CN108321104A - A kind of Etaching device with novel pipeline structure - Google Patents
A kind of Etaching device with novel pipeline structure Download PDFInfo
- Publication number
- CN108321104A CN108321104A CN201810214433.5A CN201810214433A CN108321104A CN 108321104 A CN108321104 A CN 108321104A CN 201810214433 A CN201810214433 A CN 201810214433A CN 108321104 A CN108321104 A CN 108321104A
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- China
- Prior art keywords
- unit
- pipeline
- spray
- reactive tank
- cleaning unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007921 spray Substances 0.000 claims abstract description 53
- 238000004140 cleaning Methods 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 238000001914 filtration Methods 0.000 claims abstract description 6
- 239000000376 reactant Substances 0.000 abstract description 9
- 238000003486 chemical etching Methods 0.000 abstract description 8
- 238000004064 recycling Methods 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 15
- 239000000126 substance Substances 0.000 description 11
- 230000010355 oscillation Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000019771 cognition Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The present invention discloses a kind of Etaching device with novel pipeline structure, including reactive tank, the first pipeline, the second pipeline, cycle cleaning unit and spray unit, cycle cleaning unit is connected to by the first pipeline with reaction tank bottom, cycle cleaning unit is connected to by the second pipeline with spray unit, cycle cleaning unit sprays after being used for the liquid of abstraction reaction slot and filtering from spray unit, and spray unit is arranged the notch in reactive tank and sprays the notch for being directed toward reactive tank in direction.Above-mentioned technical proposal washes away the wafer after reaction after filtering is clean by recycling the solution in cleaning unit abstraction reaction slot, avoids the reactant on wafer from remaining, and then improve the quality of chemical etching.
Description
Technical field
The present invention relates to crystal round etching engineering device technique field more particularly to a kind of etching dresses with novel pipeline structure
It sets.
Background technology
Crystal round etching device is the device that is etched to wafer using solution, after the completion of existing crystal round etching, generally
It is directly to be hung out wafer from the etching solution of reactive tank by suspender.When wafer is detached from reactive tank in this way, wafer wall
On can adhere to etching solution, due to having chemical reactant in etching solution, then can adhere to chemical reactant on wafer, cause chemical anti-
Answer object deposition problems.
Invention content
For this reason, it may be necessary to provide a kind of Etaching device with novel pipeline structure, it is de- in wafer to solve existing Etaching device
It will produce the reverse deposit problem of chemical reactant when from reactive tank.
To achieve the above object, a kind of Etaching device with novel pipeline structure is inventor provided, including reactive tank,
First pipeline, the second pipeline, cycle cleaning unit and spray unit, cycle cleaning unit pass through the first pipeline and reaction tank bottom
Connection, cycle cleaning unit are connected to by the second pipeline with spray unit, and cycle cleaning unit is used for the liquid of abstraction reaction slot
And sprayed from spray unit after filtering, spray unit is arranged the notch in reactive tank and sprays the notch for being directed toward reactive tank in direction.
Further, the spray unit includes two spray tubes being mutually parallel, and the slot in reactive tank is arranged in spray tube
Mouthful both sides are provided with row's spray port on spray tube.
Further, further include incident unit, overflow launder, third pipeline and the 4th pipeline, the incidence unit, which is arranged, to exist
The bottom of reactive tank, the overflow launder are located at the surrounding outside reactive tank, and cycle cleaning unit passes through third pipeline and overflow launder
Connection, cycle cleaning unit are connected to by the 4th pipeline with incident unit, and cycle cleaning unit is used to extract the liquid of overflow launder
And it is sprayed from incident unit.
Further, first check valve of the 4th pipeline equipped with the incident unit of circulating direction direction, described first
Pipeline is equipped with the second check valve that circulating direction is directed toward cycle cleaning unit.
It is different from the prior art, above-mentioned technical proposal is by recycling the solution in cleaning unit abstraction reaction slot, and in mistake
Wafer after reaction is washed away after filter is clean, the reactant on wafer is avoided to remain, and then improves the quality of chemical etching.
Description of the drawings
Fig. 1 is the structural schematic diagram of Etaching device described in technology before improving；
Fig. 2 is the structural schematic diagram of the Etaching device described in specific implementation mode；
Fig. 3 is the structural schematic diagram of the cycle cleaning unit described in specific implementation mode；
Fig. 4 is the structural schematic diagram of the cycle cleaning unit described in another specific implementation mode.
Reference sign：
1, Etaching device；2, reactive tank；3, the first pipeline；4, the second pipeline；
5, cleaning unit is recycled；6, spray unit；60, spray port；
7, incident unit；70, incident pipe；71, reflector；
8, overflow launder；9, third pipeline；10, the 4th pipeline；11 first check valves；
12, the second check valve；13, ultrasonic oscillation unit；14, level sensing unit；
15, multiaxial motion mechanical arm；A, mechanical arm.
Specific implementation mode
For the technology contents of technical solution, construction feature, the objects and the effects are described in detail, below in conjunction with specific reality
It applies example and attached drawing is coordinated to be explained in detail.
Fig. 4 is please referred to Fig.1, the present embodiment provides a kind of Etaching device with novel pipeline structure, existing etchings
Device is as shown in Figure 1, include reactive tank and overflow launder, there are one circulation lines to be used to the easy of overflow launder being drawn into instead
Answer trench bottom, mechanical arm chemically react and after the reaction by wafer from reactive tank for wafer to be put into reactive tank
Middle taking-up.The Etaching device 1 of the present embodiment is as shown in Fig. 2, clean including reactive tank 2, the first pipeline 3, the second pipeline 4, cycle
Unit 5 and spray unit 6, cycle cleaning unit are connected to by the first pipeline with reaction tank bottom, recycle cleaning unit by the
Two pipelines are connected to spray unit, and cycle cleaning unit sprays after being used for the liquid of abstraction reaction slot and filtering from spray unit,
Spray unit is arranged the notch in reactive tank and sprays the notch for being directed toward reactive tank in direction.Wherein, cycle cleaning unit can be real
The effect now extracted and filtered specifically can increase a filter element come real by drawing liquid pump and in the exit of drawing liquid pump
Now to the extraction of solution and filtering.Etaching device can include that there are one controller, controls generally by the way of automation control
Device processed is used to control the work of all units of Etaching device.
Etaching device at work, fills chemical solution in reactive tank first, and then controller control machinery arm A is hung
The hanging basket equipped with wafer is played, then hanging basket is immersed in chemical solution and carries out chemical etching.Before chemical etching finishes, control
Device opens the motor of drawing liquid pump inside cycle cleaning unit, and the solution of reaction tank bottom is extracted into the second pipeline from the first pipeline
It is interior, and sprayed from spray unit.It is since the filter element inside cycle cleaning unit can be filtered solution, then single from spray
The chemical reactant in solution that member sprays greatly reduces.Then after chemical etching, controller control machinery arm A will
Wafer is hung out out of reactive tank.Since the notch of reactive tank is directed toward in the spray direction of spray unit, then wafer is hung out from reactive tank
When, washing away for the solution of spray can be passed through, be substantially free of chemical reactant in the solution sprayed due to spray unit, then
It avoids the reactant on wafer from remaining, and then improves the quality of chemical etching.
In order to improve spraying effect, as shown in Fig. 2, the spray unit 6 includes two spray tubes being mutually parallel, spray
Pipe, which is arranged on the notch both sides of reactive tank, spray tube, is provided with row's spray port 60.In this way spray when, spray it is molten
Liquid can be sprayed from the notch both sides of reactive tank and be crossed in centre, all sprayed, avoided out so as to the two sides to wafer
The case where now spraying dead angle.Since the wafer in wafer hanging basket is typically all to be placed in parallel, controller can be with control machinery arm
Hanging basket direction is rotated into the wafer angle parallel with direction is sprayed, the solution sprayed in this way can wash away among parallel wafer
Crystal column surface reaches better spraying effect.
Above-described embodiment emphasis is the improvement on spray pipeline, and the solution flowed is needed when due to chemical etching, then is lost
Overflow launder and circulation line are also needed on engraving device, the circulation line such as Fig. 1 may be used in circulation line, i.e., clean single in cycle
Additionally a circulation line is set again on the basis of member, then controller is before etching wafer, so that it may to start the circulation line
It is recycled.In certain embodiments, in order to realize that the solution to cycle is filtered cleaning, cycle cleaning unit can be utilized
Carry out the extraction of the solution of required flowing when chemical etching.Then Etaching device 1 further includes incident unit 7, overflow launder 8, third
Pipeline 9 and the 4th pipeline 10, the incidence unit are arranged in the bottom of reactive tank, and the overflow launder is located at four outside reactive tank
Week, cycle cleaning unit are connected to by third pipeline with overflow launder, and cycle cleaning unit is connected by the 4th pipeline and incident unit
Logical, cycle cleaning unit is used to extract the liquid of overflow launder and is sprayed from incident unit.
In order to realize the Liquid extracting of different pipelines, cycle cleaning unit can be arranged that there are two drawing liquid pump, a drawing liquids
For the solution of reactive tank to be extracted into spray unit, another drawing liquid pump is used to the solution of overflow launder being extracted into incident unit pump.
Or in some embodiments, the opening and closing that a drawing liquid pump then controls different pipelines may be used.It only needs in this way
Want a drawing liquid pump that can realize the solution extraction of two-way.Because the Liquid extracting time between not going the same way is different, then use
Not the case where one drawing liquid pump not will produce conflict.Open and close between different pipelines can be controlled by solenoid valve.
As described in Figure 3, before the etch, controller can control the solenoid valve on the one the second pipelines to close the one the second pipelines, beat
The solenoid valve of the 3rd the 4th pipeline is opened, and controls drawing liquid pump rotation, to which the solution of overflow launder is extracted into incident unit.It is etching
When closing to an end.Controller can control the solenoid valve on the one the second pipelines and open to open the one the second pipelines, close the
The solenoid valve of 3 the 4th pipelines, and drawing liquid pump rotation is controlled, to which the solution of reactive tank is extracted into spray unit.By overflow launder
Solution when being extracted into incident unit, solution can also be filtered by recycling the filter element of cleaning unit, to reduce
The content of chemical reactant in solution.
As with the above discussed embodiment, the extraction of different pipelines can be realized by opening and closing different pipelines.Or
Person by check valve and two-way pump (such as double-direction gearpump) in some embodiments it is possible to carry out automatically switching control, such as
Shown in Fig. 4, the 4th pipeline is equipped with the first check valve 11 that circulating direction is directed toward incident unit, is set on first pipeline
There is circulating direction to be directed toward the second check valve 12 of cycle cleaning unit.In this way, in etching process, cycle cleaning unit is from upper past
When lower pumping, the first check valve 11 can be opened, and liquid can enter incident unit, realize by the liquid circulation field in outer benefit
Stream.And the scour process finished in etching, when cycle cleaning unit is taken out from the bottom up, the second check valve 12 can be opened, liquid
Cognition enters cycle cleaning unit, realizes and washes away solution outside by interior benefit.Correspondingly, conducting direction can be arranged in third pipeline
The check valve that conducting direction is directed toward spray unit can also be arranged by being directed toward check valve, the second pipeline of cycle cleaning unit, be realized
The access of automation controls.
Incident unit is exactly for spraying liquid from reaction tank bottom, to realize by reaction tank bottom to reaction groove top
The solution (abbreviation field flow) of the flowing in portion.Incident unit may be used is placed on the pros of reaction tank bottom as Fig. 1 is such a
Shape pipe has on pipe through-hole straight up, such solution that can be entered in reactive tank from the through-hole on pipe.For reality
Now uniform field flow improves etching quality, and the incidence unit 7 includes incident pipe 70 and reflector 71, the reflector upper table
Face is the plane that through-hole is arranged, and lower surface is paraboloid, and the incident pipe is placed in the focus where the paraboloidal parabola
Locate, direction is provided in the incident pipe and is directed toward paraboloidal entrance aperture.When the 4th pipeline 10 flows into solution, solution meeting
Incident pipe is flowed into, is then projected from the entrance aperture of incident pipe, and rush at the paraboloid of reflector.Since incident pipe is in focus
Place, the flow after parabolic reflector can form steady field flow, simultaneously because the through-hole of reflector upper surface, can allow the stream of solution
Dynamic direction is straight up.And since the upper surface of reflector is the bottom surface of reactive tank, then the uniform field flow meeting of incident unit
It enters in reactive tank, and forms uniform field flow in reactive tank so that the flow velocity base that each place of wafer is contacted with solution
This is consistent, ensures etching quality.
In order to which further such that field flow is more uniform, the invention also includes ultrasonic oscillation unit 13, supersonic oscillations lists
Member 13 is arranged on the groove body wall of reactive tank.By ultrasonic oscillation unit, field flow is broken up so that field flow is more uniform.
Ultrasonic oscillation unit should act on field flow before field flow flows through wafer, since wafer is typically placed in reactive tank
Middle part, then the ultrasonic oscillation unit be preferably arranged on following position in the middle part of reactive tank, the side wall in reactive tank is such as set
Or bottom.
Further, the notch of the overflow launder is provided with level sensing unit 14, and the level sensing unit is for adopting
Collect overflow launder liquid level.Level sensing unit 14 is used to transmit liquid level signal to controller, in this way when liquid level deficiency, control
Device can open drawing liquid pump and add to not used solution in overflow launder or reactive tank, avoid solution evaporating loss from causing molten
The situation of liquid deficiency.
Further, further include multiaxial motion mechanical arm 15, the multiaxial motion mechanical arm is arranged on reactive tank
Side.Multiaxial motion mechanical arm includes Multi-shaft movement mechanism, and Multi-shaft movement mechanism can include horicontal motion mechanism and vertical
Motion can drive mechanical arm horizontal movement and vertical and straight movement respectively, while can also include rotating mechanism, can be with
Mechanical arm rich vertical axis rotation in the vertical direction is driven, the multi-direction whipping of cassette can be driven in this way, it can be by wafer
On bubble get rid of, realize more effective crystal round etching.
And the chemical monitoring unit (not shown) for detecting pH value is provided in the reactive tank of the present embodiment.
As long as chemical monitoring unit can touch solution, controller may be implemented to the monitoring of solution pH value and report in reactive tank
It is alert, convenient for users to replacing solution in reactive tank.
It should be noted that although the various embodiments described above have been described herein, it is not intended to limit
The scope of patent protection of the present invention.Therefore, based on the present invention innovative idea, to embodiment described herein carry out change and repair
Change, or using equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it directly or indirectly will be with
Upper technical solution is used in other related technical areas, is included within the scope of patent protection of the present invention.
Claims (4)
1. a kind of Etaching device with novel pipeline structure, it is characterised in that：Including reactive tank, the first pipeline, the second pipeline,
Cleaning unit and spray unit are recycled, cycle cleaning unit is connected to by the first pipeline with reaction tank bottom, and cleaning unit is recycled
Be connected to spray unit by the second pipeline, cycle cleaning unit for abstraction reaction slot liquid and filtering after from spray unit
It sprays, spray unit is arranged the notch in reactive tank and sprays the notch for being directed toward reactive tank in direction.
2. a kind of Etaching device with novel pipeline structure according to claim 1, it is characterised in that：The spray is single
Member includes two spray tubes being mutually parallel, and spray tube is arranged is provided with row spray on the notch both sides of reactive tank, spray tube
Drench mouth.
3. a kind of Etaching device with novel pipeline structure according to claim 1, it is characterised in that：Further include incidence
Unit, overflow launder, third pipeline and the 4th pipeline, the incidence unit are arranged in the bottom of reactive tank, and the overflow launder is located at
Surrounding outside reactive tank, cycle cleaning unit are connected to by third pipeline with overflow launder, and cycle cleaning unit passes through the 4th pipe
Road is connected to incident unit, and cycle cleaning unit is used to extract the liquid of overflow launder and is sprayed from incident unit.
4. a kind of Etaching device with novel pipeline structure according to claim 3, it is characterised in that：4th pipe
It is equipped with the first check valve that circulating direction is directed toward incident unit on the road, it is clean that first pipeline is equipped with circulating direction direction cycle
Second check valve of net unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810214433.5A CN108321104B (en) | 2018-03-15 | 2018-03-15 | Etching device with pipeline structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810214433.5A CN108321104B (en) | 2018-03-15 | 2018-03-15 | Etching device with pipeline structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108321104A true CN108321104A (en) | 2018-07-24 |
| CN108321104B CN108321104B (en) | 2024-01-23 |
Family
ID=62902217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810214433.5A Active CN108321104B (en) | 2018-03-15 | 2018-03-15 | Etching device with pipeline structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108321104B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128810A (en) * | 2020-01-02 | 2020-05-08 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning equipment |
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| CN101295622A (en) * | 2007-04-24 | 2008-10-29 | 中芯国际集成电路制造(上海)有限公司 | Device and method for cleaning wafer |
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| CN102760672A (en) * | 2011-04-28 | 2012-10-31 | 英飞凌科技股份有限公司 | Etching device and a method for etching a material of a workpiece |
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2018
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|---|---|---|---|---|
| CN101295622A (en) * | 2007-04-24 | 2008-10-29 | 中芯国际集成电路制造(上海)有限公司 | Device and method for cleaning wafer |
| CN102246277A (en) * | 2008-11-04 | 2011-11-16 | Lg矽得荣株式会社 | Apparatus and method for wet-processing object, and fluid diffusion plate and barrel used therein |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128810A (en) * | 2020-01-02 | 2020-05-08 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer cleaning equipment |
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| Publication number | Publication date |
|---|---|
| CN108321104B (en) | 2024-01-23 |
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