CN203707094U - Wafer edge cleaning device - Google Patents

Wafer edge cleaning device Download PDF

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Publication number
CN203707094U
CN203707094U CN201420072365.0U CN201420072365U CN203707094U CN 203707094 U CN203707094 U CN 203707094U CN 201420072365 U CN201420072365 U CN 201420072365U CN 203707094 U CN203707094 U CN 203707094U
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CN
China
Prior art keywords
wafer
cleaning
crystal round
round fringes
cleaning device
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Expired - Fee Related
Application number
CN201420072365.0U
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Chinese (zh)
Inventor
唐强
刘永
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Semiconductor Manufacturing International Beijing Corp
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Semiconductor Manufacturing International Beijing Corp
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Priority to CN201420072365.0U priority Critical patent/CN203707094U/en
Application granted granted Critical
Publication of CN203707094U publication Critical patent/CN203707094U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a wafer edge cleaning device, which at least comprises at least one supply pipeline providing wafer cleaning liquid, cleaning brushes, clamping members, a main control component and a control device, wherein the at least one supply pipeline is provided with a pipeline port close to the edge of a wafer; the edge of the pipeline port is provided with protrusions; the cleaning brushes are arranged inside the pipeline port and fixedly connected with the protrusions; the clamping members are clamped on the surface of the supply pipeline and used for fixing the supply pipeline; the main control component sleeves the clamping members and is used for controlling the cleaning brushes to be in contact with or deviate from the edge of the wafer; and the control device supports the wafer and controls the wafer to rotate. The wafer edge cleaning device provided by the utility model can be used for further physical cleaning of the edge of the wafer, so as to make the cleaning of the edge of the wafer more thoroughly, thereby reducing the pollution residual problem in the wafer edge cleaning process, and improving the success rate of wafer manufacturing.

Description

A kind of crystal round fringes cleaning device
Technical field
The utility model relates to semiconductor process techniques field, particularly relates to a kind of crystal round fringes cleaning device.
Background technology
At present, in the manufacturing process of semiconductor device, usually use the techniques such as electrochemistry plating (ECP) to form copper electrodeposited coating at the trench wall etching and crystal column surface, form at copper electrodeposited coating complete, after wafer is taken out from electroplate liquid, because being plated ring originally, clamped the fringe region of wafer, so substantially do not plate copper electrodeposited coating, still, may occur burr, for preventing that these burr from impacting subsequent technique, need to clean it.While adopting physical vapor deposition (PVD) to carry out copper facing to wafer, also can meet same crystal round fringes pollution problem, need to clean it.Cleaning at present the mode conventionally adopting is, on existing wafer cleaning device, wafer is cleaned, this wafer cleaning device generally includes motor and washer jet, washer jet is positioned at the top of wafer cleaning device, wafer is placed into after the cleaning positions of wafer cleaning device, under the driving of motor, carrying out wafer can High Rotation Speed, spray cleaning solvent from the washer jet that is positioned at wafer cleaning device top simultaneously, by controlling the angle of washer jet, can make cleaning solvent only be sprayed onto on the fringe region of wafer, thereby utilize the chemical characteristic of cleaning fluid to clean the burr that may occur.
Use prior art, wafer is being carried out after electrochemistry plating (ECP) or physical vapor deposition (PVD), crystal round fringes is cleaned to (EBR, Edge Bevel Remove) process in, the edge that runs into sometimes the rear wafer of cleaning also has the problem of remaining pollution, that crystal round fringes is cleaned is not thorough, and this is unsuccessful wafer cleaning, and cleaning unsuccessful wafer is that substandard products can not use.
Therefore, how to improve the success rate that crystal round fringes cleans, and then the success rate of raising wafer manufacture is those skilled in the art's technical problems urgently to be resolved hurrily.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of crystal round fringes cleaning device, cleans halfway problem for solving prior art crystal round fringes.
For achieving the above object and other relevant objects, the utility model provides a kind of crystal round fringes cleaning device, and described crystal round fringes cleaning device at least comprises:
At least one supply line of wafer cleaning liquid is provided, there is the pipeline opening of close crystal round fringes; Described pipeline opening edge is provided with projection;
The cleaning brush that is placed in described pipeline opening and is fixedly connected with described projection;
Be clamped in described supply line surface and the holder for fixing described supply line;
Be socketed in described holder surface and for controlling described cleaning brush contact or leaving the master control unit of described crystal round fringes;
And support described wafer and control the rotating control assembly that wafer rotates.
Preferably, described cleaning brush is PVA sponge.
Preferably, described cleaning brush is U font, has the dentalation at cleaning wafer edge on described U font inwall.
Preferably, described rotating control assembly is vacuum control unit.
Preferably, the rotating speed of described wafer rotation is 300~600 rpms.
Preferably, described master control unit is cylinder.
Preferably, described supply line is two supply lines that are oppositely arranged, the built-in cleaning brush of pipeline opening of each supply line.
Preferably, described cleaning fluid is flowed to described cleaning brush and is penetrated into crystal round fringes by cleaning brush by supply line.
Preferably, described cleaning fluid is citric acid.
Preferably, described crystal round fringes cleaning device also comprises and is positioned at described wafer top, two nozzles for described cleaning brush is rinsed.
Preferably, described crystal round fringes cleaning device also comprises and being connected with described nozzle and for driving the rotary drive of described nozzle rotation.
As mentioned above, crystal round fringes cleaning device of the present utility model, has following beneficial effect:
The crystal round fringes cleaning device that the utility model provides can carry out physical cleaning to crystal round fringes, makes the cleaning of crystal round fringes more thorough, thereby has reduced the pollution residual problem in crystal round fringes cleaning process, has improved the success rate that wafer is manufactured; Described crystal round fringes cleaning device only in the time carrying out crystal round fringes cleaning near wafer, original wafer cleaning device is not affected.
Accompanying drawing explanation
Structural representation when Fig. 1 is wafer cleaning device cleaning wafer of the present utility model.
Fig. 2 is the structural representation of the utility model crystal round fringes cleaning device when cleaning brush is rinsed.
Element numbers explanation
1 supply line
11 pipeline opening
12 projections
2 cleaning fluids
3 cleaning brush
31 dentalations
4 holders
5 master control units
6 rotating control assemblies
7 nozzles
8 wafers
Embodiment
By particular specific embodiment, execution mode of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.
Refer to Fig. 1 to Fig. 2.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., all contents in order to coordinate specification to disclose only, understand and read for person skilled in the art scholar, not in order to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, changing under technology contents, when being also considered as the enforceable category of the utility model without essence.
As shown in Figure 1, the utility model provides a kind of crystal round fringes cleaning device, and described crystal round fringes cleaning device at least comprises:
At least one supply line 1 of wafer cleaning liquid 2 is provided, there is the pipeline opening 11 at close wafer 8 edges; Described pipeline opening 11 edges are provided with projection 12; The cleaning brush 3 that is built in described pipeline opening 11 and is fixedly connected with described projection 12; Be clamped in described supply line 1 surface and the holder 4 for fixing described supply line 1; Be socketed in described holder 4 surfaces and contact or leave described wafer 8 edge master control units 5 for controlling described cleaning brush 2; And support described wafer 2 and control the rotating control assembly 6 that wafer 2 rotates.
Below all parts is above described in detail:
Described supply line 1 is for providing cleaning wafer 8 edges required cleaning fluid 2.In the present embodiment, provide two supply lines that are oppositely arranged 1.The pipeline opening 11 of each supply line 1 is near wafer to be cleaned 2 edges, and preferably, the diameter of described pipeline opening 11 is greater than the diameter of supply line 1 rear end, for the accommodating cleaning brush 3 of pipeline opening 11 provides space.
Described supply line 1 surface is provided with holder 4, for fixing described supply line 1.The form fit of the shape of described holder 4 and supply line 1.
Further, described pipeline opening 11 edges are provided with projection 12, for stopping cleaning fluid 2, prevent that cleaning fluid 2 is directly ejected into the position of wafer 2 except edge in the time of cleaning wafer 8 edge in supply line 1, save cleaning fluid 2.
Described cleaning brush 3 is built in described pipeline opening 11, and described cleaning brush 3 is fixedly connected with described projection 12.Further, an accommodating cleaning brush 3 only in the pipeline opening 11 of described each supply line 1.
Described cleaning brush 3 includes but not limited to PVA sponge, and certainly, described cleaning brush 3 can also be the sponge of other soft materials.In the present embodiment, described cleaning brush 3 is preferably PVA sponge.PVA, i.e. polyvinyl alcohol, is a kind of purposes high molecular weight water soluble polymer quite widely, and performance is between plastics and rubber, and its purposes can be divided into fiber and the large purposes of non-fiber two.The resistance to water that there is unique powerful caking property, epithelium pliability, flatness, oil resistance, solvent resistance, protecting colloid, gas barrier performance, resistance to wear and have through special processing due to PVA.Therefore, the present embodiment adopts PVA sponge as cleaning brush 3, can fully wash the residue at wafer 8 edges, and can not scratch wafer 8 edges.
Further, described cleaning brush 3 is set to U character form structure, two arms of U font are fixedly connected with two projections 12 of pipeline opening 11, and on the inwall of described U font cleaning brush 3, have the dentalation 31 at cleaning wafer 8 edges, this dentalation 31 is direct and wafer 8 EDGE CONTACT cleanings in the time cleaning.Can be seen by Fig. 1, be all provided with dentalation 31 at top, bottom and the sidepiece of the inwall of U font cleaning brush 3, by these dentalations 31, upper and lower edge and the side of wafer can be cleaned fully, thoroughly remove edge residue.
Because cleaning brush 3 is PVA sponge, it has permeability, and therefore, the cleaning fluid 2 of supplying from supply line 1 can be penetrated into wafer 8 edges by cleaning brush 3.Preferably, described cleaning fluid 2 can adopt citric acid, but is not limited to this.
In addition, described crystal round fringes cleaning device also comprises master control unit.Described master control unit 5 is socketed in described holder 4 surfaces.Be used for controlling supply line 1 and carry out expanding-contracting action, and then make cleaning brush 3 contact or leave described wafer 8 edges.
As the structure of a kind of optimization of crystal round fringes cleaning device of the present utility model, described master control unit 5 is cylinder.
Described crystal round fringes cleaning device also comprises a rotating control assembly 6, and this rotating control assembly 6 is preferably vacuum control unit, is rotated for supporting described wafer 8 and controlling wafer 8.Described rotating control assembly 6 is supported on the center of wafer 8, and in cleaning process, wafer 8, by certain rotating speed rotation, is realized the cleaning at whole edge.As example, the rotating speed that described wafer 8 rotates is 300~600 rpms.In the present embodiment, the rotating speed of wafer 8 is elected 500 rpms temporarily as, certainly.In other embodiments, can be also 350 rpms, 400 rpms or 550 rpms etc.
Again further, described crystal round fringes cleaning device also comprises and is positioned at wafer top, two nozzles 7 for described cleaning brush is rinsed, as shown in Figure 2.
In the time that described nozzle 7 rinses described cleaning brush 3, the cleaning agent that described nozzle 7 sprays is deionized water, and the deionized water that the angle of described nozzle 7 and described cleaning brush 3 positions can make described nozzle 7 spray can cover the brush surface of whole described cleaning brush 3.
Described two rotary drives (diagram) are connected with described nozzle 7 respectively, for driving described nozzle 7 to rotate, correspondingly can adjust the angle of described nozzle 7 and described cleaning brush 3.
In concrete implementation process, the step of the crystal round fringes cleaning device that use the utility model provides is:
First, wafer 8 is placed on rotating control assembly 6;
Then, described master control unit 5 is controlled described supply line 1 gradually near described wafer 8 edges, finally makes the dentalation 31 on cleaning brush 3 touch wafer 8 edges; And open supply line 1, make cleaning fluid 2 penetrate into cleaning brush 3;
Then, open rotating control assembly 6 and make wafer 8 edges and described cleaning brush 3 produce relative motion, wafer 8 edges are cleaned tens seconds;
Finally, clean completely, close rotating control assembly 6, and control described supply line 1 gradually away from wafer 8 edges by master control unit 5, cleaning brush 3 and wafer 8 edges are departed from.
It should be noted that, after having cleaned a wafer 8, utilize the nozzle 7 of described wafer 8 tops to spray deionized water and rinse described cleaning brush 3, while removing cleaning wafer 8 edge in order to rinse, stay the pollutant on described cleaning brush 3.Rinse completely, wait for the cleaning task at next wafer edge.
In sum, the utility model provides a kind of crystal round fringes cleaning device, and described device at least comprises: at least one supply line of wafer cleaning liquid is provided, has the pipeline opening of close crystal round fringes; Described pipeline opening edge is provided with projection; The cleaning brush that is built in described pipeline opening and is fixedly connected with described projection; Be clamped in described supply line surface and the holder for fixing described supply line; Be socketed in described holder surface and contact or leave described crystal round fringes master control unit for controlling described cleaning brush; And support described wafer and control the control device that wafer rotates.The crystal round fringes cleaning device that the utility model provides can further carry out physical cleaning to crystal round fringes, makes the cleaning of crystal round fringes more thorough, thereby has reduced the pollution residual problem in crystal round fringes cleaning process, has improved the success rate that wafer is manufactured.
So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.

Claims (11)

1. a crystal round fringes cleaning device, is characterized in that, described crystal round fringes cleaning device at least comprises:
At least one supply line of wafer cleaning liquid is provided, there is the pipeline opening of close crystal round fringes; Described pipeline opening edge is provided with projection;
The cleaning brush that is built in described pipeline opening and is fixedly connected with described projection;
Be clamped in described supply line surface and the holder for fixing described supply line;
Be socketed in described holder surface and for controlling described cleaning brush contact or leaving the master control unit of described crystal round fringes;
And support described wafer and control the rotating control assembly that wafer rotates.
2. crystal round fringes cleaning device according to claim 1, is characterized in that: described cleaning brush is PVA sponge.
3. crystal round fringes cleaning device according to claim 2, is characterized in that: described cleaning brush is U font, has the dentalation at cleaning wafer edge on described U font inwall.
4. crystal round fringes cleaning device according to claim 1, is characterized in that: described rotating control assembly is vacuum control unit.
5. crystal round fringes cleaning device according to claim 4, is characterized in that: the rotating speed of described wafer rotation is 300~600 rpms.
6. crystal round fringes cleaning device according to claim 1, is characterized in that: described master control unit is cylinder.
7. crystal round fringes cleaning device according to claim 1, is characterized in that: described supply line is two supply lines that are oppositely arranged, the built-in cleaning brush of pipeline opening of each supply line.
8. crystal round fringes cleaning device according to claim 1, is characterized in that: described cleaning fluid is flowed to described cleaning brush and is penetrated into crystal round fringes by cleaning brush by supply line.
9. crystal round fringes cleaning device according to claim 8, is characterized in that: described cleaning fluid is citric acid.
10. crystal round fringes cleaning device according to claim 1, is characterized in that: described crystal round fringes cleaning device also comprises and is positioned at described wafer top, two nozzles for described cleaning brush is rinsed.
11. crystal round fringes cleaning devices according to claim 10, is characterized in that: described crystal round fringes cleaning device also comprises and being connected with described nozzle and for driving the rotary drive of described nozzle rotation.
CN201420072365.0U 2014-02-19 2014-02-19 Wafer edge cleaning device Expired - Fee Related CN203707094U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420072365.0U CN203707094U (en) 2014-02-19 2014-02-19 Wafer edge cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420072365.0U CN203707094U (en) 2014-02-19 2014-02-19 Wafer edge cleaning device

Publications (1)

Publication Number Publication Date
CN203707094U true CN203707094U (en) 2014-07-09

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CN (1) CN203707094U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110600403A (en) * 2019-08-27 2019-12-20 长江存储科技有限责任公司 Wafer etching device
CN111261553A (en) * 2020-01-19 2020-06-09 北京北方华创微电子装备有限公司 Wafer cleaning device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110600403A (en) * 2019-08-27 2019-12-20 长江存储科技有限责任公司 Wafer etching device
CN110600403B (en) * 2019-08-27 2022-02-08 长江存储科技有限责任公司 Wafer etching device
CN111261553A (en) * 2020-01-19 2020-06-09 北京北方华创微电子装备有限公司 Wafer cleaning device
WO2021143578A1 (en) * 2020-01-19 2021-07-22 北京北方华创微电子装备有限公司 Cleaning device
CN111261553B (en) * 2020-01-19 2024-03-26 北京北方华创微电子装备有限公司 Wafer cleaning device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140709

Termination date: 20190219