CN111790663A - Wafer cleaning device and wafer cleaning machine - Google Patents
Wafer cleaning device and wafer cleaning machine Download PDFInfo
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- CN111790663A CN111790663A CN202010461427.7A CN202010461427A CN111790663A CN 111790663 A CN111790663 A CN 111790663A CN 202010461427 A CN202010461427 A CN 202010461427A CN 111790663 A CN111790663 A CN 111790663A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer cleaning device and a wafer cleaning machine, wherein the wafer cleaning device is provided with a cleaning tank and is characterized in that the wafer cleaning device also comprises a bottom supporting component; the bottom support assembly is arranged at the bottom of the cleaning tank and comprises a first support piece and a second support piece; the first supporting piece is fixedly arranged on the bottom wall of the cleaning tank and used for supporting the wafer; the second supporting piece is used for supporting and driving the wafer to rise from the initial position to a first preset position which can be separated from a contact point of the wafer, which is contacted with the first supporting piece; and the wafer is used for supporting and driving the wafer to descend from the first preset position to the initial position where the wafer can contact the contact. The invention can solve the problem that the wafer cannot be cleaned because the supporting contact point of the wafer has a dead angle when the wafer is cleaned in the prior art, thereby improving the cleaning effect of the wafer and reducing the wafer pollution caused by the improper cleaning.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer cleaning device and a wafer cleaning machine.
Background
Semiconductors are a strategic industry in the development of modern economic society, are widely applied to industries such as communication, automobiles, electronic consumption and the like, and are one of the core components of most electronic devices. As IC semiconductor manufacturing technology continues to evolve, the feature sizes of wafers continue to decrease, and the demands on wafer cleaning processes and equipment continue to increase.
At present, the groove type cleaning equipment can process wafers in batches on the premise of meeting the process effect and has irreplaceable advantages. However, the existing groove-type machine station transmits the wafer by using the basket, and the basket structure can block the flow of the liquid medicine in the process, so that a cleaning 'dead corner region' is formed in the contact area between the wafer and the basket, and the flow force of the circulating liquid medicine is not enough to break through the boundary layer formed at the contact point due to the surface tension effect, so that the effect of the wafer cleaning process is poor, the product yield is influenced, and the like.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art and provides a wafer cleaning device and a wafer cleaning machine.
In order to achieve the object of the present invention, a first aspect provides a wafer cleaning apparatus, including a cleaning tank, the wafer cleaning apparatus further including a bottom support assembly;
the bottom support assembly is arranged at the bottom of the cleaning tank and comprises a first support piece and a second support piece;
the first supporting piece is fixedly arranged on the bottom wall of the cleaning tank and used for supporting the wafer;
the second supporting piece is used for supporting and driving the wafer to rise from an initial position to a first preset position which can be separated from a contact point of the wafer, which is contacted with the first supporting piece; and the wafer is used for supporting and driving the wafer to descend from the first preset position to the initial position where the wafer can contact the contact.
Optionally, the first support comprises a first support body and a first support block arranged at the top of the first support body; one or more first constraint grooves are formed in the upper surface of the first supporting block; the first constraint groove is used for supporting the wafer and constraining the position of the wafer in the cleaning groove;
the bottom surface of the first restraining groove is tangent to the circumference of the edge of the wafer placed in the first restraining groove.
Optionally, the second supporting member includes a second supporting body and a second supporting block disposed at the top of the second supporting body, and one or more second constraining grooves are formed in the upper surface of the second supporting block; the second constraint groove is used for supporting the wafer and constraining the position of the wafer in the cleaning groove;
the bottom surface of the second constraint groove is tangent to the circumference of the edge of the wafer in the second constraint groove.
Optionally, the wafer further comprises a sidewall restraint assembly, wherein the sidewall restraint assembly comprises a sidewall restraint body and a wafer side restraint structure;
the side wall constraint body is arranged on the tank wall of the cleaning tank; the wafer side constraint structure is arranged on the side wall constraint body and used for constraining the position of the wafer in the cleaning tank.
Optionally, the wafer side constraint structure includes a wafer side constraint body and a wafer side constraint groove disposed on the wafer side constraint body, the wafer side constraint groove is used for constraining the position of the wafer in the cleaning groove, and the wafer side constraint groove is a V-shaped groove.
Optionally, a drain hole is formed in the side wall constraint body, and the cleaning solution overflows to the outside of the cleaning tank through the drain hole.
Optionally, the cleaning tank further comprises a spraying device, wherein the spraying device is arranged on the side wall of the cleaning tank and is used for spraying towards the position of the wafer, which is contacted with the second support member and/or the first support member, when the first support member and/or the second support member support the wafer.
Optionally, the spraying device includes a spraying port and a spraying pipe, the spraying pipe is disposed in the sidewall constraint body, and the spraying port is disposed on a surface of the sidewall constraint body close to the wafer;
and conveying the cleaning liquid to the spraying port through the spraying pipeline, and spraying towards the position of the wafer contacted with the second support piece and/or the first support piece through the spraying port.
Optionally, the second support further comprises a drive source and a trough bottom seal;
the driving source is used for driving the second support to ascend or descend;
the tank bottom sealing part is used for sealing the connecting part of the cleaning tank and the second supporting piece.
In order to achieve the object of the present invention, in another aspect, a wafer cleaning machine is provided, which includes the wafer cleaning apparatus of the first aspect.
The invention has the following beneficial effects:
according to the wafer cleaning device provided by the invention, the cleaning tank is internally provided with the fixed first supporting piece and the liftable second supporting piece, the wafer can be alternately supported by the lifting of the second supporting piece, and when the first supporting piece and/or the second supporting piece support the wafer, the position of the wafer contacted with the second supporting piece and/or the first supporting piece is cleaned, so that the problems that the supporting contact point of the wafer has a dead angle and cannot be cleaned completely when the wafer is cleaned in the prior art are solved, the cleaning effect on the wafer is further improved, and the wafer pollution caused by the improper cleaning is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a wafer cleaning chamber according to an embodiment of the present disclosure;
fig. 2 is a schematic view of a first support block provided in an embodiment of the present application;
FIG. 3a is a schematic view of the enlarged structure at A in FIG. 2;
FIG. 3b is a schematic diagram of the second enlarged structure at A in FIG. 2;
FIG. 4 is a schematic front view of a sidewall restraint assembly according to an embodiment of the present disclosure;
fig. 5 is a schematic side view of a sidewall restraint assembly according to an embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
As used herein, the singular forms "a", "an", "the" and "the" include plural referents unless the context clearly dictates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, elements, components, and/or groups thereof. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The wafer cleaning apparatus provided by the embodiment of the present application includes a cleaning tank 40 and a bottom support assembly. The bottom support assembly is arranged at the bottom of the cleaning tank 40 and comprises a first support 11 and a second support 12; the first supporting member 11 is fixedly arranged on the bottom wall of the cleaning tank 40 and is used for supporting the wafer 61; the second support 12 is used for supporting and driving the wafer 61 to rise from the initial position to a first preset position where the wafer 61 can be separated from a contact point of the first support 11; and a support for supporting and driving the wafer 61 to descend from the first predetermined position to an initial position where the wafer can contact the contacts.
The wafer cleaning device provided by the embodiment is provided with the fixed first supporting piece 11 and the liftable second supporting piece 12 in the cleaning tank 40, the wafer 61 can be alternately supported by the lifting of the second supporting piece 12, and when the first supporting piece 11 and/or the second supporting piece 12 support the wafer 61, the position of the wafer 61 contacted with the second supporting piece 12 and/or the first supporting piece 11 is cleaned, so that the problem that a dead angle exists at a supporting contact point of the wafer when the wafer is cleaned in the prior art and the wafer cannot be cleaned is solved, the cleaning effect on the wafer is further improved, and the wafer pollution caused by the fact that the wafer is not cleaned in place is reduced.
Referring to fig. 1, the wafer cleaning apparatus may be used for batch cleaning of the wafers 61 contained in the container 60, at least one wafer 61 may be vertically contained in the containing groove 601 of the container 60, the first support 11 and the second support 12 may alternately support the bottom edge of the wafer 61 by lifting, and the first support 11 and the second support 12 may support the wafer 61 at different heights, so that when the first support 11 and/or the second support 12 supports the wafer 61, the wafer 61 may be lifted up and tend to leave the containing groove 601, and the position of the wafer 61 located at the containing groove 601 and the position contacted with the second support 12 and/or the first support 11 may be cleaned, thereby improving the cleaning effect of the wafer 61 in the container 60.
The container 60 for holding the wafer 61 may be, but not limited to, a classic flower basket structure, a wafer support rod may be disposed at the bottom of the flower basket structure, and a containing groove 601 for containing the wafer 61 is disposed on the wafer support rod. The cleaning tank 40 for cleaning the wafer 61 may adopt a classic inner and outer tank structure, that is, as shown in fig. 1, the cleaning tank 40 may include an inner tank 41 and an outer tank 42, the inner tank 41 is used for cleaning the wafer 61, the opening of the outer tank 42 is higher than the opening of the inner tank 41, and the cleaning liquid in the inner tank 41 may overflow into the outer tank 42. In addition, the driving source 13 for driving the second supporting member 12 to move up and down may be any device (e.g., a lifting motor, an air cylinder, a hydraulic cylinder, etc.) capable of providing lifting power, and may be disposed outside the cleaning tank 40, and a sealing portion 411 may be disposed at a position connected to the cleaning tank 40 for sealing to prevent liquid leakage.
It should be noted that, the specific structure and material of the cleaning tank 40 and the first support 11 and the second support 12 are not specifically limited in this embodiment, as long as the first support 11 and the second support 12 can be disposed in the cleaning tank 40, and the above-mentioned alternative supporting of the wafer 61 is realized. Preferably, the materials are all made of corrosion-resistant materials (such as materials resistant to hydrofluoric acid, ammonia water, hydrochloric acid and the like) so as to prolong the service life of the materials.
In one embodiment, as shown in fig. 1, the first supporting member 11 and the second supporting member 12 may each include a supporting body and a supporting block disposed at the top of the supporting body. That is, the first supporting member 11 may include a first supporting body 111 and a first supporting block 112 disposed on the top of the first supporting body 111, and the upper surface of the first supporting block 112 may be provided with one or more first constraining grooves 101; the first restraining groove 101 is used for supporting the wafer 61 and restraining the position of the wafer 61 in the cleaning groove 40, and the bottom surface of the first restraining groove 101 is tangent to the circumference of the edge of the wafer 61 in the first restraining groove 101; the second supporting member 12 may include a second supporting body 121 and a second supporting block 122 disposed at the top of the second supporting body 121, and one or more second constraining grooves 102 may be formed on the upper surface of the second supporting block 122; the second confinement groove 102 is also used for supporting the wafer 61 and confining the position of the wafer 61 in the cleaning groove 40, and the bottom surface of the second confinement groove 102 is tangential to the circumference of the edge of the wafer 61 placed in the second confinement groove 102.
Wherein, the first supporting blocks 112 and the second supporting blocks 122 can be arranged at intervals along the edge profile of the wafer 61; each first support block 112 may be used to support the wafer 61 and limit the position of the wafer 61; each of the first support blocks 112 of the first support 11 and each of the second support blocks 122 of the second support 12 are staggered with each other in the circumferential direction of the wafer 61.
In this embodiment, the first supporting body 111 (the second supporting body 121) may be but not limited to a rectangular parallelepiped structure (for example, it may also be a cylinder, as long as it can support the first supporting block 112 (the second supporting block 122)), and it may support one first supporting block 112 (the second supporting block 122) alone, or may support a plurality of first supporting blocks 112 (the second supporting blocks 122) at the same time, and this embodiment is not limited in this embodiment. It is understood that, regardless of the number of the first supporting blocks 112 (the second supporting blocks 122), they can support all the wafers 61 in the cleaning tank 40 (or the container 60), and the wafers 61 are confined in the first supporting blocks 112 (the second supporting blocks 122) when the wafers 61 are supported. The plurality of first supporting blocks 112 (second supporting blocks 122) are spaced along the edge profile of the wafer 61, so that the deflection, displacement and the like of the wafer 61 caused by single-point supporting can be prevented, and the stability and reliability of supporting can be enhanced. Preferably, a plurality of first supporting blocks 112 (second supporting blocks 122) may be provided on one first supporting body 111 (second supporting body 121) so that the plurality of first supporting blocks 112 (second supporting blocks 122) move simultaneously, thereby improving the supporting reliability of the first supporting body 111 (second supporting body 121). And only one first support body 111 (second support body 121) is arranged, so that more assembly and use space can be saved, and the installation and maintenance are facilitated. In addition, the contact positions of the first support block 112 and the second support block 122 with the wafer 61 are usually far from the contact position of the wafer 61 with the receiving groove 601, and do not interfere with the flower basket, so that the contact position of the wafer 61 with the receiving groove 601 can be cleaned when the first support block 112 or the second support block 122 supports the wafer 61.
Preferably, as shown in fig. 1, the first supporting blocks 112 of the first supporting member 11 may be multiple and symmetrically disposed at two sides of the bottom center position, so that the resultant force of the multiple first supporting blocks 112 on the support of the wafer 61 is also vertical upward, and the wafer 61 can also be prevented from deflecting, shifting and the like due to unbalanced force. The number of the first supporting blocks 112 of the second supporting member 12 may be one, and the central line of the connecting portion of the second supporting member 12 and the cleaning tank 40 may pass through the center of a circle of a wafer 61, so that the wafer 61 is supported by a vertical supporting force, and deflection, displacement and the like caused by unbalanced stress on the wafer 61 due to single-point supporting may be prevented.
In this embodiment, usually, the top of the first supporting block 112 (the second supporting block 122) may have a plurality of first constraining grooves 101 (the second constraining grooves 102) and are disposed in one-to-one correspondence with the wafers 61 so as to accommodate and limit each wafer 61, and the width of the first constraining grooves 101 (the second constraining grooves 102) may be slightly larger than the thickness of the wafer 61, so as to prevent the wafer 61 from being greatly shifted and tilted even if the wafer 61 enters. The bottom surface of the first restraining groove 101 (the second restraining groove 102) is arranged to be tangent to the circumference of the edge of the wafer 61, so that the wafer 61 can be ensured to be subjected to an acting force pointing to the center of a circle, and the wafer 61 is vertically arranged, so that the wafer 61 can be ensured to be subjected to an acting force in the vertical direction, and the first restraining groove 101 (the second restraining groove 102) can support the wafer 61 more stably and reliably. In order to realize that the bottom surface of the first confinement groove 101 (the second confinement groove 102) is tangent to the circumference of the edge of the wafer 61, preferably, as shown in fig. 3a and 3b, the bottom surface of the first confinement groove 101 on the first support block 112 may be a plane, and the bottom surface of the second confinement groove 102 on the second support block 122 may be an inclined surface. In addition, as shown in fig. 2, the first and second support blocks 112 and 122 may be a taper or wedge, and the angle 103 between the taper or wedge and the constraining body may be, for example, 30 °, 60 °, etc. The inclination angle 103 can reduce the circulation resistance of the cleaning liquid when the wafer 61 is cleaned by the cleaning liquid, thereby further improving the cleaning efficiency.
In another embodiment, as shown in fig. 1, 4 and 5, the wafer cleaning apparatus may further include a sidewall restraint assembly 30, and the sidewall restraint assembly 30 may be disposed on a sidewall of the cleaning tank 40 for supporting a side edge of the wafer 61. By arranging the side wall constraining assembly 30, the edge of the side portion of the wafer 61 can be controlled, so that the wafer 61 is kept in a vertical state, and the wafer 61 is prevented from deviating from the accommodating groove 601 and even being incapable of entering a flower basket and the like. It should be noted that the specific structure of the sidewall constraint assembly 30 is not limited in the present embodiment, as long as it can support the side edge of the wafer 61 as above. The material can be made of corrosion-resistant materials (such as hydrofluoric acid, ammonia water, hydrochloric acid and the like) preferably, so that the service life of the material is prolonged.
Further, as shown in fig. 4 and 5, sidewall restraint assembly 30 may include a sidewall restraint body 31 and one or more wafer side restraint structures 32, sidewall restraint body 31 may be disposed on a tank wall of rinse tank 40; a plurality of wafer side constraining structures 32 may be disposed on the sidewall constraining body 31, each wafer side constraining structure 32 is used for supporting a side edge of the wafer 61 and constraining the position of the wafer 61 in the cleaning tank 40, so as to limit the vertical projection of the wafer 61 to be located in the accommodating groove 601.
As shown in fig. 1, the sidewall restraint assembly 30 may include two sets, one set on each side of the wafer 61. As shown in fig. 1 and 5, the side wall constraining body 31 may be a plate-shaped structure having a "barb" at the upper end, and may be hooked on the top end of the cleaning tank 40 by the "barb" structure, and may be fitted with the inner and outer tank walls of the cleaning tank 40 with a small interference to fix the upper end of the side wall constraining body 31. The lower end of the sidewall constraint body 31 may be fixed to the bottom of the wash tank 40 using a screw 312. The wafer side constraining structure 32 may be directly fixed on the sidewall constraining body 31, or may be fixed on the sidewall constraining body 31 through an adaptor, and the embodiment does not specifically limit the specific structure and the fixing manner of the wafer side constraining structure 32, as long as it can support the side edge of the wafer 61, and limit the vertical projection of the wafer 61 to be located in the accommodating groove 601.
Further, the wafer side restraining structure 32 may include a wafer side restraining body and a wafer side restraining slot disposed on the wafer side restraining body for restraining the position of the wafer 61 in the cleaning slot 40. And the wafer side restraint slots may be V-shaped slots.
The constraining body is used for supporting and fixing the wafer side constraining groove, so as to facilitate the processing and installation of the wafer side constraining groove and prevent the structural strength of the sidewall constraining body 31 from being affected by excessive connection. Similar to the principle of the wafer side confinement grooves, a plurality of wafer side confinement grooves may be provided and are arranged in one-to-one correspondence with the wafers 61 (for example, 51 wafer side confinement grooves are arranged equidistantly), and the shape of the wafer side confinement grooves may be set to be "V-shaped" (including a deformation based on the V-shape, such as a trapezoid, a wave shape, and the like), so that the circulating cleaning solution for cleaning the wafers 61 flows at the bottoms of the wafer side confinement grooves while preventing the wafers 61 from shifting during the cleaning process, thereby facilitating the cleaning of the edges of the wafer 61 and the circulation of the cleaning solution. It should be noted that the present embodiment is not limited thereto, as long as the wafer side restraining groove can support the side edge of the wafer 61 and does not affect the cleaning of the side edge of the wafer 61.
In another embodiment, as shown in fig. 4, the sidewall constraint body 31 may include a plurality of drain holes 311, and the plurality of drain holes 311 are disposed at the upper portion of the sidewall constraint body 31 and located at the opening at the upper end of the cleaning tank 40 for overflowing the liquid in the cleaning tank 40. The drain holes 311 may be rectangular, circular or other structures, and are regularly arranged in the drain hole area 301 (i.e., the hollow area inside the dashed line frame in fig. 4) to ensure that the liquid in the cleaning tank 40 can overflow normally. It should be noted that the present embodiment does not limit the specific number, structure and position of the drain holes 311, as long as the liquid in the cleaning tank 40 can overflow normally.
In another embodiment, as shown in fig. 1 and 4, the wafer cleaning apparatus may further include a spraying device, which may be disposed on a sidewall of the cleaning tank 40 and used for spraying toward a position of the wafer 61 that is in contact with the second support 11 and/or the first support 12 when the first support 11 and/or the second support 12 supports the wafer 61. By arranging the spraying device, when the wafer 61 is jacked up, the spraying device can spray towards the positions of the wafer 61, which are contacted with the first support piece 11 and/or the second support piece 12 and the containing groove 601, so that the contact positions of the wafer 61, the first support piece 11 and/or the second support piece 12 and the container 60 (such as a flower basket) are efficiently cleaned, the problem that dead angles exist when the contact points are cleaned in the prior art is solved, and the cleaning effect of the wafer 61 is improved (the contact positions of the support device and the wafer 61 can be cleaned at the positions which are not supported when the support device and the wafer 61 are alternately supported). Meanwhile, the wafer cleaning device is simple in structure and convenient to mount and dismount, and cleaning liquid can be saved by a spraying mode, so that the production cost can be properly reduced.
It should be noted that, in the present embodiment, the specific structure and material of the spraying device are not specifically limited, as long as the spraying device can spray the position where the wafer 61 contacts the accommodating groove 601. Preferably, the material can be made of corrosion-resistant material (such as hydrofluoric acid, ammonia water, hydrochloric acid and the like) to prolong the service life.
Specifically, the spraying device may include a spraying pipe 21 and a spraying port 22, and the spraying pipe 21 may be disposed in the side wall constraint body 31, so as to facilitate the arrangement of the spraying pipe 21, so as to avoid directly hanging the spraying pipe 21 on the side wall constraint body 31, which may affect the circulation flow of the liquid in the cleaning tank 40. The spray pipe 21 may communicate with a cleaning solution pipe of the cleaning bath 40 to achieve delivery of the cleaning solution to the spray opening 22 through the spray pipe 21. Specifically, the pipeline can be changed from a straight way to a multi-way pipe (including a two-way pipe, a three-way pipe and the like) at the tail end of the cleaning liquid conveying system area of the wafer cleaning equipment, so that the circulating cleaning liquid is controlled to flow through a bottom circulating pipeline or a side wall spraying pipeline. The spraying opening 22 may be disposed on a surface of the sidewall constraint body 31 close to the wafer 61, and the spraying direction may be toward a position of the wafer 61 contacting the first support 11 and/or the second support 12 and the receiving groove 601. Wherein, the spraying pipe 21 can be arranged at the lower part of the side wall constraint body 31 to be closer to the spraying area, further improving the cleaning efficiency and effect. The number of the spraying openings 22 can correspond to the wafers 61 one by one, and the spraying openings 22 can be in a necking shape, so that the spraying strength is increased, the spraying acting force on the wafers 61 is improved, and the spraying effect is further guaranteed. The specific position of the shower opening 22 may be adjusted according to the contact position of the wafer 61 with the first support 11 and/or the second support 12 and the receiving groove 601, which is not limited in this embodiment.
In addition, a top spraying device 50 may be disposed above the cleaning tank 40 to spray the top of the wafer 61, so as to enhance the cleaning effect of the wafer 61.
Based on the same concept of the wafer cleaning apparatus, the present embodiment further provides a wafer cleaning machine, which may include the wafer cleaning apparatus of any of the above embodiments.
The wafer cleaning machine provided by the embodiment includes the wafer cleaning device, and at least the beneficial effects of the wafer cleaning device can be achieved, which are not described herein again.
Those of skill in the art will appreciate that various operations, measures, or arrangements that have been discussed in the present application may be alternated, modified, combined, or deleted. Further, other steps, measures, or schemes in various operations, methods, or flows that have been discussed in this application can be alternated, altered, rearranged, broken down, combined, or deleted. Further, various operations, measures, schemes in the prior art having the same functions as those disclosed in the present application may be alternated, modified, rearranged, decomposed, combined, or deleted.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (10)
1. A wafer cleaning device comprises a cleaning tank and is characterized by also comprising a bottom supporting assembly;
the bottom support assembly is arranged at the bottom of the cleaning tank and comprises a first support piece and a second support piece;
the first supporting piece is fixedly arranged on the bottom wall of the cleaning tank and used for supporting the wafer;
the second supporting piece is used for supporting and driving the wafer to rise from an initial position to a first preset position which can be separated from a contact point of the wafer, which is contacted with the first supporting piece; and the wafer is used for supporting and driving the wafer to descend from the first preset position to the initial position where the wafer can contact the contact.
2. The wafer cleaning device according to claim 1, wherein the first support comprises a first support body and a first support block arranged on the top of the first support body; one or more first constraint grooves are formed in the upper surface of the first supporting block; the first constraint groove is used for supporting the wafer and constraining the position of the wafer in the cleaning groove;
the bottom surface of the first restraining groove is tangent to the circumference of the edge of the wafer placed in the first restraining groove.
3. The wafer cleaning device according to claim 1, wherein the second supporting member comprises a second supporting body and a second supporting block arranged on the top of the second supporting body, and one or more second restraining grooves are formed in the upper surface of the second supporting block; the second constraint groove is used for supporting the wafer and constraining the position of the wafer in the cleaning groove;
the bottom surface of the second constraint groove is tangent to the circumference of the edge of the wafer in the second constraint groove.
4. The wafer cleaning apparatus of claim 1, further comprising a sidewall restraint assembly, the sidewall restraint assembly comprising a sidewall restraint body and a wafer side restraint structure;
the side wall constraint body is arranged on the tank wall of the cleaning tank; the wafer side constraint structure is arranged on the side wall constraint body and used for constraining the position of the wafer in the cleaning tank.
5. The wafer cleaning apparatus as claimed in claim 4, wherein the wafer side restraining structure comprises a wafer side restraining body and a wafer side restraining groove disposed on the wafer side restraining body for restraining the position of the wafer in the cleaning tank, and the wafer side restraining groove is a V-shaped groove.
6. The apparatus as claimed in claim 4, wherein the sidewall constraint body has a drain hole, and the cleaning solution overflows to the outside of the cleaning tank through the drain hole.
7. The wafer cleaning device according to claim 4, further comprising a spraying device disposed on the sidewall of the cleaning tank for spraying toward a position of the wafer contacted with the second support and/or the first support when the first support and/or the second support supports the wafer.
8. The wafer cleaning device according to claim 7, wherein the spray device comprises a spray opening and a spray pipe, the spray pipe is disposed in the sidewall constraint body, and the spray opening is disposed on a surface of the sidewall constraint body close to the wafer;
and conveying the cleaning liquid to the spraying port through the spraying pipeline, and spraying towards the position of the wafer contacted with the second support piece and/or the first support piece through the spraying port.
9. The wafer cleaning apparatus of any one of claims 1-8, wherein the second support further comprises a drive source and a trough bottom seal;
the driving source is used for driving the second support to ascend or descend;
the tank bottom sealing part is used for sealing the connecting part of the cleaning tank and the second supporting piece.
10. A wafer cleaning machine comprising the wafer cleaning apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010461427.7A CN111790663A (en) | 2020-05-27 | 2020-05-27 | Wafer cleaning device and wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN113539918A (en) * | 2021-06-30 | 2021-10-22 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment, wafer positioning device and wafer positioning method |
| CN113976539A (en) * | 2021-12-11 | 2022-01-28 | 深圳市伟辉自动化科技有限公司 | Ultrasonic cleaning machine for industrial product surface decontamination |
| CN114273317A (en) * | 2021-12-06 | 2022-04-05 | 扬州思普尔科技有限公司 | High-cleanliness high-capacity semiconductor wafer wet cleaning device |
| CN115831831A (en) * | 2023-02-23 | 2023-03-21 | 苏州智程半导体科技股份有限公司 | Compact slot type machine |
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| CN115831831A (en) * | 2023-02-23 | 2023-03-21 | 苏州智程半导体科技股份有限公司 | Compact slot type machine |
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