CN203721680U - Wafer back side cleaning device - Google Patents
Wafer back side cleaning device Download PDFInfo
- Publication number
- CN203721680U CN203721680U CN201420019262.8U CN201420019262U CN203721680U CN 203721680 U CN203721680 U CN 203721680U CN 201420019262 U CN201420019262 U CN 201420019262U CN 203721680 U CN203721680 U CN 203721680U
- Authority
- CN
- China
- Prior art keywords
- wafer
- cleaning
- delivery catheter
- deionized water
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a wafer back side cleaning device. Through arranging a cleaning fluid conduction tube, a cleaning fluid nozzle, a deionized water conduction tube and a deionization nozzle, when cleaning operation is performed on the wafer back side, multiple different liquid cleaning is performed on the wafer back side and tiny particles on the wafer back side are ensured to be cleaned thoroughly. The wafer back side is effectively avoided from having pollutant and a product yield rate is increased.
Description
Technical field
The utility model relates to semiconductor integrated circuit and manufactures field, refers more particularly to a kind of device for cleaning back surface of wafer.
Background technology
Along with constantly dwindling of critical size in integrated circuit (IC) manufacture, silicon chip surface before entering per pass technique must be clean, need be through cleaning step repeatedly, remove the contamination of the types such as particle, organic substance, metal and natural oxidizing layer of silicon chip surface, its wash number depends on the complexity of wafer design and the number of plies of interconnection.At present, wet-chemical cleaning technology is the main cleaning technique of semiconducter IC industry, wet-chemical cleaning is mainly to utilize solution, soda acid, surfactant, water and composition thereof, by burn into dissolve, the method such as chemical reaction, realize certain functional requirement or remove the thing of staining of wafer surface.But simply by virtue of the flushing of deionized water, the smaller particle of some size still cannot thoroughly clean up, when the wafer that causes thoroughly cleaning up exposes, develop and occur fuzzy phenomenon, affected greatly the product yield of wafer.
Utility model content
The purpose of this utility model is to provide a kind of device for cleaning back surface of wafer, with solve in prior art wafer photolithography link for wafer rear, clean clean not, the phenomenon that causes the product yield of wafer to decline.
In order to solve the problems of the technologies described above, the utility model provides a kind of device for cleaning back surface of wafer, comprising: a wafer pallet, a delivery catheter, a cleaning fluid shower nozzle, a deionized water shower nozzle, a wafer cleaning brush and drying wafer brush; Wherein said delivery catheter is nested with a cleaning fluid delivery catheter and an ionized water delivery catheter; Described cleaning fluid delivery catheter input is arranged on described wafer pallet, and its output is provided with described cleaning fluid shower nozzle; The opening of described cleaning fluid shower nozzle, vertically towards described wafer pallet, within being parallel to the plane of described wafer pallet, can scan along the diametric(al) left and right of described wafer pallet; Described deionized water delivery catheter input is arranged on described wafer pallet, and its output is provided with described deionized water shower nozzle; The opening of described deionized water shower nozzle is vertically towards described wafer pallet, in the plane that is parallel to described wafer pallet
In, can be along the diametric(al) left and right scanning of described wafer pallet; Described wafer cleaning brush and described drying wafer brush are all arranged on described wafer pallet.
Optionally, in described device for cleaning back surface of wafer, described cleaning fluid shower nozzle inside is provided with the first jet pipe, and described the first jet pipe is connected with described cleaning fluid delivery catheter, and described the first jet pipe is horn-like.
Optionally, in described device for cleaning back surface of wafer, described deionized water shower nozzle inside is provided with the second jet pipe, and described the second jet pipe is connected with described deionization delivery catheter, and described the second jet pipe is horn-like.
Optionally, in described device for cleaning back surface of wafer, described delivery catheter is rigid material.
Optionally, in described device for cleaning back surface of wafer, described cleaning fluid delivery catheter is rigid material.
Optionally, in described device for cleaning back surface of wafer, described deionized water delivery catheter is rigid material.
Optionally, in described device for cleaning back surface of wafer, the input of described delivery catheter is free end.
Optionally, in described device for cleaning back surface of wafer, the input of the input of cleaning fluid self-cleaning liquid delivery catheter, the output output of self-cleaning liquid delivery catheter.
Optionally, in described device for cleaning back surface of wafer, deionized water is from the input input of deionized water delivery catheter, from the output output of deionized water delivery catheter.
Optionally, in described device for cleaning back surface of wafer, being shaped as of described wafer pallet is square, and described wafer cleaning brush is arranged in the different sides of described wafer pallet with described drying wafer brush.
In device for cleaning back surface of wafer provided by the utility model, by cleaning fluid conducting tube, cleaning fluid shower nozzle, deionized water conducting tube, deionization shower nozzle are set, when wafer rear is carried out to cleaning operation, wafer rear is carried out to the cleaning of multiple different liquids, the molecule of guaranteeing wafer rear cleans up thoroughly, effectively avoid wafer rear also to remain pollutant, improved product yield.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model device for cleaning back surface of wafer;
Fig. 2 is the profile of cleaning fluid shower nozzle in the utility model device for cleaning back surface of wafer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the device for cleaning back surface of wafer the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.
It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 1-Fig. 2, it is the relevant schematic diagram of structure of the device for cleaning back surface of wafer of the utility model embodiment.Device for cleaning back surface of wafer as shown in Figure 1 comprises: a wafer pallet 1, a delivery catheter 2, a cleaning fluid shower nozzle 3, a deionized water shower nozzle 4, a wafer cleaning brush 5 and one drying wafer brush 6; Wherein said delivery catheter 1 is nested with a cleaning fluid delivery catheter and an ionized water delivery catheter; Described cleaning fluid delivery catheter input is arranged on described wafer pallet 1, and its output is provided with described cleaning fluid shower nozzle 3; The opening of described cleaning fluid shower nozzle 3, vertically towards described wafer pallet 1, within being parallel to the plane of described wafer pallet 1, can scan along the diametric(al) left and right of described wafer pallet 1; Described deionized water delivery catheter input is arranged on described wafer pallet 1, and its output is provided with described deionized water shower nozzle 4; The opening of described deionized water shower nozzle 4, vertically towards described wafer pallet 1, within being parallel to the plane of described wafer pallet, can scan along the diametric(al) left and right of described wafer pallet 1; Described wafer cleaning brush 5 and described drying wafer brush 6 are all arranged on described wafer pallet 1.
Preferably, described cleaning fluid shower nozzle 3 inside are provided with the first jet pipe, and described the first jet pipe is connected with described cleaning fluid delivery catheter, and described the first jet pipe is horn-like.Further, when having increased the area that cleaning fluid shower nozzle 3 sprays when spray cleaning fluid, it is more even that cleaning fluid sprays, and reduces the waste of cleaning fluid.
Preferably, described deionized water shower nozzle 4 inside are provided with the second jet pipe, and described the second jet pipe is connected with described deionization delivery catheter, and described the second jet pipe is horn-like.Further, when having increased the area that deionized water shower nozzle 4 sprays when spray deionized water, it is more even that deionized water sprays, and reduces the waste of deionized water.
Preferably, described delivery catheter is rigid material, and cleaning fluid delivery catheter and the deionized water delivery catheter of its nested inside are rigid material.Further, reduce the corrosion of the interior liquid transmitting of conduit to conduit, guaranteed the performance of work.
Preferably, the input of described delivery catheter is free end.When carrying out wafer rear washing and cleaning operation, by freedom of movement, bring in the position that changes delivery catheter, and then change the position of cleaning fluid shower nozzle 3 and deionization shower nozzle 4, the diverse location of wafer rear is comprehensively cleaned.Further, the cleannes of wafer rear have been improved.
Preferably, the input of the input of cleaning fluid self-cleaning liquid delivery catheter, the output output of self-cleaning liquid delivery catheter.
Preferably, deionized water is from the input input of deionized water delivery catheter, from the output output of deionized water delivery catheter.
Preferably, being shaped as of described wafer pallet 1 is square, and described wafer cleaning brush 5 is arranged in the different sides of described wafer pallet 1 with described drying wafer brush 6.While adopting different operating when wafer rear is cleaned, wafer cleaning brush 5 and drying wafer brush 6 can be used flexibly, do not interfere with each other.Further, optimize the performance of device for cleaning back surface of wafer.
The operation principle of device for cleaning back surface of wafer of the present utility model:
Preferred embodiment is: in the device for cleaning back surface of wafer Job readiness stage, the wafer rear in advance needs being cleaned is positioned on wafer pallet 1 upward and fixes, mobile conducting tube afterwards, making the cleaning fluid shower nozzle 3 of conducting tube end and the position of deionized water shower nozzle 4 is the top at the crystal back side.Start afterwards cleaning operation:
The first step, opens deionized water shower nozzle 4, wafer rear is carried out preliminary moistening;
Second step, opens cleaning fluid shower nozzle 3, and wafer rear is carried out to secondary cleaning, and this step is further cleaned the molecule of wafer rear;
The 3rd step, mobile conducting tube, away from wafer rear top, moves to wafer cleaning brush 5 with wafer rear and contacts, and wafer rear is scrubbed, and guarantees that molecule and cleaning liquid merge mutually, so that next operation;
The 4th step, finishes the work of wafer cleaning brush, is moved to a side of the wafer pallet 1 that does not contact wafer, and mobile conducting tube, to wafer rear top, is opened deionized water shower nozzle again, and cleaning fluid in previous step is rinsed well;
The 5th step, utilizes drying wafer brush 6 by being dried of wafer rear, completes the work that wafer rear cleans.
To sum up, in device for cleaning back surface of wafer provided by the utility model, by cleaning fluid conducting tube, cleaning fluid shower nozzle, deionized water conducting tube, deionization shower nozzle are set, when wafer rear is carried out to cleaning operation, wafer rear is carried out to the cleaning of multiple different liquids, the molecule of guaranteeing wafer rear cleans up thoroughly, has effectively avoided wafer rear also to remain pollutant, has improved product yield.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these change and modification.
Claims (10)
1. device for cleaning back surface of wafer, is characterized in that, comprising: a wafer pallet, a delivery catheter, a cleaning fluid shower nozzle, a deionized water shower nozzle, a wafer cleaning brush and drying wafer brush; Wherein said delivery catheter is nested with a cleaning fluid delivery catheter and an ionized water delivery catheter;
Described cleaning fluid delivery catheter input is arranged on described wafer pallet, and its output is provided with described cleaning fluid shower nozzle; The opening of described cleaning fluid shower nozzle, vertically towards described wafer pallet, within being parallel to the plane of described wafer pallet, can scan along the diametric(al) left and right of described wafer pallet;
Described deionized water delivery catheter input is arranged on described wafer pallet, and its output is provided with described deionized water shower nozzle; The opening of described deionized water shower nozzle, vertically towards described wafer pallet, within being parallel to the plane of described wafer pallet, can scan along the diametric(al) left and right of described wafer pallet;
Described wafer cleaning brush and described drying wafer brush are all arranged on described wafer pallet.
2. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, described cleaning fluid shower nozzle inside is provided with the first jet pipe, and described the first jet pipe is connected with described cleaning fluid delivery catheter, and described the first jet pipe is horn-like.
3. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, described deionized water shower nozzle inside is provided with the second jet pipe, and described the second jet pipe is connected with described deionization delivery catheter, and described the second jet pipe is horn-like.
4. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, described delivery catheter is rigid material.
5. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, described cleaning fluid delivery catheter is rigid material.
6. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, described deionized water delivery catheter is rigid material.
7. device for cleaning back surface of wafer as claimed in claim 1, is characterized in that, the input of described delivery catheter is free end.
8. the device for cleaning back surface of wafer as described in any one in claim 1-7, is characterized in that, the input input of cleaning fluid self-cleaning liquid delivery catheter, the output output of self-cleaning liquid delivery catheter.
9. the device for cleaning back surface of wafer as described in any one in claim 1-7, is characterized in that, deionized water is from the input input of deionized water delivery catheter, from the output output of deionized water delivery catheter.
10. the device for cleaning back surface of wafer as described in any one in claim 1-7, is characterized in that, being shaped as of described wafer pallet is square, and described wafer cleaning brush is arranged in the different sides of described wafer pallet with described drying wafer brush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420019262.8U CN203721680U (en) | 2014-01-13 | 2014-01-13 | Wafer back side cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420019262.8U CN203721680U (en) | 2014-01-13 | 2014-01-13 | Wafer back side cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203721680U true CN203721680U (en) | 2014-07-16 |
Family
ID=51160817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420019262.8U Expired - Fee Related CN203721680U (en) | 2014-01-13 | 2014-01-13 | Wafer back side cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203721680U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447779A (en) * | 2018-04-16 | 2018-08-24 | 武汉新芯集成电路制造有限公司 | A kind of wafer bonding method |
| WO2021233139A1 (en) * | 2020-05-18 | 2021-11-25 | 长鑫存储技术有限公司 | Wafer cleaning apparatus and wafer cleaning method |
-
2014
- 2014-01-13 CN CN201420019262.8U patent/CN203721680U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108447779A (en) * | 2018-04-16 | 2018-08-24 | 武汉新芯集成电路制造有限公司 | A kind of wafer bonding method |
| CN108447779B (en) * | 2018-04-16 | 2020-12-04 | 武汉新芯集成电路制造有限公司 | Wafer bonding method |
| WO2021233139A1 (en) * | 2020-05-18 | 2021-11-25 | 长鑫存储技术有限公司 | Wafer cleaning apparatus and wafer cleaning method |
| US11571717B2 (en) | 2020-05-18 | 2023-02-07 | Changxin Memory Technologies, Inc. | Wafer cleaning apparatus and wafer cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20190113 |