CN113394140A - Semiconductor cleaning equipment and manipulator thereof - Google Patents
Semiconductor cleaning equipment and manipulator thereof Download PDFInfo
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- CN113394140A CN113394140A CN202110747757.7A CN202110747757A CN113394140A CN 113394140 A CN113394140 A CN 113394140A CN 202110747757 A CN202110747757 A CN 202110747757A CN 113394140 A CN113394140 A CN 113394140A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 238000010926 purge Methods 0.000 claims description 62
- 238000000034 method Methods 0.000 claims description 18
- 238000007664 blowing Methods 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 15
- 238000005507 spraying Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 abstract description 9
- 238000000429 assembly Methods 0.000 abstract description 9
- 238000005406 washing Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 73
- 239000007789 gas Substances 0.000 description 13
- 239000000306 component Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 230000003749 cleanliness Effects 0.000 description 6
- 238000012864 cross contamination Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The embodiment of the application provides semiconductor cleaning equipment and a manipulator thereof. The manipulator comprises two symmetrically arranged clamping assemblies, wherein each clamping assembly comprises a supporting structure, a first clamping structure and a second clamping structure; the connecting end of the supporting structure is used for being connected with the driving device, and the clamping end of the supporting structure is far away from the connecting end; the first clamping structure is arranged on the supporting structure and is close to the clamping end, and a first accommodating groove is formed in the first clamping structure and used for accommodating the edge of the wafer so as to clamp the wafer to be cleaned; the second clamping structure is arranged on the supporting structure and located between the first clamping structure and the connecting end, and a second accommodating groove is formed in the second clamping structure and used for accommodating the edge of the wafer so as to clamp the cleaned wafer. The embodiment of the application can avoid the problem that hands are required to be washed before the wafer is clamped every time in the prior art, so that the hand washing frequency is greatly reduced to improve the working efficiency, and the productivity of the semiconductor cleaning equipment is greatly improved.
Description
Technical Field
The application relates to the technical field of semiconductor processing, in particular to a semiconductor cleaning device and a manipulator thereof.
Background
At present, semiconductors are strategic industries for the development of modern economic society, are widely applied to industries such as communication, automobiles, consumer electronics and the like, and are one of the core components of most electronic devices. With the continuous development of Integrated Circuit (IC) semiconductor manufacturing technology, the feature size of the IC is continuously reduced, and the requirement of the cleaning process is continuously increased, while the current mainstream process is mostly 90-45 nm, and the trench cleaning equipment in the semiconductor cleaning equipment can process wafers in batch on the premise of satisfying the process effect, which has irreplaceable advantages. In the process of continuous development of the technology, the groove type cleaning equipment gradually replaces a 'basket of flowers' by a mechanical arm to directly clamp the wafer for transmission, and the unclean mechanical arm often causes the problems of particle pollution, water residue and the like in a clamping area, so that the clean mechanical arm plays a vital role in the yield of the wafer.
In the prior art, in the process, the wafer needs to be cleaned before being clamped (cleaned) each time, so that the working efficiency of the tank type cleaning equipment is seriously influenced due to high frequency of hand washing. Furthermore, as water is firstly sprayed to the manipulator and then nitrogen is sprayed for washing hands each time, the manipulator is easy to cause water drop residue, and water drops are also splashed to other areas again during blowing, so that the working efficiency is further reduced; and because the structure of the mechanical arm is large, residual moisture on the bottom and the back of the mechanical arm is not completely dried, and the risk of polluting wafers exists.
Disclosure of Invention
The application aims at the defects of the prior art and provides semiconductor cleaning equipment and a manipulator thereof, which are used for solving the technical problems of low working efficiency and wafer pollution caused by residual moisture due to frequent hand washing of the manipulator in the prior art.
In a first aspect, an embodiment of the present application provides a robot of a semiconductor cleaning apparatus, connected to a driving device of the semiconductor cleaning apparatus, for transferring a wafer under the driving of the driving device, including: the two symmetrically-arranged clamping assemblies are connected with the driving device and used for adjusting the clamping opening under the driving of the driving device so as to selectively clamp or release the wafer; the clamping assembly comprises a supporting structure, a first clamping structure and a second clamping structure; the connecting end of the supporting structure is used for being connected with the driving device, and the clamping end of the supporting structure is far away from the connecting end; the first clamping structure is arranged on the supporting structure and is close to the clamping end, and a first accommodating groove is formed in the first clamping structure and is used for accommodating the edge of the wafer so as to clamp the wafer to be cleaned; the second clamping structure is arranged on the supporting structure and located between the first clamping structure and the connecting end, and a second containing groove is formed in the second clamping structure and used for containing the edge of the wafer to clamp the cleaned wafer.
In an embodiment of the application, the robot further includes a first purging assembly and a second purging assembly, and the first purging assembly is disposed on the first clamping structure and used for purging the first accommodating groove; the second purging assembly is arranged above the second clamping structure and used for purging the second accommodating groove.
In an embodiment of the present application, the first clamping structure is provided with a plurality of first accommodating grooves arranged in parallel along an axial direction; the first blowing component comprises a plurality of first nozzles, the first nozzles are arranged in the first accommodating grooves respectively, first outlets are arranged on two opposite sides of the first nozzles, and the first outlets are located in the extending direction of the first accommodating grooves and used for blowing the first accommodating grooves.
In an embodiment of the present application, a groove extending along an axial direction is formed on the first clamping structure, and a preset included angle is formed between two side walls of the groove in a cross section of the first clamping structure; the first containing groove is divided into two sections and is respectively arranged on two side walls of the groove, and the first nozzle is positioned at the bottom of the groove.
In an embodiment of the present application, the second clamping structure is provided with a plurality of second accommodating grooves arranged in parallel along an axial direction; the second purging assembly comprises a plurality of second nozzles, the second nozzles are respectively arranged corresponding to the second accommodating grooves, and each second nozzle is provided with a second outlet used for purging the second accommodating grooves.
In an embodiment of the present application, the second clamping structure is movably disposed on the supporting structure, and the second clamping structure can rotate to a first position and a second position relative to the supporting structure; when the second clamping structure is located at the first position, the orientation of the second accommodating groove is the same as that of the first accommodating groove, and the second accommodating groove is used for clamping the cleaned wafer; when the second clamping structure is located at the second position, the second accommodating groove deviates from the first accommodating groove in the direction, and the second clamping structure is used for avoiding the wafer to be cleaned, which is clamped by the first clamping structure.
In an embodiment of the application, the second nozzle is located at a side position of the support structure in the axial direction, and when the second clamping structure is located at the second position, the second outlet is used for purging the second accommodating groove.
In an embodiment of the application, the robot further includes a supply pipe, the supply pipe is disposed on the support structure and extends along an axial direction of the support structure, and the supply pipe is sequentially connected to the second purging component and the first purging component for connecting a gas supply source to supply gas to the second purging component and the first purging component.
In an embodiment of the application, the supporting structure includes two supporting rods arranged in parallel, and the first clamping structure and the second clamping structure are both located between the two supporting rods and are arranged along the axial direction of the supporting rods at intervals.
In an embodiment of the present application, the robot further includes a controller; the controller is used for controlling the first blowing component and the second blowing component to respectively blow to the first clamping structure and the second clamping structure before the first clamping structure clamps the wafer to be cleaned each time; the controller is further used for controlling the manipulator to move into a cleaning tank after the first clamping structure and the second clamping structure operate for a preset time, and controlling a spraying assembly in the cleaning tank to sequentially spray liquid and gas to the first clamping structure and the second clamping structure.
In a second aspect, an embodiment of the present application provides a semiconductor cleaning apparatus, including: the robot comprises a process tank, a driving device and the robot as provided by the first aspect, wherein the process tank is used for cleaning the wafer, and the driving device is used for driving the robot to convey the wafer.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
according to the embodiment of the application, the two supporting structures are symmetrically arranged, the first clamping structure and the second clamping structure are arranged on each clamping structure, the two clamping structures are respectively used for clamping wafers in different states or different types, cross contamination of the two clamping structures can be effectively avoided, the problem that hands must be washed before the wafers are clamped every time in the prior art is avoided, the hand washing frequency is greatly reduced, the working efficiency is improved, and the productivity of semiconductor cleaning equipment is greatly improved. In addition, because hands do not need to be washed before the wafer is clamped every time, the probability that the manipulator is polluted by water can be greatly reduced, the wafer is effectively prevented from being polluted by the water on the manipulator, and the process yield is greatly improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic front view of a manipulator according to an embodiment of the present disclosure;
FIG. 2 is a schematic side view of a clamping assembly according to an embodiment of the present disclosure;
FIG. 3 is an enlarged, fragmentary schematic view of a second clamp configuration according to an embodiment of the present disclosure;
fig. 4 is a partially enlarged view illustrating the first clamping structure engaged with the wafer according to an embodiment of the present disclosure;
FIG. 5 is a schematic front view illustrating the first clamping structure engaged with the wafer according to an embodiment of the present disclosure;
fig. 6 is a schematic front view illustrating the second clamping structure cooperating with the wafer according to an embodiment of the present disclosure.
Detailed Description
Reference will now be made in detail to the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar parts or parts having the same or similar functions throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The embodiment of the application provides a manipulator of a semiconductor cleaning device, which is connected with a driving device of the semiconductor cleaning device and used for conveying a wafer under the driving of the driving device, and the structural schematic diagram of the manipulator is shown in fig. 1 and fig. 2, and the manipulator comprises: the two symmetrically arranged clamping assemblies 100 are connected with a driving device (not shown in the figure) and are used for adjusting the clamping opening under the driving of the driving device so as to selectively clamp or release the wafer; the clamping assembly 100 comprises a supporting structure 1, a first clamping structure 2 and a second clamping structure 3; the connecting end 11 of the support structure 1 is connected with the driving device, and the clamping end 12 of the support structure 1 is arranged far away from the connecting end 11; the first clamping structure 2 is arranged on the supporting structure 1 and is close to the clamping end 12, and a first accommodating groove 21 is formed in the first clamping structure 2 and used for accommodating the edge of a wafer so as to clamp the wafer to be cleaned; the second clamping structure 3 is disposed on the supporting structure 1 and located between the first clamping structure 2 and the connecting end 11, and the second clamping structure 3 is provided with a second receiving groove 31 for receiving an edge of the wafer to clamp the cleaned wafer.
As shown in fig. 1 and 2, the semiconductor cleaning apparatus is, for example, a tank cleaning apparatus, and the driving device may be connected to the robot for driving the robot to transfer the wafer and to move the robot between the plurality of process tanks of the semiconductor cleaning apparatus. The two clamping assemblies 100 may be symmetrically disposed at the bottom of the driving device, and the driving device may adjust the clamping opening of the two clamping assemblies 100 for clamping or releasing the wafer. The supporting structure 1 may be a rod-shaped structure, the connecting end 11 of the supporting structure 1 may be connected to a driving device, and the clamping end 12 is disposed away from the connecting end 11, and since the two clamping assemblies 100 are symmetrically disposed, the driving device may adjust an angle between the two supporting structures 1, that is, adjust a clamping opening between the two clamping assemblies 100. The first clamping structure 2 may be disposed near the clamping end 12 of the supporting structure 1, the first clamping structure 2 may be disposed with a first receiving slot 21, and the two first clamping structures 2 cooperate to enable an edge of a wafer to be received in the two first receiving slots 21, so as to clamp a wafer (not shown in the drawings), such as a wafer to be cleaned. The second clamping structure 3 may be disposed between the first clamping structure 2 and the connecting end 11, and the two second clamping structures 3 cooperate to enable the edge of the wafer to be accommodated in the two second accommodating grooves 32, so as to clamp the wafer, which may be a cleaned wafer. The two clamping structures can also be used for respectively clamping different types of wafers, such as different sizes, different states of the same wafer, or different states of different batches of wafers, so that cross contamination of the two clamping structures can be avoided, the problem that hands are required to be washed when the cleaned wafers are clamped every time is avoided, and the working efficiency is improved.
According to the embodiment of the application, the two supporting structures are symmetrically arranged, the first clamping structure and the second clamping structure are arranged on each clamping structure, the two clamping structures are respectively used for clamping wafers in different states or different types, cross contamination of the two clamping structures can be effectively avoided, the problem that hands must be washed before the wafers are clamped every time in the prior art is avoided, the hand washing frequency is greatly reduced, the working efficiency is improved, and the productivity of semiconductor cleaning equipment is greatly improved. In addition, because hands do not need to be washed before the wafer is clamped every time, the probability that the manipulator is polluted by water can be greatly reduced, the wafer is effectively prevented from being polluted by the water on the manipulator, and the process yield is greatly improved.
It should be noted that, the embodiment of the present application does not limit the specific distance between the first clamping structure 2 and the second clamping structure 3, and the distance between the two clamping structures may be set corresponding to the size of the wafer, for example, 300 mm may be adopted; or the distance between the two clamping structures can be smaller than 300 mm, and different types of wafers can be clamped by adjusting the clamping opening of the two supporting structures 1. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the robot further includes a first purging assembly 4 and a second purging assembly 5, wherein the first purging assembly 4 is disposed on the first clamping structure 2 and is configured to purge the first receiving cavity 21; the second purging assembly 5 is disposed above the second clamping structure 3 and configured to purge the second accommodating groove 331. Specifically, the first purging assembly 4 may be disposed on the first clamping structure 2 or disposed near the first clamping structure 2, and is configured to purge the first receiving groove 21 of the first clamping structure 2. The second purging assembly 5 may be arranged between two support bars 13 of the support structure 1, i.e. the second purging assembly 5 is arranged above the second clamping structure 3 for purging the second clamping structure 3. By adopting the design, the two clamping structures can be cleaned respectively, so that the cleaning can be carried out according to the requirement in the embodiment of the application, and the working efficiency is further improved. In addition, the second purging component 5 is arranged above the second clamping structure 3, so that the cleanliness of the second clamping structure 3 can be further improved, and the yield of wafers is further improved. It should be noted that, the setting positions of the two purge assemblies are not limited in the embodiments of the present application, and those skilled in the art can adjust the setting according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the first clamping structure 2 is provided with a plurality of first receiving grooves 21 arranged in parallel along an axial direction, for receiving an edge of a wafer to clamp the wafer to be cleaned; the second holding structure 3 is provided with a plurality of second receiving grooves 31 arranged in parallel along the axial direction for receiving the edge of the wafer to hold the cleaned wafer. Optionally, the supporting structure 1 includes two supporting rods 13 arranged in parallel, and the first clamping structure 2 and the second clamping structure 3 are both located between the two supporting rods 13 and are arranged at intervals along the axial direction of the supporting rods 13.
As shown in fig. 1 and 2, the supporting structure 1 may include two supporting rods 13 arranged side by side, the first clamping structure 2 and the second clamping structure 3 are arranged at an interval along the axial direction of the supporting rods 13, and the first clamping structure 2 is located at the bottom. The first clamping structure 2 is specifically a rod-shaped structure made of a metal material, one side of the first clamping structure 2 may be provided with a plurality of first receiving grooves 21, and the specific number of the first receiving grooves 21 may be, for example, 50, and the first receiving grooves are arranged in parallel along the axial direction of the first clamping structure 2, but the embodiment of the present application is not limited thereto. The first receiving grooves 21 of the two first clamping structures 2 are oppositely arranged to receive two opposite edges of the wafer, and when the clamping opening of the two supporting structures 1 is reduced, the two first receiving grooves 21 cooperate to clamp the wafer to be cleaned. One side of the second clamping structure 3 may be provided with a plurality of second receiving grooves 31, and since the principle of the second clamping structure 3 is the same as that of the second clamping structure 3, the description thereof is omitted. Referring to fig. 5 and fig. 6 in combination, since the support structures 1 are rod-shaped structures, when clamping different types of wafers 200, the two clamping structures can work independently by adjusting the clamping opening of the two support structures 1, and do not affect each other, but the embodiment of the present invention is not limited thereto. By adopting the design, the first clamping structure 2 or the second clamping structure 3 can clamp a plurality of wafers at a time, so that the working efficiency of the manipulator is greatly improved.
It should be noted that, in the embodiment of the present application, the number of the first receiving grooves 21 and the number of the second receiving grooves 31 are not limited, for example, the number of the first receiving grooves 21 and the number of the second receiving grooves 31 may be less than or equal to 50. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 to 4, the first clamping structure 2 is provided with a plurality of first receiving slots 21 arranged in parallel along an axial direction; the first blowing assembly 4 includes a plurality of first nozzles 41, the plurality of first nozzles 41 are respectively disposed in the plurality of first accommodating grooves 21, the two opposite sides of the first nozzles 41 are respectively provided with first outlets 42, and the two first outlets 42 are both located in the extending direction of the first accommodating grooves 21, and are used for blowing the first accommodating grooves 21. Specifically, the number of the first nozzles 41 corresponds to the number of the first receiving grooves 21, that is, the first nozzles 41 are respectively and correspondingly disposed in the first receiving grooves 21, and the first nozzles 41 can be disposed in series through a pipeline, but the embodiment of the present invention is not limited thereto. The first nozzle 41 is disposed at a middle position of the extending direction of the first receiving groove 21, and two opposite sides of the first nozzle 41 have the first outlet 42, and the specific shape thereof may be designed as a circle, a square, a polygon, an irregular shape, and the like. The two first outlets 42 are located in the extending direction of the first accommodating groove 21, so that the first outlets 42 can purge the first accommodating groove 21 from two sides. With the above design, the cleaning efficiency can be further improved by the arrangement of the plurality of first nozzles 41, so that the cleanliness of the first clamping structure 2 can be further improved.
It should be noted that, the embodiment of the present application is not limited to the specific implementation of the first nozzle 41, for example, the first nozzle 41 is respectively disposed at two ends of the first accommodating groove 21, and has only a single first outlet 42. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 to 4, a groove 22 extending along an axial direction is formed on the first clamping structure 2, and a predetermined included angle is formed between two sidewalls of the groove 22 in a cross section of the first clamping structure 2; the accommodating groove is two-section and is respectively arranged on two side walls of the groove 22, and the first nozzle 41 is positioned at the bottom of the groove 22. Specifically, the first clamping structure 2 is a rod-shaped structure, and the inner side thereof is provided with a groove 22 extending along the axial direction, a preset included angle between two side walls of the groove 22 is greater than 90 degrees, that is, the cross section of the first clamping structure 2 is a "ingot-shaped" structure as shown in fig. 1, the first accommodating groove 21 can be respectively located at the upper and lower sections, and is respectively located on two side walls of the groove 22, and the first nozzle 41 is disposed at the bottom of the groove 22. With the above design, the first receiving groove 21 avoids colliding with the first nozzle 41 when clamping the wafer 200 to be cleaned, as shown in fig. 4 and 5, which not only reduces the failure rate of the embodiment of the present application, but also simplifies the structure and facilitates the implementation, and prevents the wafer 200 from being broken due to collision. It should be noted that, the embodiment of the present application is not limited to the specific structure of the first clamping structure 2, and those skilled in the art can adjust the setting according to actual situations.
In an embodiment of the present application, as shown in fig. 1 to 4, the second clamping structure 3 is provided with a plurality of second receiving grooves 31 arranged in parallel along the axial direction; the second purging assembly 5 includes a plurality of second nozzles 51, the plurality of second nozzles 51 are respectively disposed corresponding to the plurality of second receiving grooves 31, and the second nozzles 51 have second outlets 52 for purging the second receiving grooves 31. Specifically, the second purge module 5 may specifically include a purge pipe 53, and the plurality of second nozzles 51 may be directly formed on a peripheral wall of the purge pipe 53. The number of the second nozzles 51 may be set corresponding to the number of the second receiving grooves 31, that is, the plurality of second nozzles 51 are respectively and correspondingly disposed above the plurality of second receiving grooves 31. The second outlet 52 is located at the bottom of the second nozzle 51, and the specific shape thereof may be designed to be circular, square, polygonal, irregular, and the like, for example, so as to purge the plurality of second accommodating grooves 31. With the above design, the cleaning efficiency can be further improved by the arrangement of the plurality of second nozzles 51, so that the cleanliness of the second clamping structure 3 can be further improved.
It should be noted that the embodiment of the present application is not limited to the specific implementation of the second nozzle 51, and for example, a split arrangement may be adopted between the second nozzle 51 and the purge pipe 53, so as to replace and maintain the second nozzle 51. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the second clamping structure 3 is movably disposed on the supporting structure 1, and when the second clamping structure 3 is located at the first position, the second receiving groove 31 and the first receiving groove 21 are oriented in the same direction for clamping the cleaned wafer; when the second clamping structure 3 is located at the second position, the second receiving groove 31 deviates from the first receiving groove 21 in the direction, so as to avoid the wafer to be cleaned, which is clamped by the first clamping structure 2.
As shown in fig. 1 and fig. 2, two ends of the first clamping structure 2 may be fixedly connected to two support rods 13 of the supporting structure 1, for example, two ends of the first clamping structure 2 are connected to the support rods 13 by using fixing members, which may be screws. The two ends of the second clamping structure 3 may be movably connected to the two support rods 13 of the support structure 1, for example, the two ends of the second clamping structure 3 are provided with rotation shafts, the rotation shafts penetrate through the support rods 13, and the rotation shafts may be connected to a driver (not shown in the figure) which may drive the second clamping structure 3 to rotate automatically. In practical applications, the driver may drive the second clamping structure 3 to rotate to the first position, so that the two second receiving grooves 31 face the inner side of the supporting structure 1 for clamping the cleaned wafer, that is, the second receiving grooves 31 are facing the same direction as the first receiving grooves 21 for clamping the cleaned wafer. The driver may further drive the second clamping structure 3 to rotate to the second position, so that the second receiving groove 31 may face the outer sides of the supporting structures 1, specifically, refer to the outer sides of the two supporting structures 1 shown in fig. 1, that is, the orientations of the second receiving groove 31 and the first receiving groove 21 are away from each other, so as to avoid mechanical interference when the wafer to be cleaned is clamped by the first clamping structure 2, and further avoid cross contamination between the two clamping structures. By adopting the design, the structural design of the embodiment of the application is reasonable, so that the safety and the stability are improved. Furthermore, the driver can be connected with a lower computer of the semiconductor cleaning device, so that coupling control between the driver and the driving device can be realized, namely, when the first clamping structure 2 is clamped, the driver can control the second clamping structure 3 to rotate to the second position, mechanical interference between the first clamping structure and the second clamping structure is avoided, and meanwhile, the automation degree of the embodiment of the application can be greatly improved.
It should be noted that, the present embodiment does not limit the arrangement manner of the two clamping structures, for example, the arrangement manner of the first clamping structure 2 and the second clamping structure 3 may be interchanged, that is, the first clamping structure 2 is movably disposed on the supporting structure 1, and the second clamping structure 3 is fixedly disposed on the supporting structure 1, so that the technical effect of the two clamping structures not interfering with each other can be achieved. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 to 4, the second nozzle 51 is disposed at one axial side of the supporting structure 1, and when the second clamping structure 3 is located at the second position, the second outlet 52 is used for purging the second accommodating groove 31. In particular, the second nozzle 51 may be arranged close to the outside of both support structures 1, i.e. at a position axially close to the outside of the support bar 13 of the support structure 1, so that the second outlet 52 is also located at the outside of the support structure 1. In practical applications, the driver may be connected to a lower machine of the semiconductor cleaning device, and the driver is controlled to drive the second clamping structure 3 to rotate to the second position, so that the second accommodating groove 31 is located outside the supporting structure 1, and the second outlet 52 faces the extending direction of the second accommodating groove 31, so as to purge the second accommodating groove 31. Adopt above-mentioned design for second clamping structure 3 avoids with first clamping structure 2 cross contamination at the in-process that sweeps, thereby further improves two clamping structure sweep efficiency and cleanliness factor.
It should be noted that the specific position of the second nozzle 51 is not limited in the embodiments of the present application, and for example, the second nozzle 51 may also be disposed inside the support structure 1. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the robot further includes a supply pipe 61, the supply pipe 61 is disposed on the support structure 1 and extends along the axial direction of the support structure 1, and the supply pipe 61 is sequentially connected to the second purging assembly 5 and the first purging assembly 4 for connecting a gas supply source (not shown) to supply gas to the second purging assembly 5 and the first purging assembly 4. Specifically, the supply tube 61 may be disposed on the support rod 13 of the support structure 1 by a plurality of fixing clips 62, but the embodiment of the present application is not limited thereto, and the supply tube 61 may be disposed on the support rod 13 by other methods, such as a ribbon method, and thus the embodiment of the present application is not limited thereto. One end of the supply pipe 61 is connected to the gas supply source, and the other end of the supply pipe 61 is connected to the second purge module 5 and the first purge module 4 in sequence, for example, the supply pipe 61 may be connected to the purge pipe 53 of the second purge module 5 and directly connected to the plurality of first nozzles 41 of the first purge module 4, but the embodiment of the present application is not limited thereto. By adopting the design, the structure of the embodiment of the application is simple, the failure rate can be greatly reduced, the service life is prolonged, and the application and maintenance cost is greatly reduced.
In an embodiment of the present application, as shown in fig. 1 to 4, the robot further includes a controller; the controller is used for controlling the first blowing component 4 and the second blowing component 5 to respectively blow towards the first clamping structure 2 and the second clamping structure 3 before the first clamping structure 2 clamps the wafer to be cleaned each time; the controller is further configured to control the robot to move into a cleaning tank 7 after the first clamping structure 2 and the second clamping structure 3 operate for a preset time, and control the spraying assembly in the cleaning tank 7 to sequentially spray liquid and gas on the first clamping structure 2 and the second clamping structure 3.
As shown in fig. 1 to fig. 4, the robot further includes a controller (not shown in the figures), and the controller may be a single chip microcomputer or a programmable controller, or the controller may also be a lower computer of the semiconductor process equipment, so the embodiment of the present application is not limited thereto. The controller may be configured to control the first purging component 4 and the second purging component 5 to purge the first clamping structure 2 and the second clamping structure 3 respectively before the first clamping structure 2 clamps the wafer to be cleaned each time. Specifically, the first and second purge assemblies 4 and 5 may spray a gas, such as nitrogen or other inert gas, onto the two clamp structures during actual use, thereby maintaining cleanliness of the two clamp structures to reduce frequency of hand washing. Further, the specific gas flow of the first outlet 42 and the second outlet 52 is not limited in the embodiments of the present application, as long as the gas flow rate at the preset distance from the first outlet 42 and the second outlet 52 is greater than 1 meter per second, and the preset distance may be, for example, 10 mm, but the embodiments of the present application are not limited thereto.
The controller is further configured to control the first clamping structure 2 and the second clamping structure 3 to move into the cleaning tank 7 for spraying after the first clamping structure 2 and the second clamping structure 3 operate for a preset time, that is, when the manipulator needs to be maintained. Particularly, the cleaning tank 7 can be used for accommodating the supporting structure 1, the first clamping structure 2 and the second clamping structure 3, the spraying assembly in the cleaning tank 7 can be used for spraying liquid medium to the first clamping structure 2 and the second clamping structure 3, the liquid is water or other cleaning liquid, and then the first blowing assembly 4 and the second blowing assembly 5 are matched for spraying gas, so that the two clamping structures are thoroughly cleaned to complete maintenance, and the manipulator is maintained in the mode, so that the maintenance period of the embodiment of the application is more than 12 hours. By adopting the design, the cleaning frequency of the embodiment of the application is greatly reduced, so that the working efficiency is improved, and the productivity is greatly increased; but also can further improve the cleanliness of the mechanical arm, thereby avoiding polluting the wafer and improving the yield. Optionally, the spraying assembly in the cleaning tank 7 may also be used to spray gas to the first clamping structure 2 and the second clamping structure 3, and in practical application, after the spraying assembly in the cleaning tank 7 sprays liquid, gas is sprayed to complete the thorough cleaning of the two clamping structures, but this is not limited in this embodiment of the application.
Based on the same inventive concept, the embodiment of the application provides a semiconductor cleaning device, which comprises: the robot provided by the above embodiments, the process tank is used for cleaning the wafer, and the driving device is used for driving the robot to transfer the wafer.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
according to the embodiment of the application, the two supporting structures are symmetrically arranged, the first clamping structure and the second clamping structure are arranged on each clamping structure, the two clamping structures are respectively used for clamping wafers in different states or different types, cross contamination of the two clamping structures can be effectively avoided, the problem that hands must be washed before the wafers are clamped every time in the prior art is avoided, the hand washing frequency is greatly reduced, the working efficiency is improved, and the productivity of semiconductor cleaning equipment is greatly improved. In addition, because hands do not need to be washed before the wafer is clamped every time, the probability that the manipulator is polluted by water can be greatly reduced, the wafer is effectively prevented from being polluted by the water on the manipulator, and the process yield is greatly improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.
Claims (11)
1. A manipulator of a semiconductor cleaning device is connected with a driving device of the semiconductor cleaning device and used for conveying a wafer under the driving of the driving device, and the manipulator is characterized by comprising two symmetrically arranged clamping components, wherein the two clamping components are connected with the driving device and used for adjusting the clamping opening under the driving of the driving device so as to selectively clamp or release the wafer;
the clamping assembly comprises a supporting structure, a first clamping structure and a second clamping structure; the connecting end of the supporting structure is used for being connected with the driving device, and the clamping end of the supporting structure is far away from the connecting end;
the first clamping structure is arranged on the supporting structure and is close to the clamping end, and a first accommodating groove is formed in the first clamping structure and is used for accommodating the edge of the wafer so as to clamp the wafer to be cleaned; the second clamping structure is arranged on the supporting structure and located between the first clamping structure and the connecting end, and a second containing groove is formed in the second clamping structure and used for containing the edge of the wafer to clamp the cleaned wafer.
2. The robot of claim 1, further comprising a first purge assembly and a second purge assembly, wherein the first purge assembly is disposed on the first clamping structure for purging the first receiving slot; the second purging assembly is arranged above the second clamping structure and used for purging the second accommodating groove.
3. The manipulator according to claim 2, wherein the first holding structure is provided with a plurality of first receiving slots arranged axially in parallel;
the first blowing component comprises a plurality of first nozzles, the first nozzles are arranged in the first accommodating grooves respectively, first outlets are arranged on two opposite sides of the first nozzles, and the first outlets are located in the extending direction of the first accommodating grooves and used for blowing the first accommodating grooves.
4. The manipulator according to claim 3, wherein the first clamping structure is provided with a groove extending along an axial direction, and in a cross section of the first clamping structure, two side walls of the groove form a preset included angle; the first containing groove is divided into two sections and is respectively arranged on two side walls of the groove, and the first nozzle is positioned at the bottom of the groove.
5. The manipulator according to claim 2, wherein the second holding structure is provided with a plurality of second receiving slots arranged in parallel along an axial direction;
the second purging assembly comprises a plurality of second nozzles, the second nozzles are respectively arranged corresponding to the second accommodating grooves, and each second nozzle is provided with a second outlet used for purging the second accommodating grooves.
6. The robot of claim 5, wherein the second gripping structure is movably disposed on the support structure and is self-rotatable relative to the support structure to a first position and a second position; when the second clamping structure is located at the first position, the orientation of the second accommodating groove is the same as that of the first accommodating groove, and the second accommodating groove is used for clamping the cleaned wafer; when the second clamping structure is located at the second position, the second accommodating groove deviates from the first accommodating groove in the direction, and the second clamping structure is used for avoiding the wafer to be cleaned, which is clamped by the first clamping structure.
7. The robot of claim 6, wherein the second nozzle is located at a side position in an axial direction of the support structure, and the second outlet is configured to purge the second container when the second holding structure is located at the second position.
8. The robot of claim 2, further comprising a supply tube disposed on the support structure and extending axially of the support structure, the supply tube being connected to the second purge module and the first purge module in sequence for connecting a gas supply source to supply gas to the second purge module and the first purge module.
9. The robot of any of claims 1 to 8, wherein the support structure comprises two support rods arranged side by side, and the first clamping structure and the second clamping structure are located between the two support rods and are spaced apart along the axial direction of the support rods.
10. A robot as claimed in any of claims 1 to 8, further comprising a controller;
the controller is used for controlling the first blowing component and the second blowing component to respectively blow to the first clamping structure and the second clamping structure before the first clamping structure clamps the wafer to be cleaned each time;
the controller is further used for controlling the manipulator to move into a cleaning tank after the first clamping structure and the second clamping structure operate for a preset time, and controlling a spraying assembly in the cleaning tank to sequentially spray liquid and gas to the first clamping structure and the second clamping structure.
11. A semiconductor cleaning apparatus, comprising: a process tank for cleaning the wafer, a drive means for driving the robot to transfer the wafer, and a robot as claimed in any of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110747757.7A CN113394140A (en) | 2021-07-02 | 2021-07-02 | Semiconductor cleaning equipment and manipulator thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110747757.7A CN113394140A (en) | 2021-07-02 | 2021-07-02 | Semiconductor cleaning equipment and manipulator thereof |
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| CN113394140A true CN113394140A (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110747757.7A Pending CN113394140A (en) | 2021-07-02 | 2021-07-02 | Semiconductor cleaning equipment and manipulator thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114643223A (en) * | 2022-03-31 | 2022-06-21 | 北京北方华创微电子装备有限公司 | Cleaning device |
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| US20020174881A1 (en) * | 2000-06-30 | 2002-11-28 | Lam Research Corporation | Wheel and conveyor system for transporting semiconductor wafers |
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