CN2632848Y - Silicon wafer cleaning device - Google Patents
Silicon wafer cleaning device Download PDFInfo
- Publication number
- CN2632848Y CN2632848Y CN 03265857 CN03265857U CN2632848Y CN 2632848 Y CN2632848 Y CN 2632848Y CN 03265857 CN03265857 CN 03265857 CN 03265857 U CN03265857 U CN 03265857U CN 2632848 Y CN2632848 Y CN 2632848Y
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning device
- cell body
- rolling mechanism
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model relates to a silicon wafer clearing device, which comprises: a groove body; a silicon wafer supporting structure arranged in the groove body with a plurality of silicon wafers; a rolling mechanism arranged in the groove body; wherein, the rolling mechanism is in contact with the silicon wafers on the silicon wafer supporting structure in order to drive the silicon wafer turning in the silicon wafer supporting structure by the rolling mechanism; and also an effusion mechanism arranged in the groove body to provide clearing solution for clearing the silicon wafer. The utility model can keep the silicon wafer turning when being clearing and clear the silicon wafer uniformly thus the defect and the corrosion situation generated by the prior silicon wafer clearing device can be avoid; besides, an adjustable effusion mechanism arranged in the groove body can control the velocity of flow and flow rate of the clearing solution in the groove body effectively by controlling the relative motion mechanism between the adjustable affusing mechanism and rolling mechanism, thus the rate and the uniform degree of the clearance can be improved and the utility model is of practicality.
Description
Technical field
The utility model relates to the wafer cleaning device in a kind of cleaning applications cleaning device, particularly relates to a kind ofly can improving the uniformity that wafer cleans and the wafer cleaning device of cleaning efficiency.
Background technology
In the processing procedure of integrated circuit package, the most frequent fabrication steps is exactly that wafer is cleaned.The purpose that wafer is cleaned is organic compound, metal impurities or the particulate (Particle) that is attached on the crystal column surface in order to remove.And these pollutants for the product successive process to influence meeting very big.The pollution of metal impurities can cause p-n to connect the electric leakage of face, the lifetime of reduction minority carrier, the breakdown voltage of reduction gate pole oxidation layer.Particulate adhere to the authenticity that then can influence the micro-photographing process design transfer, even cause the short circuit of circuit structure.Therefore, in the wafer manufacturing process for cleaning, must effectively remove organic compound, metal impurities and the particulate (Particle) that is attached to crystal column surface, crystal column surface must not have native oxide after cleaning simultaneously, and surface roughness is minimum.
Seeing also shown in Figure 1ly, is the generalized section of existing known a kind of wafer cleaning device.Should have known wafer cleaning device 100 now, be constituted by a cell body 102, a wafer fixed mount (waferholder) 106 and a water injecting mechanism 108.Wherein, this wafer fixed mount 106 is to be disposed in the cell body 102, this wafer fixed mount 106 is in order to put plural pieces wafer 104 thereon, water injecting mechanism 108 is the directions along vertical those wafer 104 surfaces, be disposed at the bottom of cell body 102, and by water injecting mechanism 108 supply cleaning fluids, so that wafer 104 is cleaned.
Yet, in above-mentioned wafer cleaning device 100, because wafer 104 is to be fixedly arranged in the cell body 102 with water injecting mechanism 108, and the waterflood direction 110 of its cleaning fluid also is changeless, the wafer manufacturing process for cleaning that makes the above-mentioned wafer cleaning device 100 of application be carried out also can't clean wafer 104 uniformly, even can be shown in the wafer 202 of Fig. 2, produce defective and corrosion area 204 by the bottom of wafer 202 along the both sides of wafer 202.This shows that above-mentioned existing wafer cleaning device still has many defectives, and demands urgently further being improved.
In order to solve the problem that wafer cleaning device exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that above-mentioned existing wafer cleaning device exists, the design people is actively studied innovation, through constantly studying, designing based on abundant practical experience and professional knowledge, and after studying sample and improvement repeatedly, create the utility model that has practical value finally.
Summary of the invention
Main purpose of the present utility model is, overcome the defective that existing wafer cleaning device exists, and a kind of wafer cleaning device of new structure is provided, technical problem underlying to be solved is to make its cleaning wafer uniformly, and defective and the corrosion that can avoid the wafer manufacturing process for cleaning to be caused.
Another purpose of the present utility model is, a kind of wafer cleaning device is provided, and technical problem to be solved is to make it can improve the cleaning efficiency of wafer.
The purpose of this utility model and to solve its technical problem underlying be to adopt following technical scheme to realize.According to a kind of wafer cleaning device that the utility model proposes, it comprises: a cell body; One wafer fixed mount is disposed in this cell body, puts the plural pieces wafer on it; One rolling mechanism is disposed in this cell body, wherein this rolling mechanism be be placed in this wafer fixed mount on those wafers contact, rotate in the wafer fixed mount to drive those wafers by this rolling mechanism; And a water injecting mechanism, be arranged in this cell body, in order to supply with the cleaning fluid that cleans those wafers.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid wafer cleaning device, wherein said rolling mechanism comprises at least one cylinder, and this cylinder is the direction of vertical those crystal column surfaces, be disposed at the dual-side of this wafer fixed mount, and this cylinder is the edge of those wafers of contact.
Aforesaid wafer cleaning device, wherein said rolling mechanism more comprises a motor, this motor is to be connected with this cylinder, and drives this cylinder rotation.
Aforesaid wafer cleaning device, wherein said water injecting mechanism more comprise a chemical liquids supply source, are connected to this water filling machine ditch.
The purpose of this utility model and solve its technical problem underlying and also adopt following technical scheme to realize.According to a kind of wafer cleaning device that the utility model proposes, it comprises: a cell body; One wafer fixed mount is disposed in this cell body, puts the plural pieces wafer on it; One rolling mechanism is disposed in this cell body, wherein this rolling mechanism be be placed in this wafer fixed mount on those wafers contact, rotate in the wafer fixed mount to drive those wafers by this rolling mechanism; And an adjustable water injecting mechanism, be arranged in this cell body, in order to supply with the cleaning fluid that cleans those wafers, wherein this adjustable water injecting mechanism is to be set to adjust structure, can adjust the direction of this cleaning solution supplying to this wafer.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
Aforesaid wafer cleaning device, wherein said rolling mechanism comprises at least one cylinder, and this cylinder is the direction with vertical those crystal column surfaces, be disposed at the dual-side of this wafer fixed mount, and this cylinder is the edge of those wafers of contact.
Aforesaid wafer cleaning device, wherein said rolling mechanism more comprises a motor, this motor is to be connected with this cylinder, and drives this cylinder rotation.
Aforesaid wafer cleaning device, wherein said adjustable water injecting mechanism more comprises: a revolving member is disposed in this cell body; And a water filling port, be disposed on this revolving member, and be set to change the structure of water filling port water filling angle, this water filling port by this revolving member to change the water filling angle of this water filling port.
Aforesaid wafer cleaning device, wherein said adjustable water injecting mechanism more comprises: a revolving member is disposed in this cell body; And a water filling port, being disposed on this revolving member, and being set to change the structure of water filling port location of water injection, this water filling port changes the location of water injection of this water filling port in this cell body by this driving member.
Aforesaid wafer cleaning device, wherein said adjustable water injecting mechanism more comprises a chemical liquids supply source, is connected to this adjustable water injecting mechanism.
The utility model compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present utility model thes contents are as follows:
The utility model proposes a kind of wafer cleaning device, it is made of a cell body, a wafer fixed mount, a rolling mechanism and a water injecting mechanism; Wherein, the wafer fixed mount is to be disposed in the cell body, in order to put the plural pieces wafer, rolling mechanism is to be disposed in the cell body, wherein rolling mechanism be be placed in the wafer fixed mount on wafer contact, rotate in the wafer fixed mount to drive those wafers by rolling mechanism, and water injecting mechanism is arranged in the cell body, in order to supply with the cleaning fluid that cleans those wafers.
The utility model proposes another kind of wafer cleaning device, constituted by a cell body, a wafer fixed mount, a rolling mechanism and an adjustable water injecting mechanism; Wherein, the wafer fixed mount is to be disposed in the cell body, in order to put the plural pieces wafer, rolling mechanism is to be disposed in the cell body, wherein rolling mechanism be be placed in the wafer fixed mount on wafer contact, rotate in the wafer fixed mount to drive those wafers by rolling mechanism, and adjustable water injecting mechanism is arranged in the cell body, in order to supply with a cleaning fluid of cleaning wafer, wherein adjustable water injecting mechanism is to adjust the direction of cleaning solution supplying to wafer.
From the above, because wafer cleaning device of the present utility model is that the installing rolling mechanism rotates to drive wafer in cell body, therefore when carrying out the wafer manufacturing process for cleaning, wafer is the state that is in rotation by the drive of rolling mechanism, and then can clean wafer uniformly, can avoid the defective that existing known wafer cleaning device produced and the situation of corrosion.
And, because wafer cleaning device of the present utility model is to be equiped with adjustable water injecting mechanism in cell body, by the waterflood direction of the adjustable water injecting mechanism of control and the relative motion mechanism of rolling mechanism, and can effectively control the flow velocity and the flow of cell body cleaning liquid inside, and then can increase the efficient and the uniformity of cleaning.
By said structure, wafer cleaning device of the present utility model has following advantage at least:
1, because wafer cleaning device of the present utility model is that the installing rolling mechanism rotates to drive wafer in cell body, therefore when carrying out the wafer manufacturing process for cleaning, wafer is the state that is in rotation by the drive of rolling mechanism, and then can clean wafer uniformly, can avoid the defective of existing known wafer cleaning device generation and the situation of corrosion.
2, because wafer cleaning device of the present utility model is to be equiped with adjustable water injecting mechanism in cell body, relative motion mechanism by adjustable water injecting mechanism of control and rolling mechanism, and can effectively control the flow velocity and the flow of cell body cleaning liquid inside, and then can increase the efficient and the uniformity of cleaning.
In sum, the wafer cleaning device of the utility model special construction is made of a cell body, a wafer fixed mount, a rolling mechanism and a water injecting mechanism; Wherein, this wafer fixed mount is to be disposed in the cell body, in order to put the plural pieces wafer, this rolling mechanism is to be disposed in the cell body, wherein rolling mechanism be be placed in the wafer fixed mount on wafer contact, rotate in the wafer fixed mount to drive those wafers by rolling mechanism, and water injecting mechanism is arranged in the cell body, in order to supply with the cleaning fluid that cleans these wafers.It is cleaning wafer uniformly, and defective and the corrosion that can avoid the wafer manufacturing process for cleaning to be caused, and can improve the cleaning efficiency of wafer.It has above-mentioned plurality of advantages and practical value, and having there is no similar structural design in like product publishes or uses, no matter it structurally or bigger improvement all arranged on the function, and have technically than much progress, and produced handy and practical effect, and have the effect of enhancement really, thus be suitable for practicality more, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, below with preferred embodiment of the present utility model and conjunction with figs. describe in detail as after.
Description of drawings
Fig. 1 is the generalized section of existing known a kind of wafer cleaning device.
Fig. 2 is after existing known wafer cleaning device cleans, and the both sides of edges in the wafer bottom forms the schematic diagram of corrosion.
Fig. 3 is the generalized section of the wafer cleaning device of the utility model one preferred embodiment.
Fig. 4 is the generalized section of tangential direction of the wafer cleaning device vertical view 3 of the utility model one preferred embodiment.
Fig. 5 is the generalized section of the wafer cleaning device of another preferred embodiment of the utility model.
Fig. 6 is the generalized section of the wafer cleaning device of another preferred embodiment of the utility model.
100: wafer cleaning device 102: cell body
104: wafer 106: the wafer fixed mount
108: water injecting mechanism 110: waterflood direction
202: wafer 204: defective and corrosion area
300: wafer cleaning device 302: cell body
304: wafer 306: the wafer fixed mount
308: water injecting mechanism 310: rolling mechanism
312: the rotation direction 314 of rolling mechanism: the rotation direction of wafer
316: waterflood direction 317: bracing frame
318: cleaning solution supplying source 320: adjustable water injecting mechanism
322: water filling port 324: revolving member
326: waterflood direction 330: adjustable water injecting mechanism
332: driving member 334: water filling port
336: waterflood direction
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, to according to its embodiment of wafer cleaning device, structure, feature and the effect thereof that the utility model proposes, describe in detail as after.
See also Fig. 3, shown in Figure 4, Fig. 3 is the generalized section of the wafer cleaning device of the utility model one preferred embodiment, and Fig. 4 is the generalized section of tangential direction of the wafer cleaning device vertical view 3 of the utility model one preferred embodiment.
Please consult Fig. 3, shown in Figure 4 simultaneously, the wafer cleaning device 300 of the utility model preferred embodiment is made of a cell body 302, a wafer fixed mount 306, a rolling mechanism 310 and a water injecting mechanism 308, wherein:
This wafer fixed mount 306 is to be disposed in the cell body 302, and this wafer fixed mount 306 is in order to putting plural pieces wafer 304 thereon, and this wafer fixed mount 306 for example is to be fixed in the cell body 302 by bracing frame 317.
This rolling mechanism 310, be to be arranged in the cell body 302, this rolling mechanism 310 be be placed in wafer fixed mount 306 on wafer 304 contact, rotate in wafer fixed mount 306 to drive wafer 304 by rolling mechanism 310, wherein this rolling mechanism 310 for example is to comprise at least one cylinder, and in preferred embodiment of the present invention, this rolling mechanism 310 is to comprise 3 cylinders (as shown in Figure 3), those cylinders are the dual-sides that are disposed at wafer fixed mount 306 with the direction on vertical those wafer 304 surfaces, so that cylinder is the edge that can contact whole wafer 304.
This water injecting mechanism 308, it is direction along vertical those wafer 304 surfaces, be disposed at the bottom of cell body 302, in order to supply with to clean the required cleaning fluid of those wafers 304, wherein this water injecting mechanism 308 is to be set to the structure that can control the flow velocity and the flow of institute's cleaning liquid supplied, and employed cleaning fluid for example is water or chemical liquids; And, can also dispose and be provided with a cleaning fluid source of supply 318 and be connected to water injecting mechanism 308, in order to the supply cleaning fluid to water injecting mechanism 308.
And above-mentioned rolling mechanism 310 can also comprise a motor (not shown), and this motor is to be connected with above-mentioned cylinder, rotates to drive wafer 304 rotations in order to drive this cylinder.
Please continue to consult shown in Figure 3, when the utility model wafer cleaning device 300 is applied to the wafer manufacturing process for cleaning, be by motor driven rolling mechanism 310, the rotation direction 312 of its rolling mechanism is as shown in Figure 3 rotated, this moment, the edge owing to chip 304 all contacted with rolling mechanism 310, make wafer 304 also can be driven by rolling mechanism 310, and rotate with the rotation direction 314 of wafer among Fig. 3, therefore when providing cleaning fluid to carry out cleaning wafer 304 by water injecting mechanism 308, this wafer 304 is the states that are in rotation, and can not produce existing known wafer and be fixed on the wafer fixed mount time, in the defective that both sides of edges produced of wafer bottom and the problem of corrosion area.
Except above-mentioned Fig. 3, embodiment shown in Figure 4, the utility model also has other embodiment, sees also shown in Figure 5ly, is the generalized section of the wafer cleaning device of another preferred embodiment of the utility model.In Fig. 5, the identical person with Fig. 3, Fig. 4 of member is to use identical label and omits its structure explanation.Present embodiment and Fig. 3, difference embodiment illustrated in fig. 4 are to be, present embodiment is to adopt adjustable water injecting mechanism 320, and wherein this adjustable water injecting mechanism 320 is made up of revolving member 324 and water filling port 322.Revolving member 324 is the bottoms that are disposed at cell body 302, and be connected with cleaning fluid source of supply 318, to receive by cleaning fluid source of supply 318 cleaning liquid supplied, water filling port 322 then is disposed on the revolving member 324, and can change the angle of its water filling by this revolving member 324, that is can change its waterflood direction 326.
When the utility model uses as shown in Figure 5 wafer cleaning device 300, in cleaning process, except wafer 304 be constantly rotate by rolling mechanism 310, and by the relative motion mechanism of the adjustable water injecting mechanism 320 of control (waterflood direction 326) with rolling mechanism 310, and can effectively control the flow velocity and the flow of cell body 302 cleaning liquid insides, and then can increase the efficient and the uniformity of cleaning.
And except Fig. 3, Fig. 4 and wafer cleaning device shown in Figure 5, the utility model also has other embodiment, sees also shown in Figure 6ly, is the generalized section of the wafer cleaning device of another preferred embodiment of the utility model.In Fig. 6, member is to use identical label and omits its structure explanation with Fig. 3, Fig. 4 and the identical person of Fig. 5.Present embodiment and above-mentioned two embodiment differences are to be, present embodiment is to adopt adjustable water injecting mechanism 330, and wherein this adjustable water injecting mechanism 330 is made up of driving member 332 and water filling port 334.This revolving member 332 is the bottoms that are disposed at cell body 302, and be connected with cleaning fluid source of supply 318, to receive by cleaning fluid source of supply 318 cleaning liquid supplied, water filling port 334 then is disposed on the driving member 332, and can change the position of its water filling by driving member 332.
When the utility model uses wafer cleaning device 300 shown in Figure 6, in cleaning process, except wafer 304 be constantly rotate by rolling mechanism 310, also by the relative motion mechanism of the adjustable water injecting mechanism 330 of control (waterflood direction 336) with rolling mechanism 310, and can effectively control the flow velocity and the flow of cell body 302 cleaning liquid insides, and then can increase the efficient and the uniformity of cleaning.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, though the utility model discloses as above with preferred embodiment, yet be not in order to limit the utility model, any those skilled in the art, in not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solutions of the utility model content, according to technical spirit of the present utility model to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (10)
1, a kind of wafer cleaning device is characterized in that it comprises:
One cell body;
One wafer fixed mount is disposed in this cell body, puts the plural pieces wafer on it;
One rolling mechanism is disposed in this cell body, wherein this rolling mechanism be be placed in this wafer fixed mount on those wafers contact, this rolling mechanism drives those wafers and rotates in the wafer fixed mount; And
One water injecting mechanism is arranged in this cell body, supplies with the cleaning fluid that cleans those wafers.
2, wafer cleaning device according to claim 1, it is characterized in that wherein said rolling mechanism comprises at least one cylinder, and this cylinder is the direction of vertical those crystal column surfaces, is disposed at the dual-side of this wafer fixed mount, and this cylinder is the edge of those wafers of contact.
3, wafer cleaning device according to claim 2 is characterized in that wherein said rolling mechanism more comprises a motor, and this motor is to be connected with this cylinder, and drives this cylinder rotation.
4, wafer cleaning device according to claim 1 is characterized in that wherein said water injecting mechanism more comprises a chemical liquids supply source, is connected to this water filling machine ditch.
5, a kind of wafer cleaning device is characterized in that it comprises:
One cell body;
One wafer fixed mount is disposed in this cell body, puts the plural pieces wafer on it;
One rolling mechanism is disposed in this cell body, wherein this rolling mechanism be be placed in this wafer fixed mount on those wafers contact, this rolling mechanism drives those wafers and rotates in the wafer fixed mount; And
One adjustable water injecting mechanism is arranged in this cell body, supplies with the cleaning fluid that cleans those wafers, and wherein this adjustable water injecting mechanism is to be set to adjust structure, can adjust the direction of this cleaning solution supplying to this wafer.
6, wafer cleaning device according to claim 5, it is characterized in that wherein said rolling mechanism comprises at least one cylinder, and this cylinder is the direction with vertical those crystal column surfaces, is disposed at the dual-side of this wafer fixed mount, and this cylinder is the edge of those wafers of contact.
7, wafer cleaning device according to claim 6 is characterized in that wherein said rolling mechanism more comprises a motor, and this motor is to be connected with this cylinder, and drives this cylinder rotation.
8, wafer cleaning device according to claim 5 is characterized in that wherein said adjustable water injecting mechanism more comprises:
One revolving member is disposed in this cell body; And
One water filling port is disposed on this revolving member, and is set to change the structure of water filling port water filling angle.
9, wafer cleaning device according to claim 5 is characterized in that wherein said adjustable water injecting mechanism more comprises:
One revolving member is disposed in this cell body; And
One water filling port is disposed on this revolving member, and is set to change the structure of water filling port location of water injection.
10, wafer cleaning device according to claim 5 is characterized in that wherein said adjustable water injecting mechanism more comprises a chemical liquids supply source, is connected to this adjustable water injecting mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03265857 CN2632848Y (en) | 2003-05-27 | 2003-05-27 | Silicon wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03265857 CN2632848Y (en) | 2003-05-27 | 2003-05-27 | Silicon wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2632848Y true CN2632848Y (en) | 2004-08-11 |
Family
ID=34297954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03265857 Expired - Fee Related CN2632848Y (en) | 2003-05-27 | 2003-05-27 | Silicon wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2632848Y (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151678A (en) * | 2010-12-06 | 2011-08-17 | 深圳市华星光电技术有限公司 | Liquid supply system and liquid supply method |
| CN102437045A (en) * | 2011-11-29 | 2012-05-02 | 上海宏力半导体制造有限公司 | Wet etching method and wet etching equipment |
| CN101602052B (en) * | 2008-06-11 | 2012-08-22 | 富葵精密组件(深圳)有限公司 | Cleaning device |
| CN103977973A (en) * | 2014-05-09 | 2014-08-13 | 欧蒙医学诊断（中国）有限公司 | Carrying sheet cleaning device and method |
| CN105140158A (en) * | 2015-09-28 | 2015-12-09 | 北京七星华创电子股份有限公司 | Device and method for improving wafer etching non-uniformity |
| US9611548B2 (en) | 2015-04-30 | 2017-04-04 | Globalwafers Co., Ltd. | Wafer rotating apparatus |
| CN108919618A (en) * | 2018-07-04 | 2018-11-30 | 南通沃特光电科技有限公司 | A kind of photoresist edge-washing device |
| CN109411393A (en) * | 2018-10-25 | 2019-03-01 | 德淮半导体有限公司 | Wafer cleaning device |
| CN109759937A (en) * | 2019-01-30 | 2019-05-17 | 西安奕斯伟硅片技术有限公司 | A kind for the treatment of method and apparatus of silicon wafer |
| CN110335841A (en) * | 2019-07-15 | 2019-10-15 | 北京北方华创微电子装备有限公司 | Bogey, the wafer gaily decorated basket and wafer cleaning equipment |
| CN110660705A (en) * | 2018-06-29 | 2020-01-07 | 台湾积体电路制造股份有限公司 | Apparatus for treating objects, method and system for reducing contaminants on objects |
| CN111223791A (en) * | 2018-11-23 | 2020-06-02 | 南亚科技股份有限公司 | Wafer cleaning device and cleaning method thereof |
| CN111243996A (en) * | 2020-03-23 | 2020-06-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Positioning device in wafer cleaning equipment |
| CN111790663A (en) * | 2020-05-27 | 2020-10-20 | 北京北方华创微电子装备有限公司 | Wafer cleaning device and wafer cleaning machine |
-
2003
- 2003-05-27 CN CN 03265857 patent/CN2632848Y/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101602052B (en) * | 2008-06-11 | 2012-08-22 | 富葵精密组件(深圳)有限公司 | Cleaning device |
| CN102151678A (en) * | 2010-12-06 | 2011-08-17 | 深圳市华星光电技术有限公司 | Liquid supply system and liquid supply method |
| CN102437045A (en) * | 2011-11-29 | 2012-05-02 | 上海宏力半导体制造有限公司 | Wet etching method and wet etching equipment |
| CN103977973A (en) * | 2014-05-09 | 2014-08-13 | 欧蒙医学诊断（中国）有限公司 | Carrying sheet cleaning device and method |
| US9611548B2 (en) | 2015-04-30 | 2017-04-04 | Globalwafers Co., Ltd. | Wafer rotating apparatus |
| CN105140158A (en) * | 2015-09-28 | 2015-12-09 | 北京七星华创电子股份有限公司 | Device and method for improving wafer etching non-uniformity |
| CN105140158B (en) * | 2015-09-28 | 2018-10-16 | 北京七星华创电子股份有限公司 | A kind of heteropical device and method of improvement wafer corrosion |
| CN110660705A (en) * | 2018-06-29 | 2020-01-07 | 台湾积体电路制造股份有限公司 | Apparatus for treating objects, method and system for reducing contaminants on objects |
| US11961745B2 (en) | 2018-06-29 | 2024-04-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wet bench structure |
| CN108919618A (en) * | 2018-07-04 | 2018-11-30 | 南通沃特光电科技有限公司 | A kind of photoresist edge-washing device |
| CN109411393A (en) * | 2018-10-25 | 2019-03-01 | 德淮半导体有限公司 | Wafer cleaning device |
| CN111223791A (en) * | 2018-11-23 | 2020-06-02 | 南亚科技股份有限公司 | Wafer cleaning device and cleaning method thereof |
| CN111223791B (en) * | 2018-11-23 | 2022-07-26 | 南亚科技股份有限公司 | Wafer cleaning device and cleaning method thereof |
| CN109759937A (en) * | 2019-01-30 | 2019-05-17 | 西安奕斯伟硅片技术有限公司 | A kind for the treatment of method and apparatus of silicon wafer |
| CN110335841A (en) * | 2019-07-15 | 2019-10-15 | 北京北方华创微电子装备有限公司 | Bogey, the wafer gaily decorated basket and wafer cleaning equipment |
| CN111243996A (en) * | 2020-03-23 | 2020-06-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Positioning device in wafer cleaning equipment |
| CN111243996B (en) * | 2020-03-23 | 2023-03-14 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Positioning device in wafer cleaning equipment |
| CN111790663A (en) * | 2020-05-27 | 2020-10-20 | 北京北方华创微电子装备有限公司 | Wafer cleaning device and wafer cleaning machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN2632848Y (en) | Silicon wafer cleaning device | |
| CN100341666C (en) | Polishing pad with optimized grooves and method of using same | |
| CN1137503C (en) | Cutting device | |
| CN1722373A (en) | Substrate meniscus interface and methods for operation | |
| CN1221331C (en) | Multi-functional cleaning module and cleaning apparatus using the module | |
| CN1684231A (en) | Proximity meniscus manifold | |
| CN1722375A (en) | Concentric processing head | |
| CN101045230A (en) | Substrate treatment apparatus and substrate treatment method | |
| CN1197542A (en) | Grinding method of grinding device | |
| CN1817491A (en) | Wash-target holder, and wash-target holding apparatus, washing apparatus and method for washing wash-target using the same | |
| CN1454266A (en) | Anode assembly for plating and planarizing a conductive layer | |
| CN1235267C (en) | Treating solution applying method | |
| CN202238511U (en) | Glue adding machine | |
| CN1227152A (en) | Chemical mechanical polishing apparatus and method of chemical mechanical polishing | |
| CN106670938A (en) | Silicon wafer edge polishing device | |
| CN1097490C (en) | Spinning device and spinning method | |
| CN1816900A (en) | Manufacturing method of silicon wafer | |
| CN1441712A (en) | Method and device for finishidng surface of long material | |
| CN2820440Y (en) | Filing removing brick polisher | |
| CN1868600A (en) | Fluid injection apparatus for semiconductor processing | |
| CN2820439Y (en) | Filing removing polishing grinding head and brick polisher | |
| CN1153271C (en) | Jig | |
| CN1531049A (en) | Single chip carrier and single chip carrying method | |
| CN1240487C (en) | Substrate processing apparatus and substrate processing method | |
| CN1303654C (en) | Polishing method and device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |