CN114951121A - Quartz boat cleaning equipment and use method thereof - Google Patents
Quartz boat cleaning equipment and use method thereof Download PDFInfo
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- CN114951121A CN114951121A CN202210509524.8A CN202210509524A CN114951121A CN 114951121 A CN114951121 A CN 114951121A CN 202210509524 A CN202210509524 A CN 202210509524A CN 114951121 A CN114951121 A CN 114951121A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 52
- 239000010453 quartz Substances 0.000 title claims abstract description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 129
- 238000005554 pickling Methods 0.000 claims abstract description 105
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 81
- 238000005406 washing Methods 0.000 claims abstract description 65
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 43
- 239000010703 silicon Substances 0.000 claims abstract description 43
- 239000002253 acid Substances 0.000 claims abstract description 9
- 239000007921 spray Substances 0.000 claims abstract description 7
- 238000010992 reflux Methods 0.000 claims abstract description 4
- 230000007306 turnover Effects 0.000 claims abstract description 3
- 235000012431 wafers Nutrition 0.000 claims description 33
- 239000007788 liquid Substances 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims description 3
- 238000010981 drying operation Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 239000008400 supply water Substances 0.000 claims description 3
- 235000021110 pickles Nutrition 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses quartz boat cleaning equipment and a using method thereof, wherein the quartz boat cleaning equipment comprises a bearing mechanism, an acid washing mechanism, a water washing mechanism and a circulating mechanism, wherein the bearing mechanism is used for bearing a silicon wafer to be cleaned; the pickling mechanism comprises a pickling tank and a cover plate arranged on the pickling tank, pickling solution is contained in the pickling tank, and the cover plate turnover type cover covers the opening position of the upper part of the pickling tank; the water washing mechanism comprises a water washing tank and a water outlet, the water outlet is formed in the inner wall of the water washing tank, and the silicon wafer to be washed on the bearing mechanism is subjected to spray type water washing operation through the position of the water outlet; the circulation mechanism is communicated with the inside of the pickling mechanism, so that the pickling solution loaded in the pickling mechanism is controlled to perform reflux circulation operation. The device adopts the mutual matching of the pickling mechanism and the circulating mechanism, and when acid cleaning is not needed, the pickling solution is directly recovered into the circulating mechanism, so that the pickling solution is prevented from influencing the acidity after being exposed in an open environment for a long time, and further the cleaning efficiency of the silicon wafer to be cleaned is influenced.
Description
Technical Field
The invention belongs to the technical field of semiconductor cleaning equipment, and particularly relates to quartz boat cleaning equipment and a using method thereof.
Background
The silicon chip is used as a raw material which is widely applied in the semiconductor industry at present, has excellent electrical characteristics, high insulation and pressure resistance strength and excellent market prospect.
Before a silicon wafer is prepared into a semiconductor chip, multiple steps of acid washing, alkali washing, water washing and the like are firstly adopted for the silicon wafer (or a quartz tube) so as to remove impurities on the surface of the silicon wafer (or the quartz tube), the acid-base value requirement for the acid washing or the alkali washing is extremely high, and repeated cleaning is required.
At present, in chinese patent CN202110342084.7, a quartz boat cleaning machine is disclosed, which comprises a quartz boat cleaning tank, a water tank, a frame and a bottom plate, in which the quartz boat cleaning tank can be used for accommodating and cleaning the quartz boat, and the water tank can supply cleaning liquid for the quartz boat cleaning tank. However, since both acidic and alkaline substances can generate volatility, the open cleaning tank is exposed to the air for a long time, so that the acidic and alkaline liquids are easily volatilized, the pH value is affected, and when the soaking time is not changed and the pH value of the acidic and alkaline liquids is changed, impurities are easily washed incompletely in the cleaning process of the silicon wafer (or quartz tube), so that the cleaning efficiency is greatly affected.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide quartz boat cleaning equipment and a using method thereof, and solves the technical problems in the prior art.
The purpose of the invention can be realized by the following technical scheme:
a quartz boat cleaning device comprises a bearing mechanism, a pickling mechanism, a water washing mechanism and a circulating mechanism, wherein the bearing mechanism is used for bearing a silicon wafer to be cleaned; the top of the bearing mechanism is provided with a driving assembly, the bearing mechanism bearing the silicon wafer moves back and forth in an upper area where the pickling mechanism and the washing mechanism are located through the driving assembly, and the bearing mechanism is provided with a lifting assembly moving in the up-and-down direction, so that the silicon wafer to be cleaned is controlled to be arranged at the inner side positions of the pickling mechanism and the washing mechanism;
the pickling mechanism comprises a pickling tank and a cover plate arranged on the pickling tank, pickling solution is contained in the pickling tank, and the cover plate is covered on an opening position at the upper part of the pickling tank in a turnover mode;
the water washing mechanism comprises a water washing tank and a water outlet, the water outlet is formed in the inner wall of the water washing tank, and the silicon wafer to be washed on the bearing mechanism is subjected to spray type water washing operation through the position of the water outlet;
the circulation mechanism is communicated with the inside of the pickling mechanism, so that the pickling solution loaded in the pickling mechanism is controlled to perform reflux circulation operation.
Furthermore, the hanging basket where the bearing mechanism is located is of a grid type bucket-shaped structure, and the opening direction of the bucket shape inclines outwards.
Furthermore, the water washing mechanism and the acid washing mechanism are arranged in a parallel and level position, and the water washing mechanism is arranged at the outer side position where the bearing mechanism moves out.
Furthermore, a first channel pipe is arranged at the bottom of the pickling tank and is communicated with the circulating mechanism through the first channel pipe, so that the pickling solution in the pickling mechanism can be pumped out or the pickling solution in the circulating mechanism can be pumped into the pickling tank of the pickling mechanism.
Furthermore, the lateral wall that washing mechanism belonged to is provided with the second water pipe, makes second water pipe and delivery port intercommunication to for the delivery port lasts the water supply, through the operation of going out water of delivery port carries out fountain washing to the silicon chip of waiting to wash on the bearing mechanism of placing in the wash bowl.
Furthermore, a second water through pipe arranged on the washing mechanism is communicated with an external ventilation mechanism and is used for carrying out air blowing and drying operation on the washing tank.
Furthermore, the bottoms of the pickling mechanism and the washing mechanism are provided with independent discharge pipe fittings.
The use method of the quartz boat cleaning equipment comprises the following steps:
s1, firstly, starting a driving assembly at the top of the bearing mechanism, moving the hanging basket to the front end part, and placing the silicon wafer to be cleaned on the hanging basket;
s2, according to the cleaning procedure, firstly, the hanging basket is moved to the position above the rinsing bath through the driving assembly, then the lifting assembly is controlled to integrally place the hanging basket in the rinsing bath, the second water pipe is controlled to supply water, and the hanging basket is cleaned from the water outlet by adopting a spray type cleaning method;
s3, after the silicon wafer is cleaned, ventilating through a second water pipe, and drying the water on the surface of the silicon wafer to be cleaned;
s4, placing the silicon wafer to be cleaned in the pickling tank integrally by controlling the driving assembly and the lifting assembly on the hanging basket, and controlling the lifting assembly to move in a vibration mode;
s5, after pickling, closing a cover plate above the pickling tank, simultaneously starting a circulating mechanism, performing back-pumping operation on the pickling solution in the pickling tank, simultaneously moving a hanging basket carrying silicon wafers to be cleaned into a rinsing tank for cleaning, and repeating the operations S2 and S3;
s6, in the secondary pickling, firstly, the pickling solution in the circulating mechanism is refluxed into the pickling tank, and then the pickling operation is performed.
Further, after the washing in the step S2 is finished, the whole hanging basket is placed in a water washing tank for containing water and is immersed for a plurality of times, and meanwhile, the lifting assembly is started to move in a vibration mode.
The invention has the beneficial effects that:
1. this device adopts pickling mechanism and circulation mechanism to mutually support, when not needing to carry out acid cleaning, directly retrieves circulation mechanism with the pickle in, avoids the pickle to expose under the environment of open-type for a long time, influences its acidity, and then the influence treats the cleaning efficiency who washs the silicon chip, when needs pickling, rethread circulation mechanism release can, also reduced the washing change frequency of pickle, the relative cost is reduced.
2. The bearing mechanism adopted by the device adopts the mutual matching of the lifting assembly and the driving assembly, and the transfer efficiency during cleaning is improved.
3. The washing mechanism that this device adopted uses the fountain of delivery port to wash, has greatly improved when wasing with the surperficial contact surface of silicon chip, and then improves cleaning efficiency, and the delivery port can also weather the operation by wind after wasing simultaneously, and then reaches washing and accomplishes the back and weather the surface, when avoiding secondary pickling, the acidity of the moisture influence pickle of carrying.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of an embodiment of the present invention;
FIG. 2 is a schematic view of a load bearing mechanism of an embodiment of the present invention;
FIG. 3 is a schematic view of a pickling mechanism according to an embodiment of the invention;
FIG. 4 is a schematic view of a water wash mechanism according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a quartz boat cleaning apparatus, which includes a bearing mechanism 1, an acid washing mechanism 2, a water washing mechanism 3, and a circulation mechanism 4, where as shown in fig. 2, the bearing mechanism 1 is used for bearing a silicon wafer to be cleaned; a driving assembly 11 is arranged at the top of the bearing mechanism 1, the bearing mechanism 1 bearing the silicon wafer is moved back and forth in an area above the pickling mechanism 2 and the water washing mechanism 3 through the driving assembly 11, and a lifting assembly 12 moving along the up-down direction is arranged on the bearing mechanism 1, so that the silicon wafer to be cleaned is controlled to be arranged at the inner side positions of the pickling mechanism 2 and the water washing mechanism 3; the basket 101 of hanging that bears mechanism 1 place is graticule mesh formula bucket column structure, and the opening direction of bucket form leans out, and this kind of mode of setting can realize hanging basket 101 and soak completely, treats that the washing silicon chip can soak completely.
As shown in fig. 3, the pickling mechanism 2 includes a pickling tank 21 and a cover plate 22 provided on the pickling tank 21, wherein the pickling tank 21 contains pickling solution, and the cover plate 22 is flip-type and covers the opening position of the upper part of the pickling tank 21; the bottom of the pickling tank 21 is provided with a first channel pipe 201, and is communicated with the circulating mechanism 4 through the first channel pipe 201, so that the pickling solution in the pickling mechanism 2 can be pumped out or the pickling solution in the circulating mechanism 4 can be pumped into the pickling tank 21 of the pickling mechanism 2, thereby controlling the pickling solution contained in the pickling mechanism 2 to carry out the reflux circulation operation, and avoiding the situations of acidity volatilization and the like caused by long-term exposure of the pickling solution in an open environment. When the pickling tank 21 contains the pickling solution, it can also contain other liquids such as an alkali wash solution as needed.
As shown in fig. 4, the washing mechanism 3 includes a washing tank 31 and a water outlet 32, the water outlet 32 is arranged on the inner wall of the washing tank 31, and the silicon wafer to be cleaned on the bearing mechanism 1 is subjected to spray-type washing operation through the position of the water outlet 32;
the lateral wall at washing mechanism 3 place is provided with second water pipe 301, makes second water pipe 301 and delivery port 32 intercommunication to for delivery port 32 continuously supplies water, the operation of going out water through delivery port 32 carries out fountain washing to the silicon chip of treating on the bearing mechanism 1 of placing in rinsing bath 31, and this kind of cleaning method compares and soaks formula information, more can wash surface silicon chip (or quartz tube) surface.
The second water pipe 301 arranged on the washing mechanism 3 is communicated with an external ventilation mechanism, and is used for carrying out air-blowing drying operation on the washing tank 31, so that the silicon wafer after washing is subjected to air-drying, and the problem that the acidity of the pickling solution is influenced by mixing of residual water on the silicon wafer and the pickling solution when pickling is carried out is avoided.
The use method of the quartz boat cleaning equipment comprises the following steps:
s1, firstly, the driving assembly 11 on the top of the bearing mechanism 1 is started, the hanging basket 101 is moved to the front end portion, and the silicon wafer to be cleaned is placed on the hanging basket 101 to be prepared before cleaning.
S2, according to the cleaning process, firstly, the hanging basket 101 is moved to the position above the rinsing bath 31 through the driving assembly 11, then the lifting assembly 12 is controlled to integrally place the hanging basket 101 in the rinsing bath 31, the second water through pipe 301 is controlled to supply water, and the water is cleaned from the water outlet 32 by adopting a spray type cleaning method; after the washing in S2 is completed, the water in rinsing bath 31 is not discharged, and basket 101 is wholly immersed for a plurality of times in rinsing bath 31 for holding water, and lifting assembly 12 is started to move in a vibration mode, so that the immersion efficiency is improved.
S3, after the cleaning, the water in the washing tank 31 is discharged, and then the ventilation operation is performed through the second water pipe 301, thereby drying the water on the surface of the silicon wafer to be cleaned.
S4, the silicon wafer to be cleaned is integrally placed in the pickling tank 21 by controlling the driving assembly 11 and the lifting assembly 12 on the hanging basket 101, and the lifting assembly 12 is controlled to move in a vibration mode.
S5, after pickling, closing the cover plate 22 above the pickling tank 21, simultaneously starting the circulating mechanism 4, performing pumping back operation on the pickling solution in the pickling tank 21, simultaneously moving the hanging basket 101 carrying the silicon wafer to be cleaned into the rinsing tank 31 for cleaning, and repeating the operations of S2 and S3.
At S6, in the second pickling, the pickling solution in the circulation mechanism 4 is first returned to the pickling tank 21, and the pickling operation is performed again.
The whole device is convenient to operate and can realize the general purpose
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (9)
1. A quartz boat cleaning device comprises a bearing mechanism (1), an acid washing mechanism (2), a water washing mechanism (3) and a circulating mechanism (4), and is characterized in that the bearing mechanism (1) is used for bearing silicon wafers to be cleaned; a driving assembly (11) is arranged at the top of the bearing mechanism (1), the bearing mechanism (1) bearing the silicon wafers moves back and forth in an area above the pickling mechanism (2) and the washing mechanism (3) through the driving assembly (11), and a lifting assembly (12) moving in the vertical direction is arranged on the bearing mechanism (1), so that the silicon wafers to be cleaned are controlled to be arranged at the inner side positions of the pickling mechanism (2) and the washing mechanism (3);
the pickling mechanism (2) comprises a pickling tank (21) and a cover plate (22) arranged on the pickling tank (21), pickling liquid is contained in the pickling tank (21), and the cover plate (22) covers the opening position of the upper part of the pickling tank (21) in a turnover mode;
the water washing mechanism (3) comprises a water washing tank (31) and a water outlet (32), the water outlet (32) is formed in the inner wall of the water washing tank (31), and the silicon wafer to be washed on the bearing mechanism (1) is subjected to spray type water washing operation through the position of the water outlet (32);
the circulation mechanism (4) is communicated with the inside of the pickling mechanism (2), so that the pickling solution contained in the pickling mechanism (2) is controlled to perform reflux circulation operation.
2. The quartz boat cleaning equipment according to claim 1, wherein the cradle (101) where the bearing mechanism (1) is located is of a grid type bucket-shaped structure, and the opening direction of the bucket shape is inclined outwards.
3. The quartz boat cleaning apparatus according to claim 1, wherein the water washing mechanism (3) is disposed in a flush position with the acid washing mechanism (2), and the water washing mechanism (3) is disposed in an outer position from which the carrier mechanism (1) is moved out.
4. The quartz boat cleaning equipment according to claim 1, wherein the bottom of the pickling tank (21) is provided with a first channel pipe (201), and the pickling tank is communicated with the circulating mechanism (4) through the first channel pipe (201) so as to draw out the pickling solution in the pickling mechanism (2) or draw out the pickling solution in the circulating mechanism (4) into the pickling tank (21) of the pickling mechanism (2).
5. The quartz boat cleaning equipment as claimed in claim 1, wherein the side wall of the water cleaning mechanism (3) is provided with a second water through pipe (301), the second water through pipe (301) is communicated with the water outlet (32) and continuously supplies water to the water outlet (32), and the water outlet operation of the water outlet (32) is used for performing spray type water cleaning on the silicon wafer to be cleaned on the bearing mechanism (1) in the water cleaning tank (31).
6. The quartz boat cleaning equipment as claimed in claim 1, wherein the second water through pipe (301) arranged on the washing mechanism (3) is communicated with an external ventilation mechanism and is used for performing air-blowing drying operation on the washing tank (31).
7. The quartz boat cleaning equipment according to claim 1, wherein the bottoms of the pickling mechanism (2) and the water washing mechanism (3) are provided with independent discharge pipes.
8. The method for using the quartz boat cleaning apparatus according to any one of claims 1 to 7, comprising the steps of:
s1, firstly, starting a driving assembly (11) at the top of the bearing mechanism (1), moving the hanging basket (101) to the front end part, and placing the silicon wafer to be cleaned on the hanging basket (101);
s2, according to the cleaning process, firstly, the hanging basket (101) is moved to the position above the rinsing bath (31) through the driving assembly (11), then the lifting assembly (12) is controlled to integrally place the hanging basket (101) in the rinsing bath (31), the second water pipe (301) is controlled to supply water, and the water is cleaned from the water outlet (32) by adopting a spray type cleaning method;
s3, after the silicon wafer is cleaned, ventilating through a second water pipe (301) to blow dry the moisture on the surface of the silicon wafer to be cleaned;
s4, the silicon wafer to be cleaned is integrally placed in the pickling tank (21) by controlling the driving assembly (11) and the lifting assembly (12) on the hanging basket (101), and the lifting assembly (12) is controlled to move in a vibration mode;
s5, after pickling, closing a cover plate (22) above the pickling tank (21), simultaneously starting a circulating mechanism (4), performing back-pumping operation on the pickling solution in the pickling tank (21), simultaneously moving a hanging basket (101) carrying silicon wafers to be cleaned into a rinsing tank (31) for cleaning, and repeating the operations of S2 and S3;
s6, in the secondary pickling, the pickling solution in the circulating mechanism (4) is first returned to the pickling tank (21), and the pickling operation is performed.
9. The use method of the quartz boat cleaning equipment according to claim 8, wherein after the cleaning in the step S2 is completed, the whole hanging basket (101) is placed in the water washing tank (31) for holding water to be immersed for a plurality of times, and the lifting assembly (12) is started to move in a vibration mode.
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CN202210509524.8A CN114951121A (en) | 2022-05-11 | 2022-05-11 | Quartz boat cleaning equipment and use method thereof |
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CN202210509524.8A CN114951121A (en) | 2022-05-11 | 2022-05-11 | Quartz boat cleaning equipment and use method thereof |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116159797A (en) * | 2023-04-24 | 2023-05-26 | 常州市杰洋精密机械有限公司 | Cleaning and drying integrated machine |
CN116673249A (en) * | 2023-06-19 | 2023-09-01 | 无锡中环应用材料有限公司 | Cleaning system and cleaning process for monocrystalline silicon slice production |
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CN106824901A (en) * | 2017-02-28 | 2017-06-13 | 北京北方华创微电子装备有限公司 | A kind of horizontal quartz boat cleaning machine and cleaning method |
CN107413746A (en) * | 2017-08-25 | 2017-12-01 | 北京南轩兴达电子科技有限公司 | Full-automatic LED Wafer Cleaning equipment |
CN207909846U (en) * | 2017-12-22 | 2018-09-25 | 山西飞虹激光科技有限公司 | A kind of gaily decorated basket for cleaning chip |
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CN111354637A (en) * | 2020-02-28 | 2020-06-30 | 通威太阳能(眉山)有限公司 | Method for washing graphite boat by cyclic utilization of hydrofluoric acid |
CN213483726U (en) * | 2020-12-23 | 2021-06-18 | 常州科讯精密机械有限公司 | Silicon chip washs uses basket of flowers |
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CN106824901A (en) * | 2017-02-28 | 2017-06-13 | 北京北方华创微电子装备有限公司 | A kind of horizontal quartz boat cleaning machine and cleaning method |
CN107413746A (en) * | 2017-08-25 | 2017-12-01 | 北京南轩兴达电子科技有限公司 | Full-automatic LED Wafer Cleaning equipment |
CN207909846U (en) * | 2017-12-22 | 2018-09-25 | 山西飞虹激光科技有限公司 | A kind of gaily decorated basket for cleaning chip |
CN210722959U (en) * | 2019-10-18 | 2020-06-09 | 张家港海扬超声清洗设备有限公司 | Semiconductor wafer cleaning device |
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CN113289995A (en) * | 2021-05-14 | 2021-08-24 | 无锡亚电智能装备有限公司 | Wafer containing box cleaning equipment and wafer containing box cleaning method |
CN216213287U (en) * | 2021-10-29 | 2022-04-05 | 江苏中宇光伏科技有限公司 | Washing and air-drying device based on polycrystalline silicon single-side texturing |
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CN116159797A (en) * | 2023-04-24 | 2023-05-26 | 常州市杰洋精密机械有限公司 | Cleaning and drying integrated machine |
CN116673249A (en) * | 2023-06-19 | 2023-09-01 | 无锡中环应用材料有限公司 | Cleaning system and cleaning process for monocrystalline silicon slice production |
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