CN207868175U - A kind of multi-functional Etaching device - Google Patents
A kind of multi-functional Etaching device Download PDFInfo
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- CN207868175U CN207868175U CN201820354870.2U CN201820354870U CN207868175U CN 207868175 U CN207868175 U CN 207868175U CN 201820354870 U CN201820354870 U CN 201820354870U CN 207868175 U CN207868175 U CN 207868175U
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Abstract
The utility model discloses a kind of multi-functional Etaching device, including reactive tank, multiaxial motion mechanical arm, overflow launder, cycle cleaning unit, spray unit and incident unit, the multiaxial motion mechanical arm is arranged above reactive tank, the surrounding outside reactive tank is arranged in the overflow launder, the cycle cleaning unit is used to extract and filter the liquid of extraction, spray unit is arranged the notch in reactive tank and sprays the notch for being directed toward reactive tank in direction, the incidence unit is arranged in the bottom of reactive tank, and the first inlet for recycling cleaning unit is connected to reaction tank bottom.The movement of wafer different directions in solution may be implemented by multiaxial motion mechanical arm for above-mentioned technical proposal, can move in wafer to different reactive tanks and be reacted or cleaned.Spray unit can remain to avoid the reactant on wafer, and then improve the quality of chemical etching.Uniform field flow may be implemented in paraboloidal reflector, and then improves the quality of chemical etching.
Description
Technical field
The utility model is related to crystal round etching engineering device technique field more particularly to a kind of multi-functional Etaching devices.
Background technology
Existing crystal round etching apparatus function is simple, and basic structure includes reactive tank and overflow launder and the machine of up and down motion
There are many problems in tool arm, such as just started mechanical arm and wafer is put into crystal column surface in reactive tank in actual use
Bubble is had, influences to etch quality；In etching process, the field flow in reactive tank is uneven, causes crystal column surface etching speed
It is inconsistent, it influences to etch quality；After the etch is completed, the chemical reactant after crystal column surface meeting attachment reaction, influences wafer
Post-processing.These problems can all influence the yields of crystal round etching.
Utility model content
For this reason, it may be necessary to provide a kind of multi-functional Etaching device, it is low to solve existing Etaching device crystal round etching yields
Problem.
To achieve the above object, a kind of multi-functional Etaching device, including reactive tank, multiaxial motion machine are inventor provided
Tool arm, overflow launder, cycle cleaning unit, spray unit and incident unit, the multiaxial motion mechanical arm setting are being reacted
Above slot, the surrounding outside reactive tank is arranged in the overflow launder, and the cycle cleaning unit is for extracting and filtering extraction
Liquid, spray unit are arranged the notch in reactive tank and spray the notch for being directed toward reactive tank in direction, and the incidence unit setting exists
The bottom of reactive tank, the first inlet for recycling cleaning unit are connected to reaction tank bottom, recycle the second feed liquor of cleaning unit
Mouth is connected to isopipe root, and the incidence unit includes incident pipe and reflector, and the reflector upper surface is setting through-hole
Plane, lower surface is paraboloid, and the incident pipe is placed in the focal point where the paraboloidal parabola, the incident pipe
On be provided with direction and be directed toward paraboloidal entrance aperture, the second liquid outlet for recycling cleaning unit is connect with incident pipe.
Further, the spray unit includes two spray tubes being mutually parallel, and the slot in reactive tank is arranged in spray tube
Mouthful both sides are provided with row's spray port on spray tube.
Further, first that the incident unit of circulating direction direction is equipped between the incident unit and cycle cleaning unit is single
To valve, the second check valve that circulating direction is directed toward cycle cleaning unit is equipped between the reaction tank bottom and cycle cleaning unit.
Further, further include ultrasonic oscillation unit, ultrasonic oscillation unit be arranged on the groove body wall of reactive tank or
In person's reflector lower surface wall.
Further, the notch of the overflow launder is provided with level sensing unit, and the level sensing unit is for acquiring
Overflow launder liquid level.
Further, the chemical monitoring unit for detecting pH value is provided in the reactive tank.
Further, the multiaxial motion mechanical arm includes Multi-shaft movement mechanism, rotating mechanism and mechanical arm, multiaxis
Motion is connect with rotating mechanism, and rotating mechanism is connect with mechanical arm.
It is different from the prior art, by multiaxial motion mechanical arm wafer may be implemented in solution not in above-mentioned technical proposal
Equidirectional movement can remove wafer and avoid the bubble of attachment, while can move in wafer to different reactive tanks and carry out
Reaction or cleaning.Spray unit can wash away the wafer after reaction in reactive tank notch, avoid the reaction on wafer
Object remains, and then improves the quality of chemical etching.Paraboloidal reflector can reflect incident solution so that incident
The upward uniform field flow of parallel vertical is formed after solution reflection afterwards, it, can be with simultaneously because reflector upper surface has through-hole
Blocking non-vertical upward field flow so that the field flow entered inside reactive tank is all straight up, finally to realize uniform field flow,
And then improve the quality of chemical etching.
Description of the drawings
Fig. 1 is the structural schematic diagram of Etaching device described in technology before improving；
Fig. 2 is the structural schematic diagram of the Etaching device described in specific implementation mode；
Fig. 3 is the structural schematic diagram of the incident unit described in specific implementation mode；
Fig. 4 is the reflection liquid schematic diagram of the incident unit described in specific implementation mode；
Fig. 5 is the structural schematic diagram of the cycle cleaning unit described in specific implementation mode；
Fig. 6 is the structural schematic diagram of the cycle cleaning unit described in another specific implementation mode.
Reference sign：
1, Etaching device；2, reactive tank；3, the first pipeline；4, the second pipeline；
5, cleaning unit is recycled；6, spray unit；60, spray port；
7, incident unit；70, incident pipe；71, reflector；
8, overflow launder；9, third pipeline；10, the 4th pipeline；11 first check valves；
12, the second check valve；13, ultrasonic oscillation unit；14, level sensing unit；
15, multiaxial motion mechanical arm；A, mechanical arm.
Specific implementation mode
For the technology contents of technical solution, construction feature, the objects and the effects are described in detail, below in conjunction with specific reality
It applies example and attached drawing is coordinated to be explained in detail.
Fig. 6 is please referred to Fig.1, the present embodiment provides a kind of multi-functional Etaching device, existing Etaching device such as Fig. 1 institutes
Show, includes reactive tank and overflow launder, there are one circulation lines to be used to the easy of overflow launder being drawn into reaction tank bottom, machine
Tool arm is chemically reacted for wafer to be put into reactive tank and is after the reaction taken out wafer from reactive tank.This reality
The Etaching device 1 for applying example is as shown in Figure 2,3, a kind of multi-functional Etaching device, including reactive tank 2, multiaxial motion mechanical arm
15, overflow launder 8, cycle cleaning unit 5, spray unit 6 and incident unit 7, the multiaxial motion mechanical arm setting are being reacted
Above slot, the surrounding outside reactive tank is arranged in the overflow launder, and the cycle cleaning unit is for extracting and filtering extraction
Liquid, spray unit are arranged the notch in reactive tank and spray the notch for being directed toward reactive tank in direction, and the incidence unit setting exists
The bottom of reactive tank, the first inlet for recycling cleaning unit are connected to reaction tank bottom, recycle the second feed liquor of cleaning unit
Mouth is connected to isopipe root, and the incidence unit includes incident pipe and reflector, and the reflector upper surface is setting through-hole
Plane, lower surface is paraboloid, and the incident pipe is placed in the focal point where the paraboloidal parabola, the incident pipe
On be provided with direction and be directed toward paraboloidal entrance aperture, the second liquid outlet for recycling cleaning unit is connect with incident pipe.
Wherein, Etaching device can include there are one controller, controller is used for generally by the way of automation control
Control the work of all units of Etaching device.Multiaxial motion mechanical arm includes Multi-shaft movement mechanism, such as 3D printer
Motion, Multi-shaft movement mechanism can include horicontal motion mechanism and vertical and straight movement mechanism, can drive mechanical arm respectively
The movement of wafer different directions in solution is achieved in horizontal movement and vertical and straight movement, can remove wafer and avoid attachment
Bubble, while can move in wafer to different reactive tanks and be reacted or cleaned..Can also include simultaneously rotating machine
Structure can drive mechanical arm to have mercy in the vertical direction vertical axis rotation, can drive the multi-direction whipping of cassette in this way, can be with
Bubble on wafer is got rid of, realizes more effective crystal round etching.
The effect extracted and filtered may be implemented in cycle cleaning unit, specifically can be by drawing liquid pump and in drawing liquid pump
Exit increases a filter element to realize the extraction and filtering to solution.Etaching device at work, first in reactive tank
Chemical solution is inside filled, then controller control machinery arm A slings the hanging basket equipped with wafer, and hanging basket is then immersed in chemistry
Chemical etching is carried out in solution.The solution flowed is needed when etching, cycle cleaning unit and incident unit are exactly excessive for extracting
The solution of chute simultaneously sprays liquid from reaction tank bottom, to realize by the molten of the flowing at the top of reaction tank bottom to reactive tank
Liquid (abbreviation field flow).When recycling cleaning unit start-up operation, then the 4th pipeline 10 can flow into solution, then solution can flow into incidence
Pipe then projects from the entrance aperture of incident pipe, and rushes at the paraboloid of reflector.As shown in figure 4, since incident pipe is in focus
Place, the flow after parabolic reflector can form parallel steady field flow, simultaneously because the through-hole of reflector upper surface, can allow solution
Flow direction straight up (as shown in Fig. 4 arrow directions).And since the upper surface of reflector is the bottom surface of reactive tank,
Then the uniform field flow of incident unit can enter in reactive tank, and uniform field flow is formed in reactive tank so that wafer is each
The flow velocity that place is contacted with solution is almost the same, ensures etching quality.
Before chemical etching finishes, controller opens the motor of drawing liquid pump inside cycle cleaning unit, by reaction tank bottom
Solution be extracted into the second pipeline from the first pipeline, and from spray unit spray.Due to the filtering list inside cycle cleaning unit
Member can be filtered solution, then the chemical reactant out of spray unit sprays solution greatly reduces.Then chemistry erosion
After quarter, controller control machinery arm A hangs out wafer out of reactive tank.Since the spray direction of spray unit is directed toward instead
The notch of slot is answered, then when wafer is hung out from reactive tank, washing away for the solution of spray can be passed through, sprayed due to spray unit
It is substantially free of chemical reactant in solution, then the reactant on wafer is avoided to remain, and then improves the quality of chemical etching.
In order to improve spraying effect, as shown in Fig. 2, the spray unit 6 includes two spray tubes being mutually parallel, spray
Pipe, which is arranged on the notch both sides of reactive tank, spray tube, is provided with row's spray port 60.In this way spray when, spray it is molten
Liquid can be sprayed from the notch both sides of reactive tank and be crossed in centre, all sprayed, avoided out so as to the two sides to wafer
The case where now spraying dead angle.Since the wafer in wafer hanging basket is typically all to be placed in parallel, controller can be with control machinery arm
Hanging basket direction is rotated into the wafer angle parallel with direction is sprayed, the solution sprayed in this way can wash away among parallel wafer
Crystal column surface reaches better spraying effect.
In order to realize the Liquid extracting of different pipelines, cycle cleaning unit can be arranged that there are two drawing liquid pump, a drawing liquids
For the solution of reactive tank to be extracted into spray unit, another drawing liquid pump is used to the solution of overflow launder being extracted into incident unit pump.
Or in some embodiments, the opening and closing that a drawing liquid pump then controls different pipelines may be used.It only needs in this way
Want a drawing liquid pump that can realize the solution extraction of two-way.Because the Liquid extracting time between not going the same way is different, then use
Not the case where one drawing liquid pump not will produce conflict.Open and close between different pipelines can be controlled by solenoid valve.
As described in Figure 5, before the etch, controller can control the solenoid valve on the one the second pipelines to close the one the second pipelines, beat
The solenoid valve of the 3rd the 4th pipeline is opened, and controls drawing liquid pump rotation, to which the solution of overflow launder is extracted into incident unit.It is etching
When closing to an end.Controller can control the solenoid valve on the one the second pipelines and open to open the one the second pipelines, close the
The solenoid valve of 3 the 4th pipelines, and control drawing liquid pump and rotate backward, to which the solution of reactive tank is extracted into spray unit.It will overflow
When the solution of chute is extracted into incident unit, solution can also be filtered by recycling the filter element of cleaning unit, to
Reduce the content of chemical reactant in solution.
As with the above discussed embodiment, the extraction of different pipelines can be realized by opening and closing different pipelines.Or
Person by check valve and two-way pump (such as double-direction gearpump) in some embodiments it is possible to carry out automatically switching control, such as
Shown in Fig. 6, the 4th pipeline is equipped with the first check valve 11 that circulating direction is directed toward incident unit, is set on first pipeline
There is circulating direction to be directed toward the second check valve 12 of cycle cleaning unit.In this way, in etching process, cycle cleaning unit is from upper past
When lower pumping, the first check valve 11 can be opened, and liquid can enter incident unit, realize by the liquid circulation field in outer benefit
Stream.And the scour process finished in etching, when cycle cleaning unit is taken out from the bottom up, the second check valve 12 can be opened, liquid
Cognition enters cycle cleaning unit, realizes and washes away solution outside by interior benefit.Correspondingly, conducting direction can be arranged in third pipeline
The check valve that conducting direction is directed toward spray unit can also be arranged by being directed toward check valve, the second pipeline of cycle cleaning unit, be realized
The access of automation controls.
In order to which further such that field flow is more uniform, the utility model further includes ultrasonic oscillation unit 13, and ultrasonic wave shakes
Unit 13 is swung to be arranged on the groove body wall of reactive tank.By ultrasonic oscillation unit, field flow is broken up so that field flow is more equal
It is even.Ultrasonic oscillation unit should act on field flow before field flow flows through wafer, since wafer is typically placed in the middle part of reactive tank,
Then the ultrasonic oscillation unit is preferably arranged on following position in the middle part of reactive tank, such as on the groove body wall of reactive tank or anti-
It penetrates in cover lower surface wall.
Further, the notch of the overflow launder is provided with level sensing unit 14, and the level sensing unit is for adopting
Collect overflow launder liquid level.Level sensing unit 14 is used to transmit liquid level signal to controller, in this way when liquid level deficiency, control
Device can open drawing liquid pump and add to not used solution in overflow launder or reactive tank, avoid solution evaporating loss from causing molten
The situation of liquid deficiency.
And the chemical monitoring unit (not shown) for detecting pH value is provided in the reactive tank of the present embodiment.
As long as chemical monitoring unit can touch solution, controller may be implemented to the monitoring of solution pH value and report in reactive tank
It is alert, convenient for users to replacing solution in reactive tank.
It should be noted that although the various embodiments described above have been described herein, it is not intended to limit
The scope of patent protection of the utility model.Therefore, the innovative idea based on the utility model carries out embodiment described herein
Change and modification or equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, directly
Or above technical scheme is used in other related technical areas indirectly, it is included in the patent protection model of the utility model
Within enclosing.
Claims (7)
1. a kind of multi-functional Etaching device, it is characterised in that：Including reactive tank, multiaxial motion mechanical arm, overflow launder, cycle
Cleaning unit, spray unit and incident unit, the multiaxial motion mechanical arm are arranged above reactive tank, and the overflow launder is set
The surrounding outside reactive tank is set, the cycle cleaning unit is used to extract and filter the liquid of extraction, and spray unit setting exists
The notch of reactive tank and the notch for spraying direction direction reactive tank, the incidence unit are arranged in the bottom of reactive tank, and cycle is clean
First inlet of net unit is connected to reaction tank bottom, and the second inlet for recycling cleaning unit is connected to isopipe root,
The incidence unit includes incident pipe and reflector, and the reflector upper surface is the plane that through-hole is arranged, and lower surface is parabolic
Face, the incident pipe are placed in the focal point where the paraboloidal parabola, and direction is provided in the incident pipe and is directed toward throwing
The entrance aperture of object plane, the second liquid outlet for recycling cleaning unit are connect with incident pipe.
2. a kind of multi-functional Etaching device according to claim 1, it is characterised in that：The spray unit includes two
The spray tube being mutually parallel, spray tube, which is arranged on the notch both sides of reactive tank, spray tube, is provided with row's spray port.
3. a kind of multi-functional Etaching device according to claim 1, it is characterised in that：The incidence unit and cycle are clean
It is equipped with the first check valve that circulating direction is directed toward incident unit between net unit, is set between the reaction tank bottom and cycle cleaning unit
There is circulating direction to be directed toward the second check valve of cycle cleaning unit.
4. a kind of multi-functional Etaching device according to claim 1, it is characterised in that：It further include supersonic oscillations list
Member, ultrasonic oscillation unit be arranged on the groove body wall of reactive tank or reflector lower surface wall on.
5. a kind of multi-functional Etaching device according to claim 1, it is characterised in that：The notch of the overflow launder is arranged
There is level sensing unit, the level sensing unit is for acquiring overflow launder liquid level.
6. a kind of multi-functional Etaching device according to claim 1, it is characterised in that：Setting is useful in the reactive tank
In the chemical monitoring unit of detection pH value.
7. a kind of multi-functional Etaching device according to claim 1, it is characterised in that：The multiaxial motion mechanical arm
Including Multi-shaft movement mechanism, rotating mechanism and mechanical arm, Multi-shaft movement mechanism is connect with rotating mechanism, rotating mechanism and machinery
Arm connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820354870.2U CN207868175U (en) | 2018-03-15 | 2018-03-15 | A kind of multi-functional Etaching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820354870.2U CN207868175U (en) | 2018-03-15 | 2018-03-15 | A kind of multi-functional Etaching device |
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| Publication Number | Publication Date |
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| CN207868175U true CN207868175U (en) | 2018-09-14 |
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| CN201820354870.2U Active CN207868175U (en) | 2018-03-15 | 2018-03-15 | A kind of multi-functional Etaching device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461426A (en) * | 2018-03-15 | 2018-08-28 | 福建省福联集成电路有限公司 | A kind of multi-functional Etaching device |
-
2018
- 2018-03-15 CN CN201820354870.2U patent/CN207868175U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108461426A (en) * | 2018-03-15 | 2018-08-28 | 福建省福联集成电路有限公司 | A kind of multi-functional Etaching device |
| CN108461426B (en) * | 2018-03-15 | 2024-01-23 | 福建省福联集成电路有限公司 | Multifunctional etching device |
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