CN210778501U - Wet etching and cleaning device - Google Patents
Wet etching and cleaning device Download PDFInfo
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- CN210778501U CN210778501U CN201922187894.0U CN201922187894U CN210778501U CN 210778501 U CN210778501 U CN 210778501U CN 201922187894 U CN201922187894 U CN 201922187894U CN 210778501 U CN210778501 U CN 210778501U
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- 238000004140 cleaning Methods 0.000 title claims abstract description 41
- 238000001039 wet etching Methods 0.000 title claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 95
- 238000000034 method Methods 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 25
- 239000002245 particle Substances 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 53
- 239000003153 chemical reaction reagent Substances 0.000 description 8
- 238000004891 communication Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The utility model provides a wet etching and belt cleaning device, include: the liquid supply pipeline comprises two branches which are arranged along a preset direction and are respectively located on two sides of the wafer clamp, one sides of the two branches are communicated, the liquid supply pipeline is located on the same horizontal plane, therefore, the pressure of the two branches of the liquid supply pipeline is equal, the liquid flow on two sides of the process groove is the same, the etching amount on two sides of the wafer tends to be the same, and the etching consistency of the surface of the wafer is improved. The bubble discharge pipeline is communicated with the liquid supply pipeline, the bubble discharge pipeline is arranged outside the inner groove, and the bubble discharge pipeline is provided with an upward opening, so that bubbles in the liquid supply pipeline are discharged through the bubble discharge pipeline, bubbles in the inner groove are prevented from being attached to the surface of a wafer after being sprayed with liquid, and the problems of partial etching on the surface of the wafer and residual particles are solved.
Description
Technical Field
The utility model belongs to the technical field of integrated circuit makes, concretely relates to wet etching and belt cleaning device.
Background
As feature sizes continue to shrink, the requirements for etching and cleaning wafers in integrated circuit fabrication processes become more and more demanding. Wafer etching and cleaning become very important processes in the integrated circuit manufacturing process. In a semiconductor manufacturing process, a wet process usually uses a chemical reagent (e.g., an acid-base solution) to etch a wafer, deionized water is used to clean the wafer, both etching and cleaning are performed in a process tank, and the effects of etching a wafer film layer and removing particles are achieved by rinsing and soaking the wafer film layer with liquid (the chemical reagent or the deionized water).
The liquid for washing and soaking is sprayed to the wafer through the small holes in the liquid supply pipeline, when the liquid stops supplying, air exists in the pipeline due to the existence of the small holes, when the liquid valve is opened again to supply the liquid, more bubbles are attached to the surface of the wafer after being sprayed with the liquid, etching of the wafer and removal of particles are affected, and therefore partial etching or residual particles on the surface of the wafer are caused.
In addition, due to the conditions of incomplete symmetry or aging deformation of the liquid supply pipeline, the liquid pressures on the left side and the right side of the process tank are not completely the same, so that the liquid flow rate difference between the left side and the right side is caused, the etching on one side forming the surface of the wafer is more than that on the other side, the etching on the surface of the wafer is not uniform,
SUMMERY OF THE UTILITY MODEL
The utility model provides a wet etching and belt cleaning device, an aim at effectively get rid of the bubble, solve the partial sculpture of wafer surface or remain the particulate matter problem. The other purpose is to enable the etching amount on the two sides of the wafer to be approximately the same and improve the etching consistency of the surface of the wafer.
The utility model provides a wet etching and belt cleaning device, include:
the utility model provides a wet etching and belt cleaning device, includes the technology groove, the technology groove includes the water jacket and arranges in the inside groove in the water jacket, inside along presetting the parallel wafer anchor clamps that are used for fixed wafer that are provided with of direction of interior, wet etching and belt cleaning device still includes:
the liquid supply pipeline comprises two branches, the two branches are arranged along the preset direction and are respectively positioned on two sides of the wafer clamp, one sides of the two branches are communicated, and small holes are distributed on the two branches at intervals; the liquid supply pipelines are positioned on the same horizontal plane;
the air bubble discharge pipeline is communicated with the liquid supply pipeline, is arranged outside the inner groove and is provided with an upward opening.
Furthermore, one sides of the two branches are communicated through a transverse communication pipe, and the transverse communication pipe is arranged outside the inner tank and inside the outer tank.
Further, the bubble discharge pipeline is communicated with the transverse communicating pipe and is vertically opened upwards.
Furthermore, the other sides of the two branches are connected with a liquid inlet pipeline.
Furthermore, be provided with the feed liquor valve on the feed liquor pipeline, be provided with the bubble valve of exhausting on the bubble pipeline, the bubble valve of exhausting with the feed liquor valve is opened simultaneously, and is closed simultaneously.
Furthermore, the liquid inlet pipeline is controlled by the liquid inlet valve and is used for inputting chemical reagents or deionized water.
Further, the two branches pass through the inner groove along the front wall and the rear wall in the preset direction.
Further, the liquid supply pipeline is U-shaped, and the liquid supply pipeline is positioned in the lower area inside the process tank.
Further, the material of the liquid supply pipeline comprises glass.
Furthermore, the small holes on the two branches are symmetrically distributed and are arranged towards the wafer, and the small holes on the two branches are arranged inside the inner groove.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model provides a wet etching and belt cleaning device, include: the liquid supply pipeline is divided into two branches, one sides of the two branches are communicated, and the liquid supply pipelines are located on the same horizontal plane, so that the pressures of the two branches of the liquid supply pipeline are equal, the liquid flow rates on the two sides of the process groove are the same, the etching amount on the two sides of the wafer tends to be the same, and the etching consistency of the surface of the wafer is improved.
The bubble discharge pipeline is communicated with the liquid supply pipeline, the bubble discharge pipeline is arranged outside the inner groove, and the bubble discharge pipeline is provided with an upward opening, so that bubbles in the liquid supply pipeline are discharged through the bubble discharge pipeline, bubbles in the inner groove are prevented from being attached to the surface of a wafer after being sprayed with liquid, and the problems of partial etching on the surface of the wafer and residual particles are solved.
Drawings
FIG. 1 is a top view of a wet etching and cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of the wet etching and cleaning apparatus of the embodiment of the present invention taken along AA' of FIG. 1;
FIG. 3 is a cross-sectional view taken at BB' of FIG. 1 of a wet etching and cleaning apparatus according to an embodiment of the present invention;
fig. 4 is a schematic view of the liquid inlet pipeline supply of the wet etching and cleaning apparatus according to the embodiment of the present invention.
Wherein the reference numbers are as follows:
1-wet etching and cleaning device; 10-a process tank; 101-an outer tank; 102-an inner tank; 20-a wafer holder; 30-a liquid supply line; 301-branch; 302-branch; 303-transverse communicating tube; 40-bubble discharge pipeline; 401-air bubble vent valve; 50-a liquid inlet pipeline; 501, 502, 503-liquid inlet valve; w-a wafer; 60-a liquid storage tank.
Detailed Description
Based on the research, the embodiment of the utility model provides a wet etching and belt cleaning device. The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are designed in a simplified form and are not to scale, but rather are provided for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
The embodiment of the utility model provides wet etching and belt cleaning device, including the technology groove, the technology groove includes the water jacket and arranges in inside groove in the water jacket, inside direction parallel is provided with a plurality of wafer anchor clamps that are used for fixed wafer along presetting of inside edge of inside groove, wet etching still includes with belt cleaning device:
the liquid supply pipeline comprises two branches, the two branches are arranged along the preset direction and are respectively positioned on two sides of the wafer clamp, one sides of the two branches are communicated, and small holes are distributed on the two branches at intervals; the liquid supply pipelines are positioned on the same horizontal plane;
the air bubble discharge pipeline is communicated with the liquid supply pipeline, is arranged outside the inner groove and is provided with an upward opening.
The wet etching and cleaning device of the present invention is described in detail below with reference to fig. 1 and 2, as shown in fig. 1 and 2, the wet etching and cleaning device 1 of the present invention includes a process tank 10, wherein the process tank 10 includes an outer tank 101 and an inner tank 102 disposed in the outer tank 101, and the top of the outer tank 101 and the top of the inner tank 102 are open. When the inner tank 102 is full of liquid, the liquid overflows to the outer tank 101, and a drain line is connected to the outer tank 101.
The inner tank 102 is provided with a plurality of wafer holders 20 for fixing wafers W in parallel along a predetermined direction, the plurality of wafers W are fixed on the wafer holders 20 side by side, the predetermined direction is, for example, the axial direction of the wafers W, and the wet etching and cleaning apparatus 1 further includes: the liquid supply pipeline 30 comprises two branches (301 and 302), the two branches are arranged along the preset direction and are respectively positioned at two sides of the wafer clamp, one sides of the two branches are communicated, specifically, the two branches penetrate through the inner groove 102 and along the front wall and the rear wall of the preset direction, one sides of the two branches (301 and 302) are communicated through a transverse communication pipe 303, and therefore bilateral intercommunication and balanced control of supply pressure and flow at two sides are achieved. The liquid supply lines 30(301, 302, and 303) are, for example, U-shaped, and the liquid supply lines 30 are located at the same level; therefore, the pressures of the two branches of the liquid supply pipeline are equal, and the liquid flow rates at the two sides of the process groove are the same, so that the etching amount at the two sides of the wafer tends to be the same, and the etching consistency of the surface of the wafer is improved.
The liquid supply line 30 is located in the lower interior region of the process tank 10. The liquid supply pipe 30 is made of glass, for example. The lateral communication pipe 303 is disposed outside the inner tank 102 and inside the outer tank 101. The small holes 70 are distributed on the two branches at intervals, the small holes 70 on the two branches are symmetrically distributed and are arranged towards the wafer, and the small holes on the two branches are arranged in the inner groove 102. The liquid sprayed from the small holes is sprayed upwards from the bottom to the wafer, and a washing flow effect from bottom to top is formed.
As shown in fig. 1 to 4, the bubble discharge pipe 40 is communicated with the transverse communication pipe 303 and is opened vertically upward. The other sides of the two branches (301 and 302) are connected with the liquid inlet pipeline 50. The liquid inlet pipe 50 is provided with liquid inlet valves (501, 502, 503), for example, the liquid inlet valve 501 is a deionized water liquid inlet valve, the liquid inlet valve 502 is a first chemical reagent liquid inlet valve, and the liquid inlet valve 503 is a second chemical reagent liquid inlet valve. The bubble discharge pipeline 40 is provided with a bubble discharge valve 401, the bubble discharge valve 401 is, for example, a pneumatic control valve, and the bubble discharge valve 401 and the liquid inlet valve are opened and closed simultaneously. The liquid inlet pipe 50 is controlled by the liquid inlet valve and is used for inputting chemical reagents and/or deionized water.
The bubble discharge valve 401 and the liquid inlet valve are opened at the same time, or not opened at the same time. When liquid (chemical agent or deionized water) is supplied, the air bubbles 402 in the pipeline (branches 301 and 302) are extruded into the air bubble exhausting pipeline 40 due to the pressure of the liquid, and then the air bubbles are sprayed out from the top end, so that the bubble exhausting effect is achieved. It will be appreciated that liquid will also spill over the top of the vent bubble pipe 40 during this process, and the bubble-containing spilled liquid will flow into the outer tank which is in communication with the drain line for draining the liquid from the outer tank.
The bubble discharge valve 401 and the liquid inlet valve are closed simultaneously, and when the supply of liquid (chemical reagent or deionized water) is stopped, the bubble discharge valve 401 is closed simultaneously, so as to prevent the liquid in the process tank from leaking out of the bubble discharge pipeline 40.
When the liquid supply pipeline 30 is opened again after being closed, the bubble discharge valve 401 and the liquid inlet valve are opened simultaneously, bubbles in the liquid supply pipeline 30 are discharged through the bubble discharge pipeline 40, bubbles in the inner groove 102 are prevented from being attached to the surface of the wafer after being sprayed with liquid, and the problems of partial etching of the surface of the wafer and residual particles are solved.
The wet etching and cleaning device adopts a process tank form, and has the advantages of simple structure, low cost, high yield, high reliability, excellent selection ratio and the like. When cleaning, a plurality of wafers are placed in the process tank and are fixed on the wafer clamp at the bottom of the process tank in parallel, and then liquid (chemical reagent or deionized water) can be input according to a menu to complete the etching and cleaning processes. A plurality of wafers are fixedly clamped on the wafer clamps, and the number of the wafer clamps correspondingly arranged is 25 or 50, for example. Generally, the cleaning batch of a batch of wafers is 25 wafers, and the number of the wafer clamps is set to be equal to or integral multiple of the wafer batch, so as to facilitate the batch management of etching and cleaning, ensure the yield of etching and cleaning and improve the utilization rate of the device.
To sum up, the utility model provides a one the utility model provides a wet etching and belt cleaning device, include: the liquid supply pipeline is divided into two branches, one sides of the two branches are communicated, and the liquid supply pipelines are located on the same horizontal plane, so that the pressures of the two branches of the liquid supply pipeline are equal, the liquid flow rates on the two sides of the process groove are the same, the etching amount on the two sides of the wafer tends to be the same, and the etching consistency of the surface of the wafer is improved.
The bubble discharge pipeline is communicated with the liquid supply pipeline, the bubble discharge pipeline is arranged outside the inner tank, and the bubble discharge pipeline is provided with an opening extending upwards, so that bubbles in the liquid supply pipeline are discharged through the bubble discharge pipeline, bubbles in the inner tank are prevented from being attached to the surface of a wafer after being sprayed with liquid, and the problems of partial etching on the surface of the wafer and residual particles are solved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the method disclosed by the embodiment, the description is relatively simple because the method corresponds to the device disclosed by the embodiment, and the relevant points can be referred to the description of the method part.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and any modification and modification made by those skilled in the art according to the above disclosure are all within the scope of the claims.
Claims (10)
1. The utility model provides a wet etching and belt cleaning device, includes the technology groove, the technology groove includes the water jacket and arranges in the inside groove in the water jacket, inside along presetting the parallel wafer anchor clamps that are used for fixed wafer that are provided with of direction of interior, its characterized in that, wet etching and belt cleaning device still includes:
the liquid supply pipeline comprises two branches, the two branches are arranged along the preset direction and are respectively positioned on two sides of the wafer clamp, one sides of the two branches are communicated, and small holes are distributed on the two branches at intervals; the liquid supply pipelines are positioned on the same horizontal plane;
the air bubble discharge pipeline is communicated with the liquid supply pipeline, is arranged outside the inner groove and is provided with an upward opening.
2. The wet etching and cleaning apparatus of claim 1, wherein one sides of the two branches are connected by a transverse connection pipe, the transverse connection pipe being disposed outside the inner tank and inside the outer tank.
3. The wet etching and cleaning apparatus according to claim 2, wherein the bubble discharge pipe is communicated with the transverse communicating pipe and is vertically opened to the upper top.
4. The wet etching and cleaning apparatus of claim 1, wherein the other side of each of the two branches is connected to a liquid inlet line.
5. The wet etching and cleaning apparatus of claim 4, wherein the liquid inlet line is provided with a liquid inlet valve, the bubble exhaust line is provided with a bubble exhaust valve, and the bubble exhaust valve and the liquid inlet valve are opened and closed simultaneously.
6. The wet etching and cleaning apparatus of claim 5, wherein the liquid inlet pipe is controlled by the liquid inlet valve and is supplied with a chemical or deionized water.
7. The wet etching and cleaning apparatus as claimed in any one of claims 1 to 6, wherein both of the branches pass through the front and rear walls of the inner tank in the predetermined direction.
8. The wet etching and cleaning apparatus according to any one of claims 1 to 6, wherein the liquid supply line is U-shaped and is located in an inner lower region of the process tank.
9. The wet etching and cleaning apparatus according to any one of claims 1 to 6, wherein the liquid supply line comprises glass.
10. The wet etching and cleaning apparatus of any one of claims 1 to 6, wherein the apertures of the two branches are symmetrically distributed and are disposed towards the wafer, and the apertures of the two branches are disposed inside the inner tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922187894.0U CN210778501U (en) | 2019-12-09 | 2019-12-09 | Wet etching and cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922187894.0U CN210778501U (en) | 2019-12-09 | 2019-12-09 | Wet etching and cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210778501U true CN210778501U (en) | 2020-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922187894.0U Active CN210778501U (en) | 2019-12-09 | 2019-12-09 | Wet etching and cleaning device |
Country Status (1)
| Country | Link |
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| CN (1) | CN210778501U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635356A (en) * | 2020-12-02 | 2021-04-09 | 华虹半导体(无锡)有限公司 | Wet etching cleaning equipment |
| CN113314439A (en) * | 2021-04-27 | 2021-08-27 | 长江存储科技有限责任公司 | Wet etching device and method |
-
2019
- 2019-12-09 CN CN201922187894.0U patent/CN210778501U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635356A (en) * | 2020-12-02 | 2021-04-09 | 华虹半导体(无锡)有限公司 | Wet etching cleaning equipment |
| CN112635356B (en) * | 2020-12-02 | 2022-09-20 | 华虹半导体(无锡)有限公司 | Wet etching cleaning equipment |
| CN113314439A (en) * | 2021-04-27 | 2021-08-27 | 长江存储科技有限责任公司 | Wet etching device and method |
| CN113314439B (en) * | 2021-04-27 | 2023-11-28 | 长江存储科技有限责任公司 | Wet etching device and method |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Xinxin Integrated Circuit Co.,Ltd. Country or region after: China Address before: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Xinxin Semiconductor Manufacturing Co.,Ltd. Country or region before: China |