CN220216144U

CN220216144U - Cleaning tank and wafer tank type cleaning machine

Info

Publication number: CN220216144U
Application number: CN202320106644.3U
Authority: CN
Inventors: 林士闵; 刘苏涛
Original assignee: Nexchip Semiconductor Corp
Current assignee: Nexchip Semiconductor Corp
Priority date: 2023-02-03
Filing date: 2023-02-03
Publication date: 2023-12-22
Anticipated expiration: 2033-02-03

Abstract

The utility model provides a cleaning tank and a wafer tank type cleaning machine, wherein the cleaning tank comprises a tank body and a plurality of turbulence pieces arranged in the tank body, the tank body is provided with a wafer placing area for placing a wafer, the turbulence pieces are sequentially arranged around the wafer placing area, and the turbulence pieces are arranged in an extending mode along the height direction of the tank body. According to the cleaning tank and the wafer tank type cleaning machine provided by the utility model, the original running state of part of cleaning liquid is blocked or changed by the turbulence pieces arranged in the tank body, so that the uniformity of the flow field in the tank body is improved, and the problem that impurity particles on the surface of a wafer cannot be cleaned up due to the uneven flow field of the cleaning liquid in the cleaning tank or other impurity particles in the cleaning liquid are secondarily adhered to the surface of the wafer due to the turbulence phenomenon is effectively avoided, and the wafer yield is improved.

Description

Cleaning tank and wafer tank type cleaning machine

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a cleaning tank and a wafer tank type cleaning machine.

Background

In the manufacturing process of the semiconductor, the cleanliness of the wafer has a great influence on the qualification rate of the chip, so that a step of cleaning the wafer is required before each semiconductor process is performed and after the process is completed to remove impurity particles, chemical residues and the like attached to the surface of the wafer, therefore, the wafer cleaning is a process link with high frequency in the chip manufacturing process, the cleaning process usually occurs in a cleaning cabinet, a cleaning tank filled with cleaning liquid is used for performing specific cleaning, and a mechanical station is reserved outside the cleaning tank for arranging a transmission movement control device, usually a lifting mechanical arm, of the wafer.

Because the cleaning solution in the cleaning tank is sprayed out by the jet flow pipe positioned at the bottom of the cleaning tank, and then the cleaning solution with impurity particles is discharged in a backflow way by the backflow pipe positioned at the bottom of the cleaning tank, the cleaning solution in the cleaning tank is extremely easy to generate turbulence phenomenon after the spraying process or the backflow process of the cleaning solution encounters the mechanical arm for clamping the wafer, so that the impurities positioned on the surface of the wafer are difficult to clean, and even other impurity particles in the cleaning solution are secondarily adhered to the surface of the wafer, thereby reducing the wafer yield.

Disclosure of Invention

The utility model aims to provide a cleaning tank and a wafer tank type cleaning machine, which are used for solving the problems that impurity particles on the surface of a wafer are not thoroughly cleaned or the impurity particles in the cleaning liquid are secondarily adhered to the surface of the wafer due to uneven flow field of the cleaning liquid in the cleaning tank, so that the yield of the wafer is reduced.

In order to solve the technical problems, the utility model provides a cleaning tank, which comprises a tank body and a plurality of turbulence pieces arranged in the tank body, wherein the tank body is provided with a wafer placing area for placing a wafer, the turbulence pieces are sequentially arranged around the wafer placing area, and the turbulence pieces are arranged in an extending manner along the height direction of the tank body.

Preferably, in the cleaning tank, the wafer placement area is located in a central area of a bottom wall of the tank body, and the cleaning tank includes at least four turbulence pieces which are sequentially and equidistantly arranged.

Preferably, in the cleaning tank, a plurality of the spoilers are symmetrically arranged on the side wall of the tank body.

Preferably, in the cleaning tank, each of the spoilers is detachably provided to the bottom wall.

Preferably, in the cleaning tank, the cleaning tank further comprises a liquid conveying pipeline, and each spoiler is provided with a limiting opening, and the size of the limiting opening is matched with the pipe diameter of the liquid conveying pipeline.

Preferably, in the cleaning tank, the limiting openings of all the spoilers are located at the same height, and each spoiler is abutted against the side wall of the tank body.

Preferably, in the cleaning tank, a top surface of each of the spoilers does not exceed a top surface of the tank body.

Preferably, in the cleaning tank, the height of the spoiler is 80% of the height of the side wall.

Preferably, in the cleaning tank, a width of each of the spoilers is 2 to 5mm.

The utility model also discloses a wafer groove type cleaning machine, which comprises the cleaning groove and a mechanical arm, wherein the mechanical arm clamps the wafer and completes the movement of the wafer between the inside and the outside of the groove body.

In summary, the present utility model provides a cleaning tank and a wafer tank cleaning machine, wherein the cleaning tank includes a tank body and a plurality of turbulence members disposed in the tank body, the tank body has a wafer placement area for placing a wafer, the plurality of turbulence members are sequentially disposed around the wafer placement area, and each turbulence member extends along a height direction of the tank body. According to the cleaning tank and the wafer tank type cleaning machine provided by the utility model, the plurality of turbulence pieces are arranged in the tank body to block or change the original running state of part of the cleaning liquid, so that the uniformity of a flow field in the tank body is improved, the problem that impurity particles on the surface of a wafer cannot be cleaned up due to the turbulence phenomenon of the cleaning liquid in the cleaning tank or other impurity particles in the cleaning liquid are secondarily adhered to the surface of the wafer due to the turbulence phenomenon is effectively avoided, and the wafer yield is improved.

Drawings

Fig. 1 is a schematic structural view of a cleaning tank according to an embodiment of the present utility model;

wherein, the reference numerals are as follows:

10-a groove body; 20-spoilers; 30-liquid delivery conduit.

Detailed Description

The utility model provides a cleaning tank and a wafer tank type cleaning machine, which are further described in detail below with reference to the accompanying drawings and the specific embodiments. Advantages and features of the utility model will become more apparent from the following description and from the claims. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the utility model. Furthermore, the structures shown in the drawings are often part of actual structures. In particular, the drawings are shown with different emphasis instead being placed upon illustrating the various embodiments.

As used in this disclosure, the singular forms "a," "an," and "the" include plural referents, the term "or" is generally used in the sense of comprising "and/or" and the term "at least two" is generally used in the sense of comprising "two or more," where the term "connected" is to be construed broadly, e.g., mechanically and electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. Furthermore, as used in this disclosure, an element disposed on another element generally only refers to a connection, coupling, cooperation or transmission between two elements, and the connection, coupling, cooperation or transmission between two elements may be direct or indirect through intermediate elements, and should not be construed as indicating or implying any spatial positional relationship between the two elements, i.e., an element may be in any orientation, such as inside, outside, above, below, or on one side, of the other element unless the context clearly indicates otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1, an embodiment of the present utility model provides a cleaning tank, which includes a tank body 10 and a plurality of turbulence pieces 20 disposed in the tank body 10, wherein the tank body 10 has a wafer placement area for placing a wafer, the plurality of turbulence pieces 20 are sequentially disposed around the wafer placement area, and each turbulence piece 20 is disposed to extend along a height direction of the tank body 10.

As described above, when the cleaning solution encounters the mechanical arm for clamping the wafer during the ejection process or the reflow process, the cleaning solution in the cleaning tank is easily disturbed, so that the flow field in the cleaning tank is uneven, and the impurity particles on the surface of the wafer are difficult to clean.

In this embodiment of the present utility model, the wafer placement area is located in a central area of the bottom wall of the tank body 10, so that a plurality of turbulence members are conveniently disposed around the wafer placement area, and in order to achieve a better turbulence reduction effect, preferably, the cleaning tank includes at least four turbulence members 20 disposed in a sequentially equidistant manner, and for the tank body 10 having different shapes, at least four turbulence members 20 are sequentially disposed in a sequentially equidistant manner around the wafer placement area, so as to ensure that the turbulence members 20 obstruct or change the original running state of the cleaning solution from at least four different directions, so as to achieve a good cleaning effect on the wafer.

It should be noted that, in the embodiment of the present utility model, the shape of the tank body 10 is not limited, and as an embodiment, when the tank body 10 is a square tank, at least four turbulence pieces 20 are sequentially disposed around the wafer placement area, that is, at least one turbulence piece 20 is present at four side walls of the square tank; as another embodiment, when the tank body 10 is a circular tank, at least four turbulence members 20 are sequentially disposed around the wafer placement area, that is, at this time, an angle formed by adjacent turbulence members 20 and the center of the circular tank is 90 ° or less than 90 °.

In order to realize the circulation update of the cleaning solution in the tank body 10 so as to prevent the wafer from being polluted by impurity particles in the cleaning solution after the wafer is cleaned, the cleaning tank further comprises a liquid conveying pipeline 30, and in some fixed application scenarios, the liquid conveying pipeline 30 comprises a spraying pipeline and a backflow pipeline, wherein the spraying pipeline is used for spraying the cleaning solution into the cleaning tank, and when the cleaning solution cleans the wafer, the cleaning solution cleaned by the wafer is recovered by the backflow pipeline and discharged to the outside of the tank body 10.

In some embodiments, the size of the tank 10 has a limitation requirement, in order to better utilize the internal space of the tank 10, each spoiler 20 has a limiting opening, and the size of the limiting opening is matched with the pipe diameter of the liquid conveying pipe 30, so that the position of the liquid conveying pipe 30 in the tank 10 is limited by the limiting openings of a plurality of spoilers 20, preferably, the limiting openings of the spoilers 20 are located at the same height, so as to better support and limit the spraying pipe or the return pipe.

Further, in order to better utilize the internal space of the tank body 10 and avoid friction and collision between the turbulence member 20 and the wafer, as a preferred embodiment, the opening direction of the limiting opening of the turbulence member 20 faces the side wall of the tank body 10, and the plurality of turbulence members 20 located in the tank body 10 are symmetrically disposed on the side wall of the tank body 10, when the wafer is placed in the wafer placement area and cleaned, the closer the turbulence member 20 is to the side wall, the smaller the probability of friction and collision between the turbulence member 20 and the wafer is; further, in order to avoid friction collision between the turbulence member 20 and the wafer and ensure that the turbulence member 20 plays a good role in reducing turbulence, it is preferable that the width of each turbulence member 20 is 2-5 mm.

In addition, the plurality of turbulence members 20 may be disposed on the bottom wall of the tank body 10 in addition to the side walls of the tank body 10, and in view of the fact that the specific number of the turbulence members 20 is not limited in this embodiment, the number of the turbulence members 20 may be selected according to the volume of the cleaning tank, the flow speed of the cleaning solution, and other practical working conditions, and in order to flexibly adjust the number of the turbulence members 20, each of the turbulence members 20 may be detachably disposed on the bottom wall.

As a specific embodiment, the bottom wall of the tank body 10 is provided with a plurality of grooves around the wafer placement area, and each spoiler 20 is disposed on the tank body 10 through one groove, so that each spoiler 20 is detachably disposed on the bottom wall, and when the number of the spoilers 20 needs to be increased or decreased, the spoilers 20 need only be placed in the grooves or the spoilers 20 need to be taken out from the grooves; in addition, when the cleaning tank body 10 needs to be cleaned, all the turbulence pieces 20 are only required to be taken out, so that the operation is convenient, and the cleaning tank body 10 is thoroughly cleaned. The specific manner in which the spoiler 20 is detachably disposed on the bottom wall is not limited in this embodiment.

In this embodiment, the cleaning tank further includes a tank cover (not shown), and in order to avoid the collision between each of the turbulence members 20 and the tank cover, the top surface of each of the turbulence members 20 does not exceed the top surface of the tank body 10, and preferably, the height of each of the turbulence members 20 is 80% of the height of the side wall.

In this embodiment, the material of each spoiler 20 may be a non-metal material such as quartz, polytetrafluoroethylene (PTFE), etc., which is not limited in this embodiment of the present utility model.

The embodiment of the utility model also provides a wafer groove type cleaning machine, which comprises the cleaning groove and a mechanical arm, wherein the mechanical arm clamps the wafer and completes the movement of the wafer between the inside and the outside of the groove body 10.

When the wafer groove type cleaning machine provided by the embodiment of the utility model is used for cleaning the wafer, the mechanical arm clamps the wafer to enable the wafer to be immersed into the cleaning liquid in the groove body 10 and keep the position unchanged, the liquid conveying pipeline 30 positioned at the bottom of the groove body 10 sprays the cleaning liquid towards one direction, the cleaning liquid runs along one direction, and when the mechanical arm is encountered, the cleaning liquid with more turbulence is arranged on the bottom wall of the groove body 10 because a plurality of turbulence pieces 20 obstruct or even change part of the original running state of the cleaning liquid, so that turbulence is effectively reduced, flow field uniformity is improved, and the wafer is thoroughly cleaned.

In summary, the present utility model provides a cleaning tank and a wafer tank cleaning machine, wherein the cleaning tank includes a tank body and a plurality of turbulence members disposed in the tank body, the tank body has a wafer placement area for placing a wafer, the plurality of turbulence members are uniformly distributed around the wafer placement area, and each turbulence member extends along a height direction of the tank body. According to the cleaning tank and the wafer tank type cleaning machine provided by the utility model, the original running state of part of cleaning liquid is blocked or changed by the turbulence pieces arranged in the tank body, so that the uniformity of a flow field in the tank body is improved, and the problem that impurity particles on the surface of a wafer cannot be cleaned up due to the turbulence phenomenon of the cleaning liquid in the cleaning tank or other impurity particles in the cleaning liquid are secondarily adhered to the surface of the wafer due to the turbulence phenomenon is effectively avoided, and the wafer yield is improved. Further, the spoiler is detachably arranged on the groove body, and when the groove body needs to be cleaned, the groove body can be thoroughly cleaned only by taking down the spoiler.

It should also be appreciated that while the present application has been disclosed in the context of a preferred embodiment, the above embodiment is not intended to limit the present utility model. Many possible variations and modifications of the disclosed technology can be made by anyone skilled in the art without departing from the scope of the technology, or the technology can be modified to be equivalent. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A cleaning tank, characterized in that the cleaning tank comprises: the wafer placing device comprises a groove body and a plurality of turbulence pieces arranged in the groove body, wherein the groove body is provided with a wafer placing area used for placing wafers, the turbulence pieces are sequentially arranged around the wafer placing area, and the turbulence pieces are arranged in an extending mode along the height direction of the groove body.

2. The cleaning tank of claim 1, wherein the wafer placement area is located in a central area of a bottom wall of the tank body, and the cleaning tank includes at least four spoilers disposed in sequence at equal intervals.

3. The cleaning tank of claim 1, wherein a plurality of said spoilers are symmetrically disposed on the side walls of said tank body.

4. The cleaning tank of claim 1, wherein each of the spoilers is removably disposed on the bottom wall of the tank body.

5. The cleaning tank of claim 1, further comprising a liquid delivery conduit, each of the spoilers having a limiting opening sized to match a pipe diameter of the liquid delivery conduit.

6. The cleaning tank of claim 5, wherein the limiting openings of all the spoilers are located at the same height, and each of the spoilers is abutted against a side wall of the tank body.

7. The cleaning tank of claim 1, wherein a top surface of each of the spoilers does not extend beyond a top surface of the tank body.

8. The cleaning tank of claim 7, wherein the height of the spoiler is 80% of the height of the sidewall of the tank body.

9. The cleaning tank of claim 1, wherein each of the spoilers has a width of 2 to 5mm.

10. A wafer tank cleaning machine comprising a cleaning tank as claimed in any one of claims 1 to 9 and a robotic arm which grips the wafer and effects movement of the wafer between the interior and exterior of the tank.