CN202290646U - Silicon wafer cleaning machine - Google Patents
Silicon wafer cleaning machine Download PDFInfo
- Publication number
- CN202290646U CN202290646U CN2011204203257U CN201120420325U CN202290646U CN 202290646 U CN202290646 U CN 202290646U CN 2011204203257 U CN2011204203257 U CN 2011204203257U CN 201120420325 U CN201120420325 U CN 201120420325U CN 202290646 U CN202290646 U CN 202290646U
- Authority
- CN
- China
- Prior art keywords
- pure water
- groove
- silicon wafer
- water groove
- rinse bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a silicon wafer cleaning machine, which comprises a first pure water tank, a first cleaning tank, a second cleaning tank, a third cleaning tank, a second pure water tank, a third pure water tank and a fourth pure water tank arranged into a row in sequence. The silicon wafer cleaning machine also comprises a first auxiliary tank communicated with the second pure water tank and a first water pump for pumping water from the first auxiliary tank to the first pure water tank, and a water pipe is connected between the first water pump and the first pure water tank. The silicon wafer cleaning machine provided by the utility model overcomes the shortcoming that the silicon wafer cleaning machine in the prior art has serious waste of pure water and energy, causing high silicon wafer cleaning cost, and can greatly save pure water and heat energy so as to reduce the silicon wafer cleaning cost.
Description
Technical field
The utility model relates to silicon chip and makes the field.Be specially a kind of silicon wafer cleaner that silicon chip is cleaned.
Background technology
After silicon chip passed through different manufacturing procedures in process of production, its surface had received severe contamination, and in general its surperficial pollution comprises organic contaminating impurity, particle contamination and metal ion pollution.Even the component failure that micropollution also can cause silicon chip to be processed, so silicon chip must clean through strictness.At present, the method for cleaning silicon chip has physical method and chemical method, and physical method is promptly through scrubbing or scouring, high-pressure wash and ultrasonic waves for cleaning are removed graininess and film like dirt.Chemical cleaning is in order to remove removal atom, the sightless pollution of ion; The general strong oxidizing property that adopts acidic cleaning solution to utilize cleaning fluid earlier of Chemical cleaning is decomposed organic matter and remove, and adopts alkaline cleaning fluid to clean afterwards; Make metal ion form stable soluble complexes and water-soluble; And then the use acidic cleaning solution, further make metal generate water-soluble complex ion, thereby reach the purpose of cleaning.
The silicon wafer cleaner that adopts at present generally has seven rinse baths; Comprising the first pure water groove that is used to hold pure water, the second pure water groove, the 3rd pure water groove and the 4th pure water groove; And be respectively applied for first rinse bath, second rinse bath and the 3rd rinse bath that holds different cleaning agents; Above-mentioned groove all has heater, and during cleaning silicon chip, the water in the groove is heated to the temperature that needs.The first pure water groove, first rinse bath, second rinse bath, the 3rd rinse bath, the second pure water groove, the 3rd pure water groove and the 4th pure water groove are arranged in a row successively; After silicon chip is removed pollutant through the cleaning of the first pure water groove, first rinse bath, second rinse bath and the 3rd rinse bath successively; Through the flushing of the pure water in the second pure water groove, the 3rd pure water groove and the 4th pure water groove, just accomplish the cleaning of silicon chip again.After silicon chip cleans and finishes; Water in the second pure water groove is entered sewer, and in the second pure water groove and first rinse bath, inject new pure water and be heated to the temperature that needs to carry out the cleaning of next group silicon chip, this has caused the waste of the pure water and the energy; Therefore, the cost of cleaning silicon chip is also very high.
The utility model content
The technical problem that the utility model solves is to overcome existing silicon wafer cleaner pure water and energy waste seriously causes silicon chip to clean the high shortcoming of cost, thereby a kind of silicon wafer cleaner that can save pure water and energy reduction silicon chip cleaning cost greatly is provided.
The silicon wafer cleaner of the utility model; Comprise the first pure water groove, first rinse bath, second rinse bath, the 3rd rinse bath, the second pure water groove, the 3rd pure water groove and the 4th pure water groove that are arranged in a row successively; Comprise that also the first auxilliary groove that is communicated with the said second pure water groove reaches from first water pump of the said first auxilliary groove to the said first pure water groove pump water, is connected with water pipe between said first water pump and the said first pure water groove.
As preferably, be connected with water pipe between said first water pump and said first rinse bath.
As preferably, also comprise the second auxilliary groove that is connected with said the 4th pure water groove, and, be connected with water pipe between said second water pump and said the 3rd pure water groove from second water pump of the said second auxilliary groove to said the 3rd pure water groove pump water.
As preferably, said the 4th pure water groove is provided with spout hole, and said spout hole is connected with said the 3rd pure water groove through overflow pipe.
As preferably, said the 3rd pure water groove is provided with spout hole, and the spout hole of said the 3rd pure water groove is connected with the said second pure water groove through overflow pipe.
The silicon wafer cleaner of the utility model is compared with prior art, has following beneficial effect:
1, the first auxilliary groove that is communicated with the second pure water groove of the silicon wafer cleaner setting of the utility model and from first water pump of the said first auxilliary groove to the said first pure water groove pump water; Make the water in the second pure water groove to pump into the first pure water groove, carry out the cleaning of next group silicon chip through the first auxilliary groove and first water pump.So not only can reuse the pure water in the second pure water groove, and the water in the second pure water groove need not heat after pumping in the first pure water groove, perhaps only need heating slightly can reach the temperature that needs, therefore also practice thrift the energy.
2, between first water pump and first rinse bath, be connected with water pipe, promptly the pure water in the second pure water groove also can enter in the second pure water groove and reuse.
3, silicon wafer cleaner also comprises the second auxilliary groove that is connected with the 4th pure water groove, reaches from second water pump of the second auxilliary groove to the 3rd pure water groove pump water, can the pure water of the 4th pure water groove be pumped in the 3rd pure water groove to reuse, and has further practiced thrift pure water and heat energy.
Description of drawings
Fig. 1 is the structural representation of silicon wafer cleaner first embodiment of the utility model;
Fig. 2 is the structural representation of silicon wafer cleaner second embodiment of the utility model.
Reference numeral
The 11-first pure water groove, 12-first rinse bath, 13-second rinse bath, 14-the 3rd rinse bath, the 15-second pure water groove, 16-the 3rd pure water groove, 17-the 4th pure water groove, the 18-second auxilliary groove, the 19-first auxilliary groove.
The specific embodiment
Fig. 1 is the structural representation of silicon wafer cleaner first embodiment of the utility model; As shown in Figure 1, silicon wafer cleaner comprises the first pure water groove 11 that is arranged in a row successively, first rinse bath 12, second rinse bath 13, the 3rd rinse bath 14, the second pure water groove 15, the 3rd pure water groove 16 and the 4th pure water groove 17.In the present embodiment, be contained with acidic cleaning solution in first rinse bath 12, be H like the composition ratio
2SO
4: H
2O
2=5: 1 or 4: 1 acid liquid clean, be contained with alkaline cleaning fluid in second rinse bath 13, like composition than being H
2O: H
2O
2: NH
4OH=5: the alkaline cleaning fluid of 2: 1 or 5: 1: 1 or 7: 2: 1, be contained with acidic cleaning solution in the 3rd rinse bath 14, like composition than being H
2O: H
2O
2: HCL=7: the acidic cleaning solution of 2: 1 or 5: 2: 1.In the present embodiment; Silicon wafer cleaner comprises that also the first auxilliary groove 19 that is communicated with the said second pure water groove 15 reaches from first water pump of the said first auxilliary groove 19 to the said first pure water groove, 11 pump water, is connected with water pipe between said first water pump and the said first pure water groove 11.During cleaning silicon chip; Earlier silicon chip being put into the first pure water groove 11 rinses out the granular pollutant on the silicon chip surface; Successively through the cleaning of first rinse bath 12, second rinse bath 13, the 3rd rinse bath 14, remove organic impurities and pollute and metal ion pollution afterwards.Successively through the flushing of the pure water of the second pure water groove 15, the 3rd pure water groove 16 and the 4th pure water groove 17, accomplish the cleaning of silicon chip afterwards.Can know that the water in the first pure water groove 11 is sewage, can not clean again and need emit.And the water in the second pure water groove 15 can also pump into the first pure water groove 11 through the first auxilliary groove 19 and first water pump, carries out the cleaning of next group silicon chip.So not only can reuse the pure water in the second pure water groove 15, and the water in the second pure water groove 15 need not heat after pumping in the first pure water groove 11, perhaps only need heating slightly can reach the temperature that needs, therefore also practice thrift the energy.
Preferred as the foregoing description is connected with water pipe between said first water pump and said first rinse bath 12, and promptly the second pure water groove, 15 interior pure water also can enter in first rinse bath 12 and reuse.
Preferred as the foregoing description; Silicon wafer cleaner also comprises the second auxilliary groove 18 that is connected with said the 4th pure water groove 17; And, be connected with water pipe between said second water pump and said the 3rd pure water groove 16 from second water pump of the said second auxilliary groove 18 to said the 3rd pure water groove 16 pump water.Can the pure water of the 4th pure water groove 17 be pumped into recycling in the 3rd pure water groove 16.
Fig. 2 is the structural representation of silicon wafer cleaner second embodiment of the utility model.As shown in Figure 2, the 4th pure water groove 17 is an overflow launder, and its side is provided with spout hole in top edge; Said spout hole is communicated with the 3rd pure water groove 16 through overflow pipe; But make pure water overflow to the three pure water grooves 16 in the 4th pure water groove 17, and the water in the 3rd pure water groove 16 can not get into the 4th pure water groove 17, cleaned a collection of silicon chip like this after; Can the water in the 3rd pure water groove 16 be discharged, make the water in the 4th pure water groove 17 flow to recycling in the 3rd pure water groove 16.Other content is identical with first embodiment, repeats no more at this.
Preferred as second embodiment; The 3rd pure water groove 16 is an overflow launder; Its side is provided with spout hole in top edge; Spout hole is connected with the second pure water groove 15 through overflow pipe, but makes pure water overflow to the second pure water groove 15 in the 3rd pure water groove 16, can reuse the pure water in the 3rd pure water groove 16 like this.Have only the water in the first pure water groove 11 to be discharged into sewer like this, second, third has all obtained recycling with the interior water of the 4th pure water groove, can practice thrift pure water and heat energy greatly.
Above embodiment is merely the exemplary embodiment of the utility model, is not used in restriction the utility model, and the protection domain of the utility model is defined by the claims.Those skilled in the art can make various modifications or be equal to replacement the utility model in the essence and protection domain of the utility model, this modification or be equal to replacement and also should be regarded as dropping in the protection domain of the utility model.
Claims (5)
1. silicon wafer cleaner; Comprise the first pure water groove, first rinse bath, second rinse bath, the 3rd rinse bath, the second pure water groove, the 3rd pure water groove and the 4th pure water groove that are arranged in a row successively; It is characterized in that: comprise that also the first auxilliary groove that is communicated with the said second pure water groove reaches from first water pump of the said first auxilliary groove to the said first pure water groove pump water, is connected with water pipe between said first water pump and the said first pure water groove.
2. silicon wafer cleaner according to claim 1 is characterized in that: be connected with water pipe between said first water pump and said first rinse bath.
3. silicon wafer cleaner according to claim 1 and 2; It is characterized in that: also comprise the second auxilliary groove that is connected with said the 4th pure water groove; And, be connected with water pipe between said second water pump and said the 3rd pure water groove from second water pump of the said second auxilliary groove to said the 3rd pure water groove pump water.
4. silicon wafer cleaner according to claim 1 and 2 is characterized in that: said the 4th pure water groove is provided with spout hole, and said spout hole is connected with said the 3rd pure water groove through overflow pipe.
5. silicon wafer cleaner according to claim 1 and 2 is characterized in that: said the 3rd pure water groove is provided with spout hole, and the spout hole of said the 3rd pure water groove is connected with the said second pure water groove through overflow pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204203257U CN202290646U (en) | 2011-10-28 | 2011-10-28 | Silicon wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204203257U CN202290646U (en) | 2011-10-28 | 2011-10-28 | Silicon wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202290646U true CN202290646U (en) | 2012-07-04 |
Family
ID=46359627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204203257U Expired - Lifetime CN202290646U (en) | 2011-10-28 | 2011-10-28 | Silicon wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202290646U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102806216A (en) * | 2012-08-21 | 2012-12-05 | 安阳市凤凰光伏科技有限公司 | Quasi-monocrystalline silicon wafer cleaning method |
| CN102836842A (en) * | 2012-08-08 | 2012-12-26 | 晶海洋半导体材料（东海）有限公司 | Multi-groove circulating silicon wafer cleaning machine |
| CN108722977A (en) * | 2017-04-20 | 2018-11-02 | 隆基绿能科技股份有限公司 | Raw material cleaning device and material cleaning apparatus |
| CN108941037A (en) * | 2017-05-19 | 2018-12-07 | 浙江昱辉阳光能源有限公司 | A kind of silicon material recovery and rinsing method and device |
-
2011
- 2011-10-28 CN CN2011204203257U patent/CN202290646U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102836842A (en) * | 2012-08-08 | 2012-12-26 | 晶海洋半导体材料（东海）有限公司 | Multi-groove circulating silicon wafer cleaning machine |
| CN102836842B (en) * | 2012-08-08 | 2014-07-16 | 晶海洋半导体材料（东海）有限公司 | Multi-groove circulating silicon wafer cleaning machine |
| CN102806216A (en) * | 2012-08-21 | 2012-12-05 | 安阳市凤凰光伏科技有限公司 | Quasi-monocrystalline silicon wafer cleaning method |
| CN108722977A (en) * | 2017-04-20 | 2018-11-02 | 隆基绿能科技股份有限公司 | Raw material cleaning device and material cleaning apparatus |
| CN108941037A (en) * | 2017-05-19 | 2018-12-07 | 浙江昱辉阳光能源有限公司 | A kind of silicon material recovery and rinsing method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201702135U (en) | Ultrasonic circulation wafer washer | |
| CN202290646U (en) | Silicon wafer cleaning machine | |
| CN203900007U (en) | Solar silicon wafer cleaning device | |
| WO2013139047A1 (en) | Method for cleaning tft-lcd glass substrate | |
| CN107658246A (en) | A kind of solar silicon wafers cleaning | |
| CN102698989A (en) | Method for precleaning silicon wafer | |
| CN102614705B (en) | Method and device for cleaning ceramic filter | |
| CN202822955U (en) | Ceramic filter cleaning device | |
| CN204685622U (en) | A kind of silicon wafer cleaner pure water recovery system | |
| CN202238773U (en) | Lower vibration plate type steel wire continuous ultrasonic cleaning machine set | |
| CN202155331U (en) | Silicon material rinser | |
| CN205289078U (en) | Wafer -cleaning device | |
| CN104190666A (en) | Upward washing type aluminum plate degreasing device | |
| CN205442658U (en) | Energy -concerving and environment -protective silicon material cleaning machine | |
| CN201394556Y (en) | Graphite carrying plate cleaning device | |
| CN203393242U (en) | Electrolytic manganese negative electrode plate washing device | |
| CN103668268A (en) | Waste acid recycling system | |
| CN203124318U (en) | Washing device for surfaces of waste copper wires | |
| CN107456875A (en) | A kind of cleaning method and cleaning device of percolate hyperfiltration membrane assembly | |
| CN202162174U (en) | Manual silicon slice cleaning machine | |
| CN206356315U (en) | A kind of multiple-grooved ultrasonic cleaning equipment | |
| CN204769666U (en) | Silicon chip washing unit | |
| CN101289640A (en) | Cleaning agent for grinding wafer | |
| CN206997140U (en) | A kind of electric automatization glass cleaning machine | |
| CN205362237U (en) | Circulation washing unit for belted steel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |
|
| CX01 | Expiry of patent term |