CN210788411U - Silicon treatment pure water cleaning mechanism - Google Patents
Silicon treatment pure water cleaning mechanism Download PDFInfo
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- CN210788411U CN210788411U CN201921842493.8U CN201921842493U CN210788411U CN 210788411 U CN210788411 U CN 210788411U CN 201921842493 U CN201921842493 U CN 201921842493U CN 210788411 U CN210788411 U CN 210788411U
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Abstract
The utility model provides a pure water cleaning mechanism is handled to silicon, include: the first cleaning tank, the second cleaning tank and the third cleaning tank are sequentially connected in series; the upper ends of the first cleaning tank, the second cleaning tank and the third cleaning tank are provided with openings, and silicon wafers to be cleaned are placed in the openings. The liquid inlet hole of the first cleaning tank, the liquid inlet hole of the second cleaning tank and the liquid inlet hole of the third cleaning tank are respectively connected with the liquid conveying pipeline. And conveying the cleaning solution to the first cleaning tank, the second cleaning tank and the third cleaning tank through the liquid conveying pipeline. The liquid level heights of the first cleaning tank, the second cleaning tank and the third cleaning tank are different. The third cleaning tank has the highest liquid level, the second cleaning tank is arranged next to the third cleaning tank, and the first cleaning tank is arranged at the lowest cleaning tank. Therefore, the cleaning liquid flows through the through holes in sequence and is driven by the liquid return driving pump to form circulation, the cleaning effect is improved, the cleaning quality in the cleaning process is ensured, impurities on the surface of the silicon wafer are removed, and the influence on the subsequent use of the silicon wafer is avoided.
Description
Technical Field
The utility model relates to a silicon processing technology field especially relates to a pure water cleaning mechanism is handled to silicon.
Background
Silicon has semiconductor properties. Silicon is mainly used for manufacturing high-purity semiconductors, high-temperature-resistant materials, optical fiber communication materials, organic silicon compounds, alloys and the like, and is widely applied to the industries of aerospace, electronics and electricity, buildings, transportation, energy, chemical engineering, textiles, food, light industry, medical treatment, agriculture and the like.
In semiconductor devices, silicon wafers are used more rigorously and the silicon wafers are subjected to rigorous cleaning. Trace contamination can also lead to device failure. The purpose of cleaning is to remove surface contaminating impurities, including organic and inorganic species, which can lead to various defects.
In order to use a silicon wafer before use, it is currently mainly performed by cleaning. The cleaning process is to soak the silicon wafer in the cleaning solution, and after a certain time, the silicon wafer is taken out for use. The cleaning process is difficult to clean impurities on the surface of the silicon wafer, and further influences the subsequent use.
SUMMERY OF THE UTILITY MODEL
In order to overcome the deficiencies in the prior art, the utility model provides a silicon treatment pure water cleaning mechanism, include: the first cleaning tank, the second cleaning tank and the third cleaning tank are sequentially connected in series;
the side wall of the first cleaning tank, the side wall of the second cleaning tank and the side wall of the third cleaning tank are respectively provided with a liquid level meter and a liquid inlet hole;
a first liquid return hole is also formed in the side wall of the first cleaning tank;
a second liquid return hole is also formed in the side wall of the third cleaning groove;
a first through hole is formed in the first side wall between the first cleaning tank and the second cleaning tank;
a second through hole is formed in the second side wall between the second cleaning tank and the third cleaning tank;
the arrangement height of the first through hole is higher than that of the second through hole;
the first liquid return hole is connected with the second liquid return hole through a liquid return pipeline, and a liquid return driving pump is arranged on the liquid return pipeline.
Preferably, a first baffle is arranged close to the first side wall; the first baffle is fixedly arranged on the side wall of the second cleaning tank;
a space is formed between the lower end of the first baffle and the bottom of the second cleaning tank;
the upper end of the first baffle is flush with the upper edge of the second cleaning tank.
Preferably, a second baffle is disposed adjacent the second sidewall; the second baffle is fixedly arranged on the side wall of the first cleaning tank;
a space is formed between the lower end of the second baffle and the bottom of the first cleaning tank;
the upper end of the first baffle is flush with the upper edge of the first cleaning tank.
Preferably, the inner side of the bottom of the first cleaning tank, the inner side of the bottom of the second cleaning tank and the inner side of the bottom of the third cleaning tank are respectively provided with a bubbling spraying pipeline;
the bubbling spraying pipelines are arranged at the bottoms of the cleaning tanks in a cross manner;
the bubbling spraying pipeline is connected with the bubbling machine through a bubbling connecting pipeline.
Preferably, the bottom outer side of the first cleaning tank, the bottom outer side of the second cleaning tank and the bottom outer side of the third cleaning tank are respectively connected with a bottom discharge pipeline, and a bottom discharge valve is arranged on the bottom discharge pipeline.
Preferably, the outer side of the bottom of the first cleaning tank, the outer side of the bottom of the second cleaning tank and the outer side of the bottom of the third cleaning tank are respectively connected with a support leg.
Preferably, heaters are respectively disposed at the inner side of the bottom of the first cleaning tank, the inner side of the bottom of the second cleaning tank and the inner side of the bottom of the third cleaning tank.
Preferably, the liquid inlet hole of the first cleaning tank, the liquid inlet hole of the second cleaning tank and the liquid inlet hole of the third cleaning tank are respectively connected with the liquid conveying pipeline.
According to the technical scheme, the utility model has the advantages of it is following:
the upper ends of the first cleaning tank, the second cleaning tank and the third cleaning tank are provided with openings, and silicon wafers to be cleaned are placed in the openings. The liquid inlet hole of the first cleaning tank, the liquid inlet hole of the second cleaning tank and the liquid inlet hole of the third cleaning tank are respectively connected with the liquid conveying pipeline. And conveying the cleaning solution to the first cleaning tank, the second cleaning tank and the third cleaning tank through the liquid conveying pipeline. The liquid level heights of the first cleaning tank, the second cleaning tank and the third cleaning tank are different. The third cleaning tank has the highest liquid level, the second cleaning tank is arranged next to the third cleaning tank, and the first cleaning tank is arranged at the lowest cleaning tank. Therefore, the cleaning liquid flows through the through holes in sequence and is driven by the liquid return driving pump to form circulation, the cleaning effect is improved, the cleaning quality in the cleaning process is ensured, impurities on the surface of the silicon wafer are removed, and the influence on the subsequent use of the silicon wafer is avoided.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a pure water cleaning mechanism for silicon treatment;
FIG. 2 is a schematic view showing the flow of the cleaning liquid in the pure water cleaning mechanism for silicon treatment;
FIG. 3 is a schematic view of a bubbling and discharging pipeline and a liquid conveying pipeline in the mechanism.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments, and obviously, the embodiments described below are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the scope of protection of this patent.
The utility model provides a pure water cleaning mechanism is handled to silicon, as shown in fig. 1 to 3, include: a first cleaning tank 1, a second cleaning tank 2 and a third cleaning tank 3 which are connected in series in sequence; a liquid level meter 11 and a liquid inlet hole 12 are respectively arranged on the side wall of the first cleaning tank 1, the side wall of the second cleaning tank 2 and the side wall of the third cleaning tank 3;
a first liquid return hole 15 is also formed in the side wall of the first cleaning tank 1; a second liquid return hole 16 is also formed in the side wall of the third cleaning tank 3; a first through hole 17 is formed in a first side wall 21 between the first cleaning tank 1 and the second cleaning tank 2; a second through hole 18 is formed in a second side wall 22 between the second cleaning tank 2 and the third cleaning tank 3; the setting height of the first through hole 17 is higher than that of the second through hole 18; the first liquid return hole 15 and the second liquid return hole 16 are connected through a liquid return pipeline 19, and a liquid return driving pump 20 is arranged on the liquid return pipeline 19.
The upper ends of the first cleaning tank 1, the second cleaning tank 2 and the third cleaning tank 3 are opened, and silicon wafers to be cleaned are put in. The liquid inlet hole 12 of the first cleaning tank 1, the liquid inlet hole 12 of the second cleaning tank 2 and the liquid inlet hole 12 of the third cleaning tank 3 are respectively connected with a liquid conveying pipeline 28. The cleaning solution is transferred to the first cleaning bath 1, the second cleaning bath 2, and the third cleaning bath 3 through the transfer line 28. The liquid levels of the first cleaning tank 1, the second cleaning tank 2 and the third cleaning tank 3 are different. The third wash tank 3 has the highest liquid level, followed by the second wash tank 2, and the lowest is the first wash tank 1. Therefore, the cleaning liquid flows through the through holes in sequence and is driven by the liquid return driving pump 20 to form a circulation flow, so that the cleaning effect is improved, the cleaning quality in the cleaning process is ensured, impurities on the surface of the silicon wafer are removed, and the influence on the subsequent use of the silicon wafer is avoided.
In order to enable a sufficient flow of the washing liquid, a first baffle 23 is provided adjacent to the first side wall 21; the first baffle 23 is fixedly arranged on the side wall of the second cleaning tank 2; a space is arranged between the lower end of the first baffle 23 and the bottom of the second cleaning tank 2; the upper end of the first baffle 23 is flush with the upper edge of the second cleaning tank 2.
A second baffle 24 is disposed adjacent the second sidewall 22; the second baffle 24 is fixedly arranged on the side wall of the first cleaning tank 1; a space is arranged between the lower end of the second baffle plate 24 and the bottom of the first cleaning tank 1; the upper end of the first baffle 23 is flush with the upper edge of the first cleaning tank 1. Therefore, the liquid enters the cleaning tank from the bottom to be turned over, and the cleaning effect is improved.
The inner side of the bottom of the first cleaning tank 1, the inner side of the bottom of the second cleaning tank 2 and the inner side of the bottom of the third cleaning tank 3 are respectively provided with a bubbling spraying pipeline 13; the bubbling spraying pipelines 13 are arranged at the bottoms of the cleaning tanks in a cross manner; the bubbling ejection pipe 13 is connected to the bubbling machine through a bubbling connection pipe 27. The bubbling can play a role in improving the cleaning effect, so that the cleaning liquid can be fully contacted and cleaned with the surface of the silicon wafer.
The utility model discloses a bottom row's of being connected with pipeline 25 in the bottom outside of first washing tank 1, the bottom outside of second washing tank 2 and the bottom outside of third washing tank 3 respectively, is equipped with the end row valve on the end row's of being equipped with pipeline 25. The outer side of the bottom of the first cleaning tank 1, the outer side of the bottom of the second cleaning tank 2 and the outer side of the bottom of the third cleaning tank 3 are respectively connected with a supporting leg 26. Thus, the washing and brushing operations of the washing tank and the like are facilitated. And also facilitates the discharge of the cleaning liquid.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A silicon processing pure water cleaning mechanism, comprising: a first cleaning tank (1), a second cleaning tank (2) and a third cleaning tank (3) which are connected in series in sequence;
a liquid level meter (11) and a liquid inlet hole (12) are respectively arranged on the side wall of the first cleaning tank (1), the side wall of the second cleaning tank (2) and the side wall of the third cleaning tank (3);
a first liquid return hole (15) is also formed in the side wall of the first cleaning tank (1);
a second liquid return hole (16) is also formed in the side wall of the third cleaning groove (3);
a first through hole (17) is formed in a first side wall (21) between the first cleaning tank (1) and the second cleaning tank (2);
a second through hole (18) is formed in a second side wall (22) between the second cleaning tank (2) and the third cleaning tank (3);
the setting height of the first through hole (17) is higher than that of the second through hole (18);
the first liquid return hole (15) is connected with the second liquid return hole (16) through a liquid return pipeline (19), and a liquid return driving pump (20) is arranged on the liquid return pipeline (19).
2. The silicon processing pure water cleaning mechanism according to claim 1,
a first baffle (23) is arranged close to the first side wall (21); the first baffle (23) is fixedly arranged on the side wall of the second cleaning tank (2);
a space is arranged between the lower end of the first baffle (23) and the bottom of the second cleaning tank (2);
the upper end of the first baffle (23) is flush with the upper edge of the second cleaning tank (2).
3. The silicon processing pure water cleaning mechanism according to claim 1,
a second baffle (24) is arranged close to the second side wall (22); the second baffle (24) is fixedly arranged on the side wall of the first cleaning tank (1);
a space is arranged between the lower end of the second baffle (24) and the bottom of the first cleaning tank (1);
the upper end of the first baffle (23) is flush with the upper edge of the first cleaning tank (1).
4. The silicon processing pure water cleaning processing mechanism according to claim 1 or 2,
the inner side of the bottom of the first cleaning tank (1), the inner side of the bottom of the second cleaning tank (2) and the inner side of the bottom of the third cleaning tank (3) are respectively provided with a bubbling spraying pipeline (13);
the bubbling spraying pipelines (13) are arranged at the bottoms of the cleaning tanks in a cross manner;
the bubbling ejection pipeline (13) is connected with a bubbling machine through a bubbling connecting pipeline (27).
5. The silicon processing pure water cleaning processing mechanism according to claim 1 or 2,
the outer side of the bottom of the first cleaning tank (1), the outer side of the bottom of the second cleaning tank (2) and the outer side of the bottom of the third cleaning tank (3) are respectively connected with a bottom discharge pipeline (25), and a bottom discharge valve is arranged on the bottom discharge pipeline (25).
6. The silicon processing pure water cleaning processing mechanism according to claim 1 or 2,
the outer side of the bottom of the first cleaning tank (1), the outer side of the bottom of the second cleaning tank (2) and the outer side of the bottom of the third cleaning tank (3) are respectively connected with a supporting leg (26).
7. The silicon processing pure water cleaning processing mechanism according to claim 1 or 2,
heaters (14) are respectively arranged on the inner side of the bottom of the first cleaning tank (1), the inner side of the bottom of the second cleaning tank (2) and the inner side of the bottom of the third cleaning tank (3).
8. The silicon processing pure water cleaning processing mechanism according to claim 1 or 2,
the liquid inlet hole (12) of the first cleaning tank (1), the liquid inlet hole (12) of the second cleaning tank (2) and the liquid inlet hole (12) of the third cleaning tank (3) are respectively connected with a liquid conveying pipeline (28).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921842493.8U CN210788411U (en) | 2019-10-28 | 2019-10-28 | Silicon treatment pure water cleaning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921842493.8U CN210788411U (en) | 2019-10-28 | 2019-10-28 | Silicon treatment pure water cleaning mechanism |
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| Publication Number | Publication Date |
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| CN210788411U true CN210788411U (en) | 2020-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921842493.8U Active CN210788411U (en) | 2019-10-28 | 2019-10-28 | Silicon treatment pure water cleaning mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113292367A (en) * | 2021-04-09 | 2021-08-24 | 贵州师范学院 | Extensible purple perilla straw compost integration raw materials preprocessing device |
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2019
- 2019-10-28 CN CN201921842493.8U patent/CN210788411U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113292367A (en) * | 2021-04-09 | 2021-08-24 | 贵州师范学院 | Extensible purple perilla straw compost integration raw materials preprocessing device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210524 Address after: 272000 Miao Guan Zhen Er Er Li Pu Cun, Sishui County, Jining City, Shandong Province Patentee after: SHANDONG CHEN YU RARE MSTAR TECHNOLOGY Ltd. Address before: No.23 Quanji Road, economic development zone, Sishui County, Jining City, Shandong Province Patentee before: SHANDONG JIUSI NEW MATERIAL TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |