CN208680012U - A kind of new type ultrasonic cleaning device - Google Patents
A kind of new type ultrasonic cleaning device Download PDFInfo
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- CN208680012U CN208680012U CN201820605777.4U CN201820605777U CN208680012U CN 208680012 U CN208680012 U CN 208680012U CN 201820605777 U CN201820605777 U CN 201820605777U CN 208680012 U CN208680012 U CN 208680012U
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- cleaning device
- inside groove
- new type
- type ultrasonic
- ultrasonic cleaning
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Abstract
The utility model provides a kind of new type ultrasonic cleaning device, wherein includes: rinse bath, the rinse bath includes inside groove and outer groove, at least one circulation port is arranged in the bottom of the inside groove, and a liquid inlet is arranged in the bottom of the first side wall of the inside groove, and a liquid outlet is arranged in the bottom of the outer groove;Wafer cleaning device, the wafer cleaning device include: ultrasonic generator, are set to the inside groove bottom;Wafer rest area is set to above the ultrasonic generator;Drain line is recycled, one end connects the liquid outlet, and the other end connects the liquid inlet by a filter, and the circulation drain line further includes at least one discharge line, and every discharge line connects a circulation port;The utility model has the advantages that the abrasive grains for accumulating inside groove bottom enter circulation drainage system by increasing discharge line in interior trench bottom, effectively inside groove is kept to be in clean cleaning solution environment.
Description
Technical field
The utility model relates to a kind of wafer cleaning field more particularly to a kind of new type ultrasonic cleaning devices.
Background technique
In the prior art, after the grinding by chemical mechanical milling tech, the surface of wafer (wafer) can be adhered to largely
Abrasive grains and by-product.So board is from the cleaning part after belt grinding, main function is to remove grinding of adhering on wafer
Abrasive particle and by-product.
Currently, the first sequent modular is ultrasonic cleaning (MEGA) module, module fortune in the cleaning part that board carries
With megasonic (Megasonic) cleaning technique.The structure of the cleaning module includes inside and outside two mutual through slots, and principle is such as
Under: inside groove passes through lower end inlet feed liquor;The supersonic generator of its bottom by vibration generate bubble, and abrasive grains from
Bottom end takes groove top, final spill-over to outer groove to;Outer groove by connection have the pipeline self-loopa of filter (filter) to inside groove into
Liquid mouth.During such circulation, outer groove circulation line can exhaust some waste liquids in real time, when the liquid level of outer groove is triggered to outer groove side
Fluid infusion is carried out when the low liquid level sensor of wall in time, remains that inside groove is in clean cleaning solution environment.
The module determines final cleaning effect as the module for contacting wafer at first, cleaning ability.But it sees at present
Come, the cleaning effect of the module is less desirable.
Summary of the invention
The utility model provides a kind of new type ultrasonic cleaning device, wherein includes:
Rinse bath, the rinse bath include inside groove and outer groove, at least one circulation port is arranged in the bottom of the inside groove, described
A liquid inlet is arranged in the bottom of the first side wall of inside groove, and a liquid outlet is arranged in the bottom of the outer groove;
Wafer cleaning device, the wafer cleaning device include:
Ultrasonic generator is set to the inside groove bottom;
Wafer rest area is set to above the ultrasonic generator;
Drain line is recycled, one end connects the liquid outlet, and the other end connects the liquid inlet by a filter, described
Circulation drain line further includes at least one discharge line, and every discharge line connects a circulation port.
Wherein, the bottom of the outer groove is an inclined-plane, and the liquid outlet is set to the lowest part on the inclined-plane.
Wherein, the inside groove is an open-topped rectangular parallelepiped structure, is laciniation at the top of four walls of the inside groove.
Wherein, the circulation drain line further includes a fluid infusion system, and the fluid infusion system includes: deionized water, NH4OH
Solution and H2O2Solution.
Wherein, the circulation drain line further includes a relief valve, and the relief valve connects the filter.
Wherein, the circulation drain line further includes a heat exchanger, and the heat exchanger connects the relief valve.
Wherein, the circulation drain line further includes a pump housing, and the pump housing connects the heat exchanger.
Wherein, the circulation drain line further includes a waste liquid discharge line.
Wherein, a liquid level detection device is also set up on the side wall of the outer groove.
Wherein, the wafer rest area includes a plurality of idler wheels, and the idler wheel connects the second sidewall of the inside groove, each
The same plane position of the idler wheel is provided with a groove.
The utility model has the advantages that the abrasive grains for accumulating inside groove bottom enter by increasing discharge line in interior trench bottom
Drain line is recycled, effectively inside groove is kept to be in clean cleaning solution environment.
Detailed description of the invention
Fig. 1 is the schematic diagram of the utility model specific embodiment;
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work
Under every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can
To be combined with each other.
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, but not as the utility model
It limits.
By substep test discovery, circulation drainage system used in the prior art cannot make inside groove remain one
Environment clean enough.The a small amount of abrasive grains overflowed are had not enough time at the end of the ultrasonic activation of every wafer, in inside groove
It can decline and be accumulated in inside groove bottom.With the increase of cleaning wafer quantity, bottom abrasive grains, which gradually accumulate, becomes more, causes to adhere to
It is not easy to remove on wafer, influences the conducting of subsequent conditioning circuit.
As shown in Figure 1, the utility model provides a kind of new type ultrasonic cleaning device, wherein include:
Rinse bath, the rinse bath include inside groove 11 and outer groove 12, at least one circulation is arranged in the bottom of the inside groove 11
A liquid inlet 112 is arranged in mouth 111, the bottom of the first side wall of the inside groove 11, and a liquid outlet is arranged in the bottom of the outer groove 12
121;
Wafer cleaning device, the wafer cleaning device 2 include:
Ultrasonic generator 21 is set to 11 bottom of inside groove;
Wafer rest area 22 is set to 21 top of ultrasonic generator,
Recycle drain line, one end connects the liquid outlet 121, the other end by a filter 31 connect it is described enter liquid
Mouth 112, the circulation drain line further include at least one discharge line 32, and every discharge line 32 connects described in one
Circulation port 111.
In above-mentioned technical proposal, by being additionally arranged at the bottom of at least one row being connected with circulation drain line 3 in inside groove 11
Pipeline 32 out are effectively improved current inside groove 11 so that the pollutant of inside groove bottom can also participate in the circulation of cleaning solution
The phenomenon that pollutant meeting chronic pollution wafer of bottom accumulation.
In a preferred embodiment, the bottom of the outer groove 12 is an inclined-plane, and the liquid outlet 121 is set to institute
State the lowest part on inclined-plane.
In above-mentioned technical proposal, the bottom surface of outer groove 12 is arranged to the precipitating that inclined surface is conducive to pollutant, be also convenient for by
Pollutant is discharged into circulation drain line 3 by liquid outlet 121.
In a preferred embodiment, the inside groove 11 is an open-topped rectangular parallelepiped structure, the inside groove 11
It is laciniation at the top of four walls.
In above-mentioned technical proposal, by jagged top design, convenient for pollutant as cleaning solution enters from inside groove 11
Outer groove 12.
In a preferred embodiment, the circulation drain line 3 further includes a fluid infusion system 33, the fluid infusion system
33 include: deionized water 331, NH4OH solution 332 and H2O2Solution 333.
In above-mentioned technical proposal, use the cleaning solution fluid infusion system 33 of the proportion for work well known to those skilled in the art
Skill, therefore repeat no more, it should be noted that the feasible of technical solution is merely to illustrate using the fluid infusion system in the embodiment
Property, not protection scope of the present invention is limited.
In a preferred embodiment, the circulation drain line 3 further includes a relief valve 34, and the relief valve 34 connects
Connect the filter 31.
In a preferred embodiment, the circulation drain line 3 further includes a heat exchanger 35, and the heat exchanger 35 connects
Connect the relief valve 34.
In a preferred embodiment, the circulation drain line 3 further includes a pump housing 36, and the pump housing 36 connects institute
State heat exchanger 35.
In a preferred embodiment, the circulation drain line 3 further includes a waste liquid discharge line 37.
In a preferred embodiment, a liquid level detection device is also set up on the side wall of the outer groove 12 (not show in figure
Out).
In above-mentioned technical proposal, it is monitored by the liquid level of liquid level detection device external groove 12, it is low in 12 liquid level of outer groove
Fluid infusion system 33 is controlled when a predetermined threshold, and fluid infusion is carried out to it.
In a preferred embodiment, wafer rest area 22 further includes a plurality of idler wheels 221, and the idler wheel 221 connects
The same plane position of the second sidewall of the inside groove 11, each idler wheel 221 is provided with a groove (not shown).
In above-mentioned technical proposal, wafer is placed in the groove of idler wheel 221 can be very good that wafer is fixed.
The foregoing is merely the utility model preferred embodiment, be not intended to limit the embodiments of the present invention and
Protection scope should can appreciate that all in the utility model specification and diagram to those skilled in the art
Hold made equivalent replacement and obviously change obtained scheme, the protection model of the utility model should all be included in
In enclosing.
Claims (10)
1. a kind of new type ultrasonic cleaning device characterized by comprising
Rinse bath, the rinse bath include inside groove and outer groove, at least one circulation port, the inside groove is arranged in the bottom of the inside groove
The bottom of the first side wall one liquid inlet is set, a liquid outlet is arranged in the bottom of the outer groove;
Wafer cleaning device, the wafer cleaning device include:
Ultrasonic generator is set to the inside groove bottom;
Wafer rest area is set to above the ultrasonic generator;
Drain line is recycled, one end connects the liquid outlet, and the other end connects the liquid inlet, the circulation by a filter
Drain line further includes at least one discharge line, and every discharge line connects a circulation port.
2. a kind of new type ultrasonic cleaning device according to claim 1, which is characterized in that the bottom of the outer groove is one
Inclined-plane, the liquid outlet are set to the lowest part on the inclined-plane.
3. a kind of new type ultrasonic cleaning device according to claim 1, which is characterized in that the inside groove is that a top is opened
The four walls top of the rectangular parallelepiped structure of mouth, the inside groove is laciniation.
4. a kind of new type ultrasonic cleaning device according to claim 1, which is characterized in that the circulation drain line is also
Including a fluid infusion system, the fluid infusion system includes: deionized water, NH4OH solution and H2O2Solution.
5. a kind of new type ultrasonic cleaning device according to claim 1, which is characterized in that the circulation drain line is also
Including a relief valve, the relief valve connects the filter.
6. a kind of new type ultrasonic cleaning device according to claim 5, which is characterized in that the circulation drain line is also
Including a heat exchanger, the heat exchanger connects the relief valve.
7. a kind of new type ultrasonic cleaning device according to claim 6, which is characterized in that the circulation drain line is also
Including a pump housing, the pump housing connects the heat exchanger.
8. a kind of new type ultrasonic cleaning device according to claim 1, which is characterized in that the circulation drain line is also
Including a waste liquid discharge line.
9. a kind of new type ultrasonic cleaning device according to claim 1, which is characterized in that on the side wall of the outer groove also
One liquid level detection device is set.
10. a kind of new type ultrasonic cleaning device according to claim 1, which is characterized in that the wafer rest area is also
Including a plurality of idler wheels, the idler wheel connects the second sidewall of the inside groove, the same plane position setting of each idler wheel
There is a groove.
Priority Applications (1)
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CN201820605777.4U CN208680012U (en) | 2018-04-26 | 2018-04-26 | A kind of new type ultrasonic cleaning device |
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CN201820605777.4U CN208680012U (en) | 2018-04-26 | 2018-04-26 | A kind of new type ultrasonic cleaning device |
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CN208680012U true CN208680012U (en) | 2019-04-02 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109946929A (en) * | 2019-04-12 | 2019-06-28 | 江苏汇成光电有限公司 | A kind of IC chip photoresist removal device and technique |
CN111014205A (en) * | 2020-01-02 | 2020-04-17 | 湖南普照信息材料有限公司 | Tank body cleaning, maintaining and maintaining method and cleaning tank system |
CN111128810A (en) * | 2020-01-02 | 2020-05-08 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Wafer cleaning equipment |
-
2018
- 2018-04-26 CN CN201820605777.4U patent/CN208680012U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109946929A (en) * | 2019-04-12 | 2019-06-28 | 江苏汇成光电有限公司 | A kind of IC chip photoresist removal device and technique |
CN111014205A (en) * | 2020-01-02 | 2020-04-17 | 湖南普照信息材料有限公司 | Tank body cleaning, maintaining and maintaining method and cleaning tank system |
CN111128810A (en) * | 2020-01-02 | 2020-05-08 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | Wafer cleaning equipment |
CN111014205B (en) * | 2020-01-02 | 2021-06-25 | 湖南普照信息材料有限公司 | Tank body cleaning, maintaining and maintaining method and cleaning tank system |
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