Spraying system suitable for chemical etching is used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111674381.8A CN114405072A (en) | 2021-12-31 | 2021-12-31 | Spraying system suitable for chemical etching is used |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114405072A true CN114405072A (en) | 2022-04-29 |
Family
ID=81272372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111674381.8A Pending CN114405072A (en) | 2021-12-31 | 2021-12-31 | Spraying system suitable for chemical etching is used |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114405072A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542765A (en) * | 2024-01-03 | 2024-02-09 | 苏州智程半导体科技股份有限公司 | Full-automatic nozzle for semiconductor wafer etching |
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2021
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| US6644791B1 (en) * | 2002-08-23 | 2003-11-11 | Xerox Corporation | Ink jet printhead having efficient heat dissipation and removal of air |
| CN201073592Y (en) * | 2007-07-27 | 2008-06-18 | 攀枝花新钢钒股份有限公司 | Hole plate pipeline fluid mixer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN117542765B (en) * | 2024-01-03 | 2024-03-12 | 苏州智程半导体科技股份有限公司 | Full-automatic nozzle for semiconductor wafer etching |
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