CN111128810A - Wafer cleaning equipment - Google Patents
Wafer cleaning equipment Download PDFInfo
- Publication number
- CN111128810A CN111128810A CN202010000902.0A CN202010000902A CN111128810A CN 111128810 A CN111128810 A CN 111128810A CN 202010000902 A CN202010000902 A CN 202010000902A CN 111128810 A CN111128810 A CN 111128810A
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- Prior art keywords
- tank
- liquid medicine
- wafer cleaning
- wafer
- communicating pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 47
- 239000007788 liquid Substances 0.000 claims abstract description 151
- 239000003814 drug Substances 0.000 claims abstract description 87
- 238000002347 injection Methods 0.000 claims abstract description 44
- 239000007924 injection Substances 0.000 claims abstract description 44
- 239000000126 substance Substances 0.000 claims description 53
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
- 239000000243 solution Substances 0.000 claims description 11
- 238000001514 detection method Methods 0.000 description 11
- 238000004891 communication Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer cleaning device, which relates to the technical field of wafer cleaning devices and comprises an inner groove and a communicating pipe arranged in the inner groove; one end of the communicating pipe is used for communicating with the liquid medicine injection assembly, the communicating pipe extends along the circumferential direction of the inner groove, a plurality of liquid medicine outlets are arranged on the communicating pipe at intervals along the extending direction of the communicating pipe, and the liquid medicine outlets are used for injecting liquid medicine into the inner groove. The technical problems that the circular injection of the liquid medicine is not uniform and the contact between the liquid medicine and the surface of the wafer is not uniform in the prior art are solved, and the technical effect that the liquid medicine and the surface of the wafer can be uniformly contacted and cleaned is achieved.
Description
Technical Field
The invention relates to the technical field of wafer cleaning devices, in particular to wafer cleaning equipment.
Background
In the prior art, after being polished by a polishing process, a large amount of polishing particles and byproducts are adhered to the surface of a wafer. Therefore, after the polishing process, a wafer cleaning apparatus capable of removing the abrasive particles and by-products adhered to the wafer is required.
Currently, wafer cleaning equipment employs megasonic cleaning. The wafer cleaning equipment for cleaning by utilizing the megasonic principle comprises an inner communicating groove and an outer communicating groove, and the wafer cleaning equipment has the following principle: the inner groove is filled with liquid through the top end, the megasonic generator at the bottom of the inner groove generates high-energy sound waves through vibration, a wafer to be cleaned is placed in the inner groove, and when the liquid level in the inner groove exceeds the height of the inner groove, the ground particles which are vibrated off the wafer to be cleaned in the inner groove finally overflow to the outer groove; the outer tank is self-circulated to the liquid inlet of the inner tank through a pipeline connected with a filter. During such a cycle, filter effluent is drained when the filter cartridge needs to be replaced after a certain number of cycles; the volatilization of the liquid medicine can also cause the reduction of the liquid level, and the liquid is timely replenished when the liquid level of the outer tank triggers the low liquid level sensor on the side wall of the outer tank.
Although the existing cleaning of the wafer in the inner groove can be realized, the existing liquid medicine directly enters the inner groove from the top end of the inner groove through one end opening of the pipe, the liquid medicine is not uniformly injected by the injection mode of the liquid medicine, and the cleaning of the wafer cannot be guaranteed.
Disclosure of Invention
The invention aims to provide wafer cleaning equipment to solve the technical problems of uneven circular injection of a liquid medicine and uneven contact between the liquid medicine and the surface of a wafer in the prior art.
The invention provides wafer cleaning equipment, which comprises an inner groove and a communicating pipe arranged in the inner groove;
one end of the communicating pipe is used for being communicated with the liquid medicine injection assembly, the communicating pipe extends along the circumferential direction of the inner groove, a plurality of liquid medicine injection ports are arranged on the communicating pipe at intervals along the extending direction of the communicating pipe, and the liquid medicine injection ports are used for injecting liquid medicine into the inner groove.
Further, the liquid medicine injection assembly further comprises an outer tank and a circulating pipeline;
the outer tank is connected to the outside of the inner tank, a liquid medicine outlet is formed in the outer tank, at least one liquid medicine inlet is formed in the inner tank, the liquid medicine outlet is communicated with the liquid medicine inlet through a circulating pipeline, and the liquid medicine inlet is communicated with one end of the communicating pipe.
Further, the communicating pipe is arranged on the tank bottom wall of the inner tank.
Further, the liquid medicine injection assembly further comprises a liquid medicine injection device;
the liquid medicine injection device is connected with the top end of the outer tank and is used for injecting liquid medicine into the outer tank.
Furthermore, a fixing plate is arranged at the top of the outer tank, and the liquid medicine injection device is fixedly connected to the fixing plate.
Furthermore, the fixing plate is also provided with a liquid level detection device for detecting the liquid level of the liquid medicine in the inner groove and the outer groove and a temperature detection device for detecting the temperature of the liquid medicine in the inner groove.
Furthermore, the wafer cleaning equipment also comprises a megasonic generator and a water bath;
the bottom end of the inner groove is arranged in the water bath tank, the megasonic generator is arranged at the bottom of the water bath tank, and water in the water bath tank can transmit vibration generated by the megasonic generator so as to vibrate liquid medicine in the inner groove in the water bath tank and clean the wafer to be cleaned in the inner groove.
Furthermore, the wafer cleaning equipment also comprises a connecting plate;
the water bath is connected with the outer tank through a connecting plate.
Furthermore, the top of the outer tank is higher than the top of the side wall of the inner tank, and a plurality of overflow ports are arranged at intervals on the top of the side wall of the inner tank, so that the liquid medicine in the inner tank overflows into the outer tank along the overflow ports.
Furthermore, the groove bottom of the outer groove is obliquely arranged from two sides to the middle part towards the direction far away from the groove top.
The wafer cleaning equipment provided by the invention is characterized in that a wafer to be cleaned is placed in an inner groove, a communicating pipe is arranged in the inner groove, one end of the communicating pipe is communicated with a liquid medicine injection pipe, the communicating pipe extends along the circumferential direction of the inner groove, a plurality of liquid medicine spray outlets are arranged on the communicating pipe at intervals, so that liquid medicine reaching the communicating pipe can be sprayed out through the liquid medicine spray outlets, namely, the liquid medicine can be injected into the inner groove from a plurality of positions in the circumferential direction of the inner groove, even if the liquid medicine height of the inner groove is lower than that of the wafer, the liquid medicine can be correspondingly spread to the wafer from a plurality of positions due to the fact that the liquid medicine is injected into the inner groove from a plurality of positions, compared with the existing mode that the liquid medicine is injected into the inner groove through only one end opening of a liquid inlet pipe, the liquid medicine can be contacted with the wafer more quickly, and the direct contact area of the, can realize that the liquid medicine misce bene, the liquid medicine can be more even with wafer contact, washs the wafer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a wafer cleaning apparatus according to a first angle in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a wafer cleaning apparatus according to a second angle in the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a wafer cleaning apparatus according to a third angle in the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fourth angle of the wafer cleaning apparatus according to the embodiment of the invention.
Icon: 100-a cleaning tank; 200-a liquid medicine injection device; 300-a circulation line; 400-megasonic generator; 500-water bath; 600-a connecting plate; 700-fixing plate; 101-an inner tank; 102-an outer tank; 103-a liquid medicine outlet; 104-liquid medicine inlet; 105-an overflow; 106-communicating tube; 107-liquid medicine outlet.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the orientations or positional relationships indicated as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., appear based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention provides a wafer cleaning device, as shown in fig. 1-4, the wafer cleaning device comprises an inner tank 101 and a communicating pipe 106 arranged in the inner tank 101; one end of the communication pipe 106 is used for communicating with the chemical liquid injection assembly, the communication pipe 106 extends along the circumferential direction of the inner tank 101, a plurality of chemical liquid injection ports 107 are arranged on the communication pipe 106 at intervals along the extending direction, the chemical liquid injection ports 107 are used for injecting the chemical liquid into the inner tank 101, so that the chemical liquid reaching the communication pipe 106 can be injected through the plurality of chemical liquid injection ports 107, a plurality of injection positions can be formed in the inner tank 101 and can be injected into the inner tank 101 from the plurality of injection positions, namely, the chemical liquid can be injected into the inner tank 101 from a plurality of positions in the circumferential direction of the inner tank 101, even if the chemical liquid level of the inner tank 101 is lower than the wafer position, the chemical liquid can be correspondingly spread onto the wafer from a plurality of positions due to the injection of the chemical liquid into the inner tank 101 from a plurality of positions, compared with the existing form of injecting the, the liquid medicine can be faster and the wafer contact to because can follow a plurality of directions of circumference and annotate the liquid medicine to the wafer, the wafer is also great with the area of the liquid medicine direct contact who erupts, can realize the liquid medicine misce bene, and the liquid medicine can wash the wafer with the more even of wafer contact.
Further, the liquid medicine injection assembly further includes an outer tank 102 and a circulation line 300; the outer tank 102 is fixedly connected to the outside of the inner tank 101; the inner groove 101 is used for placing a wafer to be cleaned; a chemical liquid outlet 103 is provided on the side wall of the outer tank 102, two chemical liquid inlets 104 are provided on the side wall of the inner tank 101, the chemical liquid injected into the outer tank 102 from the chemical liquid injector 200 can reach the inner tank 101 through the circulation line 300, the chemical outlet of the circulation line 300 is communicated with the chemical inlet of the communication pipe 106, so that the chemical liquid in the inner tank 101 is injected through the plurality of chemical liquid injection ports 107, and the chemical liquid is injected from the plurality of chemical liquid injection ports 107 to form a plurality of injection positions, that is, the chemical liquid can be injected into the inner tank 101 from a plurality of positions in the circumferential direction of the inner tank 101, so that even when the chemical liquid level of the inner tank 101 is lower than the wafer position, the chemical liquid can be spread onto the wafer from a plurality of positions correspondingly, compared with the conventional form of injecting the chemical liquid into the inner tank 101 only through one end opening of the liquid inlet pipe, the liquid medicine can be faster and the wafer contact to because can follow a plurality of directions of circumference and annotate the liquid medicine to the wafer, the wafer is also great with the area of the liquid medicine direct contact who erupts, can realize the liquid medicine misce bene, and the liquid medicine can wash the wafer with the more even of wafer contact.
The outer tank 102 and the inner tank 101 together form a cleaning tank 100, wherein the cleaning tank 100 is made of quartz, and the quartz has high purity, so that the cleaning tank can be applied to occasions with high requirements on wafer cleaning degree.
Preferably, as shown in fig. 4, the communication pipe 106 is four pipes connected end to end in sequence, the four pipes are provided with a plurality of chemical liquid outlets 107, and the chemical liquid outlets 107 are arranged to ensure that the chemical liquid in each direction can be sprayed, so that each part of the wafer to be cleaned can be contacted with the chemical liquid, and the wafer is cleaned.
The number of the chemical solution inlets 104 may be three, four or more, as long as the chemical solution can be securely introduced into the inner tank 101.
The circulation line 300 is provided with a filter device capable of filtering the liquid medicine to some extent before flowing into the inner tank 101, and specifically, the filter device is a filter device commonly used in the related art.
Further, the communicating pipe 106 is disposed on the bottom wall of the inner tank 101, and the chemical liquid is injected upwards into the bottom of the tank, so as to ensure that the surface of the wafer to be cleaned can be contacted with the chemical liquid.
As shown in fig. 1, the chemical liquid injection assembly further includes a chemical liquid injection device 200, the chemical liquid injection device 200 is a chemical liquid injection tube for injecting a chemical liquid into the outer tub 102, and the chemical liquid injection device 200 is connected to a top end of the outer tub 102 to facilitate the injection of the chemical liquid into the outer tub 102.
The communication pipe 106 may communicate with the discharge port of the chemical liquid injector 200 or with the discharge port of the circulation line 300.
As shown in fig. 1, the outer tank 102 protrudes from the side wall of the inner tank 101, so that the outer tank 102 forms a stop above the side wall of the inner tank 101, when a wafer to be cleaned is placed in the inner tank 101, the chemical liquid in the inner tank 101 can overflow from the side wall of the inner tank 101 into the outer tank 102, the chemical liquid is ensured to completely overflow into the outer tank 102, the situation that the chemical liquid flows out of the wafer cleaning equipment due to the fact that the top end of the outer tank 102 is lower than the top end of the inner tank 101 is avoided, and the chemical liquid is fully utilized.
Further, as shown in fig. 1 and 2, the bottom end of the inner tank 101 is disposed inside the water bath 500, and the megasonic generator 400 is disposed at the bottom of the water bath 500, specifically, the megasonic generator 400 is a megasonic generator, when a wafer to be cleaned is cleaned, a certain amount of water is filled in the water bath 500, and then the megasonic generator is activated, and vibration generated by the megasonic generator is transmitted through the water in the water bath 500, so that the liquid medicine in the inner tank 101 in the water bath 500 is simultaneously vibrated, and the wafer to be cleaned in the inner tank 101 is cleaned through vibration.
The water bath 500 is provided with support blocks therein, and the inner tank 101 is supported in the water bath 500 by the support blocks.
It should be further noted that the supporting block may be one supporting block placed at the bottom center of the inner groove 101, or may be four supporting blocks placed at four corners of the inner groove 101 or two symmetrical supporting blocks placed at two corners, as long as the inner groove 101 can be supported.
Further, as shown in fig. 1 and 2, the wafer cleaning apparatus further includes a connection plate 600, and the water bath 500 and the outer tank 102 are connected by the connection plate 600, so as to ensure stability of the overall structure of the wafer cleaning apparatus.
The upper end of the connecting plate 600 may be detachably connected to the outer sidewall of the outer tank 102 by a screw or may be fixedly connected to the outer sidewall of the water bath 500 by welding, and the lower end of the connecting plate 600 may be detachably connected to the outer sidewall of the water bath 500 by a screw or may be fixedly connected to the outer sidewall of the water bath 500 by welding, thereby connecting the water bath 500 to the outer tank 102. The number of the connection plates 600 provided in this embodiment is two, and the two connection plates 600 are symmetrically connected to two opposite sides of the wafer cleaning apparatus; it should be noted that the number of the connection plates 600 may be four, and four connection plates 600 are sequentially connected to four sides of the wafer cleaning apparatus, so that the connection between the water bath 500 and the outer tank 102 is more stable.
Further, as shown in fig. 1 and 2, a fixing plate 700 is disposed at the top of the outer tank 102, the fixing plate 700 is fixedly connected by welding or the like or detachably connected by screw connection or the like to the outer tank 102, a mounting hole is disposed on the fixing plate 700, and the injection end of the liquid medicine injection device 200 passes through the mounting hole and enters the outer tank 102; by providing the fixing plate 700, the stability of the connection between the chemical solution injector 200 and the outer tank 102 is ensured.
Further, a liquid level detection device and a temperature detection device are further arranged on the fixing plate 700, when the liquid level of the liquid medicine in the outer tank 102 reaches a required liquid level, the liquid level detection device controls the liquid medicine injection device 200 to stop injecting the liquid medicine, and specifically, the control method of the liquid level detection device is the same as that of the liquid level detection method in the prior art; the temperature detection device is used for detecting the temperature of the liquid medicine in the outer tank 102, so that the liquid medicine is in a proper temperature range, and the control mode of the temperature detection device is the same as that of the temperature detection device in the prior art.
As shown in fig. 1, a plurality of overflow ports 105 are provided at intervals on the top end of the side wall of the inner tank 101, and when a wafer to be cleaned is placed in the inner tank 101, the chemical in the inner tank 101 overflows from the inner tank 101 into the outer tank 102, and the chemical in the inner tank 101 and impurities on the cleaned wafer can flow out through the action of the overflow ports 105.
Furthermore, the bottom of the outer tank 102 is inclined from two sides to the middle toward the direction away from the top of the tank, i.e. is arranged in a V shape, so that impurities in the liquid medicine can be deposited in the middle of the bottom of the tank, and the liquid medicine flowing out through the side wall of the outer tank 102 does not contain a large amount of impurities.
Specifically, the two sides of the bottom of the outer tank 102 are inclined at an angle of 3 ° and have a wall thickness of 3mm, so that loss of megasonic energy can be minimized, and bubbles do not adhere to the bottom of the inner tank 101.
By using the wafer cleaning equipment provided by the invention, firstly, the liquid medicine injection device 200 is used for injecting the liquid medicine into the outer tank 102 of the cleaning tank 100, the liquid level detection device is used for controlling the injection depth of the liquid medicine, then a certain amount of water is injected into the water bath 500, the megasonic generator is started, when the wafer is placed into the inner tank 101, a part of the liquid medicine overflows into the outer tank 102, and then the liquid medicine in the outer tank 102 is extracted into the inner tank 101 by using the circulating pipeline 300, so that the circular cleaning of the wafer is realized.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A wafer cleaning device is characterized by comprising an inner tank and a communicating pipe arranged in the inner tank;
one end of the communicating pipe is used for being communicated with the liquid medicine injection assembly, the communicating pipe extends along the circumferential direction of the inner groove, a plurality of liquid medicine injection ports are arranged on the communicating pipe at intervals along the extending direction of the communicating pipe, and the liquid medicine injection ports are used for injecting liquid medicine into the inner groove.
2. The wafer cleaning apparatus according to claim 1, wherein the chemical liquid injection assembly further comprises an outer tank and a circulation line;
the outer tank is connected to the outside of the inner tank, a liquid medicine outlet is formed in the outer tank, at least one liquid medicine inlet is formed in the inner tank, the liquid medicine outlet is communicated with the liquid medicine inlet through a circulating pipeline, and the liquid medicine inlet is communicated with one end of the communicating pipe.
3. The wafer cleaning apparatus according to claim 1 or 2, wherein the communicating pipe is provided on the tank bottom wall of the inner tank.
4. The wafer cleaning apparatus according to claim 2, wherein the chemical liquid injection assembly further comprises a chemical liquid injection device;
the liquid medicine injection device is connected with the top end of the outer tank and is used for injecting liquid medicine into the outer tank.
5. The wafer cleaning equipment according to claim 4, wherein a fixing plate is arranged at the top of the outer tank, and the chemical liquid injection device is fixedly connected to the fixing plate.
6. The apparatus of claim 5, wherein the fixing plate further comprises a liquid level detector for detecting liquid levels of the chemical solutions in the inner tank and the outer tank, and a temperature detector for detecting a temperature of the chemical solution in the inner tank.
7. The wafer cleaning apparatus according to claim 2, further comprising a megasonic generator and a water bath;
the bottom end of the inner groove is arranged in the water bath tank, the megasonic generator is arranged at the bottom of the water bath tank, and water in the water bath tank can transmit vibration generated by the megasonic generator so as to vibrate liquid medicine in the inner groove in the water bath tank and clean the wafer to be cleaned in the inner groove.
8. The wafer cleaning apparatus according to claim 7, further comprising a connection plate;
the water bath is connected with the outer tank through a connecting plate.
9. The wafer cleaning equipment as claimed in claim 2, wherein the top of the outer tank is higher than the top of the side wall of the inner tank, and a plurality of overflow ports are arranged at intervals on the top of the side wall of the inner tank, so that the liquid medicine in the inner tank overflows into the outer tank along the overflow ports.
10. The wafer cleaning apparatus according to claim 2, wherein the bottom of the outer tank is inclined from two sides to a middle part toward a direction away from the top of the tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010000902.0A CN111128810A (en) | 2020-01-02 | 2020-01-02 | Wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010000902.0A CN111128810A (en) | 2020-01-02 | 2020-01-02 | Wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111128810A true CN111128810A (en) | 2020-05-08 |
Family
ID=70507316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010000902.0A Pending CN111128810A (en) | 2020-01-02 | 2020-01-02 | Wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111128810A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112058774A (en) * | 2020-08-24 | 2020-12-11 | 台州市老林装饰有限公司 | Overflow groove structure of wet etching cleaning mechanism |
| CN115228836A (en) * | 2022-06-30 | 2022-10-25 | 上海图灵智算量子科技有限公司 | Wafer cleaning device |
| CN115254781A (en) * | 2022-09-30 | 2022-11-01 | 智程半导体设备科技(昆山)有限公司 | Megasonic cleaning device for semiconductor wafer capable of avoiding surface damage |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10289894A (en) * | 1997-04-15 | 1998-10-27 | Tokyo Electron Ltd | Cleaning system and method |
| JPH11204479A (en) * | 1998-01-13 | 1999-07-30 | Tokyo Electron Ltd | Ultrasonic cleaning device |
| CN108321104A (en) * | 2018-03-15 | 2018-07-24 | 福建省福联集成电路有限公司 | A kind of Etaching device with novel pipeline structure |
| CN108598016A (en) * | 2018-03-15 | 2018-09-28 | 福建省福联集成电路有限公司 | A kind of Etaching device of uniform field flow |
| CN208680012U (en) * | 2018-04-26 | 2019-04-02 | 上海华力集成电路制造有限公司 | A kind of new type ultrasonic cleaning device |
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2020
- 2020-01-02 CN CN202010000902.0A patent/CN111128810A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10289894A (en) * | 1997-04-15 | 1998-10-27 | Tokyo Electron Ltd | Cleaning system and method |
| JPH11204479A (en) * | 1998-01-13 | 1999-07-30 | Tokyo Electron Ltd | Ultrasonic cleaning device |
| CN108321104A (en) * | 2018-03-15 | 2018-07-24 | 福建省福联集成电路有限公司 | A kind of Etaching device with novel pipeline structure |
| CN108598016A (en) * | 2018-03-15 | 2018-09-28 | 福建省福联集成电路有限公司 | A kind of Etaching device of uniform field flow |
| CN208680012U (en) * | 2018-04-26 | 2019-04-02 | 上海华力集成电路制造有限公司 | A kind of new type ultrasonic cleaning device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112058774A (en) * | 2020-08-24 | 2020-12-11 | 台州市老林装饰有限公司 | Overflow groove structure of wet etching cleaning mechanism |
| CN115228836A (en) * | 2022-06-30 | 2022-10-25 | 上海图灵智算量子科技有限公司 | Wafer cleaning device |
| CN115254781A (en) * | 2022-09-30 | 2022-11-01 | 智程半导体设备科技(昆山)有限公司 | Megasonic cleaning device for semiconductor wafer capable of avoiding surface damage |
| CN115254781B (en) * | 2022-09-30 | 2023-01-13 | 智程半导体设备科技(昆山)有限公司 | Megasonic cleaning device for semiconductor wafer capable of avoiding surface damage |
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Application publication date: 20200508 |
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